LED packaging structure with double-layer BT board and three-layer copper foil

Abstract

The utility model relates to the technical field of integrated chip packaging, in particular to a double-layer BT board three-layer copper foil LED packaging structure, which comprises a double-layer BT board, an LED chip welded on the double-layer BT board and a packaging piece covered on the LED chip. The double-layer BT board comprises a first BT substrate, a second BT substrate, an insulating layer located between the first BT substrate and the second BT substrate, a first copper foil layer located on the first BT substrate, a second copper foil layer located on the second BT substrate and a third copper foil layer located in the insulating layer. According to the LED packaging structure with the double-layer BT board and the three-layer copper foil, the flexibility and the density of wiring of the LED chips can be improved, and display diversification of the LED chips is further achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated chip packaging technical field, concretely relates to a double -layer BT board three -layer copper foil LED packaging structure. BACKGROUND

[0002] LED chip as an excellent semiconductor photoelectric device, with its small size, low power consumption, long service life, environmental protection and other advantages, is expected to become a new generation of solid-state energy-saving lighting light source. The power of a single LED chip cannot meet the needs of consumers high brightness and diversification, so it is necessary to combine many LED chips under the condition of requiring high brightness diversification.

[0003] At present, for the diversified lighting needs, the required number of LED chips is more, therefore, the line requirement is more complex, when connecting multiple chips and a large number of discrete components with different functions, the wiring space on the single layer circuit board is limited, and it is difficult to realize reasonable layout. UTILITY MODEL CONTENT

[0004] Based on the technical problems existing in the prior art, the utility model provides a double -layer BT board three -layer copper foil LED packaging structure, which can increase the flexibility and density of LED chip wiring, and further realize LED chip display diversification.

[0005] The utility model solves technical scheme that its technical problem adopts: provide a double -layer BT board three -layer copper foil LED packaging structure, including double -layer BT board, the LED chip of welding on double -layer BT board and the packaging piece covered on the LED chip, the double -layer BT board includes first BT base plate, second BT base plate, the insulating layer between first BT base plate and second BT base plate, the first copper foil layer on first BT base plate, the second copper foil layer on second BT base plate and the third copper foil layer in the insulating layer.

[0006] Further, the insulating layer is made of a semi-cured sheet material, and the main component of the semi-cured sheet is epoxy resin.

[0007] Further, the first copper foil layer includes a solder pad, various circuit patterns are formed on the first copper foil layer by photolithography, etching and other processes, and the first copper foil layer is provided with a circuit for connecting chips, sensors and other components.

[0008] Further, the second copper foil layer includes a ground terminal, and the second copper foil layer is provided with a ground circuit, a power distribution circuit and a circuit sensitive to electromagnetic interference.

[0009] Further, the double-layer BT board further comprises a via hole, the via hole is arranged on the double-layer BT board, and the inner wall of the via hole is provided with a conductive material.

[0010] Further, the double-layer BT board further comprises a mounting hole, the mounting hole is located at the edge of the double-layer BT board.

[0011] Further, the LED chip comprises a first pin and a second pin, and the first pin and the second pin are electrically connected with the solder pad by means of soldering.

[0012] Further, the first copper foil layer is further covered with a solder resist layer, and the solder resist layer covers the surface of the first copper foil layer except the solder pad and the part area which needs to be soldered.

[0013] Further, the package comprises a dam and a package glue, and the dam is used for enclosing the plurality of LED chips.

[0014] Further, the double-layer BT board three-layer copper foil LED packaging structure further comprises an isolation grating, and the isolation grating is arranged between two adjacent LED chips.

[0015] The double-layer BT board three-layer copper foil LED packaging structure has the advantages that the semi-cured sheet of the insulating layer can be completely cured at high temperature, so that the first BT substrate, the second BT substrate and the third copper foil layer are tightly bonded together, and meanwhile, the insulating effect is achieved, so that short circuit between the upper and lower circuits is prevented; the first copper foil layer further comprises a solder pad, and the solder pad is used for soldering the LED chip; the third copper foil layer serves as an additional signal transmission layer or a power supply layer, and is used for increasing the flexibility and density of wiring; the via hole is arranged, and is used for realizing electrical connection between the circuits of different layers; the double-layer BT board further comprises a mounting hole, the mounting hole is located at the edge of the double-layer BT board, so that the double-layer BT board 1 can be fixed on a case, a device shell or other support structure; the solder resist layer is arranged on the first copper foil layer, and the solder resist layer is used for preventing short circuit and protecting the copper foil, so that the copper foil is prevented from being oxidized and corroded and physically rubbed; the isolation grating is arranged, and the isolation grating is used for preventing light crosstalk and color mixing. BRIEF DESCRIPTION OF DRAWINGS

[0016] The utility model is further described below in combination with the drawings and embodiments.

[0017] Figure 1 It is a sectional view of a double-layer BT plate three-layer copper foil LED packaging structure provided by the utility model.

[0018] Figure 2 It is Figure 1 The local amplification schematic view of A in the middle.

[0019] The names and numbers of the parts in the drawings are as follows:

[0020] Double-layer BT plate three-layer copper foil LED packaging structure 100.

[0021] Double-layer BT plate 1, first BT substrate 11, second BT substrate 12, insulating layer 13, first copper foil layer 14, solder pad 141, solder resist layer 142, second copper foil layer 15, ground terminal 151, third copper foil layer 16, via hole 17, mounting hole 18.

[0022] LED chip 2, first pin 21, second pin 22.

[0023] Packaging piece 3, dam 31, encapsulation glue 32.

[0024] Isolation grating 4. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical schemes and beneficial effects to be solved by the utility model more clear, the utility model is described in detail in combination with the drawings. The drawing is a simplified schematic view, and only illustrates the basic of the utility model in a schematic way, therefore it only shows the relevant constitution of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without creative labor are within the protection scope of the utility model.

[0026] As Figure 1 Indicated, the embodiment provides a double-layer BT plate three-layer copper foil LED packaging structure 100, including double-layer BT plate 1, LED chip 2 welded on double-layer BT plate 1 and packaging piece 3 covering on LED chip 2.

[0027] In some embodiments, double-layer BT plate 1 includes first BT substrate 11, second BT substrate 12, insulating layer 13 between first BT substrate 11 and second BT substrate 12, first copper foil layer 14 on first BT substrate 11, second copper foil layer 15 on second BT substrate 12 and third copper foil layer 16 inside insulating layer 13.

[0028] In some embodiments, the first BT substrate 11 and the second BT substrate 12 are respectively located on the upper and lower end surfaces, and the insulating layer 13 is arranged between the first BT substrate 11 and the second BT substrate 12. The first BT substrate 11 and the second BT substrate 12 have substantially the same shape and size, and are made of a BT resin material, which is a polymer of a bismaleimide and a triazine compound. The BT substrate has excellent heat resistance and a relatively high glass transition temperature, generally around 180-200°C, which enables the BT substrate to maintain stable physical and electrical properties in a high-temperature environment. In addition, the BT substrate also has good mechanical properties, with high strength and hardness, and can withstand a certain degree of external force impact and vibration, effectively protecting the electronic components and circuits on the board. The insulating layer 13 is made of a prepreg material, which is pressed between the first BT substrate 11 and the second BT substrate 12 by equipment. The prepreg is a partially cured resin material, mainly composed of epoxy resin and other thermosetting resins. During the pressing process, the prepreg of the insulating layer 13 will be completely cured at high temperature, tightly bonding the first BT substrate 11 and the second BT substrate 13 and the third copper foil layer 16 together, while also serving as an insulating layer to prevent short circuits between the upper and lower layers of circuits.

[0029] In some embodiments, the first copper foil layer 14 is located on the upper end surface of the first BT substrate 11, i.e., the first copper foil layer 14 is located on the uppermost layer of the double-layer BT board 1, and various circuit patterns are formed on the first copper foil layer 14 through processes such as photoetching and etching. The first copper foil layer 14 is provided with lines connecting components such as chips and sensors, thereby realizing functions such as data transmission and display control. The first copper foil layer 14 also includes a solder pad 141 for soldering the LED chip 2.

[0030] In some embodiments, the second copper foil layer 15 is located on the surface of the second BT substrate 12, i.e., the second copper foil layer 15 is located on the lowermost layer of the double-layer BT board 1, and various circuit patterns are formed on the second copper foil layer 15 through processes such as photoetching and etching. The second copper foil layer 15 is provided with grounding lines, power distribution lines, and lines sensitive to electromagnetic interference. The second copper foil layer 15 also includes a grounding terminal 151, which has a large size and is used to provide a stable reference potential for the entire circuit and help shield electromagnetic interference. The third copper foil layer 16 is located inside the insulating layer 13, and circuit lines are formed on the third copper foil layer 16 through processes such as photoetching and etching. The third copper foil layer 16 serves as an additional signal transmission layer or power layer, which is used to increase the flexibility and density of the wiring.

[0031] In some embodiments, the double-layer BT board 1 further comprises a via hole 17. The via hole 17 is formed through the double-layer BT board 1, and is connected with the first copper foil layer 14, the second copper foil layer 15 and the third copper foil layer 16. The inner wall of the via hole 17 is provided with a conductive material for transmitting an electrical signal. The via hole 17 is formed by processes such as drilling and electroplating. After drilling, copper or other metals are deposited on the hole wall by electroplating, so that the via hole 17 can be electrically connected with the circuits on the first copper foil layer 14, the second copper foil layer 15 and the third copper foil layer 16. The size, shape and distribution position of the via hole 17 are set according to the specific circuit design requirements. In some other embodiments not shown in the figure, the via hole 17 is connected only with the first copper foil 14 and the third copper foil layer 16, or the via hole 17 is connected only with the second copper foil 15 and the third copper foil layer 16.

[0032] In some embodiments, the double-layer BT board 1 further comprises a mounting hole 18. The mounting hole 18 is located at the edge of the double-layer BT board 1, so as to facilitate the fixation of the double-layer BT board 1 on a case, a device shell or other support structure. The size of the mounting hole 18 mainly depends on the specifications of the screws, bolts or other connecting members used by the double-layer BT board 1. In order to prevent the copper foil around the mounting hole 18 from being short-circuited or corroded, the mounting hole 18 is subjected to a metalization treatment or coated with an insulating material. The metalization treatment can make the inner wall of the mounting hole 18 conductive, facilitating some special grounding or shielding designs. The coating of the insulating material is mainly to isolate the copper foil from the connecting member, ensuring electrical safety.

[0033] In some embodiments, a plurality of LED chips 2 are provided and mounted on the first copper foil layer 14. The LED chip 2 comprises a first pin 21 and a second pin 22, which are electrically connected with the pads 141 of the first copper foil layer 14 by soldering. Specifically, the corresponding electrodes of the first pin 21 and the second pin 22 are opposite. If the first pin 21 is a positive pin, the second pin 22 is a negative pin. If the first pin 21 is a negative pin, the second pin 22 is a positive pin.

[0034] As shown in FIG. 1, Figure 2 In some embodiments, a solder resist layer 142 is further provided on the first copper foil layer 14. The solder resist layer 142 covers the surface of the first copper foil layer 14 except the pads 141 and the areas that need to be soldered. The solder resist layer 142 is used to prevent short circuit and protect the copper foil from being oxidized and corroded and physically rubbed.

[0035] In some embodiments, the package 3 comprises a dam 31 and a package glue 32. The dam 31 is used to enclose the plurality of LED chips 3, and the dam 31 is formed by applying glue to form a ring structure and then curing. The dam 31 is obtained after applying a ring of glue and then drying and curing. The dam 31 is simple to prepare, and the size and shape of the dam 31 can be adjusted according to actual requirements. Further, the dam 40 is a white dam, which is not transparent and does not absorb light, and is suitable for LED lamp beads with white light. In other embodiments, the color and shape of the dam 31 are not limited to this. The package glue 32 is located in the inner circle of the dam 31 and is used to cover all the LED chips 31 located in the dam 31. The package glue 32 is used to protect the chips from the external environment, while ensuring that the light emitted by the LED chips 31 can effectively pass through. In some examples, the package glue 31 is made of epoxy resin material, which has good optical transparency, moisture resistance and mechanical strength. The refractive index of the epoxy resin package glue can be adjusted as needed to optimize the light emitting effect of the chip.

[0036] In some embodiments, the double-layer BT plate three-layer copper foil LED packaging structure 100 further comprises an isolation grating 4 arranged between two adjacent LED chips 2. The isolation grating 4 is made of transparent organic material. Further, the isolation grating 4 is made of transparent epoxy resin. The isolation grating 4 is used to separate different LED chips 2 or different color LED chips 2, and plays a role in preventing light crosstalk and color mixing. The isolation grating 2 can play a physical protection role for the LED chip 2. During the packaging process or the use process of the LED chip 2, it can prevent the LED chips 2 from being damaged due to mutual collision or external pressure, and help to improve the reliability and stability of the LED packaging device.

[0037] The double-layer BT plate three-layer copper foil LED packaging structure 100 comprises a double-layer BT plate 1, an LED chip 2 welded on the double-layer BT plate 1 and a packaging piece 3 covering the LED chip 2, wherein the double-layer BT plate 1 comprises a first BT substrate 11, a second BT substrate 12, an insulating layer 13 between the first BT substrate 11 and the second BT substrate 12, a first copper foil layer 14 on the first BT substrate 11, a second copper foil layer 15 on the second BT substrate 12 and a third copper foil layer 16 in the insulating layer 13, the semi-cured sheet of the insulating layer 13 is completely cured at high temperature, the first BT substrate 11 and the second BT substrate 13 and the third copper foil 16 layer are tightly bonded together, meanwhile, the insulating effect is achieved, so that short circuit between the upper and lower layers of circuits is prevented; the first copper foil layer 14 further comprises a solder pad 141, the solder pad 141 is used for welding the LED chip 2; the third copper foil layer 16 is used as an additional signal transmission layer or a power supply layer, and is used for increasing flexibility and density of wiring; a via hole 17 is arranged and is used for realizing electrical connection between the layers of circuits; the double-layer BT plate 1 further comprises a mounting hole 18, the mounting hole 18 is located at an edge position of the double-layer BT plate 1, so that the double-layer BT plate 1 is conveniently fixed on a case, a device shell or other support structures; a solder resist layer 142 is further covered on the first copper foil layer 14, the solder resist layer 142 is used for preventing short circuit and protecting the copper foil, so that the copper foil is prevented from being oxidized and corroded and physically rubbed; an isolation grating 4 is arranged, the isolation grating 4 plays a role in preventing light crosstalk and color mixing.

[0038] In the description of the utility model, it needs to explain, unless another explicit stipulation and limit term " install " " link " " connection " should be broad sense understanding, for example, can be fixed connection, also can be detachable connection or integral connection, can be mechanical connection, can be direct connection also can pass through intermediate medium indirectly link, can be two element inside link or two element mutual action relation. For ordinary skilled person in the art, the above-mentioned term can be understood according to the specific meaning in the utility model.

[0039] It needs to understand that the orientation or position relation indicated by the terms " length " " width " " upper " " lower " " front and back " " left and right " " vertical " " horizontal " " top " " bottom " " inner " " outer " is based on the orientation or position relation shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore can not be understood as a limitation on the utility model.

[0040] The above is according to the ideal embodiment of the utility model for the inspiration, through the above description, the relevant staff can fully change and modify in the range without deviating from the utility model. The technical scope of the utility model is not limited to the content in the specification, and the technical scope must be determined according to the scope of claims.

Claims

1. A double-layer BT board three-layer copper foil LED packaging structure, characterized in that: The application relates to a double-layer BT plate, an LED chip welded on the double-layer BT plate and a packaging piece covering the LED chip, wherein the double-layer BT plate comprises a first BT substrate, a second BT substrate, an insulating layer between the first BT substrate and the second BT substrate, a first copper foil layer on the first BT substrate, a second copper foil layer on the second BT substrate and a third copper foil layer in the insulating layer; the insulating layer is made of a prepreg material, the composition of the prepreg is epoxy resin, the first copper foil layer comprises a solder pad, a circuit pattern is formed on the first copper foil layer through a photoetching or etching process, a circuit for connecting a chip and a sensor is arranged on the first copper foil layer, the second copper foil layer comprises a grounding terminal, a grounding circuit, a power distribution circuit and a line sensitive to electromagnetic interference are arranged on the second copper foil layer; the double-layer BT plate further comprises a via hole, the via hole is formed through the double-layer BT plate, and a conductive material is arranged on the inner wall of the via hole. 2.The double-layer BT board three-layer copper foil LED packaging structure according to claim 1, characterized in that: The double-layer BT plate further comprises a mounting hole, and the mounting hole is located at the edge of the double-layer BT plate. 3.The double-layer BT board three-layer copper foil LED packaging structure according to claim 1, characterized in that: The LED chip comprises a first pin and a second pin, and the first pin and the second pin are electrically connected with the solder pad through soldering. 4.The double-layer BT board three-layer copper foil LED packaging structure according to claim 1, characterized in that: The first copper foil layer further comprises a solder mask layer, and the solder mask layer covers the surface of the first copper foil layer except the solder pad and the part area to be welded. 5.The double-layer BT board three-layer copper foil LED packaging structure according to claim 1, characterized in that: The packaging piece comprises a dam and packaging glue, and the dam is used for enclosing a plurality of LED chips. 6.The double-layer BT board three-layer copper foil LED packaging structure according to claim 1, characterized in that: The double-layer BT plate three-layer copper foil LED packaging structure further comprises an isolation grating arranged between two adjacent LED chips.

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