Coating head for high-temperature-resistant electronic tag screening agent
By introducing a material control device into the coating head and using an arc-shaped baffle to control the material output from the material passage gap, the problem of material overflow during coating is solved, and precise control of the coating amount is achieved, ensuring that the material at the edge of the electronic tag is appropriate.
Patent Information
- Application Number
- CN202422745709.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-11-12
AI Technical Summary
When applying high-temperature resistant electronic tag masking agent with existing coating heads, the material tends to overflow to the edges, resulting in excessive material at the edges.
A coating head was designed, which includes a material passage gap between an upper die head and a lower die head, and is equipped with a material control device. The material passage gap is blocked or opened in different areas by an arc baffle to control the output and prevent overflow.
Effectively control the coating amount to prevent the material in the middle from overflowing to the edge, ensuring that the material at the edge of the electronic tag is of appropriate amount, and improving the coating accuracy.
Smart Images
Figure CN223571138U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic label processing technical field especially relates to a kind of coating head for high-temperature-resistant electronic label shielding agent. BACKGROUND
[0002] High-temperature-resistant electronic label shielding agent is a kind of material for protecting electronic label to maintain its performance under high temperature environment. This shielding agent is usually applied to products that need to go through high-temperature processing, such as components in the fields of automobile manufacturing, electronic product production, etc., to ensure that the electronic label will not be damaged or lose function due to high temperature. Using a coating head to apply high-temperature-resistant electronic label shielding agent is a common way, which can accurately coat the shielding agent to the surface of the electronic label or other areas that need protection.
[0003] In the prior art, the coating head forms a slurry passage by clamping a gasket between the upper die and the lower die for large-area coating. It can work on the entire surface of the electronic label. However, since the material is a fluid and the shielding agent used in the electronic label is usually made of organic silicon resin, polyimide and other raw materials that are not easy to solidify quickly, when coating the edge of the electronic label, the material in the middle of the electronic label may overflow to the edge. If the large-area coating method is used, it may cause too much material at the edge. SUMMARY
[0004] The utility model aims at the problems in the background art and provides a coating head for high-temperature-resistant electronic label shielding agent.
[0005] The technical solution of the utility model is a coating head for high-temperature-resistant electronic label shielding agent, which includes an upper die and a lower die. A gasket is clamped between the upper die and the lower die to form a material passage gap. A material distribution cavity is formed in the lower die. A material control device is provided in the upper die to block the material passage gap.
[0006] The material control device includes an arc-shaped baffle in the upper die and a baffle fixed in the material distribution cavity. The arc-shaped baffle can be moved into the material distribution cavity and abut against the baffle to block the material passage gap. The lower die is provided with a discharge port at both ends of the material passage gap. The arc-shaped baffle is provided with a through hole at both ends.
[0007] Preferably, the material control device further includes an inner cavity formed in the upper die. An arc-shaped seat is fixedly installed above the material distribution cavity in the inner cavity. An arc-shaped cavity is formed between the arc-shaped seat and the inner cavity. The arc-shaped baffle is located in the arc-shaped cavity, and the arc-shaped cavity is in communication with the material distribution cavity.
[0008] Preferably, the material control device further comprises an arc-shaped slot formed in the upper die head, the arc-shaped slot is located at one side of the inner cavity and penetrates through the upper die head, the arc-shaped baffle is fixedly installed with an arc-shaped rod, the arc-shaped rod is slidingly installed in the arc-shaped slot, and the arc-shaped slot is fixed with an operating head located outside the upper die head.
[0009] Preferably, the arc-shaped baffle is asymmetrically arranged, when the arc-shaped baffle does not block the material passing gap, the side of the arc-shaped baffle away from the discharge port is located in the material distribution cavity, and the side of the arc-shaped baffle provided with the through hole is located in the arc-shaped cavity.
[0010] Preferably, the first back plate and the second back plate are arranged between the upper die head and the lower die head, the arc-shaped slot penetrates through the first back plate, the operating head is located on the first back plate, and the material distribution cavity is provided with a material channel.
[0011] Compared with the prior art, the beneficial effects of the present application are that: by arranging the material passing gap to be blockable, the material passing gap has different discharging amounts in different regions, so as to be more in line with the coating mode of the electronic label shielding agent, and the amount of discharging material can be controlled to prevent the material in the middle from overflowing to the edge and causing the material at the edge to be too much. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 It is a structural schematic view of the present application;
[0013] Figure 2 It is a structural schematic view of the lower die head of the present application;
[0014] Figure 3 It is a structural schematic view of the upper die head of the present application;
[0015] Figure 4 It is a sectional structural schematic view of Figure 1 .
[0016] Fig. 1 is a structural schematic view of the present application; Fig. 2 is a sectional structural schematic view of the present application; Fig. 3 is a structural schematic view of the present application; Fig. 4 is a sectional structural schematic view of the present application; Fig. 5 is a structural schematic view of the present application; Fig. 6 is a sectional structural schematic view of the present application. DETAILED DESCRIPTION
[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.
[0018] Reference is made to the drawings Figures 1-4A coating head for a high-temperature resistant electronic tag masking agent includes an upper die head 1 and a lower die head 2. A gasket is sandwiched between the upper die head 1 and the lower die head 2 to form a material passage gap 4. A material distribution cavity 21 is opened in the lower die head 2. A material control device 3 for blocking the material passage gap 4 is provided in the upper die head 1.
[0019] The material control device 3 includes an arc-shaped baffle 33 located inside the upper die head 1, a baffle 38 fixed inside the material distribution cavity 21, the arc-shaped baffle 33 can be moved into the material distribution cavity 21 and abuts against the baffle 38 to block the material passage gap 4, and both ends of the material passage gap 4 of the lower die head 2 are provided with discharge ports 36, and both ends of the arc-shaped baffle 33 are provided with through holes 37.
[0020] By moving the arc-shaped baffle 33 into the material distribution chamber 21, the channel between the material distribution chamber 21 and the material passage gap 4 is blocked, thus preventing the masking agent from entering the material passage gap 4. At this time, the through holes 37 at both ends of the arc-shaped baffle 33 will be directly opposite the discharge port 36, allowing the masking agent to flow out from the through holes 37 into the discharge port 36. Therefore, when the arc-shaped baffle 33 blocks the material passage gap 4, the middle of the material passage gap 4 will no longer discharge material, and the presence of the through holes 37 at both ends will only result in material discharge from both ends. In this way, when coating the edge of the electronic tag, the amount of material discharged can be controlled to prevent the material in the middle from overflowing to the edge and causing excessive material at the edge.
[0021] When the masking agent is discharged from the outlet 36, a small amount of material will also overflow from the material passage gap 4, but most of the material will be discharged from the outlet 36, so it will not have any impact.
[0022] Specifically, the material control device 3 also includes an inner cavity 100 opened in the upper die head 1. An arc-shaped seat 31 located above the material distribution cavity 21 is fixedly installed in the inner cavity 100. An arc-shaped cavity 32 is formed between the arc-shaped seat 31 and the inner cavity 100. An arc-shaped baffle 33 is located in the arc-shaped cavity 32. The arc-shaped cavity 32 is connected to the material distribution cavity 21.
[0023] like Figure 3 and Figure 4 As shown, the arc-shaped seat 31 supports the arc-shaped baffle 33, so that the arc-shaped baffle 33 is attached to the arc-shaped seat 31 and moves along its surface.
[0024] Specifically, the material control device 3 also includes an arc-shaped groove 34 opened in the upper die head 1. The arc-shaped groove 34 is located on one side of the inner cavity 100 and passes through the upper die head 1. An arc-shaped baffle 33 is fixedly installed with an arc-shaped rod 35. The arc-shaped rod 35 is slidably installed in the arc-shaped groove 34. An operating head 39 located outside the upper die head 1 is fixed in the arc-shaped groove 34.
[0025] The arc-shaped rod 35 is driven to move by the operation head 39, so that the arc-shaped baffle 33 is moved into the material distribution cavity 21.
[0026] It should be noted that, in the embodiment, the technical problem solved by the present application is related to the coating head, so only the structure of the coating head is described. In actual use, the operation head 39 is often controlled by an external electric or hydraulic wall, rather than manually controlled, because the temperature of the electronic tag is relatively high when the shielding agent is coated.
[0027] In the embodiment, the arc-shaped baffle 33 is asymmetrically arranged. When the arc-shaped baffle 33 does not block the material passing gap 4, the side of the arc-shaped baffle 33 away from the discharge port 36 is located in the material distribution cavity 21, so that the shielding agent can be prevented from entering the arc-shaped groove 34 through the arc-shaped cavity 32, and the material is prevented from being discharged out of the coating head, thereby playing a sealing and blocking role. The side of the arc-shaped baffle 33 provided with the through hole 37 is located in the arc-shaped cavity 32, so that the shielding agent can smoothly enter the material passing gap 4. At this time, the material will also flow out of the discharge port 36, but it will not affect the operation.
[0028] In addition, the first back plate 200 and the second back plate 300 are arranged between the upper die head 1 and the lower die head 2. The arc-shaped groove 34 penetrates the first back plate 200, the operation head 39 is located on the first back plate 200, and the material distribution cavity 21 is provided with a material channel 22.
[0029] During operation, the shielding agent is input into the material distribution cavity 21 through the material channel 22. When the coating head is used to coat the electronic tag, the material will be coated to the middle region of the electronic tag from the material passing gap 4. When it is necessary to coat the edge of the electronic tag, the arc-shaped rod 35 is moved in the arc-shaped groove 34 by pulling the operation head 39, the arc-shaped rod 35 drives the arc-shaped baffle 33 to move into the material distribution cavity 21, and the movement of the arc-shaped baffle 33 stops when the arc-shaped baffle 33 abuts against the blocking piece 38. At this time, the arc-shaped baffle 33 blocks the material passing gap 4, the through hole 37 is located at the discharge port 36, the material continues to be discharged, the middle part of the material passing gap 4 is not discharged, and the two sides of the material passing gap 4 are discharged through the discharge port 36, so that the edge of the electronic tag can be coated.
[0030] The above describes only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A coating head for a high-temperature resistant electronic tag masking agent, comprising an upper die head (1) and a lower die head (2), wherein a gasket is sandwiched between the upper die head (1) and the lower die head (2) to form a material passage gap (4), characterized in that, The lower die head (2) is provided with a material distribution cavity (21), and the upper die head (1) is provided with a material control device (3) for blocking the material passage gap (4). The material control device (3) includes an arc-shaped baffle (33) located inside the upper die head (1), a baffle (38) fixed inside the material distribution cavity (21), the arc-shaped baffle (33) can be moved into the material distribution cavity (21) and abut against the baffle (38) to block the material passage gap (4), and both ends of the material passage gap (4) of the lower die head (2) are provided with discharge ports (36), and both ends of the arc-shaped baffle (33) are provided with through holes (37).
2. The coating head for a high-temperature resistant electronic tag masking agent according to claim 1, characterized in that, The material control device (3) further includes an inner cavity (100) opened in the upper die head (1). An arc-shaped seat (31) located above the material distribution cavity (21) is fixedly installed in the inner cavity (100). An arc-shaped cavity (32) is formed between the arc-shaped seat (31) and the inner cavity (100). The arc-shaped baffle (33) is located in the arc-shaped cavity (32). The arc-shaped cavity (32) and the material distribution cavity (21) are connected.
3. The coating head for a high-temperature resistant electronic tag masking agent according to claim 2, characterized in that, The material control device (3) also includes an arc groove (34) opened in the upper die head (1). The arc groove (34) is located on one side of the inner cavity (100) and passes through the upper die head (1). An arc baffle (33) is fixedly installed with an arc rod (35). The arc rod (35) is slidably installed in the arc groove (34). An operating head (39) located outside the upper die head (1) is fixed in the arc groove (34).
4. The coating head for a high-temperature resistant electronic tag masking agent according to claim 3, characterized in that, The arc-shaped baffle (33) is asymmetrically arranged. When the arc-shaped baffle (33) does not block the material passage gap (4), the side of the arc-shaped baffle (33) away from the discharge port (36) is located in the material distribution cavity (21), and the side of the arc-shaped baffle (33) with the through hole (37) is located in the arc-shaped cavity (32).
5. The coating head for a high-temperature resistant electronic tag masking agent according to claim 3, characterized in that, A first back plate (200) and a second back plate (300) are provided between the upper die head (1) and the lower die head (2). The arc groove (34) passes through the first back plate (200). The operating head (39) is located on the first back plate (200). A material channel (22) is provided in the material distribution cavity (21).