Heat dissipation module and electronic equipment

Abstract

The utility model relates to the technical field of heat dissipation, and provides a heat dissipation module and electronic equipment, the heat dissipation module comprises a shell and a piezoelectric fan, the shell is provided with a first air inlet and a first air outlet, and the piezoelectric fan is located in the shell; the piezoelectric fan is provided with a second air inlet and a second air outlet, the second air inlet is communicated with the first air inlet, and the second air outlet is communicated with the first air outlet; the piezoelectric fan is used for sucking cold air from the first air inlet and discharging hot air from the first air outlet. Due to the fact that the size of the piezoelectric fan is small, the size of the heat dissipation module is small, the piezoelectric fan generates airflow through high-frequency reciprocating vibration, no motor rotates, noise can be reduced, and the problems that in the prior art, a heat dissipation fan is large in size and high in noise are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and in particular to a heat dissipation module and an electronic device. BACKGROUND

[0002] In the use process of electronic devices such as mobile phones and tablet computers, a part of the heat generating components (such as central processors, graphic processors, battery charging and discharging modules, etc.) will often generate a large amount of heat. In order to ensure the normal use of the electronic device, it is usually necessary to dissipate the heat of the heat generating components of the electronic device.

[0003] At present, there are two ways to dissipate the heat of the heat generating components of the electronic device. One is passive heat dissipation, for example, using a graphite sheet or a heat plate for heat dissipation, but the heat dissipation efficiency is low. The other is active heat dissipation, for example, using a heat dissipation fan (such as an axial flow fan) for heat dissipation. However, the volume of the heat dissipation fan is large at present, and the electronic device needs to reserve a large installation space, which is not conducive to the miniaturization design of the electronic device. Moreover, the noise of the heat dissipation fan is large during rotation, which affects the user's experience. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the present application provides a heat dissipation module and an electronic device to solve the problem of large volume and loud noise of the heat dissipation fan in the prior art.

[0005] The first aspect of the present application provides a heat dissipation module, comprising a shell and a piezoelectric fan, the shell having a first air inlet and a first air outlet, and the piezoelectric fan being in the shell; the piezoelectric fan having a second air inlet and a second air outlet, the second air inlet being in communication with the first air inlet, and the second air outlet being in communication with the first air outlet; the piezoelectric fan being used for sucking cold air from the first air inlet and discharging hot air from the first air outlet.

[0006] The heat dissipation module provided by the present application has the following beneficial effects: when the heat dissipation module is installed on the device main body of the electronic device, the heat of the heat generating components is directly or indirectly conducted to the shell and enters the inside of the shell, the piezoelectric fan sucks the cold air from the first air inlet into the shell to take away the heat, and the hot air is discharged from the first air outlet to achieve active heat dissipation, thereby achieving heat dissipation of the heat generating components. Since the size of the piezoelectric fan is small, the overall size of the heat dissipation module is relatively small, and the piezoelectric fan relies on high-frequency reciprocating vibration to generate airflow, without motor rotation, which can reduce noise, thereby solving the problem of large volume and loud noise of the heat dissipation fan in the prior art.

[0007] In some embodiments, the heat dissipation module further comprises a heat dissipation fin in the shell, and the cold air sucked by the piezoelectric fan from the first air inlet is used to take away the heat of the heat dissipation fin.

[0008] In some embodiments, the heat dissipation fin is downstream of the piezoelectric fan in the flow direction of the airflow, and the second air outlet is directed towards the heat dissipation fin.

[0009] In some embodiments, the second air outlet is directed downwards, and the heat dissipation fin is below the piezoelectric fan; or the second air outlet is directed horizontally, and the heat dissipation fin is on one side of the piezoelectric fan in the horizontal direction.

[0010] In some embodiments, the heat dissipation fin is upstream of the piezoelectric fan in the flow direction of the airflow, and the second air outlet is directed towards the first air outlet.

[0011] In some embodiments, the heat dissipation fin is above the piezoelectric fan; or the heat dissipation fin is on one side of the piezoelectric fan in the horizontal direction.

[0012] In some embodiments, the first air inlet is on the upper side of the housing, or the first air inlet is on one side of the housing in the horizontal direction.

[0013] In some embodiments, the housing comprises a housing body and a heat dissipation base connected to the housing body, and the heat dissipation fin is arranged on the heat dissipation base.

[0014] A second aspect of the present application provides an electronic device comprising a device main body and a heat dissipation module as described in the first aspect, wherein the device main body is provided with a heat generating component, and the heat dissipation module is arranged in the device main body and used for dissipating heat of the heat generating component.

[0015] The electronic device adopts any one or more embodiments of the above heat dissipation module, and thus has the beneficial effects of the above embodiments, which will not be repeated here.

[0016] In some embodiments, the device main body comprises a screen, a middle frame and a back cover, the screen, the middle frame and the back cover are connected in sequence, the heat generating component and the heat dissipation module are arranged on the middle frame, and a lens module is arranged on the back cover.

[0017] In some embodiments, the heat dissipation module comprises a first air inlet and a first air outlet, and the first air inlet and the first air outlet are respectively arranged on opposite sides or adjacent sides of the lens module; or

[0018] In some embodiments, the heat dissipation module comprises a first air inlet and a first air outlet, and the first air inlet and the first air outlet are respectively arranged on opposite sides or adjacent sides of the middle frame; or

[0019] In some embodiments, the heat dissipation module comprises a first air inlet and a first air outlet, and the first air inlet and the first air outlet are respectively arranged on one side of the lens module and one side of the middle frame.

[0020] In some embodiments, the heat dissipation module is arranged on the heat generating component; or, a vapor chamber is arranged on the middle frame, and the heat dissipation module is arranged on the vapor chamber.

[0021] The above description is only a summary of the technical solutions of the present application. In order to enable one skilled in the art to better understand the technical means of the present application, the content of the specification can be implemented, and in order to enable the above and other purposes, features and advantages of the present application to be more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or conventional technology description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.

[0023] Figure 1 is a structural schematic diagram of a heat dissipation module provided by some embodiments of the present application (the heat dissipation fins are below the piezoelectric fan, and the first air inlet is on the upper side);

[0024] Figure 2 is a structural schematic diagram of a heat dissipation module provided by some embodiments of the present application (the heat dissipation fins are below the piezoelectric fan, and the first air inlet is on the upper side);

[0025] Figure 3 is a structural schematic diagram of a piezoelectric fan provided by some embodiments of the present application;

[0026] Figure 4 is a structural schematic diagram of a heat dissipation module provided by some embodiments of the present application (the heat dissipation fins are on the side of the piezoelectric fan in the horizontal direction, and the first air inlet is on the upper side);

[0027] Figure 5 is a structural schematic diagram of a heat dissipation module provided by some embodiments of the present application (the heat dissipation fins are on the side of the piezoelectric fan in the horizontal direction, and the first air inlet is on the upper side);

[0028] Figure 6 is a structural schematic diagram of a piezoelectric fan provided by some embodiments of the present application;

[0029] Figure 7 is a structural schematic diagram of a heat dissipation module provided by some embodiments of the present application (the heat dissipation fins are below the piezoelectric fan, and the first air inlet is on the upper side);

[0030] Figure 8is a structural schematic diagram of a heat dissipation module (the heat dissipation fins are above the piezoelectric fan, and the first air inlet is at one side in the horizontal direction) provided by some embodiments of the present application;

[0031] Figure 9 is a structural schematic diagram of a heat dissipation module (the heat dissipation fins are at one side in the horizontal direction of the piezoelectric fan, and the first air inlet is at the upper side) provided by some embodiments of the present application;

[0032] Figure 10 is a structural schematic diagram of a heat dissipation module (the heat dissipation fins are at one side in the horizontal direction of the piezoelectric fan, and the first air inlet is at one side in the horizontal direction) provided by some embodiments of the present application;

[0033] Figure 11 is a structural schematic diagram of a piezoelectric fan provided by some embodiments of the present application;

[0034] Figure 12 is a structural schematic diagram of an electronic device provided by some embodiments of the present application;

[0035] Figure 13 is a structural schematic diagram of air flow direction when the electronic device dissipates heat provided by some embodiments of the present application;

[0036] Figure 14 is a structural schematic diagram of air flow direction when the electronic device dissipates heat provided by some embodiments of the present application;

[0037] Figure 15 is a structural schematic diagram of air flow direction when the electronic device dissipates heat provided by some embodiments of the present application;

[0038] Figure 16 is a structural schematic diagram of air flow direction when the electronic device dissipates heat provided by some embodiments of the present application.

[0039] The meanings of the marks in the figures are as follows:

[0040] 100, an electronic device;

[0041] 10, a heat dissipation module;

[0042] 11, a housing; 111, a housing body; 1111, a first air inlet; 1112, a first air outlet; 112, a heat dissipation base body;

[0043] 12, a piezoelectric fan; 121, a second air inlet; 122, a second air outlet; 123, a piezoelectric vibrator;

[0044] 13, a heat dissipation fin;

[0045] 14, a thermal interface material layer;

[0046] 20, a heat generating component;

[0047] 30, screen;

[0048] 40, middle frame;

[0049] 50, rear cover; 51, lens module;

[0050] 60, vapor chamber. DETAILED DESCRIPTION

[0051] The embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above description of drawings are intended to cover non-exclusive inclusion.

[0053] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise explicitly and specifically limited.

[0054] Reference herein to "embodiments" means that the specific features, structures or properties described in connection with the embodiments can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily mean the same embodiment, nor is it an independent or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0055] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents a "or" relationship between the front and rear associated objects.

[0056] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two), and similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0057] In the description of the embodiments of the present application, the orientations or positional relationships indicated by the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application.

[0058] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connection", "connection", "fixing" and other terms should be understood in a broad sense, for example, can be fixed connection, or can be detachable connection, or can be integrated; can be mechanical connection, or can be electrical connection; can be directly connected, or can be indirectly connected through an intermediate medium, or can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0059] At present, the heat dissipation modes of the heat generating components of electronic devices include passive heat dissipation and active heat dissipation.

[0060] Traditional passive heat dissipation technologies such as graphite patches and metal frames rely only on heat conduction for natural heat dissipation, without active air flow, and the heat dissipation efficiency is greatly affected by the thermal conductivity of the material and the environment. When the heat flux density of the heat generating component is large, the heat cannot be dissipated in time, local hot spots are easily formed, the temperature of the heat generating component is increased, the performance is decreased, and even failure occurs.

[0061] Existing active heat dissipation technologies such as axial flow fans have a large volume, are limited by the narrow space in the electronic device, have poor layout flexibility, and are easy to interfere with other elements such as batteries inside the electronic device; rely on motor rotation to drive the blade to rotate to generate air flow, and have a large operating noise.

[0062] In order to solve the problems of large volume and large noise of the heat dissipation fan in the prior art, the present application provides a heat dissipation module and an electronic device.

[0063] Embodiments of the first aspect of the present application provide a heat dissipation module. Please refer to Figure 1 The heat dissipation module 10 includes a shell 11 and a piezoelectric fan 12, the shell 11 has a first air inlet 1111 and a first air outlet 1112, and the piezoelectric fan 12 is in the shell 11; the piezoelectric fan 12 has a second air inlet 121 and a second air outlet 122, the second air inlet 121 is communicated with the first air inlet 1111, and the second air outlet 122 is communicated with the first air outlet 1112; the piezoelectric fan 12 is used for sucking cold air from the first air inlet 1111 and discharging hot air from the first air outlet 1112.

[0064] When the piezoelectric fan 12 is working, cold air enters the shell 11 through the first air inlet 1111, and hot air is discharged from the first air outlet 1112. It can be understood that the first air inlet 1111 can be provided with one or more, and the first air outlet 1112 can be provided with one or more.

[0065] It can be understood that the second air inlet 121 can be provided with one or more, and the second air outlet 122 can be provided with one or more.

[0066] Among them, the shape of the first air inlet 1111, the first air outlet 1112, the second air inlet 121 and the second air outlet 122 is not limited in the present application, for example, can be circular, oval, rectangular, petal-shaped, etc.

[0067] It can be understood that the shell 11 is entirely made of metal material with good heat conduction performance; or, part of the shell 11 is made of metal material with good heat conduction performance.

[0068] Among them, the piezoelectric fan 12 is a mature product, and its working principle will not be described in detail here.

[0069] The heat dissipation module 10 provided by the embodiment of the present application has the beneficial effects that when the heat dissipation module 10 is installed on the device main body of the electronic device 100, the heat of the heat generating component 20 is directly or indirectly conducted to the shell 11 and enters the inside of the shell 11, the piezoelectric fan 12 sucks in cold air from the first air inlet 1111 to take away heat, and hot air is discharged from the first air outlet 1112 to realize active heat dissipation, thereby realizing heat dissipation of the heat generating component 20. Since the size of the piezoelectric fan 12 is small, the overall size of the heat dissipation module 10 is relatively small, and the piezoelectric fan 12 relies on high-frequency reciprocating vibration to generate airflow, without motor rotation, which can reduce noise, solving the problem of large volume and high noise of the heat dissipation fan in the prior art.

[0070] Among them, the piezoelectric fan 12 is in the shell 11, and except for the first air inlet 1111 and the first air outlet 1112, the rest of the positions are all sealed, so it has good dustproof and waterproof performance; moreover, the piezoelectric fan 12 mainly relies on the principle of synthetic jet, and relies on the piezoelectric vibrator 123 with high-frequency vibration to spray air, so there will not be a large negative pressure area in the air inlet area, which effectively prevents dust from entering the inside of the shell 11 due to the action of pressure difference. In addition, the air duct formed in the shell 11 has a good constraint and flow guiding effect on the airflow, reducing the air duct noise caused by turbulence and vortex in the flow process.

[0071] In some embodiments, the heat dissipation module 10 further comprises a heat dissipation fin 13, which is located in the shell 11, and the cold air sucked in by the piezoelectric fan 12 from the first air inlet 1111 is used to take away the heat of the heat dissipation fin 13.

[0072] The piezoelectric fan 12 and the heat dissipation fin 13 are both located in the shell 11, and it can be understood that the piezoelectric fan 12 and the heat dissipation fin 13 are located in the flow path of the air flow. Among them, in the flow direction of the air flow, the piezoelectric fan 12 can be located upstream of the heat dissipation fin 13, or located downstream of the heat dissipation fin 13.

[0073] It can be understood that the heat dissipation fin 13 is made of a metal material with good heat conduction performance, for example, the heat dissipation fin 13 is made of copper material, or the heat dissipation fin 13 is made of aluminum material.

[0074] Among them, the part of the shell 11 corresponding to the heat dissipation fin 13 is made of a metal material with good heat conduction performance.

[0075] Please refer to Figure 1 , Figure 2 , Figure 4 and Figure 5 , in some embodiments, in the flow direction of the air flow, the heat dissipation fin 13 is located downstream of the piezoelectric fan 12, and the second air outlet 122 is directed towards the heat dissipation fin 13.

[0076] The heat dissipation fin 13 is located downstream of the piezoelectric fan 12, which can be understood as that the air flow first flows through the piezoelectric fan 12 and then flows to the heat dissipation fin 13.

[0077] Based on the above technical solution, the second air outlet 122 is directed towards the heat dissipation fin 13, so that the air flow generated by the piezoelectric fan 12 is directly blown to the heat dissipation fin 13 through the second air outlet 122, which can accelerate the heat exchange between the heat dissipation fin 13 and the air, and is beneficial to improve the heat dissipation efficiency.

[0078] In other embodiments, the second air outlet 122 can not be directed towards the heat dissipation fin 13, and the air flow blown out by the second air outlet 122 is turned 90° and then blown to the heat dissipation fin 13.

[0079] Please refer to Figure 1 and Figure 2 , in some embodiments, the second air outlet 122 is directed downwards, and the heat dissipation fin 13 is located below the piezoelectric fan 12.

[0080] Exemplarily, in the direction shown in Figure 1 , the first air inlet 1111 is located at the upper side of the shell 11, and the first air outlet 1112 is located at the right side of the shell 11; the second air inlet 121 is located at the upper side of the piezoelectric fan 12, and the second air outlet 122 is located at the lower side of the piezoelectric fan 12.

[0081] Exemplarily, in the direction shown in Figure 2 the first air inlet 1111 is on the left side of the shell 11, and the first air outlet 1112 is on the right side of the shell 11; the second air inlet 121 is on the upper side of the piezoelectric fan 12, and the second air outlet 122 is on the lower side of the piezoelectric fan 12.

[0082] The airflow generated by the piezoelectric fan 12 directly blows to the heat dissipation fins 13 through the second air outlet 122, and then the airflow is turned by 90° and discharged from the first air outlet 1112. Among them, when the piezoelectric fan 12 is running at low power consumption, the airflow speed blown out from the second air outlet 122 of the piezoelectric fan 12 reaches 40-60 m / s, and the high-speed blown airflow can effectively destroy the thermal boundary layer on the heat dissipation fins 13, accelerate the heat exchange between the heat dissipation fins 13 and the air, and significantly improve the heat transfer speed compared with the traditional passive heat dissipation and axial flow fan active heat dissipation scheme.

[0083] Exemplarily, the heat dissipation fins 13 are arranged on the inner side of the bottom wall of the shell 11, and the heat generating component 20 or the vapor chamber 60 is arranged on the outer side of the bottom wall of the shell 11.

[0084] For the piezoelectric fan 12 in Figure 1 and Figure 2 , please refer to Figure 3 In some embodiments, the upper side of the piezoelectric fan 12 is provided with two second air inlets 121, and the lower side of the piezoelectric fan 12 is provided with one second air outlet 122, in the left-right direction of Figure 3 , the second air outlet 122 is between the two second air inlets 121. Among them, the piezoelectric fan 12 is internally provided with a piezoelectric vibrator 123 (including a vibration plate and a piezoelectric element), and through the vibration of the piezoelectric vibrator 123, the air enters from the second air inlet 121 and flows out from the second air outlet 122.

[0085] Please refer to Figure 4 and Figure 5 , in some embodiments, the second air outlet 122 is towards the horizontal direction, and the heat dissipation fins 13 are on one side of the piezoelectric fan 12 in the horizontal direction.

[0086] Exemplarily, in the direction shown in Figure 4 , the first air inlet 1111 is on the upper side of the shell 11, and the first air outlet 1112 is on the right side of the shell 11; the second air inlet 121 is on the upper side of the piezoelectric fan 12, and the second air outlet 122 is on the right side of the piezoelectric fan 12.

[0087] Exemplarily, in the direction shown in Figure 5In the direction shown, the first air inlet 1111 is on the left side of the shell 11, and the first air outlet 1112 is on the right side of the shell 11; the second air inlet 121 is on the upper side of the piezoelectric fan 12, and the second air outlet 122 is on the right side of the piezoelectric fan 12.

[0088] In some embodiments, the heat dissipation fin 13 is upstream of the piezoelectric fan 12, and the second air outlet 122 is directed toward the first air outlet 1112.

[0089] In some embodiments, the heat dissipation fin 13 is upstream of the piezoelectric fan 12, and the second air outlet 122 is directed toward the first air outlet 1112.

[0090] For the piezoelectric fan 12 in Figure 4 and Figure 5 , please refer to Figure 6 In some embodiments, the upper side of the piezoelectric fan 12 is provided with a second air inlet 121, and the right side of the piezoelectric fan 12 is provided with a second air outlet 122. In the piezoelectric fan 12, a piezoelectric vibrator 123 is arranged inside the piezoelectric fan 12, and through the vibration of the piezoelectric vibrator 123, the air enters from the second air inlet 121 and flows out from the second air outlet 122.

[0091] For the piezoelectric fan 12 in Figures 7 to 10 , please refer to In some embodiments, the heat dissipation fin 13 is upstream of the piezoelectric fan 12, and the second air outlet 122 is directed toward the first air outlet 1112.

[0092] The heat dissipation fin 13 is upstream of the piezoelectric fan 12, which can be understood as the air flow first flows through the heat dissipation fin 13, and then flows to the piezoelectric fan 12.

[0093] In some embodiments, please refer to Figure 7 and Figure 8 , the heat dissipation fin 13 is above the piezoelectric fan 12.

[0094] Exemplarily, in Figure 7 , in the direction shown, the first air inlet 1111 is on the upper side of the shell 11, and the first air outlet 1112 is on the right side of the shell 11; the second air inlet 121 is on the upper side of the piezoelectric fan 12, and the second air outlet 122 is on the right side of the piezoelectric fan 12.

[0095] Exemplarily, in Figure 8In the direction shown, the first air inlet 1111 is located on the left side of the housing 11, and the first air outlet 1112 is located on the right side of the housing 11; the second air inlet 121 is located on the upper side of the piezoelectric fan 12, and the second air outlet 122 is located on the right side of the piezoelectric fan 12.

[0096] The heat dissipation fins 13 are located on the inner side of the top wall of the housing 11, and the heat-generating component 20 or the heat dissipation plate 60 is located on the outer side of the top wall of the housing 11.

[0097] Please refer to Figure 9 and Figure 10 In some embodiments, the heat sink 13 is located on the side of the piezoelectric fan 12 in the horizontal direction.

[0098] For example, in Figure 9 In the indicated direction, the first air inlet 1111 is located on the upper side of the housing 11, and the first air outlet 1112 is located on the right side of the housing 11; the second air inlet 121 is located on the left side of the piezoelectric fan 12, and the second air outlet 122 is located on the right side of the piezoelectric fan 12.

[0099] For example, in Figure 10 In the indicated direction, the first air inlet 1111 is located on the left side of the housing 11, and the first air outlet 1112 is located on the right side of the housing 11; the second air inlet 121 is located on the left side of the piezoelectric fan 12, and the second air outlet 122 is located on the right side of the piezoelectric fan 12.

[0100] The heat dissipation fins 13 are located on the left side of the piezoelectric fan 12. Understandably, the heat dissipation fins 13 can be located on the inner side of the bottom wall of the housing 11, and correspondingly, the heat-generating component 20 or the heat spreader 60 is located on the outer side of the bottom wall of the housing 11; the heat dissipation fins 13 can also be located on the inner side of the top wall of the housing 11, and correspondingly, the heat-generating component 20 or the heat spreader 60 is located on the outer side of the top wall of the housing 11.

[0101] for Figure 9 and Figure 10 The piezoelectric fan 12 in the middle can be referred to Figure 11 In some embodiments, the piezoelectric fan 12 has a second air inlet 121 on its left side and a second air outlet 122 on its right side. The piezoelectric fan 12 contains a piezoelectric vibrator 123, which vibrates to allow air to enter through the second air inlet 121 and exit through the second air outlet 122.

[0102] In some other embodiments, the first air outlet 1112 may also be located on the upper side of the housing 11.

[0103] Please refer to Figure 1 In some embodiments, the housing 11 includes a housing body 111 and a heat dissipation base 112, with heat dissipation fins 13 disposed on the heat dissipation base 112.

[0104] The heat dissipation base 112 is made of a metal material with good heat conduction performance, for example, the heat dissipation base 112 is made of copper material, or the heat dissipation base 112 is made of aluminum material. It can be understood that the material of the heat dissipation base 112 and the material of the heat dissipation fins 13 can be the same or different.

[0105] The shell body 111 can be made of a metal material or a non-metal material (for example, plastic).

[0106] It can be understood that the heat dissipation base 112 can be integrally formed with the heat dissipation fins 13, or the heat dissipation base 112 can be fixedly connected with the heat dissipation fins 13 by welding, clamping, fastener connection or the like.

[0107] It can be understood that the heat dissipation base 112 can be integrally formed with the shell body 111, or the heat dissipation base 112 can be fixedly connected with the shell body 111 by welding, clamping, fastener connection or the like.

[0108] The heat dissipation base 112 is in contact with the heat generating component 20, or the heat dissipation base 112 is in contact with the heat spreading plate 60 (for uniformly spreading the heat of the heat generating component 20). Exemplarily, a thermal interface material (TIM) layer 14 is arranged between the heat dissipation base 112 and the heat generating component 20 or between the heat dissipation base 112 and the heat spreading plate 60, which functions to fill the micro gaps of the contact surface between the heat generating component 20 and the heat dissipation base 112, replace the air with low thermal conductivity, and reduce the contact thermal resistance, thereby optimizing the heat dissipation performance.

[0109] In other embodiments, the shell 11 includes the shell body 111 but does not include the heat dissipation base 112, and the heat dissipation fins 13 are arranged on the shell body 111. At this time, the shell body 111 can be made of a metal material with good heat conduction performance. It can be understood that the heat dissipation fins 13 can be integrally formed with the shell body 111, or the heat dissipation fins 13 can be fixedly connected with the shell body 111 by welding, clamping, fastener connection or the like.

[0110] The heat dissipation module 10 provided by the embodiments of the present application has the structural feature of miniaturization, has wide adaptability and compatibility for mainstream mobile terminal devices (such as mobile phones), and can be flexibly configured according to the internal space layout of the device.

[0111] Please refer to Figure 12 The second aspect of the present application provides an electronic device 100, which includes a device main body and the heat dissipation module 10 as described in the first aspect, the device main body is provided with a heat generating component 20, and the heat dissipation module 10 is arranged in the device main body and is used for dissipating heat of the heat generating component 20.

[0112] Exemplarily, the electronic device 100 can be a mobile terminal device with certain requirement for heat dissipation, such as a smart phone, a tablet computer, a notebook computer, a wearable device (such as a smart watch, AR glasses, a bracelet), a vehicle-mounted intelligent terminal, etc. Of course, the electronic device 100 can also be a charger, a sports camera, etc.

[0113] The electronic device 100 adopts any one or more embodiments of the heat dissipation module 10 described above, thus having the beneficial effects of the above embodiments, which will not be repeated here.

[0114] Please refer to Figure 12 In some embodiments, the device body includes a screen 30, a middle frame 40 and a back cover 50, which are connected in sequence, the heat generating component 20 and the heat dissipation module 10 are arranged on the middle frame 40, and the back cover 50 is provided with a lens module 51.

[0115] Exemplarily, the upper side of the heat dissipation module 10 is the back side of the device body.

[0116] Exemplarily, the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at opposite sides of the lens module 51, as shown in Figure 13 Exemplarily, the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at opposite sides of the lens module 51, as shown in

[0117] Exemplarily, the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at adjacent sides of the lens module 51. For example, the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the left side and the upper side of the lens module 51; or the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the left side and the lower side of the lens module 51; or the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the upper side and the right side of the lens module 51; or the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the lower side and the right side of the lens module 51.

[0118] Exemplarily, the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at one side of the lens module 51 and one side of the middle frame 40. For example, please refer to Figure 14 Exemplarily, the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at one side of the lens module 51 and one side of the middle frame 40. For example, please refer to

[0119] Exemplarily, the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at opposite sides of the middle frame 40, for example, please refer to Figure 15The air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the left side and the right side of the middle frame 40. Of course, the air inlet side and the air outlet side of the heat dissipation module 10 can also be respectively located at the upper side and the lower side of the middle frame 40.

[0120] Exemplarily, the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at two adjacent sides of the middle frame 40. For example, refer to Figure 16 The air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the left side and the upper side of the middle frame 40; or the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the left side and the lower side of the middle frame 40; or the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the upper side and the right side of the middle frame 40; or the air inlet side and the air outlet side of the heat dissipation module 10 are respectively located at the lower side and the right side of the middle frame 40.

[0121] It should be noted that the air inlet side of the heat dissipation module 10 is arranged corresponding to the first air inlet 1111, and the air outlet side of the heat dissipation module 10 is arranged corresponding to the first air outlet 1112.

[0122] For example, refer to Figure 12 In some embodiments, the middle frame 40 is provided with a vapor chamber 60, and the heat dissipation module 10 is arranged on the vapor chamber 60.

[0123] Exemplarily, the vapor chamber 60 is a VC (Vapor Chamber) vapor chamber.

[0124] When the electronic device 100 is running, the heat generating component 20 (heat source) generates heat, which is first transmitted to the VC vapor chamber through heat conduction. The VC vapor chamber can quickly and uniformly spread the heat to a larger area by using the phase change (cycle of liquid to gas and then to liquid) of the internal working medium. Then, the heat is conducted to the heat dissipation fins 13, and the heat dissipation module 10 drives the airflow by using the piezoelectric fan 12 to accelerate the heat exchange between the heat on the heat dissipation fins 13 and the outside air, so as to dissipate the heat to the surrounding environment.

[0125] In other embodiments, the heat dissipation module 10 can be arranged on the heat generating component 20, that is, the heat generated by the heat generating component 20 is directly conducted to the heat dissipation fins 13, and the heat dissipation module 10 drives the airflow by using the piezoelectric fan 12 to accelerate the heat exchange between the heat on the heat dissipation fins 13 and the outside air, so as to dissipate the heat to the surrounding environment.

[0126] In some embodiments, the screen 30, the middle frame 40, the back cover 50 and other components also assist in dissipating part of the heat through heat conduction, heat radiation and other ways, so as to jointly ensure that the electronic device 100 keeps in a reasonable temperature range during the working process, and avoid affecting the performance and service life due to overheating.

[0127] The above examples are only used to illustrate the technical solutions of the present application, but not limit the same; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent ones; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A heat dissipation module, characterized by: The heat dissipation module comprises a shell and a piezoelectric fan, the shell has a first air inlet and a first air outlet, and the piezoelectric fan is in the shell; the piezoelectric fan has a second air inlet and a second air outlet, the second air inlet communicates with the first air inlet, and the second air outlet communicates with the first air outlet; the piezoelectric fan is used for sucking cold air from the first air inlet and discharging hot air from the first air outlet.

2. The heat dissipating module of claim 1, wherein: The heat dissipation module further comprises a heat dissipation fin in the shell, and the cold air sucked by the piezoelectric fan from the first air inlet is used for taking away the heat of the heat dissipation fin.

3. The heat dissipating module of claim 2, wherein: In the flow direction of the air flow, the heat dissipation fin is downstream of the piezoelectric fan, and the second air outlet is towards the heat dissipation fin.

4. The heat dissipating module of claim 3, wherein: The second air outlet is downward, and the heat dissipation fin is below the piezoelectric fan; or the second air outlet is horizontally, and the heat dissipation fin is on one side of the piezoelectric fan in the horizontal direction.

5. The heat dissipating module of claim 2, wherein: In the flow direction of the air flow, the heat dissipation fin is upstream of the piezoelectric fan, and the second air outlet is towards the first air outlet.

6. The heat dissipating module of claim 5, wherein: The heat dissipation fin is above the piezoelectric fan; or the heat dissipation fin is on one side of the piezoelectric fan in the horizontal direction.

7. The heat dissipating module of any one of claims 1-6, wherein: The first air inlet is on the upper side of the shell, or the first air inlet is on one side of the shell in the horizontal direction.

8. The heat dissipating module of any one of claims 2-6, wherein: The shell comprises a shell body and a heat dissipation base connected with the shell body, and the heat dissipation fin is arranged on the heat dissipation base.

9. An electronic device, comprising: The heat dissipation module comprises a shell and a piezoelectric fan, the shell has a first air inlet and a first air outlet, and the piezoelectric fan is in the shell; the piezoelectric fan has a second air inlet and a second air outlet, the second air inlet communicates with the first air inlet, and the second air outlet communicates with the first air outlet; the piezoelectric fan is used for sucking cold air from the first air inlet and discharging hot air from the first air outlet.

10. The electronic device of claim 9, wherein: The heat dissipation module further comprises a heat dissipation fin in the shell, and the cold air sucked by the piezoelectric fan from the first air inlet is used for taking away the heat of the heat dissipation fin. In the flow direction of the air flow, the heat dissipation fin is downstream of the piezoelectric fan, and the second air outlet is towards the heat dissipation fin. The second air outlet is downward, and the heat dissipation fin is below the piezoelectric fan; or the second air outlet is horizontally, and the heat dissipation fin is on one side of the piezoelectric fan in the horizontal direction. In the flow direction of the air flow, the heat dissipation fin is upstream of the piezoelectric fan, and the second air outlet is towards the first air outlet.

11. The electronic device of claim 10, wherein: The heat dissipation fin is above the piezoelectric fan; or the heat dissipation fin is on one side of the piezoelectric fan in the horizontal direction. The first air inlet is on the upper side of the shell, or the first air inlet is on one side of the shell in the horizontal direction. The shell comprises a shell body and a heat dissipation base connected with the shell body, and the heat dissipation fin is arranged on the heat dissipation base. The heat dissipation module comprises a shell and a piezoelectric fan, the shell has a first air inlet and a first air outlet, and the piezoelectric fan is in the shell; the piezoelectric fan has a second air inlet and a second air outlet, the second air inlet communicates with the first air inlet, and the second air outlet communicates with the first air outlet; the piezoelectric fan is used for sucking cold air from the first air inlet and discharging hot air from the first air outlet. The heat dissipation module further comprises a heat dissipation fin in the shell, and the cold air sucked by the piezoelectric fan from the first air inlet is used for taking away the heat of the heat dissipation fin. In the flow direction of the air flow, the heat dissipation fin is downstream of the piezoelectric fan, and the second air outlet is towards the heat dissipation fin. The second air outlet is downward, and the heat dissipation fin is below the piezoelectric fan; or the second air outlet is horizontally, and the heat dissipation fin is on one side of the piezoelectric fan in the horizontal direction. In the flow direction of the air flow, the heat dissipation fin is upstream of the piezoelectric fan, and the second air outlet is towards the first air outlet. The heat dissipation fin is above the piezoelectric fan; or the heat dissipation fin is on one side of the piezoelectric fan in the horizontal direction. The first air inlet is on the upper side of the shell, or the first air inlet is on one side of the shell in the horizontal direction. The shell comprises a shell body and a heat dissipation base connected with the shell body, and the heat dissipation fin is arranged on the heat dissipation base. The heat dissipation module comprises a shell and a piezoelectric fan, the shell has a first air inlet and a first air outlet, and the piezoelectric fan is in the shell; the piezoelectric fan has a second air inlet and a second air outlet, the second air inlet communicates with the first air inlet, and the second air outlet communicates with the first air outlet; the piezoelectric fan is used for sucking cold air from the first air inlet and discharging hot air from the first air outlet. The heat dissipation module further comprises a heat dissipation fin in the shell, and the cold air sucked by the piezoelectric fan from the first air inlet is used for taking away the heat of the heat dissipation fin.

Images