Novel LED packaging structure

Abstract

The utility model provides a novel LED packaging structure, belongs to the technical field of LED lamps, and solves the technical problem of how to avoid short circuit of an LED lamp caused by welding. A novel LED packaging structure comprises a glue filling body, an LED chip and a substrate which are sequentially arranged from top to bottom, the substrate comprises two pins located on the two sides, one ends of the two pins are located in the substrate and connected with the LED chip, the novel LED packaging structure is characterized in that the other ends of the two pins extend outwards and are bent in the opposite directions to form welding parts, and the welding parts are connected with the LED chip. The welding parts are used for being welded with an external circuit, so that the LED chip is electrically connected with the external circuit, and the welding parts of the two pins are separated through the glue filling body and the substrate. The welding parts of the two pins are arranged up and down, so that short circuit caused by direct communication of the two pins through soldering tin is avoided.

Description

TECHNICAL FIELD

[0001] The utility model belongs to LED lamp technical field, especially a novel LED packaging structure. BACKGROUND

[0002] As the illuminated tool, LED lamp mainly releases photon to realize light emitting by applying positive voltage to PN junction composed of P-type semiconductor and N-type semiconductor, wherein, because of its green environmental protection, low energy consumption and long service life, it is widely used in various environment lighting, the LED lamp can be divided into straight insertion type LED and patch type LED according to the shape, wherein, patch type LED is widely used in various high-density installation circuit board due to its small volume and light weight after packaging, and the positive and negative pins are welded on the circuit board to complete the communication between external circuit and LED chip.

[0003] As the patch type LED lamp with stable packaging in prior art, metal support is embedded in the inside of glue body to form a channel, and the metal support is divided into positive support and negative support, the two are electrically connected through LED chip, and the end of the two supports is wrapped down to form an inner wrapping structure, and then the upper and lower ends of LED chip are integrally filled, thereby improving the bonding force, but in the use process, since the positive support and the negative support are on the same side and close to each other, the positive and negative supports are connected due to too much welding, causing short circuit. UTILITARIAN CONTENT

[0004] The utility model aims at the above-mentioned problems existing in prior art, and provides a novel LED packaging structure, and the technical problem to be solved by the utility model is how to avoid short circuit of LED lamp caused by welding.

[0005] The utility model discloses a novel LED packaging structure, including from top to bottom sequentially arranged glue body, LED chip and substrate, the substrate includes two pins on both sides, one end of the two pins is located in the substrate and is connected with the LED chip, and the other end extends outward and is bent to form a welding part in opposite directions, and the welding part is used for welding with external circuit, so that the LED chip is electrically connected with the external circuit, and the welding parts of the two pins are separated by the glue body and the substrate.

[0006] Based on the existing top-down arrangement of potting compound, LED chip, and substrate, this application uses the potting compound and substrate to sandwich the LED chip while connecting the LED chip to an external circuit through two pins located on the substrate, enabling it to work normally. Compared to the prior art where the positive and negative electrode supports are placed on the same side, this application bends the soldering portions of the two pins in opposite directions. That is, one end of one pin is bent upwards towards the potting compound, and one end of the other pin is bent downwards towards the substrate. By bending in opposite directions, the soldering portions of the two pins are separated from the substrate by the potting compound, avoiding short circuits caused by direct connection between the two.

[0007] In the aforementioned novel LED packaging structure, the potting compound includes a damming compound disposed above the substrate, and the LED chip is located within the damming compound, with the solder joint of one of the leads located above the damming compound. The damming compound prevents the leakage of liquid encapsulation material during the encapsulation process.

[0008] In the aforementioned novel LED packaging structure, one end of the pin with a solder joint is bent into a U-shape. By bending the pin end into a U-shape, the area of ​​the LED structure is reduced while maintaining the soldering area.

[0009] In the above-mentioned novel LED packaging structure, the two pins are respectively connected to the positive and negative terminals of the LED chip, and an identification groove is provided on the damming adhesive. The identification groove is used for identification and is located on the side of the pin above the potting adhesive or on the side of the pin below the substrate.

[0010] In the above-mentioned novel LED packaging structure, a reflective layer is covered on the substrate to reflect the area above the chip.

[0011] In the aforementioned novel LED packaging structure, the substrate has a mounting area for mounting an LED chip, which is then connected to its pins via wire bonding. The LED chip is placed within the mounting area of ​​the substrate.

[0012] In the aforementioned novel LED packaging structure, the inner sidewall of the damming adhesive is inclined. After the damming adhesive is cured, the sidewall of the damming adhesive becomes inclined, thereby increasing the illumination area of ​​the LED chip when emitting light.

[0013] Compared with the prior art, the present invention has the following advantages:

[0014] 1. In the case of existing surface-mount LEDs, this application bends the soldering portions of the two pins connecting the LED chip toward the top of the potting compound and the bottom of the substrate, respectively, thereby using the potting compound and the bottom of the substrate to separate the soldering portions of the two pins and prevent the two soldering portions from being connected by solder. Attached Figure Description

[0015] Figure 1 is an explosion schematic view of the new LED packaging structure;

[0016] Figure 2 is a top view schematic view of the new LED packaging structure;

[0017] Figure 3 is a sectional view schematic view of the new LED packaging structure;

[0018] Figure 4 is a connection schematic view of two new LED packaging structures;

[0019] In the figure, 1, glue body; 1a, dam glue; 1a1, identification groove; 1b, transparent glue; 2, LED chip; 2a, metal wire; 3, substrate; 3a, mounting area; 4, pin; 4a, welding part; 5, external circuit; DETAILED DESCRIPTION

[0020] The following is a specific embodiment of the present application and further describes the technical scheme of the present application in combination with the drawings, but the present application is not limited to these embodiments.

[0021] As shown in Figure 1 and Figure 2 , a new LED packaging structure is provided with glue body 1, LED chip 2 and substrate 3 from top to bottom, wherein two pins 4 are arranged between glue body 1 and substrate 3 for electrically connecting LED chip 2 and external circuit 5, substrate 3 has mounting area 3a at the bottom for mounting LED chip 2, glue body 1 includes dam glue 1a and transparent glue 1b, dam glue 1a is located outside LED chip 2, and after solidification, the inner wall of dam glue 1a near LED chip 2 has a certain slope, transparent glue 1b is located directly above LED, and after assembly, identification groove 1a1 is arranged on the side of pin 4 with downward bending.

[0022] As shown in Figure 3As shown in the drawings, the LED chip 2 of the present application is located in the middle of the LED packaging structure, and one end of the two pins 4 on both sides of the substrate 3 is respectively connected to the positive and negative electrodes of the LED chip 2, and the other end of the two pins 4 is respectively bent in opposite directions, that is, one of the pins 4 is bent upwards to form a soldering portion 4a, and the other pin 4 is bent downwards to form a soldering portion 4a, and the soldering portions 4a of the two pins 4 are staggered and separated by the glue body 1 and the substrate 3, so that the two pins 4 will not be connected due to soldering when the patch LED lamp is soldered to the external circuit 5. The external circuit 5 includes a driving circuit connected by wires and a circuit board for mounting the LED lamp, such as a patch lamp string with patent number 201610035273. The form of the external circuit 5 is various, and is prior art, which will not be described in detail here.

[0023] As shown in the drawings, Figure 4 The novel LED packaging structure of the present application is used in a certain number, and as a specific embodiment, the two novel LED packaging structures are connected by wires to the downward bent pin 4 and the upward bent pin 4, so that they are electrically connected.

[0024] The processing steps of the novel LED packaging structure of the present application are as follows:

[0025] Step one, the LED chip 2 is adhered to the mounting area 3a of the substrate 3 by LED die bonding glue;

[0026] Step two, the positive and negative electrodes of the LED chip 2 are soldered in the mounting area 3a by metal wires 2a, and one end of the pins 4 on both sides is electrically connected to the LED chip 2;

[0027] Step three, after soldering, the soldered LED chip 2 is sealed by the glue body 1;

[0028] Step four, after packaging and curing the glue, the other end of the two pins 4 is bent in opposite directions, so that the two soldering portions 4a formed after bending are separated by the glue body 1 and the substrate 3.

[0029] Step five, after bending, the adjacent two LED lamps are connected by wires to test the LED lamp.

[0030] The metal wire 2a can be made of gold wire, silver wire, aluminum wire and other conductive materials

[0031] In summary, on the basis of the existing LED packaging structure composed of a glue filling body 1, an LED chip 2 and a substrate 3, the LED chip 2 is connected with the pins 4 located on both sides of the mounting area 3a through the metal wire 2a, so that the LED chip 2 can be in communication with the external circuit 5, and thus normal work is realized. Different from the existing patch type LED, both of the pins 4 of the present application extend to the outside of the substrate 3 and are respectively bent in opposite directions to form the welding portions 4a, so that one of the welding portions 4a is attached above the solidified glue filling body 1, and the other welding portion 4a is attached below the substrate 3, and thus the two welding portions 4a are separated from each other by the glue filling body 1 and the substrate 3. Since the glue filling body 1 and the substrate 3 are usually made of insulating materials, the patch type LED using the packaging structure will not cause short circuit due to the direct connection of the two pins 4 caused by too much solder during the soldering installation process.

[0032] In addition, the glue filling body 1 includes transparent glue 1b and dam glue 1a. The transparent glue 1b in the pouring process is limited by the dam glue 1a to avoid the overflow of the transparent glue 1b in liquid form, improve the use experience, and make it convenient for the user to distinguish the positive and negative poles of the patch type LED lamp. Therefore, an identification groove 1a1 is formed at a corner of the dam glue 1a.

[0033] The specific embodiments described herein merely exemplify the spirit of the present application. Those skilled in the art to which the present application belongs can make various modifications or supplements to the described specific embodiments or use similar ways to replace them, without deviating from the spirit of the present application or exceeding the scope defined by the appended claims.

[0034] Although the terms such as 1, glue filling body; 1a, dam glue; 1a1, identification groove; 1b, transparent glue; 2, LED chip; 2a, metal wire; 3, substrate; 3a, mounting area; 4, pin; 4a, welding portion; 5, external circuit are used more frequently herein, but the possibility of using other terms is not excluded. The use of these terms is only for the convenience of describing and explaining the essence of the present application; any interpretation of them as any kind of additional limitation is contrary to the spirit of the present application.

Claims

1. A novel LED packaging structure, comprising a potting compound (1), an LED chip (2), and a substrate (3) arranged sequentially from top to bottom, wherein the substrate (3) includes two pins (4) located on both sides, one end of each pin (4) being located on the substrate (3) and connected to the LED chip (2), characterized in that, The other end extends outward and bends in opposite directions to form a welding part (4a). The welding part (4a) is used to weld with the external circuit (5) so that the LED chip (2) is electrically connected to the external circuit (5). The welding parts (4a) of the two pins (4) are separated by the potting compound (1) and the substrate (3). The welding parts of the two pins of the LED chip bend towards the top of the potting compound and the bottom of the substrate, respectively.

2. The novel LED packaging structure according to claim 1, characterized in that, The potting compound (1) includes a damming compound (1a) disposed above the substrate (3), and the LED chip (2) is located inside the damming compound (1a), wherein the solder portion (4a) of one of the pins (4) is located above the damming compound (1a).

3. The novel LED packaging structure according to claim 2, characterized in that, One end of the pin (4) with a solder part (4a) is bent into a U-shape.

4. The novel LED packaging structure according to claim 2 or 3, characterized in that, The two pins (4) are respectively connected to the positive and negative terminals of the LED chip (2). The dammed adhesive (1a) is provided with an identification groove (1a1). The identification groove (1a1) is used for identification. The identification groove (1a1) is located on the side of the pin (4) above the potting adhesive on the welding part (4a) or on the side of the pin (4) below the substrate (3) on the welding part (4a).

5. The novel LED packaging structure according to claim 1, characterized in that, A reflective layer is covered on the substrate (3).

6. The novel LED packaging structure according to claim 1, characterized in that, The substrate (3) has a mounting area (3a) for mounting an LED chip (2), and the LED chip (2) is soldered to the pin (4) via a metal wire (2a).

7. The novel LED packaging structure according to claim 2, characterized in that, The inner wall of the dam material (1a) is inclined.

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