Chip packaging structure of brushless motor

Abstract

The utility model provides a chip packaging structure of a brushless motor, which comprises a packaging frame, a motor driving chip, an MOS chip and an MCU chip, four side edges of the packaging frame are provided with pins, the packaging frame is provided with a redistribution layer (RDL), and the motor driving chip is connected with the MCU chip. And the motor driving chip, the MOS chip and the MCU chip are integrated in the packaging frame through the RDL and are respectively connected with the pins on different side edges. According to the embodiment of the invention, the area of the packaging frame is fully utilized, so that a plurality of chips can be placed in the base island and are integrated through the RDL, the integration level and the space utilization rate of the chips are improved, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a chip packaging structure of a brushless motor. BACKGROUND

[0002] In the early stage, the packaging method of integrated circuits is mainly single-chip packaging (SCP), that is, a single chip is packaged in a circuit board. However, as the functional requirements of electronic devices continue to increase, single-chip packaging cannot meet the integration requirements of multiple different functional modules. In order to solve this problem, multi-chip packaging (MCP) technology emerges as the times require, which refers to integrating multiple chip components with different functions in one circuit board, so that the device has higher integration and smaller packaging size.

[0003] In the prior art, the brushless motor integrates the MCU chip, the motor drive chip and the MOS chip in the same chip through the above-mentioned multi-chip packaging technology, and then the functions are led out through the PIN pins on the frame. However, due to the use of wiring, this technology has many limitations, such as adjacent Pad wiring cannot have intersecting lines, etc., resulting in the need to rotate the wafer on the carrier to avoid the production risk caused by the limitation, and the Pad position on the wafer cannot be changed, so that it may not be integrated or waste a lot of carrier area. SUMMARY

[0004] In view of this, the present application provides a chip packaging structure of a brushless motor to improve the integration and space utilization of the chip.

[0005] The present application provides a chip packaging structure of a brushless motor, which comprises a packaging frame, a motor drive chip, a MOS chip and an MCU chip. The four sides of the packaging frame are provided with pins. A redistribution layer RDL is arranged on the packaging frame. The motor drive chip, the MOS chip and the MCU chip are integrated in the packaging frame through the redistribution layer RDL and are connected to the pins on different sides, respectively.

[0006] In some embodiments, the redistribution layer RDL forms metal wires by depositing metal layers and dielectric layers. One end of the metal wires is connected to the pad position of the motor drive chip, the MOS chip and the MCU chip, and the other end is connected to the pins on the packaging frame.

[0007] In some embodiments, the redistribution layer RDL connects the pad position of the motor drive chip and the pins on the first side through three metal wires. The redistribution layer RDL connects the pad position of the MOS chip and the pins on the second side through two metal wires. The redistribution layer RDL connects the pad position of the MCU chip and the pins on the third side through three metal wires.

[0008] In some embodiments, the packaging frame is rectangular in shape, with the first side and the third side located on opposite sides of the packaging frame, and the second side adjacent to the first side and the third side respectively.

[0009] In some embodiments, the motor drive chip, MOS chip, and MCU chip generate crystal pillars at the pad locations using an electrolytic deposition process to connect the metal wiring.

[0010] In some embodiments, the motor drive chip, MOS chip, and MCU chip are mounted on the packaging frame using a flip-chip packaging method.

[0011] In some embodiments, the ingots of the motor drive chip, MOS chip, and MCU chip are bonded to the packaging frame by reflow soldering.

[0012] In some embodiments, the motor drive chip, MOS chip, and MCU chip are integrated on the same base island within the package frame.

[0013] In some embodiments, the chip package structure further includes a molding compound that covers the package frame, the motor driver chip, the MOS chip, and the MCU chip, with the pins located between the base island and the edge of the molding compound.

[0014] In some embodiments, the MOS chip includes a plurality of P-MOS chips and a plurality of N-MOS chips, wherein the P-MOS chips and N-MOS chips are disposed on the packaging frame by means of tiling or stacking.

[0015] This application provides a chip packaging structure for a brushless motor, including a packaging frame, a motor driver chip, a MOS chip, and an MCU chip. Pins are provided on all four sides of the packaging frame. A redistribution layer (RDL) is disposed on the packaging frame. The motor driver chip, MOS chip, and MCU chip are integrated within the packaging frame via the RDL and connected to pins on different sides. This embodiment fully utilizes the area of ​​the packaging frame, allowing multiple chips to be placed in the base island and integrated via the RDL, thus improving chip integration and space utilization while reducing production costs. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of one possible chip packaging structure for the brushless motor provided in this application.

[0018] Figure 2 This is another schematic diagram of the chip packaging structure of the brushless motor provided in this application. Detailed Implementation

[0019] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. In the description of this application, "several" means at least one, such as one, two, etc., unless otherwise explicitly specified.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. The terms "connection," "electrical connection," and "electrical link" as used herein include any direct and indirect electrical or structural connection means. Therefore, if a first device is described herein as coupled / connected / electrically connected to a second device, it means that the first device can be directly electrically / structurally connected to the second device, or indirectly electrically / structurally connected to the second device through other means or connection methods.

[0022] This application provides a chip packaging structure for a brushless motor, including a packaging frame, a motor driver chip, a MOS chip, and an MCU chip. Pins are provided on all four sides of the packaging frame, and a redistribution layer (RDL) is provided on the packaging frame. The motor driver chip, MOS chip, and MCU chip are integrated and disposed within the packaging frame through the redistribution layer (RDL) and are respectively connected to the pins on different sides.

[0023] Please refer to Figure 1 ,Figure 1 This is a schematic diagram of a chip packaging structure for a brushless motor provided in this application. The chip packaging structure 10 for the brushless motor in this application includes a packaging frame 100, a motor driver chip 300, a MOS chip 400, and an MCU chip 500. The packaging frame 100 can be rectangular in shape, and each of the four sides of the rectangle is provided with pins 110, 120, 130, and 140, respectively.

[0024] In one embodiment, the redistribution layer (RDL) can form metal wiring by depositing metal layers and dielectric layers. One end of the metal wiring connects to the pad positions of the motor driver chip 300, MOS chip 300, and MCU chip 500, and the other end connects to the pins on the package frame 100. The RDL is mainly used to redistribute the input / output (I / O) ports of the chips, enabling connections between the chips and external circuits. For motor driver chips, MOS chips, and MCU chips, the RDL connects the pad positions of these chips to the pins on the package frame, enabling effective signal transmission and power supply between chips and between chips and external circuits. For example, metal layers can be deposited on the chip surface or other substrates using methods such as physical vapor deposition (PVD), chemical vapor deposition (CVD), or electroplating. Commonly used metal materials include copper and aluminum, which have good electrical and thermal conductivity. Dielectric layers are deposited between the metal layers or between the metal layers and the chip surface to achieve insulation and isolation. The dielectric layer can be an insulating material such as silicon dioxide or silicon nitride. Finally, the metal and dielectric layers are patterned using processes such as photolithography and etching to form the desired metal wiring. The photolithography process uses photoresist to transfer the designed pattern onto the metal and dielectric layers, and then etching removes the unwanted parts, leaving the metal wiring.

[0025] Furthermore, the motor driver chip 300, MOS chip 300, and MCU chip 500 have multiple pads for connecting to external circuits. One end of the RDL's metal wiring connects to the pads of these chips, enabling the connection between the internal circuitry and the external circuitry. The connection can be direct contact or via bumps or other connection structures. Direct contact means the metal wiring directly contacts the chip pads, achieving electrical connection through soldering or other methods. Bump connection involves forming bumps on the chip pads and then connecting them via metal wiring. The pins on the package frame are the interfaces for connecting to external circuit boards. The other end of the RDL's metal wiring connects to the pins on the package frame 100, transmitting the chip's signals and power to the external circuit board. Connection methods can include soldering, crimping, or other reliable connection methods. RDL allows for finer metal wiring to be formed on the chip surface, increasing package density, reducing package size, and optimizing signal transmission paths by redistributing chip I / O ports, reducing signal delay and interference, and improving signal integrity.

[0026] Specifically, the redistribution layer RDL can be connected to the pad position of the motor driver chip 300 and the pin 110 on the first side through three metal wires, to the pad position of the MOS chip 400 and the pin 120 on the second side through two metal wires, and to the pad position of the MCU chip 500 and the pin 130 on the third side through three metal wires.

[0027] In one embodiment, please continue to refer to Figure 1 The first and third sides are located on opposite sides of the packaging frame 100, and the second side is adjacent to both the first and third sides. This arrangement avoids intersections between the motor drive chip 300, MOS chip 300, and MCU chip 500 and their pins, reducing the requirements for the frame and the manufacturing risks associated with wire bonding, thus improving system performance and reliability.

[0028] In one embodiment, the motor driver chip 300, MOS chip 300, and MCU chip 500 can be integrated onto the same base island 200 within the packaging frame 100. This arrangement allows for a high degree of integration between the MCU chip, the motor driver chip, and the MOS chip. By packaging multiple chips into a single chip, the overall space utilization of the chip is improved, and the production cost of semiconductor devices is reduced. Through the chip integration method in this embodiment, at least three or more integrated circuit chips will be integrated into the brushless motor. Furthermore, since the base island 200 needs to integrate multiple chips, the area of ​​the selected base island 200 can be increased by etching or stamping, based on the actual dimensions of the motor driver chip 300, MOS chip 300, and MCU chip 500.

[0029] Please continue reviewing. Figure 2 In this process, motor driver chips, MOS chips, and MCU chips can be deposited onto pads using electrolytic deposition to create crystal pillars that connect metal wiring to corresponding pins. These chips can then be mounted on a package frame via flip-chip packaging using these crystal pillars. Electrolytic deposition is a method of depositing metal onto electrode surfaces using electrochemical principles. In this process, an electrolyte containing the metal ions to be deposited is brought into contact with the pads of the motor driver chip, MOS chip, and MCU chip. An applied current reduces the metal ions to metal crystals on the pads, forming crystal pillars. These pillars serve as connection structures, ensuring a reliable connection between the chip pads and the RDL metal wiring. The pillars have a specific height and diameter to ensure sufficient contact area and good conductivity with the metal wiring. The presence of the crystal pillars makes the connection between the chip and the metal wiring more robust, able to withstand mechanical and thermal stresses during the packaging process, and ensuring stable signal and power transmission.

[0030] Flip-chip packaging is a packaging technology in which the chip is mounted face down on a package frame. In this packaging method, the chip's pads are directly connected to the metal wiring or pins on the package frame via die pillars, eliminating the need for wire bonding as in traditional packaging. For example, metal wiring and pins are first prepared on the package frame, and then the aforementioned motor driver chip, MOS chip, and MCU chip are flipped onto the package frame via die pillars, aligning the die pillars with the corresponding connection points on the package frame. In this embodiment, because the chip is directly connected to the package frame without wire bonding, the overall package size can be significantly reduced, increasing package density. Furthermore, the die pillar connection and short signal transmission path reduce signal delay and loss, improving signal integrity and speed. In addition, this setup allows the chip to be in direct contact with the package frame, facilitating rapid heat conduction and dissipation, thus improving the chip's heat dissipation efficiency.

[0031] Furthermore, the ingots of the aforementioned motor driver chip, MOS chip, and MCU chip can also be bonded to the package frame via reflow soldering. Reflow soldering is a welding method that melts solder by heating, thereby connecting electronic components to a circuit board or package frame. In this process, solder is applied to the corresponding connection points on the ingots of the motor driver chip, MOS chip, and MCU chip and the package frame. The solder is then heated to melt and solidifies upon cooling, forming a strong connection. For example, tin-lead solder or lead-free solder is used, heated at a specific temperature profile. When the temperature rises to the solder's melting point, the solder melts and wets the connection surfaces of the ingot and the package frame. As the temperature decreases, the solder solidifies, firmly bonding the ingot and the package frame together. This embodiment provides a high-strength connection by using reflow soldering, making the bond between the ingot and the package frame more robust and preventing loosening or breakage during use. Furthermore, by adjusting the reflow soldering parameters, it can adapt to different types of chips, solders, and package frames, meeting the needs of various packaging applications.

[0032] In one embodiment, the chip package structure may further include a molding compound that covers the package frame, the motor driver chip, the MOS chip, and the MCU chip, with pins disposed between the base island and the edge of the molding compound. Further, the pins may include a soldering area and multiple pins connected to the soldering area, with the multiple pins spaced apart.

[0033] In one embodiment, the aforementioned MOS chip may include multiple P-MOS chips and multiple N-MOS chips. The P-MOS chips and N-MOS chips can be disposed on the first base island in a planar or stacked manner. For example, the MOS chip may consist of three P-MOS chips and three N-MOS chips. P-MOS and N-MOS are two basic types of MOS field-effect transistors. The planar method refers to placing multiple MOS chips side-by-side on the base island and connecting them via metal wires or other connection methods. The stacked method refers to vertically stacking multiple MOS chips and connecting them via a special connection technology.

[0034] Furthermore, for the internal interconnections of the aforementioned highly integrated chips, multiple relatively thick-diameter copper wires or copper alloy wires can be evenly laid flat on the surface of each P-MOS and N-MOS chip. This is because using copper wires or copper alloy wires in highly integrated chips provides better conductivity, helping to reduce power consumption and improve signal transmission speed. Choosing thicker copper wires or copper alloy wires can reduce resistance and inductance, improving signal transmission quality. Evenly laying copper wires or copper alloy wires on the MOS chip surface ensures uniform current distribution within the chip, avoiding problems such as localized overheating and current congestion. In other embodiments, aluminum strips can also be used for internal interconnections, as aluminum strips provide sufficient conductivity while being relatively inexpensive.

[0035] This application embodiment integrates an MCU chip, a motor drive chip, and a MOS chip into a single chip using PLP packaging technology. This reduces the area of ​​the integrated chip, lowers the requirements for the frame, reduces the production risks of wire bonding processes, improves system performance and reliability, and also reduces power consumption between chips.

[0036] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, such as the combination of technical features between embodiments, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A chip packaging structure for a brushless motor, characterized in that, The package includes a package frame, a motor driver chip, a MOS chip, and an MCU chip. The package frame has pins on all four sides and a redistribution layer (RDL) is provided on the package frame. The motor driver chip, MOS chip, and MCU chip are integrated within the package frame through the redistribution layer (RDL) and are respectively connected to the pins on different sides.

2. The chip packaging structure of the brushless motor according to claim 1, characterized in that, The redistribution layer (RDL) forms metal wiring by depositing a metal layer and a dielectric layer. One end of the metal wiring is connected to the pads of the motor driver chip, MOS chip, and MCU chip, and the other end is connected to the pins on the package frame.

3. The chip packaging structure for the brushless motor according to claim 2, characterized in that, The redistribution layer RDL connects the pad position of the motor driver chip and the pin on the first side through three metal wires. The redistribution layer RDL connects the pad position of the MOS chip and the pin on the second side through two metal wires. The redistribution layer RDL connects the pad position of the MCU chip and the pin on the third side through three metal wires.

4. The chip packaging structure for the brushless motor according to claim 3, characterized in that, The packaging frame is rectangular in shape, with the first side and the third side located on opposite sides of the packaging frame, and the second side adjacent to the first side and the third side respectively.

5. The chip packaging structure for the brushless motor according to claim 2, characterized in that, The motor drive chip, MOS chip, and MCU chip are used to form crystal pillars at the pad locations through an electrolytic deposition process to connect the metal wiring.

6. The chip packaging structure for the brushless motor according to claim 5, characterized in that, The motor drive chip, MOS chip, and MCU chip are mounted on the packaging frame using a flip-chip packaging method.

7. The chip packaging structure for the brushless motor according to claim 6, characterized in that, The ingots of the motor drive chip, MOS chip, and MCU chip are bonded to the packaging frame by reflow soldering.

8. The chip packaging structure of the brushless motor according to claim 1, characterized in that, The motor drive chip, MOS chip, and MCU chip are integrated on the same base island within the package frame.

9. The chip packaging structure for the brushless motor according to claim 8, characterized in that, The chip packaging structure also includes a molding compound that covers the packaging frame, motor drive chip, MOS chip, and MCU chip, with the pins located between the base island and the edge of the molding compound.

10. The chip packaging structure for the brushless motor according to claim 1, characterized in that, The MOS chip includes multiple P-MOS chips and multiple N-MOS chips, which are arranged on the packaging frame by means of flat or stacked arrangement.

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