Dimming jig, laser processing light path structure and laser processing equipment

Abstract

The utility model discloses a dimming jig which comprises a first jig and a second jig. The first jig is axially provided with a first light through hole in a penetrating manner, and the first jig is used for being arranged on the first side of the objective lens mounting table; a second light through hole is formed in the second jig in the axial direction in a penetrating mode, the second jig is used for being arranged on the second side of the objective lens installation table, the second light through hole and the first light through hole are coaxially arranged and both communicated with the assembling through hole, and the aperture of the second light through hole and the aperture of the first light through hole are matched with the laser so that the laser can pass through the second light through hole and the first light through hole. The dimming jig disclosed by the utility model is simple in structure, can quickly adjust the laser processing light path of the laser processing equipment, greatly reduces the dimming time, and improves the production efficiency. The utility model further discloses a laser processing light path structure and laser processing equipment.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and more specifically, to a dimming fixture, a laser processing optical path structure, and a laser processing equipment. Background Technology

[0002] With the continuous development and advancement of semiconductor manufacturing technology, and the ever-increasing performance requirements of semiconductor devices, traditional mechanical cutting methods can no longer meet the demands for high precision, high efficiency, and low damage. Laser cutting technology, as an advanced processing method, can achieve cutting results with high precision, high efficiency, and low damage. In the laser cutting process of wafers, whether the laser processing optical path is perpendicular to the surface of the wafer being processed is a key factor affecting cutting accuracy. However, the debugging process of the laser processing optical path is time-consuming, which seriously affects production efficiency.

[0003] Therefore, how to achieve rapid adjustment of the optical path in laser processing has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a light-adjusting fixture to achieve rapid adjustment of the optical path in laser processing.

[0005] Another objective of this invention is to provide a laser processing optical path structure including the above-mentioned dimming fixture.

[0006] Another objective of this utility model is to provide a laser processing device including the above-mentioned laser processing optical path structure.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A light-adjusting fixture is used for mounting on an objective lens mounting stage, wherein the objective lens mounting stage has a through-hole for mounting and processing an objective lens, comprising:

[0009] The first fixture has a first light-transmitting hole extending along the axial direction, and the first fixture is used to be set on the first side of the objective lens mounting stage;

[0010] The second fixture has a second light-transmitting hole extending through it along the axial direction. The second fixture is used to be set on the second side of the objective lens mounting stage. The second light-transmitting hole and the first light-transmitting hole are arranged coaxially and are both connected to the assembly through hole for laser to pass through.

[0011] Optionally, in the above-mentioned dimming fixture, an observation window is provided on the outer peripheral wall of the end of the second fixture away from the first fixture. The observation window is connected to the second light-transmitting hole and is used for the operator to observe the laser through the observation window.

[0012] Optionally, in the above-mentioned dimming fixture, a first partition plate is provided inside the first light-transmitting hole. A first central hole and a plurality of first circumferential holes are formed through the first partition plate. The first central hole is coaxially arranged with the first light-transmitting hole, and the first circumferential holes are arranged circumferentially around the first central hole at intervals. Furthermore, the first central hole and each of the first circumferential holes are connected to the first light-transmitting hole; and / or,

[0013] A second partition plate is provided inside the second light-transmitting hole. A second central hole and a plurality of second circumferential holes are provided through the second partition plate. The second central hole is arranged coaxially with the second light-transmitting hole. The second circumferential holes are arranged circumferentially around the second central hole at intervals. The second central hole and each of the second circumferential holes are all connected to the second light-transmitting hole.

[0014] Optionally, in the above-mentioned dimming fixture, a focusing lens is provided at the assembly through hole, and the second fixture is used to connect to the focusing lens via a thread.

[0015] Optionally, in the above-mentioned dimming fixture, the first fixture is provided with a mounting step, which is used to be embedded in the assembly through hole.

[0016] Optionally, in the above-mentioned dimming fixture, the circumferential outer wall of the first fixture is provided with an operating surface for the operator to rotate and twist.

[0017] A laser processing optical path structure includes a laser, a mirror assembly, an objective lens mounting stage, a processing objective lens, and the aforementioned dimming fixture;

[0018] The objective lens mounting stage has the assembly through hole, and the machining objective lens is used to be set at the assembly through hole;

[0019] The light emitted from the laser is reflected by the mirror assembly and passes through the processing objective lens or the first and second light-transmitting apertures.

[0020] Optionally, the laser processing optical path structure described above also includes a beam expander;

[0021] The mirror assembly includes a first mirror and a second mirror;

[0022] The light emitted from the laser is reflected by the first reflector to the beam expander, and the light emitted from the beam expander is reflected by the second reflector and passes through the processing objective lens or the first light-transmitting aperture and the second light-transmitting aperture.

[0023] Optionally, in the above-described laser processing optical path structure, a collimating mirror is provided between the first reflecting mirror and the beam expander, and a collimating mirror is provided between the beam expander and the second reflecting mirror.

[0024] Optionally, the laser processing optical path structure described above also includes a power meter;

[0025] The reflector assembly includes a first adjustable reflector, a second adjustable reflector, a telescopic reflector, and a power meter;

[0026] The telescopic mirror can move between a first position and a second position. When the telescopic mirror is in the first position, the first adjusting mirror is used to reflect the light emitted by the laser through the second adjusting mirror and through the processing objective or the first light-transmitting aperture and the second light-transmitting aperture. When the telescopic mirror is in the second position, the first adjusting mirror is used to reflect the light emitted by the laser through the telescopic mirror to the power meter.

[0027] A laser processing device includes the aforementioned laser processing optical path structure.

[0028] The dimming fixture provided by this utility model is used for mounting on an objective lens mounting stage. The objective lens mounting stage has a through-hole for mounting and processing the objective lens. The dimming fixture includes a first fixture and a second fixture. The first fixture has a first light-transmitting hole extending axially and is positioned on a first side of the objective lens mounting stage. The second fixture has a second light-transmitting hole extending axially and is positioned on a second side of the objective lens mounting stage. The second light-transmitting hole and the first light-transmitting hole are coaxially arranged and both communicate with the through-hole. The apertures of the second light-transmitting hole and the first light-transmitting hole are adapted to the laser beam to allow the laser beam to pass through. During the light adjustment process, first remove the processing objective lens from the objective lens mounting stage. Then, install the first fixture on the first side of the objective lens mounting stage, and replace the processing objective lens with the second fixture on the second side of the objective lens mounting stage. Adjust each of the reflectors of the laser processing equipment until the laser can pass through the first and second light-transmitting holes sequentially and exit onto a piece of paper or other observable plane. By observing whether the beam pattern of the emitted laser on the paper matches the cross-sectional shape of the first or second light-transmitting hole, it can be determined whether the laser processing optical path of the laser processing equipment is properly adjusted. After proper adjustment, the light adjustment fixture can be removed from the objective lens mounting stage, and the processing objective lens can be reassembled onto the objective lens mounting stage to perform laser cutting.

[0029] Compared with existing technologies, the dimming fixture provided by this utility model has a simple structure and can quickly adjust the laser processing optical path of laser processing equipment, which greatly reduces the dimming time and improves production efficiency.

[0030] The laser processing optical path structure and laser processing equipment provided by this utility model include the above-mentioned dimming fixture, so they also have the above-mentioned structure and beneficial effects, which will not be repeated here. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the assembly structure of the dimming fixture disclosed in an embodiment of the present utility model;

[0033] Figure 2 This is a schematic diagram of the structure of the first fixture disclosed in an embodiment of the present utility model;

[0034] Figure 3 This is a schematic diagram of the structure of the second fixture disclosed in an embodiment of the present utility model. Figure 1 ;

[0035] Figure 4 This is a schematic diagram of the structure of the second fixture disclosed in an embodiment of the present utility model. Figure 2 ;

[0036] Figure 5 The optical path of the laser processing optical path structure disclosed in the embodiments of this utility model Figure 1 ;

[0037] Figure 6 The optical path of the laser processing optical path structure disclosed in the embodiments of this utility model Figure 2 ;

[0038] Figure 7 The optical path of the laser processing optical path structure disclosed in the embodiments of this utility model Figure 3 .

[0039] Among them, 100 is the first fixture, 101 is the first central hole, 102 is the first circumferential hole, 103 is the operating plane, 104 is the mounting step, 110 is the second fixture, 111 is the second light-transmitting hole, 112 is the observation window, 113 is the second central hole, and 114 is the second circumferential hole;

[0040] 200 is the objective lens mounting stage, 210 is the laser, 220 is the mirror assembly, 221 is mirror one, 222 is mirror two, 223 is the first adjusting mirror, 224 is the telescopic mirror, 225 is the second adjusting mirror, 230 is the beam expander, 240 is the power meter, 250 is the focusing mirror, and 260 is the collimating mirror.

[0041] 300 represents the workpiece being processed. Detailed Implementation

[0042] The core of this utility model lies in disclosing a dimming fixture to achieve rapid adjustment of the optical path in laser processing.

[0043] Another core aspect of this utility model is the disclosure of a laser processing optical path structure including the aforementioned dimming fixture.

[0044] Another core aspect of this utility model is the disclosure of a laser processing device that includes the aforementioned laser processing optical path structure.

[0045] Hereinafter, embodiments will be described with reference to the accompanying drawings. Furthermore, the embodiments shown below do not limit the scope of the utility model as described in the claims. Additionally, the complete contents of the structures represented in the embodiments below are not limited to those necessary for the solution of the utility model as described in the claims. It should be noted that, for ease of description, only the parts relevant to the utility model are shown in the drawings. Unless otherwise specified, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0046] Combination Figures 1-7 , Figure 1 The dotted line in the diagram shows the laser emission path. The dimming fixture disclosed in this utility model is used to mount on the objective lens mounting stage 200. The objective lens mounting stage 200 has a through hole for mounting and processing the objective lens. The dimming fixture includes a first fixture 100 and a second fixture 110. The first fixture 100 has a first light-transmitting hole through it along the axial direction and is used to be disposed on the first side of the objective lens mounting stage 200. The second fixture 110 has a second light-transmitting hole 111 through it along the axial direction and is used to be disposed on the second side of the objective lens mounting stage 200. The second light-transmitting hole 111 and the first light-transmitting hole are coaxially arranged and both communicate with the through hole. The apertures of the second light-transmitting hole 111 and the first light-transmitting hole are adapted to the laser to allow the laser to pass through.

[0047] During the light adjustment process, the processing objective lens is first removed from the objective lens mounting stage 200. Then, the first fixture 100 is installed on the first side of the objective lens mounting stage 200, and the second fixture 110 is installed on the second side of the objective lens mounting stage 200 in place of the processing objective lens. The various reflectors of the laser processing equipment are adjusted until the laser can pass through the first and second light-transmitting holes 111 in sequence and exit onto a piece of paper or other observable plane. By observing whether the light pattern of the emitted laser on the paper is consistent with the cross-sectional shape of the first or second light-transmitting hole, it can be determined whether the laser processing optical path of the laser processing equipment is properly adjusted. After proper adjustment, the light adjustment fixture can be removed from the objective lens mounting stage 200, and the processing objective lens can be reassembled onto the objective lens mounting stage 200 to perform laser cutting.

[0048] Compared with the prior art, the dimming fixture disclosed in this utility model has a simple structure and can quickly adjust the laser processing optical path of the laser processing equipment, which greatly reduces the dimming time and improves production efficiency.

[0049] The second fixture 110 has an axial extension length that is close to or the same as that of the processing objective lens, so as to effectively replace the processing objective lens and simulate the laser processing optical path.

[0050] For ease of observation, combined with Figure 1 , Figure 3 and Figure 4 An observation window 112 is radially provided on the outer peripheral wall of the end of the second fixture 110 away from the first fixture 100. The observation window 112 is connected to the second light-transmitting hole 111, allowing the operator to directly observe the laser processing optical path and make adjustments through the observation window 112, which is safe and convenient.

[0051] Further optimize the plan, combined with Figure 2 A first partition plate is provided inside the first light-transmitting hole. A first central hole 101 and a plurality of first circumferential holes 102 are formed through the first partition plate. The first central hole 101 is coaxially arranged with the first light-transmitting hole. The first circumferential holes 102 are arranged circumferentially around the first central hole 101 at intervals. The first central hole 101 and each of the first circumferential holes 102 are all connected to the first light-transmitting hole, and / or, in combination with… Figure 3 and Figure 4 A second partition plate is provided inside the second light-transmitting hole 111. A second central hole 113 and a plurality of second circumferential holes 114 are provided through the second partition plate. The second central hole 113 is arranged coaxially with the second light-transmitting hole 111. The second circumferential holes 114 are arranged circumferentially around the second central hole 113 at intervals. The second central hole 113 and each of the second circumferential holes 114 are all connected to the second light-transmitting hole 111.

[0052] The arrangement of the first and / or second partition plates allows for the determination of laser processing optical path collimation by observing the completeness of the laser emission pattern (including shadow and bright areas). The first central hole 101 and the second central hole 113 are circular holes, while the shapes of the first circumferential holes 102 and the second circumferential holes 114 are not limited to fan-shaped or circular shapes. When both the first and second partition plates are used, it is preferable that the number of first circumferential holes 102 and the second circumferential holes 114 are equal and they are staggered for easy observation. Specifically, positioning protrusions can be provided on one of the first fixture 100 and the second fixture 110, and positioning grooves can be provided on the other. The positioning protrusions and positioning grooves are fitted together to achieve circumferential positioning and assembly.

[0053] Preferably, the first partition plate and the first fixture 100 are integrally formed and are disposed at the end of the first fixture 100 for easy processing; the second partition plate and the second fixture 110 are integrally formed and are disposed at the end of the second fixture 110 for easy processing.

[0054] In one embodiment, a focusing lens 250 is provided at the assembly through hole, and the second fixture 110 can be threadedly connected to the focusing lens 250 for installation. Then, the optical path is adjusted by adjusting each reflector.

[0055] Combination Figure 2 The first fixture 100 is provided with a mounting step 104, which is used to assemble with the assembly through hole. Threads may be provided on the circumferential outer wall of the mounting step 104 for threaded connection with the assembly through hole.

[0056] Further optimize the plan, combined with Figure 2 An operating surface 103 is provided on the circumferential outer wall of the first fixture 100 for operators to perform screwing operations.

[0057] Combination Figure 5 and Figure 6 The laser processing optical path structure disclosed in this utility model includes a laser 210, a mirror assembly 220, an objective lens mounting stage 200, a processing objective lens, and the aforementioned dimming fixture. The objective lens mounting stage 200 has an assembly through-hole, and the processing objective lens is positioned at the assembly through-hole. The light emitted from the laser 210 is reflected by the mirror assembly 220 and passes through the processing objective lens or the first and second light-transmitting holes 111 to form a laser processing optical path or a laser adjustment optical path. Since it includes the aforementioned dimming fixture, it also possesses the aforementioned structure and beneficial effects. Other structures refer to existing technology and will not be described in detail here.

[0058] The laser 210 mentioned above is preferably a high-power, short-pulse laser 210. The laser 210 emits ultraviolet laser, and the pulse width of the emitted laser is nanosecond, picosecond or femtosecond. The emitted laser wavelength is 355nm or 343nm, the emitted laser frequency is continuously adjustable between 10KHz and 2000KHz, and the average power is adjustable from 0 to 30W.

[0059] Furthermore, combined Figure 5 The laser processing optical path structure includes a focusing lens 250, which is mounted on the objective lens stage 200. The focusing lens 250 can focus the laser beam onto the surface of the workpiece 300 for cutting.

[0060] In one embodiment, combined with Figure 6The laser processing optical path structure also includes a beam expander 230 and a reflector assembly 220 including a first reflector and a second reflector. Light emitted from the laser 210 is reflected by the first reflector to the beam expander 230. The laser spot size can be adjusted by the beam expander 230. Light emitted from the beam expander 230 is reflected by the second reflector and passes through the processing objective lens or the first and second light-transmitting apertures 111. The beam expander 230 allows for spot shaping, achieving micron-level cutting precision for cutting small-sized chips.

[0061] In one embodiment, the laser processing optical path structure further includes a power meter 240 for power measurement. The mirror assembly 220 includes a first adjusting mirror 223, a second adjusting mirror 225, a telescopic mirror 224, and the power meter 240. The telescopic mirror 224 is movable between a first position and a second position. When the telescopic mirror 224 is in the first position, the first adjusting mirror 223 reflects the light emitted from the laser 210 through the second adjusting mirror 225, passing through the processing objective lens or the first and second light-transmitting apertures 111. When the telescopic mirror 224 is in the second position, the first adjusting mirror 223 reflects the light emitted from the laser 210 to the power meter 240. During optical path adjustment, the telescopic mirror 224 is in the first position, and the optical path can be adjusted by adjusting the reflection angles of the first adjusting mirror 223 and the second adjusting mirror 225.

[0062] In a specific embodiment disclosed in this utility model, combined with Figure 5 The laser 210 has a series of reflectors arranged in its output path, including a first reflector 221, a second reflector 222, a beam expander 230, a first adjusting reflector 223, a second adjusting reflector 225, a focusing lens 250, and a processing objective lens. After reflection by each reflector, the laser beam finally passes completely through the processing objective lens. The laser output from the processing objective lens is focused on the surface of the workpiece 300, causing the material to melt or vaporize at the laser focusing point, thereby achieving the cutting of the workpiece 300.

[0063] The specific formula for the diameter of the laser focal point on the surface of the workpiece 300 through the focusing lens 250 is as follows:

[0064]

[0065] In the formula: f is the focal length of the focusing lens 250; λ is the wavelength of the incident beam; D is the diameter of the incident beam.

[0066] To ensure the collimation effect of the laser processing optical path, combined with Figures 5-7A collimating mirror 260 can be installed between the second reflector 222 and the beam expander 230, between the beam expander 230 and the first adjusting reflector 223, and between the second adjusting reflector 225 and the focusing mirror 250.

[0067] The laser processing equipment disclosed in this utility model includes the aforementioned laser processing optical path structure, and therefore also possesses the aforementioned structure and beneficial effects, which will not be repeated here. Specifically, this laser processing equipment can be a laser surface cutting machine.

[0068] The laser processing equipment disclosed in this utility model uses a non-contact method to cut wafers, reducing the risk of material damage and improving the cutting quality; it has a fast cutting speed, which can improve production efficiency and reduce the production cycle; and it has a wide range of applications, applicable to the cutting of a variety of hard and brittle materials.

[0069] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Specific technical means in some embodiments may be incorporated, in whole or in part, into another embodiment without being explicitly excluded by another embodiment. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A light adjusting tool for mounting on an objective lens mounting table (200) through which an assembly through hole for mounting a processing objective lens is formed, characterized in that, The utility model relates to a laser processing device, comprising: a first jig (100) having a first light passage hole axially through, the first jig (100) is used to set up in the first side of the objective lens mounting platform (200); a second jig (110) having a second light passage hole (111) axially through, the second jig (110) is used to set up in the second side of the objective lens mounting platform (200), the second light passage hole (111) and the first light passage hole coaxially arranged and all with the assembly through -hole communication, for the laser passes through.

2. The dimming fixture of claim 1, wherein, The second jig (110) is away from the first jig (100) one end outer wall and is opened with observation window (112), the observation window (112) with the second light passage hole (111) communication, for the operating personnel observes laser by the observation window (112) place.

3. The light adjusting fixture of claim 1, wherein, The first light passage hole is provided with the first partition plate, the first partition plate is opened with first center hole (101) and a plurality of first circumferential hole (102) through, the first center hole (101) with the first light passage hole coaxially arranged, the first circumferential hole (102) is arranged in the circumferential spacing of first center hole (101), and the first center hole (101) and each first circumferential hole (102) are communicated with first light passage hole;And / or, The second light passage hole (111) is provided with the second partition plate, the second partition plate is opened with second center hole (113) and a plurality of second circumferential hole (114) through, the second center hole (113) with the second light passage hole (111) coaxially arranged, the second circumferential hole (114) is arranged in the circumferential spacing of second center hole (113), and the second center hole (113) and each second circumferential hole (114) are communicated with second light passage hole (111).

4. The dimming fixture of claim 1, wherein, The assembly through -hole is provided with focusing mirror (250), and the second jig (110) is used for with focusing mirror (250) threaded connection.

5. The dimming fixture as described in claim 1, characterized in that, The first jig (100) is provided with mounting step (104), and the mounting step is used to embed in the assembly through -hole.

6. The dimming fixture of claim 5, wherein the first and second light sources are arranged in a substantially linear array. The circumferential outer wall of the first jig (100) is provided with the operation plane (103) for the operating personnel screwing operation.

7. A laser machining optical path structure, characterized by, The utility model relates to a laser processing device, comprising: The objective lens mounting platform (200) is opened with the assembly through -hole, and the processing objective lens is arranged at the assembly through -hole; The light of laser (210) exit passes through the processing objective lens or the first light passage hole and the second light passage hole (111) via the reflection of reflecting mirror assembly (220).

8. The laser machining optical path structure of claim 7, wherein, Further comprising beam expander (230); The reflecting mirror assembly (220) comprises first reflecting mirror and second reflecting mirror; The light emitted by the laser (210) is reflected by the first mirror to the beam expander (230), and the light emitted by the beam expander (230) is reflected by the second mirror to pass through the machining objective or the first and second light holes (111).

9. The laser machining optical path structure of claim 8, wherein, A collimating mirror (260) is arranged between the first mirror and the beam expander (230), and a collimating mirror (260) is arranged between the beam expander (230) and the second mirror.

10. The laser machining optical path structure of claim 7, wherein, A power meter (240) is further included. The mirror assembly (220) comprises a first adjusting mirror (223), a second adjusting mirror (225), a telescopic mirror (224) and a power meter (240). The telescopic mirror (224) is movable between a first position and a second position, when the telescopic mirror (224) is in the first position, the first adjusting mirror (223) is used to reflect the light emitted by the laser (210) to pass through the machining objective or the first and second light holes (111) via the second adjusting mirror (225); when the telescopic mirror (224) is in the second position, the first adjusting mirror (223) is used to reflect the light emitted by the laser (210) to the power meter (240) via the telescopic mirror (224).

11. A laser processing apparatus characterized by comprising: The laser machining optical path structure as claimed in any one of claims 7-10 is included.

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