Domain controller housing and domain controller
By designing a modular heatsink, the problem of low adaptability of the domain controller housing was solved, enabling heat dissipation capabilities to be adapted to different scenarios, thus reducing design, development, and maintenance costs.
Patent Information
- Application Number
- CN202423118031.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2034-12-17
AI Technical Summary
Existing domain controller enclosures have low adaptability, making it difficult to balance cost and heat dissipation requirements in different scenarios, and their design, development, and maintenance are time-consuming and labor-intensive.
It adopts a modular heat sink, including natural heat dissipation module, air cooling module and water cooling module, which can be combined and used in a detachable connection to meet the heat dissipation needs of different scenarios.
It improves the adaptability of domain controllers and enables heat dissipation capabilities in different scenarios by replacing the heat dissipation modules of modular heat sinks, thereby reducing design, development and maintenance costs.
Smart Images
Figure CN223567973U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electrical equipment heat dissipation technical field especially relates to a domain controller casing and domain controller. BACKGROUND
[0002] With the development of science and technology and the development of the industry, the controller of vehicle electrical equipment gradually develops into a multifunctional integrated controller, i.e. a domain controller, from the original single module controller. The casing of the domain controller is a very important part in its structure, which plays the role of fixing the internal circuit board, dustproof and waterproof, heat conduction and heat dissipation, etc. The working scene of the current domain controller is becoming more and more rich, and the same domain controller may be applied to different scenes to realize different functions. In different scenes, the calculation amount and the heat generation of the domain controller differ greatly. To meet different heat dissipation requirements, the design and cost of the casing will be very different.
[0003] In the related art, some designs a domain controller for each scene, uses a design scheme with poor heat dissipation capacity but low cost in a simple scene, and uses a design scheme with high cost but strong heat dissipation capacity in a complex scene, however, this will be time-consuming and laborious in design development and later maintenance, and the comprehensive cost will be greatly increased. Some positions the high end at the design initial stage, so that the domain controller can meet the high heat generation requirement of the complex scene as much as possible, and covers the simple scene requirement, but in the case of less application scene, the scale effect does not work, which will form a great waste to the single domain controller. Therefore, the current domain controller has low adaptability and cannot take into account the cost in many aspects, and it is difficult to select a suitable domain controller casing scheme when facing different scenes at the design initial stage. UTILITY MODEL CONTENTS
[0004] The utility model provides a kind of domain controller casing and domain controller to solve the problem of low adaptability of domain controller in prior art.
[0005] The utility model provides a kind of domain controller casing, comprising:
[0006] Casing, the casing is equipped with mounting portion;
[0007] Modular heat sink, including natural heat dissipation module and air-cooled heat dissipation module, the natural heat dissipation module and the air-cooled heat dissipation module can be detachably connected with the mounting portion;
[0008] In the case where the natural heat dissipation module is connected with the mounting portion, the natural heat dissipation module and the casing form a first containing space, and the first containing space is used to set circuit board, and the circuit board is in contact with the natural heat dissipation module;
[0009] In the case that the natural heat dissipation module and the air-cooled heat dissipation module are connected with the mounting part, the air-cooled heat dissipation module is located on the side of the natural heat dissipation module away from the mounting part.
[0010] According to the domain controller shell, the natural heat dissipation module comprises:
[0011] A base plate is detachably connected with the mounting part.
[0012] A plurality of heat dissipation parts are connected with the base plate and are arranged at intervals, and the side of the base plate away from the heat dissipation parts is used for contact connection with the circuit board.
[0013] According to the domain controller shell, the air-cooled heat dissipation module comprises a heat dissipation fan, and in the case that the natural heat dissipation module and the air-cooled heat dissipation module are connected with the mounting part, the air outlet side of the heat dissipation fan is arranged opposite to the natural heat dissipation module.
[0014] According to the domain controller shell, the heat dissipation part is a heat dissipation fin, the heat dissipation fin is arranged to extend in a first direction on the base plate, a plurality of the heat dissipation fins are arranged at intervals in a second direction, and the first direction and the second direction are arranged at an angle.
[0015] According to the domain controller shell, the modular heat dissipator further comprises:
[0016] A water-cooled heat dissipation module can be detachably connected with the mounting part, and the heat dissipation capacity of the water-cooled heat dissipation module is greater than that of the combination structure of the natural heat dissipation module and the air-cooled heat dissipation module.
[0017] In the case that the water-cooled heat dissipation module is connected with the mounting part, the water-cooled heat dissipation module and the shell form a second containing space, and the second containing space is used for arranging the circuit board, and the circuit board is in contact connection with the water-cooled heat dissipation module.
[0018] According to the domain controller shell, the water-cooled heat dissipation module comprises a heat dissipation body, the inside of the heat dissipation body is provided with a cooling water flow channel, the heat dissipation body is further provided with a water inlet and a water outlet, and the water inlet and the water outlet are connected with two ends of the cooling water flow channel, respectively.
[0019] According to the domain controller shell, the shell comprises a side wall and a cover body, the side wall and the cover body form a containing cavity, and the mounting part is arranged at one end of the side wall away from the cover body.
[0020] The side wall and the cover body are detachably connected.
[0021] The utility model also provides a kind of domain controller, comprising: circuit board and above any one domain controller shell, the circuit board is arranged in the containing space surrounded by the modular radiator and the shell.
[0022] According to the utility model provides a kind of domain controller, the circuit board is connected in the natural heat dissipation module or water-cooling heat dissipation module of the domain controller shell close to the side of the installation part.
[0023] The domain controller shell and the domain controller provided by the utility model are provided with a modular radiator, which includes a natural heat dissipation module and an air-cooled heat dissipation module. The circuit board can be cooled by the natural heat dissipation module or the combination of the natural heat dissipation module and the air-cooled heat dissipation module. Through modular design, an expandable domain controller shell is obtained. By replacing the heat dissipation module of the modular radiator, a set of domain controller shell can achieve different heat dissipation capabilities, improving the adaptability of the domain controller. The configuration of the heat dissipation module can be adjusted according to different scenarios, so as to balance the cost of design, development and maintenance and the cost of the domain controller itself. BRIEF DESCRIPTION OF DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings in the following description are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.
[0025] Figure 1 is one of the explosion structure diagrams of the domain controller provided by the utility model.
[0026] Figure 2 is the second explosion structure diagram of the domain controller provided by the utility model.
[0027] Figure 3 is the third explosion structure diagram of the domain controller provided by the utility model.
[0028] REFERENCE NUMERALS
[0029] 1, shell; 11, installation part; 12, containing cavity; 13, side wall; 14, cover body; 2, modular radiator; 21, natural heat dissipation module; 211, base plate; 212, heat dissipation part; 22, air-cooled heat dissipation module; 23, water-cooled heat dissipation module; 3, connecting piece; 4, circuit board. DETAILED DESCRIPTION
[0030] In order to make the purpose, technical scheme and advantages of the utility model clearer, the technical scheme in the utility model will be described clearly and completely in combination with the drawings in the utility model below. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without creative labor belong to the protection scope of the utility model.
[0031] In the description of the embodiments of the utility model, it should be explained that, unless explicitly specified and limited, the terms "first" and "second" are numbered for the purpose of clearly explaining the product components, and do not represent any substantial difference. The terms "mounting", "connection" and "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected, it can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For the ordinary skilled in the art, the specific meaning of the above terms in the embodiments of the utility model can be understood according to the specific circumstances. In addition, the meaning of "multiple" is two or more than two.
[0032] The embodiments of the utility model will be described below in combination with Figures 1-3 The domain controller shell and the domain controller of the utility model are described.
[0033] As Figure 1 And Figure 2 The domain controller shell provided by the embodiments of the utility model includes a shell 1 and a modular heat sink 2. The shell 1 is provided with a mounting portion 11. The modular heat sink 2 includes a natural heat dissipation module 21 and an air-cooled heat dissipation module 22, and the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 can be detachably connected with the mounting portion 11. In the case that the natural heat dissipation module 21 is connected with the mounting portion 11, the natural heat dissipation module 21 and the shell 1 form a first containing space, and the first containing space is used for arranging a circuit board 4, and the circuit board 4 is in contact with the natural heat dissipation module 21. In the case that the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 are both connected with the mounting portion 11, the air-cooled heat dissipation module 22 is located on the side of the natural heat dissipation module 21 away from the mounting portion 11.
[0034] Specifically, the shell 1 is provided with a containing cavity 12, one side of the shell 1 is provided with an opening communicating with the containing cavity 12, the mounting portion 11 is arranged at the opening of the containing cavity 12, and the containing cavity 12 is used for accommodating the circuit board 4. When the modular heat sink 2 is connected with the mounting portion 11, the containing cavity 12 is closed to form a containing space, and the circuit board 4 is arranged in the containing space.
[0035] Among them, the modular heat sink includes a plurality of heat dissipation modules, one or more heat dissipation modules in the plurality of heat dissipation modules are selectively connected with the mounting portion 11.
[0036] The plurality of heat dissipation modules includes a natural heat dissipation module 21 and an air-cooled heat dissipation module 22. The natural heat dissipation module 21 is used to be in contact with the circuit board 4 to conduct the heat generated by the circuit board 4 to the surrounding air. The natural heat dissipation module 21 can be selected alone, or the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 can be selected at the same time.
[0037] In the case of selecting the natural heat dissipation module 21 alone, the natural heat dissipation module 21 and the shell 1 form a first accommodating space, and the circuit board 4 is arranged in the first accommodating space and in contact with the natural heat dissipation module 21. In this case, only the natural heat dissipation module 21 is used to dissipate heat from the circuit board 4.
[0038] In the case of selecting the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 at the same time, the natural heat dissipation module 21 and the shell 1 form a first accommodating space, and the circuit board 4 is arranged in the first accommodating space and in contact with the natural heat dissipation module 21. The air-cooled heat dissipation module 22 is located on the side of the natural heat dissipation module 21 away from the mounting portion 11, and is used to forcibly air-cool the natural heat dissipation module 21 to enhance the heat dissipation capacity.
[0039] The air-cooled heat dissipation module 22 can be directly connected with the mounting portion 11, or can be connected with the mounting portion 11 through the natural heat dissipation module 21, that is, the air-cooled heat dissipation module 22 is detachably connected with the natural heat dissipation module 21. As long as the air-cooled heat dissipation module 22 is located on the side of the natural heat dissipation module 21 away from the mounting portion 11.
[0040] When the domain controller is assembled before leaving the factory, the natural heat dissipation module 21 or the combination of the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 can be reasonably selected according to the actual use scene of the product. Figure 1 As shown in FIG. 1, when only the natural heat dissipation module 21 is connected with the shell 1, a basic version domain controller shell is obtained. Figure 2 As shown in FIG. 2, when the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 are connected with the shell 1, a high-end version domain controller shell is obtained, and the air-cooled heat dissipation module 22 forcibly convects the air around the natural heat dissipation module 21 to improve the heat dissipation capacity.
[0041] When facing a simple scene, the above-mentioned basic version domain controller shell can be used to meet the basic heat dissipation requirement, and the cost is low. When facing a more complex scene, the function design of the domain controller and the performance requirement of the main chip will be correspondingly increased to meet the demand of the complex scene for computing power, resulting in an increase in the heat generation of the domain controller. At this time, the above-mentioned high-end version domain controller shell can be used.
[0042] The domain controller shell provided by the embodiment of the utility model, through setting modular radiator 2, modular radiator 2 includes natural heat dissipation module 21 and air cooling heat dissipation module 22, can utilize natural heat dissipation module 21 or utilize natural heat dissipation module 21 and air cooling heat dissipation module 22's combination to circuit board 4 carries out heat dissipation, through modular design, obtains the domain controller shell that can expand, through replacing the heat dissipation module of modular radiator 2, makes a set of domain controller shell realizes different heat dissipation capacity, improved the adaptability of domain controller. The configuration of heat dissipation module can be adjusted according to different scenes, so as to take into account the cost of design development and maintenance and the cost of the domain controller itself.
[0043] As Figure 1 The utility model discloses a domain controller shell still includes a plurality of connecting pieces 3, and natural heat dissipation module 21 passes through a plurality of connecting pieces 3 and is detachably connected with installation portion 11. The connecting piece 3 can be screw or bolt or the like.
[0044] In the case of selecting natural heat dissipation module 21 and air cooling heat dissipation module 22 simultaneously, a plurality of connecting pieces 3 pass through air cooling heat dissipation module 22 and natural heat dissipation module 21 and are connected with installation portion 11.
[0045] As Figure 2 The utility model discloses a shell 1 includes side wall 13 and cover 14, and side wall 13 and cover 14 surround and form containing cavity 12, and installation portion 11 is set up at the end of side wall 13 away from cover 14.
[0046] Specifically, the side wall 13 is surrounded by the edge of the cover 14, and the first end of the side wall 13 is connected with the cover 14, and the second end surrounds the opening of the containing cavity 12. The installation portion 11 is arranged at the second end of the side wall 13.
[0047] Optionally, the side wall 13 and the cover 14 are integrally formed. Optionally, the side wall 13 and the cover 14 are detachably connected, and in the later period, the modular radiator 2 does not need to be assembled and disassembled, and the domain controller can be conveniently maintained by only opening the cover 14.
[0048] Among them, the detachable connection mode of side wall 13 and cover 14 has multiple. For example, the cover 14 and the side wall 13 are detachably connected by screws, or the cover 14 and the side wall 13 are detachably connected. Specifically, the first end of the side wall 13 is provided with a plurality of clamping grooves, and a plurality of clamping hooks are correspondingly arranged on the cover 14, and the cover 14 and the side wall 13 are clamped by a plurality of clamping hooks and a plurality of clamping grooves corresponding to each other.
[0049] As Figure 2As shown, in some embodiments of this utility model, the natural heat dissipation module 21 includes a substrate 211 and a plurality of heat dissipation parts 212. The substrate 211 is detachably connected to the mounting part 11. The plurality of heat dissipation parts 212 are connected to the substrate 211 and are spaced apart from each other. The side of the substrate 211 away from the heat dissipation parts 212 is used for contact connection with the circuit board 4. The heat generated by the circuit board 4 can be transferred through the substrate 211 to the plurality of heat dissipation parts 212, and then the plurality of heat dissipation parts 212 transfer the heat to the surrounding air, thereby achieving heat dissipation of the circuit board 4.
[0050] The substrate 211 is a flat plate with two opposing surfaces. One surface faces the first accommodating space, and the other surface is connected to multiple heat dissipation sections 212. One end of each heat dissipation section 212 is connected to the substrate 211 and extends away from the substrate 211. The heat dissipation section 212 can be a heat dissipation fin, heat dissipation rib, or heat dissipation stud, etc. Multiple heat dissipation sections 212 are spaced apart to form airflow gaps between them.
[0051] Optionally, both the substrate 211 and the heat sink 212 are metal parts, giving them high thermal conductivity. Optionally, the substrate 211 and the heat sink 212 are integrally formed.
[0052] When both the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 are installed, the air-cooled heat dissipation module 22 can promote airflow between multiple heat dissipation parts 212 and improve heat dissipation capacity.
[0053] like Figure 2 As shown, the air-cooled heat dissipation module in this embodiment includes a cooling fan. When both the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 are connected to the mounting part 11, the cooling fan drives air to flow through multiple heat dissipation parts 212 to accelerate the heat dissipation rate of the natural heat dissipation module 21.
[0054] The air-cooled heat dissipation module also includes a mounting frame, on which a cooling fan is rotatably mounted. The air-cooled heat dissipation module 22 is detachably connected to the mounting part 11 or the natural heat dissipation module 21 via the mounting frame.
[0055] The cooling fans can be multiple, arranged on a plane parallel to the substrate 211, creating a large-scale airflow between the multiple heat dissipation sections 212 of the natural heat dissipation module 21, thereby improving the heat dissipation efficiency of the natural heat dissipation module 21. (See also...) Figure 2 The air-cooled heat dissipation module 22 includes three cooling fans arranged side by side.
[0056] Optionally, in the case that the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 are both connected with the mounting portion 11, the air outlet side of the heat dissipation fan is arranged opposite to the natural heat dissipation module 21. That is, the air outlet side of the heat dissipation fan is arranged opposite to the plurality of heat dissipation portions 212. The heat dissipation fan transports the air with a lower temperature outside the domain controller housing to between the plurality of heat dissipation portions 212, so as to accelerate the heat dissipation rate of the natural heat dissipation module 21.
[0057] Further, the heat dissipation portion 212 is a heat dissipation fin, the heat dissipation fin is arranged to extend in the first direction on the base plate 211, and the plurality of heat dissipation fins are arranged to be spaced from each other in the second direction, and the first direction and the second direction are arranged at an angle.
[0058] For example, the base plate 211 is a rectangular plate, the first direction is the length direction of the base plate 211, and the second direction is the width direction of the base plate 211. A plurality of air flow channels extending in the length direction of the base plate 211 are formed between the plurality of heat dissipation fins.
[0059] In the case that the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 are used in combination, the air with a lower temperature around enters each air flow channel of the natural heat dissipation module 21 under the action of the heat dissipation fan, and then is discharged from both ends of the air flow channel. The plurality of air flow channels form a flow guide effect on the air, so that the air with a lower temperature can exchange heat with each position of the heat dissipation fin in the first direction, and the heat dissipation efficiency is improved.
[0060] As shown in Figure 3 The modular heat dissipation device 2 further includes a water-cooled heat dissipation module 23 in the embodiment of the utility model. The water-cooled heat dissipation module 23 can be detachably connected with the mounting portion 11, and the heat dissipation capacity of the water-cooled heat dissipation module 23 is greater than that of the combination structure of the natural heat dissipation module 21 and the air-cooled heat dissipation module 22.
[0061] In the case that the water-cooled heat dissipation module 23 is connected with the mounting portion 11, the water-cooled heat dissipation module 23 and the housing 1 form a second containing space, and the second containing space is used for arranging the circuit board 4, and the circuit board 4 is in contact with the water-cooled heat dissipation module 23.
[0062] Since the heat dissipation capacity of the water-cooled heat dissipation module 23 is greater than that of the combination structure of the natural heat dissipation module 21 and the air-cooled heat dissipation module 22, in the embodiment, only the water-cooled heat dissipation module 23 can be selected to be connected with the mounting portion 11, and the natural heat dissipation module 21 and the air-cooled heat dissipation module 22 are not connected with the mounting portion 11, that is, only the water-cooled heat dissipation module 23 is used for heat dissipation, and a full-function domain controller housing is obtained.
[0063] When facing the full-featured scene, the functions reserved by the domain controller are all turned on, the domain controller is in the highest configuration and strongest function state, and the domain controller generates a very large amount of heat and has very high heat dissipation requirements. At this time, if the natural cooling module 21 and the air-cooled cooling module 22 combined structure still cannot meet the heat dissipation requirements of the domain controller, a full-featured domain controller shell can be used to ensure that the domain controller does not overheat.
[0064] Among them, the water-cooled heat dissipation module 23 is also detachably connected with the mounting portion 11 through a plurality of connecting pieces 3. The natural cooling module 21 and the water-cooled heat dissipation module 23 are connected with the mounting portion 11 through the connecting pieces 3, which improves the versatility of the connecting pieces 3 and realizes the mutual replacement of the natural cooling module 21 and the water-cooled heat dissipation module 23. In this way, the shell 1 can be processed by using the same mold, and for different scenes, only the heat dissipation module assembled and connected therewith needs to be replaced, so that a domain controller shell with different heat dissipation capacities can be produced, which is flexible and convenient to assemble, has strong pertinence, and is low in production cost and convenient for mass production.
[0065] Specifically, the water-cooled heat dissipation module 23 comprises a heat dissipation body, the inside of the heat dissipation body is provided with a cooling water flow channel, and the heat dissipation body is also provided with a water inlet and a water outlet, and the water inlet and the water outlet are connected to the two ends of the cooling water flow channel, respectively. Among them, the heat dissipation body is a metal piece, so that it has high heat conduction performance and improves the heat conduction rate of the circuit board 4 and the cooling water.
[0066] Further, the domain controller further comprises a water circulation mechanism, the water circulation mechanism is connected with the water inlet and the water outlet of the water-cooled heat dissipation module 23 through a pipeline, so that the cooling water circulates between the water circulation mechanism and the water-cooled heat dissipation module 23. The water circulation mechanism provides low-temperature cooling water for the water-cooled heat dissipation module 23.
[0067] As shown in Figures 1-3 The utility model embodiment further provides a domain controller, the domain controller comprises a circuit board 4 and the domain controller shell of any one of the above-mentioned embodiments, and the circuit board 4 is arranged in the accommodation space surrounded by the modular heat dissipation device 2 and the shell 1.
[0068] Further, the circuit board 4 is connected to the side of the natural cooling module 21 or the water-cooled heat dissipation module 23 of the domain controller shell close to the mounting portion 11.
[0069] Specifically, when the natural cooling module 21 is connected with the mounting portion 11 of the shell 1, the natural cooling module 21 and the shell 1 form a first accommodation space, and the circuit board 4 is connected to the side of the natural cooling module 21 facing the first accommodation space. On this basis, the air-cooled heat dissipation module 22 can also be connected with the natural cooling module 21.
[0070] When the water-cooling heat dissipation module 23 is selected to be connected with the mounting portion 11 of the shell 1, the water-cooling heat dissipation module 23 and the shell 1 form a second containing space, and the circuit board 4 and the side of the water-cooling heat dissipation module 23 facing the second containing space are connected in contact.
[0071] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, but not limited to them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A domain controller housing, characterized by, include: A housing, wherein the housing is provided with a mounting portion; A modular heat sink includes a natural heat dissipation module and an air-cooled heat dissipation module, both of which can be detachably connected to the mounting part; When the natural heat dissipation module is connected to the mounting part, the natural heat dissipation module and the housing enclose a first accommodating space, the first accommodating space is used to house the circuit board, and the circuit board is in contact with the natural heat dissipation module. When both the natural heat dissipation module and the air-cooled heat dissipation module are connected to the mounting part, the air-cooled heat dissipation module is located on the side of the natural heat dissipation module away from the mounting part.
2. The domain controller housing of claim 1, wherein, The natural heat dissipation module includes: A substrate, wherein the substrate is detachably connected to the mounting portion; Multiple heat dissipation sections are connected to the substrate and spaced apart from each other. The side of the substrate away from the heat dissipation sections is used to contact and connect with the circuit board.
3. The domain controller housing of claim 2, wherein, The air-cooled heat dissipation module includes a cooling fan. When both the natural heat dissipation module and the air-cooled heat dissipation module are connected to the mounting part, the air outlet side of the cooling fan is arranged opposite to the natural heat dissipation module.
4. The domain controller housing of claim 3, wherein, The heat dissipation part is a heat sink, which extends on the substrate along a first direction, and a plurality of heat sinks are spaced apart from each other in a second direction. The first direction and the second direction are at an angle.
5. The domain controller housing of any one of claims 1 to 4, wherein, The modular heat sink also includes: A water-cooled heat dissipation module, which can be detachably connected to the mounting part, and the heat dissipation of the water-cooled heat dissipation module is greater than the heat dissipation of the combination structure of the natural heat dissipation module and the air-cooled heat dissipation module; When the water-cooled heat dissipation module is connected to the mounting part, the water-cooled heat dissipation module and the housing form a second accommodating space, the second accommodating space is used to house the circuit board, and the circuit board is in contact with the water-cooled heat dissipation module.
6. The domain controller housing of claim 5, wherein, The water-cooled heat dissipation module includes a heat dissipation body, which has a cooling water channel inside. The heat dissipation body also has a water inlet and a water outlet, which are respectively connected to the two ends of the cooling water channel.
7. The domain controller enclosure of claim 1, wherein, The housing includes a side wall and a cover, the side wall and the cover forming an accommodating cavity, and the mounting portion is disposed at the end of the side wall away from the cover.
8. The domain controller housing of claim 7, wherein, The sidewall and the cover are detachably snapped together.
9. A domain controller, characterized by include: The circuit board and the domain controller housing as described in any one of claims 1 to 8, wherein the circuit board is disposed within an accommodating space enclosed by the modular heat sink and the housing.
10. The domain controller of claim 9, wherein, The circuit board is connected to the side of the domain controller housing's natural heat dissipation module or water-cooled heat dissipation module near the mounting part.