Microelectronic temperature control packaging structure
By introducing rectangular dust filter plates and dustproof turntables into the packaging structure of microelectronic devices, the problems of poor heat dissipation and equipment instability caused by dust accumulation are solved, and stable operation and efficient heat dissipation of the equipment are achieved.
Patent Information
- Application Number
- CN202423093577.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Dust accumulates at the ventilation openings of microelectronic devices, affecting heat dissipation and equipment stability.
A microelectronic temperature control packaging structure was designed, including a top shell, a rectangular dust filter plate, a cooling fan, and a dustproof turntable. Through sliding and threaded connections, dust backflow is prevented, ensuring the cleanliness of the equipment's interior.
It effectively prevents dust backflow, maintains stable operation and heat dissipation of the equipment, and avoids performance degradation or malfunction due to dust accumulation.
Smart Images
Figure CN223567968U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to microelectronic packaging technical field especially relates to a microelectronic temperature control packaging structure. BACKGROUND
[0002] Microelectronic device refers to the small -size electronic device through microelectronic technology manufacture, is widely used in computer, communication and electronic equipment etc. field. With the rapid development of integrated circuit technology, microelectronic device is towards high performance, miniaturization, low power consumption direction evolution,
[0003] Because its working environment usually accompanies high density integration and high -speed operation, device will produce significant operating heat in operation, and the device needs to be promptly discharged through the heat dissipation system, to guarantee the normal operation and stability of equipment. But in the heat dissipation process, the heat dissipation system will cause the dust in the external air to flow back and be sucked into the ventilation side of the device while discharging heat to the outside, and accumulate and block in the ventilation opening, not only influence the heat dissipation effect, but also accumulate dust inside, influence the stable operation of device, lead to performance decline even equipment failure. UTILITARIAN CONTENT
[0004] The technical problem to be solved by the utility model is that dust accumulation is easy to produce backflow, which affects the stable operation of the circuit.
[0005] In order to solve the above technical problem, the utility model adopts the technical scheme of a microelectronic temperature control packaging structure, which comprises a packaging top shell, the packaging top shell top end is slidably connected with a rectangular dust filter plate, a splicing clamping groove is formed in the side frame of the packaging top shell, a plurality of heat dissipation fans are fixedly arranged on the top of the packaging top shell, a threaded column is fixedly connected to the bottom of each heat dissipation fan, and a dustproof turntable is threadedly connected to the threaded column.
[0006] As a further improvement of the utility model, sliding grooves are formed in the two sides and the bottom end of the rectangular dust filter plate, and a plurality of sliding blocks for slidably connecting the sliding grooves are fixedly connected to the packaging top shell.
[0007] As a further improvement of the utility model, a plug is inserted into the two sides of the packaging top shell, and a plug slot is formed in the rectangular dust filter plate for fastening and inserting the plug.
[0008] As a further improvement of the utility model, a temperature sensor is fixedly arranged on the inner side of the packaging top shell, and the temperature sensor is electrically connected to the heat dissipation fan.
[0009] As a further improvement of the utility model, a threaded hole plate is fixedly connected to the four corners around the packaging top shell, and a fixing bolt is threadedly connected to the threaded hole plate.
[0010] As a further improvement of the utility model, two groups of symmetrical finger buckles are fixedly connected to the bottom end of the dustproof turntable.
[0011] The utility model discloses the beneficial effects of the utility model: the utility model discloses a plurality of heat dissipation fans are equipped with in the packaging top shell top, and the rectangular dust filter board is slidably connected with the packaging top shell top end, when the internal heat is discharged outward, the rectangular dust filter board can avoid the external dust to fall into the device to a certain extent, and simultaneously, since the bottom of every heat dissipation fan is threadedly connected with the dustproof turntable through the threaded column, when the rectangular dust filter board deposits too much fly ash, will fall into the device interior due to the blowing of heat dissipation fan, can isolate the fly ash falling from the packaging top shell top through the dustproof turntable, guarantee the stability of equipment operation. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 It is the whole schematic diagram of the utility model microelectronic temperature control packaging structure Figure 1 ;
[0013] Figure 2 It is the local display drawing of the utility model microelectronic temperature control packaging structure
[0014] Figure 3 It is the local component bottom view of the utility model microelectronic temperature control packaging structure
[0015] Figure 4 It is the whole schematic diagram of the utility model microelectronic temperature control packaging structure Figure 2 .
[0016] As shown in the figure: 1, the packaging top shell, 2, the rectangular dust filter board, 3, the heat dissipation fan, 4, the threaded column, 5, the dustproof turntable, 6, the sliding slot, 7, the plug bolt, 8, the temperature sensor, 9, the threaded hole plate, 10, the finger buckle. DETAILED DESCRIPTION
[0017] In the present specification, the orientation terms such as up, down, left, right, front, back, front face, back face, top, bottom, etc. are defined with respect to its structure, and they are relative concepts. Therefore, it is possible to change accordingly according to its different positions, different use states, so it should not be interpreted as a restrictive term.
[0018] In the present specification, the singular forms "a", "said" and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein means and includes any or all possible combinations of one or more associated listed items.
[0019] In order to make the technical problems, technical schemes and beneficial effects to be solved in the present application more clear and explicit, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the embodiments described herein are only used to explain the present application and not used to limit the present application.
[0020] The utility model provides a kind of microelectronic temperature control packaging structure,
[0021] As shown in the accompanying Figures 1-4 It includes packaging top shell 1, and rectangular dust filter plate 2 is slidably connected to the top end of packaging top shell 1;Sliding grooves 6 are formed in both sides and the bottom end of rectangular dust filter plate 2, and sliding blocks for sliding connection with sliding grooves 6 are fixedly connected to packaging top shell 1;The sliding grooves 6 and the sliding blocks provide a good guiding effect for the sliding in and out of rectangular dust filter plate 2. Assembly clamping grooves are formed in one side frame of packaging top shell 1, and the assembly clamping grooves are located on the sliding-out side of rectangular dust filter plate 2, and the assembly clamping grooves can ensure the mutual assembly of packaging top shell 1 and the circuit board. Four rectangularly arranged heat dissipation fans 3 are fixedly arranged on the top of packaging top shell 1, threaded columns 4 are fixedly connected to the bottom of heat dissipation fans 3, and dustproof turntables 5 are threadedly connected to threaded columns 4;Two groups of symmetrically arranged finger clasps 10 are fixedly connected to the bottom end of dustproof turntables 5;The finger clasps 10 facilitate the rotation of dustproof turntables 5 on threaded columns 4.
[0022] As shown in the accompanying Figures 1-4 Insert bolts 7 are inserted into both sides of packaging top shell 1, and insertion grooves for the insertion and fastening of insert bolts 7 are formed in rectangular dust filter plate 2;The insert bolts 7 and the insertion grooves are used to fasten the connection between packaging top shell 1 and rectangular dust filter plate 2. Temperature sensors 8 are fixedly arranged on the inner side of packaging top shell 1, and the temperature sensors 8 are electrically connected to heat dissipation fans 3;The temperature sensors 8 can start heat dissipation fans 3 to perform heat dissipation treatment on the inside according to the internal operating temperature. Screw hole plates 9 are fixedly connected to the four corners around packaging top shell 1, and fixing bolts are threadedly connected to screw hole plates 9;The screw hole plates 9 and the fixing bolts are used to provide reliable connection between packaging top shell 1 and the circuit board.
[0023] Working principle: in the specific implementation of the utility model, first, the temperature sensor 8 fixedly arranged on the inner side of packaging top shell 1 performs temperature measurement treatment on the inside of the device, and when the operating temperature is too high, four heat dissipation fans 3 are started to discharge the internal heat upward through air power. After a long time of air discharge, dust will gather around the air outlet, and when the heat dissipation fans 3 are started again, the dust will be blown back to the inside of the device along with the air power. Since threaded columns 4 are fixedly arranged at the bottom end of heat dissipation fans 3, and dustproof turntables 5 are threadedly connected to threaded columns 4, the dust falling down can be further adsorbed and isolated by dustproof turntables 5 located directly below heat dissipation fans 3, so as to avoid the direct accumulation of dust on the circuit board and ensure the stability of equipment operation.
[0024] The foregoing embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features therein can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A microelectronic temperature-controlled package structure, characterized by: Including the package top cover (1), the rectangular dust filter board (2) is slidably connected to the top of the package top cover (1), the package top cover (1) is provided with a plurality of heat dissipation fans (3) on the top, the bottom of the heat dissipation fan (3) is fixedly connected with a threaded column (4), and the threaded column (4) is threadedly connected with a dustproof turntable (5).
2. The microelectronic temperature-controlled package structure of claim 1, wherein: The both sides and the bottom of the rectangular dust filter board (2) are provided with sliding grooves (6), and the package top cover (1) is fixedly connected with a plurality of sliding blocks for sliding connection of the sliding grooves (6).
3. The microelectronic temperature-controlled package structure of claim 1, wherein: The both sides of the package top cover (1) are inserted with plugs (7), and the rectangular dust filter board (2) is provided with a plug groove for fastening insertion of the plug (7).
4. The microelectronic temperature-controlled package structure of claim 1, wherein: The inside of the package top cover (1) is fixedly provided with a temperature sensor (8), and the temperature sensor (8) is electrically connected with the heat dissipation fan (3).
5. The microelectronic temperature-controlled package structure of claim 1, wherein: The package top cover (1) is fixedly connected with a threaded hole plate (9) at the four corners, and the threaded hole plate (9) is threadedly connected with a fixing bolt.
6. The microelectronic temperature-controlled package structure of claim 1, wherein: The bottom of the dustproof turntable (5) is fixedly connected with two groups of symmetrically arranged finger buckles (10).