A manual riveting device for semiconductor chip test probe production

Abstract

The utility model relates to the technical field of semiconductor chip, especially a manual riveting pressure device for semiconductor chip test probe production, and its technical scheme comprises: fixed plate and screw bush, the fixed plate side welding has the connecting plate, the connecting plate inlays and installs bearing no.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor chip, concretely to a manual riveting device for semiconductor chip test probe production. BACKGROUND

[0002] The manual riveting device for semiconductor chip test probe production is a kind of equipment, usually used to manufacture semiconductor chip test probe, the function of this device is to connect test probe with semiconductor chip by manual operation to ensure that it can be tested reliably, riveting device usually includes a mechanical system to apply appropriate force and pressure to firmly fix test probe on chip, which helps to ensure normal electrical connection and stable signal transmission, thereby improving the accuracy and reliability of test.

[0003] Through the retrieval, the publication number: CN220239966U, a kind of manual riveting machine, including workbench, the workbench top one side fixed connection concave support frame, be equipped with riveting device on the concave support frame, the workbench top is opened sliding rail, the sliding rail matching connection transverse moving table, the transverse moving table top one side is equipped with push-pull device, to solve when manual riveting machine carries out riveting operation, the bottom plate parts generally need to be fixed, currently adopt manual adjustment fixed majority, not careful easily press to finger, even if using clamping device to be fixed, after each riveting, still need to take down the plate and adjust the position to be clamped, lead to the process is more complicated.

[0004] As described above, in prior art CN220239966U, when performing riveting operation, the transverse moving table can only move horizontally, resulting in a long stroke of the riveting device, which leads to a long time consumption of riveting operation. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of manual riveting device for semiconductor chip test probe production, with the advantages of can drive semiconductor chip and probe to move in opposite directions synchronously, improve riveting speed, solve the problem of long time consumption of manual riveting device processing.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of manual riveting device for semiconductor chip test probe production, including fixed plate and screw sleeve, the fixed plate side welding has connecting plate, the connecting plate is embedded and is equipped with bearing one, the bearing one inner ring is fixedly installed with two screw rods, two the screw sleeve is engaged with two screw rods, the screw sleeve side surface of the connecting plate upper portion is installed with fixed sleeve, the screw sleeve side surface of the connecting plate lower portion is installed with bearing plate, the bearing plate top front and rear sides are both installed with support plate, the opposite side of two the support plate is both symmetrically installed with spring, the opposite end of two groups the spring is both installed with clamping plate.

[0007] When the manual riveting device for producing semiconductor chip test probes is used, the bottom plate is fixed on the bearing structure through the fixing holes of the bottom plate by using bolts and other tools, the test probe is inserted into the fixed sleeve, the two screw rods are rotated by using the two fixed discs, the two screw rods move in the two screw holes of the fixed sleeve, the two clamping sleeves are moved by the two screw rods to clamp and fix the probe, the two pull rods are pulled by using the two pull plates, the two pull rods drive the two clamping plates to move in opposite directions, the semiconductor chip is placed on the top of the bearing plate, the two clamping plates clamp and fix the semiconductor chip by the elastic force of the two springs, the two screw sleeves move in opposite directions on the two lead screws by rotating the two lead screws by using the hand wheel, and the semiconductor chip is lifted and the probe is lowered, so that the probe is inserted into the semiconductor chip.

[0008] Preferably, a hand wheel is installed at the top of the lead screw, and the two lead screws are distributed in opposite directions. The hand wheel can be used to rotate the two lead screws, and the two screw sleeves can move in opposite directions on the two lead screws.

[0009] Preferably, two sliding grooves are symmetrically formed in the side surface of the fixed plate, and a sliding block is installed on the side of each screw sleeve opposite to the fixed plate, and the two sliding blocks are slidably connected with the two sliding grooves. The two sliding blocks limit the two screw sleeves, and when the two screw sleeves move, the two sliding blocks slide in the two sliding grooves to prevent the two screw sleeves from shaking.

[0010] Preferably, a bottom plate is welded to the side surface of the fixed plate below the connecting plate, a bearing No. 2 is installed at the top of the bottom plate, and the bottom of the lead screw is fixedly connected with the inner ring of the bearing No. 2. The bearing No. 2 fixes the lead screw below the connecting plate, thereby increasing the stability of the lead screw.

[0011] Preferably, the bottom plate is rectangularly arrayed with fixing holes. The bottom plate is fixed on the bearing structure through the fixing holes of the bottom plate by using bolts and other tools.

[0012] Preferably, screw holes are formed in the front and back sides of the fixed sleeve, screw rods are threadedly connected with the inner walls of the two screw holes, clamping sleeves are movably installed at the opposite ends of the two screw rods, and fixed discs are installed at the ends of the two screw rods away from each other. The two fixed discs can be used to rotate the two screw rods, the two screw rods move in the two screw holes of the fixed sleeve, and the two screw rods drive the two clamping sleeves to move to clamp and fix the probe.

[0013] Preferably, rubber pads are installed at the opposite sides of the two clamping plates, pull rods are installed at the ends of the two pull rods away from each other, the two support plates are arrayed with movable holes, and pull plates are installed at the ends of the two pull rods penetrating through the two movable holes. The two pull plates can be used to pull the two pull rods, the two pull rods can drive the two clamping plates to move, and the two rubber pads prevent the two clamping plates from directly contacting the semiconductor chip to leave clamping marks on the side surface of the semiconductor chip.

[0014] Preferably, the outer diameter of the two pull plates is larger than the inner diameter of the two movable holes. The two pull plates prevent the two pull rods from slipping out of the two movable holes.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This invention uses a screw sleeve, a fixing sleeve, and a carrier plate to fix the semiconductor chip on the top of the carrier plate. After fixing the probe inside the fixing sleeve, the two lead screws are rotated by handwheel. The two screw sleeves move in opposite directions on the two lead screws. The two screw sleeves drive the semiconductor chip to rise and drive the probe to fall, so that the probe can be inserted into the semiconductor chip. This achieves the effect of synchronously driving the semiconductor chip and the probe to move in opposite directions, thereby improving the riveting speed. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention from a first angle;

[0018] Figure 2 This is a two-dimensional structural diagram of the present invention from a second angle;

[0019] Figure 3 This is a schematic diagram of the base plate, fixing plate, and connecting plate of this utility model;

[0020] Figure 4 This is a schematic diagram of the fixing sleeve structure of this utility model;

[0021] Figure 5 This is a schematic diagram of the support plate structure of this utility model.

[0022] In the diagram: 1. Base plate; 2. Fixing plate; 3. Screw sleeve; 4. Connecting plate; 5. Handwheel; 6. Lead screw; 7. Fixing sleeve; 8. Support plate; 9. Pull plate; 10. Spring; 11. Bearing plate; 12. Rubber pad; 13. Clamping plate; 14. Fixing hole; 15. Clamping sleeve; 16. Slide groove; 17. Sliding block; 18. Bearing 1; 19. Bearing 2; 20. Fixing plate; 21. Screw; 22. Screw hole; 23. Movable hole; 24. Pull rod. Detailed Implementation

[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0025] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0027] Example 1

[0028] like Figures 1-5 As shown, this utility model proposes a manual riveting device for producing semiconductor chip test probes, including a fixing plate 2 and screw sleeves 3. A connecting plate 4 is welded to the side of the fixing plate 2. A bearing 18 is embedded in the connecting plate 4. Two lead screws 6 are fixedly installed on the inner ring of the bearing 18. A handwheel 5 is installed on the top of the lead screws 6. The outer screws of the two lead screws 6 are distributed in opposite directions. Two screw sleeves 3 are engaged with the two lead screws 6. Two sliding grooves 16 are symmetrically opened on the side of the fixing plate 2. A slider 17 is installed on the side of the two screw sleeves 3 opposite to the fixing plate 2. The two sliders 17 and the two sliding grooves 16 are slidably connected. A base plate 1 is welded to the side of the fixing plate 2 below the connecting plate 4. A bearing 29 is installed on the top of the base plate 1. The bottom of the lead screw 6 is fixedly connected to the inner ring of the bearing 29. The base plate 1 has fixing holes 14 in a rectangular array. A fixing sleeve 7 is installed on the side of the screw sleeve 3 above the connecting plate 4. The fixing sleeve 7 has screw holes 22 on both the front and rear sides. The inner walls of the two screw holes 22 are threaded with screw rods 21. The opposite ends of the two screw rods 21 are movably installed with clamps 15. The opposite ends of the two screw rods 21 are installed with fixing plates 20. A bearing plate 11 is installed on the side of the screw sleeve 3 below the connecting plate 4. The top front and rear sides of the bearing plate 11 are installed with support plates 8. The opposite sides of the two support plates 8 are symmetrically installed with springs 10. The opposite ends of the two sets of springs 10 are installed with clamps 13. The opposite sides of the two clamps 13 are installed with rubber pads 12. The opposite ends of the two clamps 13 are installed with pull rods 24. The two support plates 8 have movable holes 23. The ends of the two pull rods 24 that pass through the two movable holes 23 are installed with pull plates 9.

[0029] In the embodiment, the bottom plate 1 is fixed on the bearing structure through the fixing hole 14 of the bottom plate 1 by using a bolt or the like, the test probe is inserted into the fixed sleeve 7, the two clamping sleeves 15 are moved to clamp and fix the probe by rotating the two screw rods 21 using the two fixing discs 20, the two clamping plates 13 are moved in the opposite direction by pulling the two pull rods 24 using the two pull plates 9, the semiconductor chip is placed on the top of the bearing plate 11, the two clamping plates 13 clamp and fix the semiconductor chip by the elastic force of the two groups of springs 10 after the two pull plates 9 are loosened, the two screw sleeves 3 move in the opposite direction on the two lead screws 6 by rotating the two lead screws 6 using the hand wheel 5, and the semiconductor chip is lifted and the probe is lowered, so that the probe is inserted into the semiconductor chip.

[0030] Embodiment two

[0031] As Figures 1-5 shown, the utility model discloses a kind of manual riveting pressure devices for semiconductor chip test probe production, compared with embodiment one, the utility model further includes: pull plate 9 and movable hole 23, the diameter of two pull plate 9 outside is greater than the diameter of two movable hole 23 inside.

[0032] In the embodiment, the pull rod 24 can be prevented from sliding out of the movable hole 23 by the pull plate 9.

[0033] Finally, it should be noted that: the above only for the preferred embodiment of the utility model, and not for limiting the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of technical features. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A hand riveting device for semiconductor chip test probe production, comprising a fixed plate (2) and a screw sleeve (3), characterized in that: The fixed plate (2) side welding has connecting plate (4), the connecting plate (4) is embedded with bearing one (18), the bearing one (18) inner ring fixed mounting has two lead screws (6), two screw sleeves (3) and two lead screws (6) meshing connection, the screw sleeve (3) side above the connecting plate (4) is installed with fixed sleeve (7), the screw sleeve (3) side below the connecting plate (4) is installed with bearing plate (11), the bearing plate (11) top front and back both sides are installed with support plate (8), two support plates (8) opposite sides are symmetrically installed with spring (10), two groups of springs (10) opposite ends are installed with clamping plate (13).

2. The hand riveting device for semiconductor chip test probe production according to claim 1, characterized in that: The lead screw (6) top is installed with hand wheel (5), and the two lead screws (6) are distributed in opposite directions.

3. The hand riveting device for semiconductor chip test probe production according to claim 1, characterized in that: The fixed plate (2) side is symmetrically provided with two sliding grooves (16), and two screw sleeves (3) are installed on the opposite sides of the fixed plate (2), and two sliding blocks (17) are installed on the opposite sides of the two sliding grooves (16).

4. The hand riveting device for semiconductor chip test probe production of claim 1, wherein: The connecting plate (4) below the fixed plate (2) side welding has bottom plate (1), and the bottom plate (1) top is installed with bearing two (19), and the lead screw (6) bottom is fixedly connected with the inner ring of the bearing two (19).

5. The hand riveting device for semiconductor chip test probe production according to claim 4, characterized in that: The bottom plate (1) is provided with a plurality of fixing holes (14) in a rectangular array.

6. The hand riveting device for semiconductor chip test probe production of claim 1, wherein: The fixed sleeve (7) is provided with screw holes (22) on the front and back sides, and two screw rods (21) are screwed on the inner walls of the two screw holes (22), two clamping sleeves (15) are movably installed on the opposite ends of the two screw rods (21), and two fixed discs (20) are installed on the ends away from each other of the two screw rods (21).

7. The hand riveting device for semiconductor chip test probe production of claim 1, wherein: Two clamping plates (13) opposite sides are installed with rubber pad (12), two clamping plates (13) away from each other end are installed with pull rod (24), two support plates (8) are provided with movable hole (23), two pull rod (24) pass through two movable hole (23) one end are installed with pull plate (9).

8. The hand riveting device for semiconductor chip test probe production according to claim 7, characterized in that: The outer diameter of the two pull plates (9) is greater than the inner diameter of the two movable holes (23).

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