Dust sticking rod for chip

Abstract

The dust sticking rod for the chip comprises a dust sticking rod assembly, and the dust sticking rod assembly comprises a dust sticking rod body, a baffle fixed to the bottom face of the dust sticking rod body, a first internal thread formed in the tail end of the dust sticking rod body, a threaded rod connected with the first internal thread and a dust sticking connector connected with the threaded rod. Wherein the dust sticking connector is in a conical shape. According to the utility model, the dust-sticking rod assembly is arranged to form a separated use structure, the dust-sticking connector is directly inserted into the rubber adsorption head used for adsorbing dust, the dust-sticking rod body is held by a hand for dust sticking, and the rubber adsorption head adhered to the dust-sticking connector is directly unscrewed after the dust-sticking rod is used, so that the dust-sticking rod can be used for dust sticking. According to the structural design, only the rubber adsorption head needs to be replaced, the use cost is reduced, the rubber adsorption heads of different shapes can be inserted, the dust sticking device is suitable for dust sticking of different electronic components, the applicability is improved, and due to the detachable structural design of the dust sticking connector, a user can select suitable specifications according to actual requirements.

Description

TECHNICAL FIELD

[0001] The utility model relates to dust stick technical field, specifically is a dust stick for chip. BACKGROUND

[0002] Chip is a kind of microcircuit integrated with multiple electronic components, usually manufactured on semiconductor material, chip needs to be dusted by dust stick after production, dust stick is generally disposable, the top end of dust stick is rubber, dust is adsorbed by rubber, the dust stick in the prior art is relatively high in use cost when using the whole structure of one-time use, and the rubber adsorption head at the top end of dust stick cannot be completely applicable to different electronic components, so the dusting effect is relatively poor. SUMMARY

[0003] Therefore, the utility model aims at providing a dust stick for chip, the dust stick assembly is formed by being set, the dusting connection head is directly inserted into the rubber adsorption head for adsorbing dust, the dust stick body is held to carry out dusting, the rubber adsorption head adhered on the dusting connection head is directly screwed off after use, the structure design only replaces the rubber adsorption head, reduces use cost, and different shapes of rubber adsorption heads can be inserted, suitable for different electronic components dusting, improve applicability, the dusting connection head can be detachably designed, and the user can select applicable specifications according to actual demand.

[0004] To solve the above technical problems, according to one aspect of the utility model, the utility model provides the following technical scheme: a dust stick for chip, comprising:

[0005] Dust stick assembly, the dust stick assembly includes the dust stick body that is set, the baffle that is fixed at the bottom surface of the dust stick body, the first internal thread that is opened at the tail end of the dust stick body, the threaded rod that is connected with the first internal thread, the dusting connection head that is connected with the threaded rod;

[0006] Wherein, the dusting connection head is conical.

[0007] As a preferred scheme of the dust stick for chip, further comprising a raised plate, the raised plate is fixed to the side wall of the threaded rod, and the raised plate is located close to the tip of the dusting connection head.

[0008] As a preferred scheme of the dust stick for chip, further comprising a material removing assembly, the material removing assembly includes a spring connected to the surface of the baffle, a push material cylinder sleeved with the dust stick body, and an annular baffle fixed to the top end of the push material cylinder.

[0009] As a preferred scheme of the dust-sticking rod for chip, the spring is connected with the annular baffle, and the pushing cylinder slides along the dust-sticking rod body.

[0010] As a preferred scheme of the dust-sticking rod for chip, the spring is connected with the annular baffle, and the pushing cylinder slides along the dust-sticking rod body.

[0011] As a preferred scheme of the dust-sticking rod for chip, the spring is connected with the annular baffle, and the pushing cylinder slides along the dust-sticking rod body.

[0012] Compared with the prior art, the dust-sticking rod has the following advantages:

[0013] The dust-sticking rod assembly is provided, forming a separated use structure, the dust-sticking connector is directly inserted into the rubber adsorption head for adsorbing dust, the dust-sticking rod body is held for dust-sticking use, and the rubber adsorption head adhered to the dust-sticking connector is directly screwed off after use, so that the structure design can only replace the rubber adsorption head, the use cost is reduced, different-shaped rubber adsorption heads can be inserted, the dust-sticking rod is suitable for dust-sticking use of different electronic components, the applicability is improved, and the dust-sticking connector can be selected according to actual needs.

[0014] The pushing cylinder is pushed to remove the rubber adsorption head adhered to the dust-sticking connector, and the pushing cylinder is automatically reset after removal, so that the pushing cylinder is used next time.

[0015] The pushing cylinder is pushed to remove the rubber adsorption head adhered to the dust-sticking connector, and the pushing cylinder is automatically reset after removal, so that the pushing cylinder is used next time.

[0016] In specific use, the user holds the dust-sticking rod body, directly inserts the dust-sticking connector into the rubber adsorption head, so that the rubber adsorption head is driven to adsorb dust on the electronic component, after adsorption, the user presses the pushing cylinder downward, the spring is compressed in the process that the pushing cylinder moves downward, until the pushing cylinder separates the rubber adsorption head adhered to the dust-sticking connector, at this time, the pushing cylinder is released, the spring restores deformation, and the pushing cylinder is directly jolted to restore the original position, so that the dust-sticking rod body can be used for dust-sticking next time, and during use, the user rotates the threaded rod, so that the threaded rod and the dust-sticking connector are detached, and the dust-sticking connector of a suitable size can be replaced. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to make the technical scheme of the embodiments of the present application clearer, the present application will be described in detail below with reference to the drawings and specific embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings. Among them:

[0018] Figure 1 is a structural diagram of the present application;

[0019] Figure 2 is an exploded structural schematic diagram of the pusher barrel of the present application;

[0020] Figure 3 is a state schematic diagram of the pushing of the pusher barrel of the present application;

[0021] Figure 4 is a structural diagram of the replacement assembly of the present application.

[0022] In the drawings: 11, dust sticking rod body; 12, baffle; 13, first internal thread; 14, threaded rod; 15, dust sticking connector; 16, protruding plate; 21, spring; 22, pusher barrel; 23, annular baffle; 31, second internal thread; 32, spare pusher barrel; 33, external thread. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings.

[0024] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0025] Secondly, the present application is described in detail in combination with the schematic diagram, and in the detailed description of the embodiments of the present application, the sectional view of the device structure will be partially enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual production.

[0026] In order to make the purposes, technical schemes and advantages of the present application clearer, the embodiments of the present application will be described in further detail below with reference to the drawings.

[0027] The utility model provides a dust sticking rod for chip, through set up dust sticking rod subassembly, form the use structure of separation, through dust sticking connector directly inserts in the rubber adsorption head for adsorbing dust, hand dust sticking rod body carries out dust sticking use, after use, directly unscrew the rubber adsorption head that sticks on dust sticking connector, such structure design can replace rubber adsorption head only, reduce use cost, and can insert the rubber adsorption head of different shape, be applicable to different electronic components dust sticking use, improve applicability, the structure design of detachable dust sticking connector, the user can select the applicable specification according to actual demand.

[0028] Figures 1-4 It shows that the overall structure schematic diagram of the utility model chip dust sticking rod implementation mode, please refer to Figures 1-4 The main structure of the embodiment includes: dust sticking rod subassembly.

[0029] Dust sticking rod subassembly, dust sticking rod subassembly includes set up dust sticking rod body 11, the baffle 12 of fixed dust sticking rod body 11 bottom surface, the first internal thread 13 of opening in dust sticking rod body 11 end, the screw rod 14 connected with the first internal thread 13, the dust sticking connector 15 connected with screw rod 14;

[0030] Among them, dust sticking connector 15 is conical shape;

[0031] In specific use, the user hand holds dust sticking rod body 11, directly inserts dust sticking connector 15 into rubber adsorption head, which can drive rubber adsorption head to adsorb dust on electronic components, and the user rotates screw rod 14 during use, which can detach screw rod 14 and dust sticking connector 15, facilitating replacement of dust sticking connector 15 of applicable specification.

[0032] The material removing assembly is used for assisting material removal, specifically, the material removing assembly includes a spring 21 connected to the surface of the baffle 12, a pushing cylinder 22 sleeved with the dust sticking rod body 11, and an annular baffle 23 fixed to the top end of the pushing cylinder 22. The spring 21 is connected to the annular baffle 23, and the pushing cylinder 22 slides along the dust sticking rod body 11.

[0033] In specific use, after dust adsorption is completed, the user presses the pushing cylinder 22 downward, the pushing cylinder 22 moves downward to compress the spring 21, until the pushing cylinder 22 separates the rubber adsorption head attached to the dust sticking connector 15, at this time, the pushing cylinder 22 is released, the spring 21 restores to its original shape, and directly drives the pushing cylinder 22 to return to its original position, so that the dust sticking rod body 11 can be used for dust sticking next time.

[0034] Further, the replacement assembly includes a second internal thread 31 opened in the inner side of the pushing cylinder 22, a standby pushing cylinder 32 arranged below the pushing cylinder 22, and an external thread 33 opened in the outer side of the standby pushing cylinder 32.

[0035] In the specific use, the user turns the spare push cylinder 32, the spare push cylinder 32 is connected with the push cylinder 22 through the second internal thread 31, so that the caliber of the push cylinder 22 is changed, so that the caliber used can be selected to smoothly remove the rubber suction head on the dust joint 15.

[0036] Further, the raised plate 16 is further included, the raised plate 16 is fixed on the side wall of the threaded rod 14, and the raised plate 16 is located close to the tip of the dust joint 15;

[0037] In the specific use, the raised plate 16 facilitates the user's hand to exert force, and assists the worker to easily unscrew the threaded rod 14 without using tools.

[0038] Although the utility model has been described above with reference to the embodiments, various improvements can be made and equivalent parts can be replaced without departing from the scope of the utility model. In particular, as long as there is no structural conflict, each feature in the embodiments disclosed by the utility model can be combined with each other in any way, and the combinations are not exhaustively described in the specification only for the purpose of omitting the length and saving resources. Therefore, the utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A chip adhesive stick, characterized in that, include: The adhesive stick assembly includes an adhesive stick body (11), a baffle (12) fixed to the bottom surface of the adhesive stick body (11), a first internal thread (13) opened at the end of the adhesive stick body (11), a threaded rod (14) connected to the first internal thread (13), and an adhesive connector (15) connected to the threaded rod (14). The adhesive connector (15) is conical in shape.

2. The adhesive stick for chips according to claim 1, characterized in that, It also includes a protruding plate (16) fixed to the side wall of the threaded rod (14) and located near the tip of the adhesive connector (15).

3. The adhesive stick for chips according to claim 2, characterized in that, It also includes a material removal assembly, which includes a spring (21) connected to the surface of the baffle (12), a pusher cylinder (22) fitted with the sticky stick (11), and an annular baffle (23) fixed to the top of the pusher cylinder (22).

4. The adhesive stick for chips according to claim 3, characterized in that, The spring (21) is connected to the annular baffle (23), and the pusher cylinder (22) slides along the sticky rod (11).

5. The adhesive stick for chips according to claim 4, characterized in that, Three springs (21) are provided, and the three springs (21) are distributed in a ring on the bottom surface of the annular baffle (23).

6. The adhesive stick for chips according to claim 5, characterized in that, It also includes a replacement component, which includes a second internal thread (31) opened inside the pusher cylinder (22), a spare pusher cylinder (32) located below the pusher cylinder (22), and an external thread (33) opened outside the spare pusher cylinder (32).

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