Supporting structure for silicon rod cutting operation

Abstract

The utility model discloses a supporting structure for silicon rod cutting operation. The supporting structure comprises a bearing frame arranged on a machining platform and used for bearing a to-be-cut silicon rod, and a bottom jacking mechanism arranged on the bearing frame and used for providing support for the to-be-cut silicon rod. The bottom jacking mechanism comprises a plurality of jacking columns arranged in two rows in parallel in the second direction, and a jacking driving unit capable of independently controlling the jacking columns so that each jacking column can ascend to abut against or descend to be away from the outer circumferential face of the silicon rod. According to the supporting structure provided by the invention, by arranging the bottom jacking mechanism, supporting of the silicon rod in the cutting-off process is achieved. A plurality of jacking columns which can be independently controlled are arranged in the bottom jacking mechanism, so that each jacking column can be lifted by different heights to jack the circumferential surface of a silicon rod in a self-adaptive manner, full contact with the silicon rod is realized, the silicon rod is stably jacked, displacement of the silicon rod during cutting is avoided, and the silicon rod cutting efficiency is improved. Therefore, the edge breakage phenomenon is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon processing, in particular to a support structure for silicon rod cutting operation. BACKGROUND

[0002] At present, with the attention and opening of society to green renewable energy utilization, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, the common crystalline silicon solar cell is made on a high-quality silicon wafer, which is cut from a pulled or cast silicon ingot through multi-wire saw cutting and subsequent processing.

[0003] The existing silicon wafer manufacturing process, taking a single crystal silicon wafer as an example, can generally include the following steps: first, a long silicon rod in the form of a whole cylinder is cut by a silicon rod cutting machine to form a plurality of short silicon rods; after cutting, a silicon rod squaring machine is used to square the short silicon rods after cutting to form square silicon rods with a rectangular cross section; then, the square silicon rods are subjected to grinding, rounding or chamfering and other grinding operations to shape the surface of the silicon rod to meet the corresponding flatness and size tolerance requirements, and then the square silicon rods are cut to obtain silicon wafers.

[0004] Generally, the silicon rod is formed by melting polycrystalline silicon and growing single crystal silicon by the Czochralski method, so the diameter of the silicon rod can be gradually changed. When cutting the silicon rod, most manufacturers use a fixed support structure to support the silicon rod. However, this support structure can not be in contact with the silicon rod or not in sufficient contact, resulting in displacement of the silicon rod at the moment of cutting, which in turn causes edge collapse. Therefore, how to provide a support structure that can be in full contact with the silicon rod to avoid edge collapse during cutting is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0005] In view of the above-mentioned shortcomings of the related art, the purpose of the present application is to provide a support structure for silicon rod cutting operation to solve the technical problem that the existing support structure is not in contact with the silicon rod or not in sufficient contact, resulting in edge collapse of the silicon rod during cutting.

[0006] To achieve the above-mentioned purposes and other related purposes, the present application provides a support structure for silicon rod cutting operation, which includes a support frame arranged on a processing platform for carrying a to-be-cut silicon rod, and a bottom lifting mechanism arranged on the support frame for providing support for the to-be-cut silicon rod; wherein the bottom lifting mechanism includes a plurality of lifting columns arranged in two rows in parallel along a second direction, and a lifting drive unit capable of independently controlling the lifting columns, so that each lifting column can be lifted to touch or lowered away from the outer circumferential surface of the silicon rod.

[0007] In summary, the support structure provided in this application, by setting a bottom lifting mechanism, achieves support for the silicon rod during the cutting process; by setting multiple independently controllable lifting columns in the bottom lifting mechanism, each lifting column can rise to a different height to adaptively contact the circumferential surface of the silicon rod, thereby achieving full contact with the silicon rod, so that the silicon rod is stably supported, thus avoiding displacement of the silicon rod during cutting, thereby avoiding edge chipping and improving the quality of silicon rod processing. Attached Figure Description

[0008] The specific features involved in this application are shown in the appended claims. The features and advantages of the invention can be better understood by referring to the exemplary embodiments and accompanying drawings described in detail below. A brief description of the drawings is as follows:

[0009] Figure 1 The diagram shown is a structural schematic of a dual-station silicon rod cutting machine in one embodiment of this application.

[0010] Figure 2 The diagram shown is a structural schematic of the first support structure in one embodiment of this application.

[0011] Figure 3 and Figure 4 The following are schematic diagrams of the wire cutting device in one embodiment of this application.

[0012] Figure 5 The diagram shown is a flowchart illustrating how a control device controls multiple support structures to perform a feeding operation under a first command in one embodiment of this application.

[0013] Figure 6 The diagram shown is a schematic diagram of multiple first support structures converging at the feeding end in one embodiment of this application.

[0014] Figure 7 This is a schematic diagram showing the state of the first support structure performing a truncation operation in one embodiment of this application.

[0015] Figure 8 The diagram shows a flow chart in one embodiment of this application, in which a control device controls multiple support structures and multiple wire cutting devices to perform material cutting operations under a second command.

[0016] Figure 9 This is a schematic diagram showing the state of the silicon rod dual-station cutting machine after performing step S210 in one embodiment of this application.

[0017] Figure 10 This is a schematic diagram showing the state of the silicon rod dual-station cutting machine after step S220 is performed in one embodiment of this application.

[0018] Figure 11Fig. 6 shows a schematic diagram of a state of the silicon rod double station cutting machine after performing step S230 in an embodiment of the present application.

[0019] Figure 12 Fig. 7 shows a schematic diagram of a state of the silicon rod double station cutting machine when performing step S250 in an embodiment of the present application. DETAILED DESCRIPTION

[0020] The advantages and superiorities of the present application can be readily understood and appreciated by those skilled in the art from the following detailed description in conjunction with the accompanying drawings. In the following description, some embodiments can be described with reference to the accompanying drawings. It will be understood that other embodiments can be used and structural, component or mechanical changes can be made without departing from the spirit and scope of the present application. The following detailed description is not intended to limit the scope of the present application, as defined by the appended claims, and the scope of the embodiments of the present application solely by the claims as published. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application.

[0021] It should be understood that, although the terms first, second, or third, etc. can be used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first station can be termed a second station, and similarly, a second station can be termed a first station, without departing from the scope of the various described embodiments. The first station and the second station are both stations that are being described, but they are not the same station, unless the context clearly indicates otherwise. The same applies to a first silicon rod and a second silicon rod, a first support structure and a second support structure, a first cutting wire saw and a second cutting wire saw, and a first guide rail and a second guide rail, etc.

[0022] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including", when used herein, specify the presence of stated features, steps, operations, elements, components, items, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, and / or groups thereof. For example, a process, method, system, product or apparatus that comprises a list of steps or units does not necessarily rely on the clear list of those steps or units for its operation, but can include other steps or units that are not explicitly listed, or inherent to such process, method, product or apparatus. In addition, the term "and / or" where used herein, describes association between items associated by the conjunctive "and" and / or the disjunctive "or", that is, A and / or B can mean: A alone; B alone; A and B together. Further, the character " / " as used in the description of embodiments of the application generally indicates alternative or additional items that can be taken together. In addition, "multiple" in the description of embodiments of the application means two or more than two. Furthermore, the terms "or" and "and / or" as used herein, are to be interpreted as inclusive or meaning any one or any combination. Only when a combination of elements, functions, steps or operations are in some way inherently mutually exclusive, will that exception be applicable.

[0023] It will be further understood that when an element such as a layer, region or substrate is referred to as being "on" or extending "over" another element, it can be directly on or extend directly over the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" or extending "directly over" another element, there are no intervening elements present. It will also be appreciated by those of skill in the art that when an element, such as a layer, region or substrate, is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present. It will also be appreciated by those of skill in the art that the terms "coupled" and "coupling" generally refer to physical, mechanical, magnetic and / or electrical coupling or connection, and do not exclude the presence of an intermediate element between the coupled or associated items, unless specifically noted otherwise.

[0024] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" can be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the figures. It will be understood that these terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. In the present application, the "vertical", "horizontal", "parallel", and "perpendicular" definitions are intended to include instances of 10% variation from the standard definitions. For example, vertical typically means 90° from a reference line, but in the present application, vertical means within 80° to 100°. Unless specifically stated otherwise, comparative quantitative terms such as "greater than" and "less than" are intended to encompass the concept of "equal to".

[0025] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0026] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0027] In view of the technical problems mentioned in the background, the present application provides a support structure for silicon rod cutting operation, which is applied to a silicon rod double-station cutting machine. The support structure provided by the present application realizes the support of the silicon rod during the cutting process by arranging a bottom jacking mechanism. A plurality of jacking columns that can be independently controlled are arranged in the bottom jacking mechanism, so that each jacking column can be raised to a different height to adaptively touch the circumferential surface of the silicon rod, thereby realizing sufficient contact with the silicon rod, stably supporting the silicon rod, avoiding displacement of the silicon rod during cutting, avoiding the generation of edge collapse phenomenon, and improving the quality of silicon rod processing.

[0028] To define the directions and the way of operation between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined in the embodiments disclosed in the present application, wherein the first direction, the second direction and the third direction are straight directions and perpendicular to each other. For example, the length extension direction of the base of the machine stand is defined as the first direction (i.e. the left-right direction or the transfer direction), the width extension direction of the base of the machine stand is defined as the second direction (i.e. the front-rear direction or the transposition direction), and the vertical direction is defined as the third direction (i.e. the vertical direction, the plumb line direction, the up-down direction or the lifting direction).

[0029] The silicon rod double-station cutting machine provided in some embodiments of the present application is used for cutting operation of a silicon rod, i.e. cutting operation of an original long silicon rod to form a plurality of short silicon rods (i.e. cut silicon rod segments conforming to the workpiece specifications). In the following, for the convenience of description, the original long silicon rod is referred to as a silicon rod, and the short silicon rod formed after cutting operation is referred to as a silicon rod segment. The silicon rod is, for example, a single crystal silicon rod, i.e. a single crystal silicon rod with a length of about 5000 mm to 8000 mm, which is commonly used in silicon rod processing, etc., and the length of the silicon rod segment formed by cutting can be, for example, 300 mm to 1000 mm.

[0030] The following will be described in combination with Figures 1 to 12 The silicon rod double-station cutting machine will be described in detail.

[0031] Please refer to Figure 1 , which shows the structural schematic diagram of the silicon rod double-station cutting machine in an embodiment of the present application. As Figure 1 shown, the silicon rod double-station cutting machine comprises a machine stand, a plurality of support structures and a plurality of wire cutting devices. In some embodiments, the support structure can also be referred to as a supporting assembly, and in the following embodiments, the support structure is described as the term.

[0032] In an embodiment, the machine stand 1 is provided with a processing platform comprising a first station and a second station parallel to each other in the first direction. Further, the wire cutting device 4 for processing, such as cutting operation, of the to-be-cut silicon rod can be provided on the processing platform, and the cutting operation of the to-be-cut silicon rod is performed by the wire cutting device 4. The shape of the processing platform can be determined according to the machine stand 1, or can be determined according to the processing needs of the machine stand 1 and the wire cutting device 4 together. As Figure 1 shown, the machine stand 1 is in the shape of a rectangle as a whole, and the top thereof is provided with a processing platform. The processing platform of the machine stand 1 can be, for example, a rectangle, and the length thereof matches the length of the to-be-cut silicon rod. Here, the end of the machine stand 1 used for feeding can be called the feeding end, and the end of the machine stand 1 used for discharging can be called the discharging end. In Figure 1In the shown example, the first work station and the second work station are symmetrically arranged on the left and right sides of the base 1.

[0033] The support structure provided in the present application comprises a support frame arranged on the machining platform and used for supporting a to-be-cut silicon rod, and a bottom lifting mechanism arranged on the support frame and used for providing support for the to-be-cut silicon rod; wherein the bottom lifting mechanism comprises a plurality of lifting columns arranged in two rows in parallel along a second direction, and a lifting driving unit capable of independently controlling the lifting columns so that each lifting column can be lifted to touch or lowered away from the outer circumferential surface of the silicon rod.

[0034] In the present application, the support structure is for cutting a silicon rod. Figures 1-2 In the support structure in the shown example, the support frame is for cutting a silicon rod. Figures 1-2 In the support frame in the shown example, the bottom lifting mechanism is for cutting a silicon rod. Figures 1-2 In the bottom lifting mechanism in the shown example, the specific structure of the support frame and the bottom lifting mechanism can be referred to the description below, which will not be repeated here.

[0035] In an embodiment, the support structure further comprises a top pressing mechanism arranged on the support frame and used for pressing the top of the silicon rod. The specific structure of the top pressing mechanism can be referred to the description below, which will not be repeated here.

[0036] In an embodiment, the support structure further comprises a silicon rod moving mechanism arranged adjacent to the bottom lifting mechanism and used for delivering the to-be-cut silicon rod into position. The specific structure of the silicon rod moving mechanism can be referred to the description below, which will not be repeated here.

[0037] In an embodiment, the support structure further comprises a support frame shifting mechanism used for driving the support frame to move the silicon rod along a first direction to cooperate with the silicon rod moving mechanism to deliver the silicon rod into position. The specific structure of the support frame shifting mechanism can be referred to the description below, which will not be repeated here.

[0038] The support structure provided in the present application and the mechanisms included in the support structure will be described in detail below. Figures 1 to 2 The support structure provided in the present application and the mechanisms included in the support structure will be described in detail below.

[0039] In an embodiment, the plurality of support structures comprises a plurality of first support structures 2 and a plurality of second support structures 3, the plurality of first support structures 2 are movably arranged at the first work station and used for supporting a first silicon rod 10 placed horizontally and performing loading or unloading operation, and the plurality of second support structures 3 are movably arranged at the second work station and used for supporting a second silicon rod placed horizontally and performing loading or unloading operation.

[0040] In one embodiment, a plurality of first support structures 2 are provided on the first guide rail, and a plurality of second support structures 3 are provided on the second guide rail, which are parallel to each other. In other words, when the first silicon rod 10 or the second silicon rod is placed horizontally on the plurality of first support structures 2 or the plurality of second support structures 3, the axis of the first silicon rod 10 or the second silicon rod is substantially parallel to the first direction. It should be noted that the first support structure 2 and the second support structure 3 have the same structure and working principle, and therefore, the structure and working principle of the first support structure will be described in detail below by taking the first support structure 2 supporting the first silicon rod 10 as an example.

[0041] In one embodiment, a plurality of first support structures 2 are movably provided on the first work station for supporting the horizontally placed first silicon rod 10. Further, the plurality of first support structures 2 are spaced apart on the first work station for supporting the plurality of silicon rod segments formed after the first silicon rod 10 is cut. Each silicon rod segment can be supported by at least one first support structure 2. For example, in some examples, a silicon rod segment can be supported by one first support structure 2, and the central region of the silicon rod segment is supported. In other examples, a silicon rod segment can be supported by two or more first support structures 2.

[0042] Referring to Figure 2 , which shows a schematic view of the structure of the first support structure in one embodiment of the present application. As shown in Figure 2 , the first support structure 2 includes a support frame 21, a support frame displacement mechanism 22, and a silicon rod transfer mechanism 23. The support frame 21 is provided on the first guide rail for carrying the first silicon rod 10 for loading and cutting, and carrying the silicon rod segment after cutting for unloading. The support frame displacement mechanism 22 is used to drive the support frame 21 to move the first silicon rod 10 or the silicon rod segment along the first direction. The silicon rod transfer mechanism 23 is used to drive the first silicon rod 10 or the silicon rod segment to move relative to the support frame 21 along the first direction.

[0043] In the embodiment shown in Figure 2 , the support frame 21 is the main structure of the first support structure 2, the support frame displacement mechanism 22 is located at the bottom of the support frame 21, and the silicon rod transfer mechanism 23 is provided at the top of the support frame 21. It should be understood that for the movement of the first silicon rod 10 along the first direction, it can be achieved not only by driving the support frame 21 to move through the support frame displacement mechanism 22, but also by directly driving the first silicon rod 10 through the silicon rod transfer mechanism 23.

[0044] In an embodiment, the cradle shifting mechanism 22 comprises a slider and a moving driving unit, the slider is located at the bottom of the cradle 21 and is arranged on the first guide rail, and correspondingly, the machining platform of the base 1 is provided with a rack parallel to the first guide rail. The moving driving unit can comprise a driving gear and a gear driving motor associated with the driving gear, the driving gear is engaged with the rack, and the gear driving motor drives the driving gear connected therewith to rotate, and through the engagement between the driving gear and the rack, the first support structure 2 is driven to move along the first direction on the machining platform and on the first guide rail. Specifically, when the first silicon rod is placed on each first support structure 2 in a horizontal manner, the support structure to which each first support structure 2 belongs is driven to move along the first direction by the cradle shifting mechanism 22 in each first support structure 2, and the first silicon rod supported by each first support structure 2 is driven to move along the first direction.

[0045] Of course, the cradle shifting mechanism 22 can still be changed in other ways, for example, in other embodiments, the cradle shifting mechanism comprises a chain conveying mechanism or a conveyor belt mechanism, etc.

[0046] In an embodiment, the silicon rod transferring mechanism 23 comprises a roller set and a roller set driving unit, the roller set is arranged in two rows along the second direction, and the roller set driving unit is used to drive the roller set to rotate to drive the first silicon rod or the silicon rod segment to move along the first direction.

[0047] In an embodiment, each of the two rows of roller sets comprises a plurality of rollers arranged along the first direction. In Figure 2 In the example shown, each row of roller sets can comprise three rollers arranged along the first direction, of course, Figure 2For example, if the length of the silicon rod segment to be supported is longer, the number of rollers in each row of roller groups can be more than three (e.g., four, five, or more, etc.) to provide support over a larger length range and to provide greater rolling friction when moving the silicon rod segment. If the length of the silicon rod segment to be supported is shorter, the number of rollers in each row of roller groups can be less than three (e.g., two). In addition, the number of rollers included in the two rows of roller groups can also be inconsistent, e.g., in some examples, one row of roller groups includes two rollers and the other row of roller groups includes three rollers, or one row of roller groups includes three rollers and the other row of roller groups includes four rollers, or one row of roller groups includes four rollers and the other row of roller groups includes five rollers. It should be noted that the above examples are not exhaustive and can be adjusted according to actual production needs. In addition, in some examples, the rollers in the two rows of roller groups are aligned with each other, but this is not the case, e.g., in some examples, the rollers in the two rows of roller groups can also be staggered at a half-roller interval.

[0048] In an embodiment, each of the plurality of rollers has an inner inclined angle such that the roller face of the roller is in contact with the circumferential surface of the silicon rod, increasing the contact area and facilitating movement of the silicon rod.

[0049] In an embodiment, the roller group driving unit is configured to drive the rollers in the corresponding roller group to rotate to move the first silicon rod on the two rows of roller groups in the first direction. In one example, the two rows of roller groups share one roller group driving unit, and the rollers in the two rows of roller groups are driven to rotate simultaneously by the roller group driving unit. In another example, each of the two rows of roller groups corresponds to one roller group driving unit, and each roller group driving unit is configured to drive the rollers in the corresponding row of roller groups to rotate. The roller group driving unit may, for example, include a roller driving motor.

[0050] Specifically, in actual application, when the first silicon rod is placed in a horizontal manner on each first support structure 2, the rollers in the roller group of each first support structure are in contact with the first silicon rod, and the rollers in the roller group to which each first support structure belongs are driven by the roller group driving unit in the first support structure to move the first silicon rod relative to the support structure in the first direction by the friction between the rollers and the first silicon rod.

[0051] Of course, the silicon rod transfer mechanism can still be varied, e.g., in other embodiments, the silicon rod transfer mechanism includes a roller conveying mechanism, a chain conveying mechanism, or a conveyor belt mechanism, etc.

[0052] In an embodiment, the silicon rod moving mechanism 23 comprises a roller set folding unit for folding down the roller set to move away from the first silicon rod or the silicon rod segment. In an implementation, the roller set folding unit can be configured as a telescopic rod cylinder or oil cylinder, and is arranged between the roller set and the support frame 21. Each roller in the roller set is arranged on a base, which can be a bottom frame or a bottom plate for example, and the proximal end of the base is connected to the support frame 21 via a shaft joint. The telescopic rod cylinder or oil cylinder drives the telescopic rod to perform telescopic movement, thereby driving each roller in the roller set on the base to perform upward or downward folding. In some other implementations, the roller set folding unit can be configured as a screw motor.

[0053] In an embodiment, as shown in FIG. 2, the first support structure 2 further comprises a top pressing mechanism 24 arranged on the support frame 21 for pressing the top of the first silicon rod 10, and a bottom jacking mechanism 25 arranged on the support frame 21 adjacent to the silicon rod moving mechanism 23 for jacking the bottom of the first silicon rod 10 during the cutting operation. Figure 2

[0054] In an embodiment, the top pressing mechanism 24 comprises a pressing member 241 and a pressing driving unit 243 for driving the pressing member 241 to press or release the first silicon rod 10.

[0055] In an embodiment, the pressing member 241 has a shaft joint, a pressing portion, and a force receiving portion. The shaft joint is connected to the support frame 21, the pressing portion is used to press the first silicon rod 10, and the force receiving portion makes the pressing member 241 controlled by the pressing driving unit 243. In an example, the position where the pressing portion contacts the first silicon rod 10 has a downward curvature, which can be matched with the curvature of the circumferential surface of the first silicon rod 10 to expand the force receiving range of the first silicon rod 10. In some other examples, an elastic element is additionally arranged on the pressing portion, which can be attached to the circumferential surface of the first silicon rod 10 to buffer the first silicon rod 10 while pressing the first silicon rod 10, thereby preventing damage to the first silicon rod 10.

[0056] ​In an embodiment, the force applying unit 243 can apply a force to the force receiving part to make the pressing member 241 move downward around the shaft connecting part to release or press the top of the first silicon rod 10 by the principle of lever. The force applying unit 243 can include, but is not limited to, a pneumatic cylinder with a telescopic rod. The telescopic rod can be driven to move in and out by the pneumatic cylinder to drive the pressing member 241 to move. Specifically, when the telescopic rod is driven to move in by the pneumatic cylinder, the telescopic rod in is used to pull the pressing member 241 to move the pressing part of the pressing member 241 away from the supported first silicon rod 10 based on the shaft connecting part. When the telescopic rod is driven to move out by the pneumatic cylinder, the telescopic rod out is used to push the pressing member 241 to move the pressing part of the pressing member 241 toward the supported first silicon rod 10 based on the shaft connecting part.

[0057] In an embodiment, the bottom lifting mechanism 25 includes lifting columns 251 and a lifting driving unit 253 for driving the lifting columns 251 to move upward to support the first silicon rod 10. In the embodiment, the lifting columns 251 are arranged in two rows in the second direction, and each row includes a plurality of lifting columns 251 arranged in the first direction. Figure 2 In the shown example, the lifting column 251 has an inner inclined angle, so that the lifting column 251 provides a stable supporting surface for the first silicon rod 10 when the lifting column 251 contacts the first silicon rod 10. In an example, a supporting pad such as a rubber pad is arranged on the supporting surface to avoid direct contact between the lifting column 251 and the first silicon rod 10, thereby preventing mechanical damage to the first silicon rod 10.

[0058] In an embodiment, the lifting driving unit 253 can control the lifting column 251 to actuate or lock at a corresponding position. It should be understood that a silicon rod is usually formed by melting polycrystalline silicon and then growing single crystal silicon by the Czochralski method, so the diameter of the silicon rod can be gradually changed. In view of this, in order to provide stable support for the silicon rod during the cutting operation, the lifting columns 251 need to be independently controlled to allow different heights to be lifted until the circumferential surface of the silicon rod is touched. In the embodiment, each lifting column 251 is configured with a lifting driving unit 253, so that each lifting column can be independently controlled and can be lifted to different heights to touch the circumferential surface of the first silicon rod 10 under the driving of the lifting driving unit 253.

[0059] In one embodiment, the bottom lifting mechanism 25 is configured as two rows of cylinders arranged in parallel along a second direction. In one example, each row of the bottom lifting mechanism 25 is configured with at least one cylinder; for example, each row of the bottom lifting mechanism 25 includes two cylinders arranged along a first direction. Of course, the number of bottom lifting mechanisms 25 can be any number, as long as the formed support surface can stably support the first silicon rod, and the number and layout of each bottom support mechanism are not limited. For example, the number of bottom lifting mechanisms in each row can be more than two, such as three, four, five, or more, to provide support over a greater length range. In addition, the number of bottom lifting mechanisms included in the two rows of bottom lifting mechanisms can also be inconsistent. For example, in some embodiments, one row of bottom lifting mechanisms includes two bottom lifting mechanisms and the other row includes three bottom lifting mechanisms, or one row of bottom lifting mechanisms includes three bottom lifting mechanisms and the other row includes four bottom lifting mechanisms, or one row of bottom lifting mechanisms includes two bottom lifting mechanisms and the other row includes only one bottom lifting mechanism. It should be noted that the examples above are not exhaustive and can be adjusted according to actual production needs.

[0060] In one embodiment, such as Figure 1 As shown, ten first support structures 2 and ten second support structures 3 are configured, and each support structure can be controlled independently. Specifically, ten first support structures 2 are provided on the first guide rail of the first station, and ten second support structures 3 are provided on the second guide rail of the second station. The structure of each support structure can be the same, and each has an independent support frame shifting mechanism, so that each support structure can move arbitrarily on its respective guide rail until it moves to its respective support position, and transfers the first silicon rod 10 or the second silicon rod to the cutting position on the processing platform for subsequent cutting operations.

[0061] In an embodiment, the support structure at the loading end of the processing platform is fixedly arranged, and the remaining 9 first support structures 2 or 9 second support structures 3 can be moved along the first guide rail and the second guide rail, respectively. In an implementation, a locking structure can be arranged on the support bracket displacement mechanism, and the first support structure 2 and the second support structure 3 at the loading end are fixed by locking the support bracket displacement mechanism through the locking structure. In another embodiment, the support structure at the unloading end of the processing platform can be fixedly arranged, and the remaining 9 first support structures 2 or 9 second support structures 3 can be moved along the first guide rail and the second guide rail, respectively. Of course, the number of support structures fixedly arranged at the loading end or the unloading end can also be multiple, which is determined according to actual production needs. For example, when the length of the cut-off silicon rod is short, not all support structures are needed to support the silicon rod or the silicon rod segment, and then the excess support structures can be fixedly arranged at the loading end or the unloading end to avoid interfering with the cutting operation.

[0062] In an embodiment, the 9 first support structures 2 or the 9 second support structures 3 are sequentially moved towards the unloading end of the processing platform, and the moving distance is sequentially reduced. Specifically, taking the example of moving the first silicon rod 10 to the cutting position, all the first support structures 2 can first converge to the loading end of the first station, wherein the first support structure 2 close to the loading end is fixed, and then, starting from the first support structure 2 close to the unloading end, the support bracket displacement mechanisms of the nine first support structures 2 are sequentially driven to move in the first direction towards the unloading end, and the moving distance of the nine first support structures 2 is sequentially reduced, until the first silicon rod 10 is moved to the cutting position. In an example, the distance moved by each of the 9 first support structures 2 or the 9 second support structures 3 is an arithmetic sequence. It should be noted that the specific movement mode of each support structure during the loading or unloading process of the silicon rod double-station cutting machine described in the present application can refer to the description in the subsequent embodiments, which will not be repeated here.

[0063] Further, after the first silicon rod 10 is moved to the cutting position of the processing platform and each first support structure 2 is moved to the respective supporting position, the pressing member 241 in the top pressing mechanism 24 is actuated by the pressing driving unit 243 to press the first silicon rod 10 supported by each first support structure 2, and the first silicon rod 10 is positioned by the cooperation between the pressing member 241 and the roller set in the silicon rod moving mechanism 23. Subsequently, the lifting column 251 in the bottom lifting mechanism 25 is lifted by the lifting driving unit 253 until the bottom of the first silicon rod 10 is contacted. Then, the pressing member 241 in the top pressing mechanism 24 is actuated by the pressing driving unit 243 to move away from the first silicon rod 10, and the roller set in the silicon rod moving mechanism 23 is flipped downward by the roller set flipping unit and is separated from the first silicon rod 10, so that the silicon rod moving mechanism 23 and the top pressing mechanism 24 are both moved away from the first silicon rod 10, so that the first silicon rod 10 is only supported by the lifting column 251 in the bottom lifting mechanism 25 and is cut by the wire cutting device to form the segmented silicon rods.

[0064] Please refer to Figure 3 and Figure 4 , respectively showing the structural schematic diagram of the wire cutting device in an embodiment of the present application. As shown in Figure 3 and Figure 4 , each wire cutting device in the plurality of wire cutting devices 4 comprises a cutting seat 41, a cutting mounting structure 42, and a station switching mechanism 45. The cutting seat 41 is arranged between the first station and the second station along the first direction, the cutting mounting structure 42 is arranged in the cutting seat 41 and is provided with a first cutting wire saw 435a and a second cutting wire saw 435b, and the station switching mechanism 45 can swing the cutting mounting structure 42 between the first station and the second station, so that when the first silicon rod 10 is loaded in the first station, the second cutting wire saw 435b is swung to the second station to cut the second silicon rod to form the segmented silicon rods, and when the second silicon rod after the cutting operation is unloaded, the first cutting wire saw 435a is swung to the first station to cut the first silicon rod 10.

[0065] In an embodiment, as Figure 3 and Figure 4As shown, the first cutting wire saw 435a and the second cutting wire saw 435b can be provided on a wire cutting unit 43, which can be configured to include a plurality of cutting wheels and transition wheels, and provided on the cutting mounting structure 42. In some examples, the plurality of cutting wheels and transition wheels can be directly mounted on the cutting mounting structure 42, and in some other examples, the plurality of cutting wheels and transition wheels can be provided on the cutting mounting structure 42 through a support, a connecting plate, or a mounting frame. The cutting mounting structure 42 serves as a carrier to associate the plurality of cutting wheels and transition wheels in the wire cutting unit 43 with the cutting seat 41, which can be in the form of a beam, a plate frame, a support, etc., and the present application does not limit the same.

[0066] In an embodiment, the first cutting wire saw 435a and the second cutting wire saw 435b are configured as parallel double wire cutting wire saws. In an example, the double wire cutting wire saws are formed by two closed loop cutting wires wound around the cutting wheels and transition wheels of the wire cutting unit 43, respectively. Specifically, as shown, Figure 3 As shown, the wire cutting unit 43 includes a first cutting wheel 431a, a second cutting wheel 431b, a third cutting wheel 431c, a first transition wheel 433a, a second transition wheel 433b, a first cutting wire 435, and a second cutting wire 436. The second cutting wheel 431b is located between the first cutting wheel 431a and the third cutting wheel 431c, the first cutting wire 435 is wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a in sequence to form the first cutting wire saw 435a between the first cutting wheel 431a and the second cutting wheel 431b, and the second cutting wire 436 is wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the second transition wheel 433b in sequence to form the second cutting wire saw 435b between the third cutting wheel 431c and the second cutting wheel 431b.

[0067] In the above embodiment, the first cutting wire 435 and the second cutting wire 436 are both wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the transition wheels in a ring-shaped winding manner to form closed loop cutting wires. In this example, the wire cutting device 4 can dispense with components such as a take-up reel and a pay-off reel, thereby effectively reducing the total length of the cutting wire required by the wire cutting unit and lowering the production cost. At the same time, the first cutting wire 435 and the second cutting wire 436 can be driven to run at high speed in the same direction of rotation, thereby avoiding problems such as corrugation of the cutting surface caused by the change in the direction of rotation of the cutting wire during the cutting process, and achieving high-precision cutting operation.

[0068] In an embodiment, each cutting line can be independently tension-adjusted. In an implementation, the line cutting device 4 further comprises a first tension-adjusting mechanism 437 corresponding to the first cutting line 435 and a second tension-adjusting mechanism 438 corresponding to the second cutting line 436, wherein the first tension-adjusting mechanism 437 is associated with the first transition wheel 433a and the second tension-adjusting mechanism 438 is associated with the second transition wheel 433b, the first transition wheel 433a simultaneously acts as a tension wheel for tension adjustment of the first cutting line 435 when guiding and pulling the first cutting line 435, and the second transition wheel 433b simultaneously acts as a tension wheel for tension adjustment of the second cutting line 436 when guiding and pulling the second cutting line 436.

[0069] Taking the first tension-adjusting mechanism 437 as an example, in some embodiments, the first tension-adjusting mechanism 437 can be configured to comprise a tension sensor, a servo motor and a lead screw. The tension sensor is arranged on the first transition wheel 433a, constantly senses the tension value of the first cutting line 435 on the first transition wheel 433a, and sends a driving signal when the tension value is less than a preset value. The servo motor is electrically connected to the tension sensor, and starts to work after receiving the driving signal sent by the tension sensor. One end of the lead screw is connected to the first transition wheel 433a, the other end is connected to the servo motor, and the lead screw pulls the first transition wheel 433a to move unidirectionally when the servo motor works, so as to adjust the tension of the first cutting line 435.

[0070] In some embodiments, the first tension-adjusting mechanism 437 can be configured to comprise a linkage assembly and a tension driving unit, the linkage assembly is associated with the first transition wheel 433a as a tension wheel and is controlled by the tension driving unit, that is, the linkage assembly is driven by the tension driving unit to drive the first transition wheel 433a to change the position to adjust the tension of the first cutting line 435.

[0071] In some implementations, the tension drive unit may include a counterweight, which may be associated with a linkage assembly. For example, when increasing the tension of the first cutting line 435, the counterweight is released, causing it to descend. Under the weight of the counterweight, the linkage assembly moves the associated tensioning wheel, thereby expanding the perimeter of the pattern formed by the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a, thus increasing the tension of the first cutting line 435. When decreasing the tension of the first cutting line 435, the counterweight is raised. Under the weight of the counterweight, the linkage assembly moves the associated tensioning wheel in the opposite direction, thereby reducing the perimeter of the pattern formed by the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a, thus decreasing the tension of the first cutting line 435. The counterweight may include counterweight blocks, wherein the number of counterweight blocks may vary according to the tension adjustment requirements of the first cutting line 435. For example, when increasing the tension of the first cutting line 435, the number of counterweight blocks may be increased, and when decreasing the tension of the first cutting line 435, the number of counterweight blocks may be decreased.

[0072] In some examples, the counterweight may include a locking mechanism for locking the counterweight so that it is stationary relative to the cutting mounting structure 42, thereby switching the counterweight and the cutting mounting structure 42 from an active state to a locked state. In some examples, the locking mechanism may be, for example, a pin, and the tension drive unit may include, for example, a tension cylinder associated with a movable tension wheel. The tension cylinder drives the associated tension wheel, and the tension of the first cutting line 435 is adjusted by changing the position of the tension wheel.

[0073] In some embodiments, the first tension adjusting mechanism 437 may be configured to include a torsion motor and a torsion shaft, the torsion motor being mounted on the cutting mounting structure 42, and the torsion shaft being associated with the torsion motor and the first transition wheel 433a. When the tension of the first cutting line 435 is to be increased, the torsion motor is driven to rotate in a first direction to drive the first transition wheel 433a to make a first movement via the torsion shaft, thereby expanding the perimeter of the pattern enclosed by the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a, thus increasing the tension of the first cutting line 435. When the tension of the first cutting line 435 is to be decreased, the torsion motor is driven to rotate in a second direction to drive the first transition wheel 433a to make a second movement via the torsion shaft, thereby reducing the perimeter of the pattern enclosed by the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a, thus decreasing the tension of the first cutting line 435.

[0074] The second tension adjusting mechanism 438 can have the same configuration as the first tension adjusting mechanism 437, and its specific structure and implementation mode will not be described again.

[0075] In an embodiment, the first cutting wheel 431a, the second cutting wheel 431b, and the third cutting wheel 431c have at least two cutting wire grooves, and the different cutting wire grooves are parallel to each other, so that the first cutting wire 435 and the second cutting wire 436 can be arranged in different cutting wire grooves to form double-wire cutting wire saws that are parallel to each other. It should be understood that, in the process of cutting a silicon rod, slicing sampling of the silicon rod needs to be performed to check the material properties of the silicon rod to be cut. The double-wire cutting wire saw can simultaneously perform the cutting and slicing sampling of the silicon rod, and the thickness of the sample obtained by the slicing sampling is the wire spacing between the first cutting wire 435 and the second cutting wire 436 in the double-wire cutting wire saw.

[0076] In an embodiment, the wire cutting device 4 further comprises a distance adjusting mechanism for adjusting the switching of the first cutting wire 435 or the second cutting wire 436 between the cutting wire grooves, thereby adjusting the thickness of the sample obtained by the slicing sampling. In some implementations, the distance adjusting mechanism comprises a screw rod and a screw rod driving source, the screw rod is arranged in a direction perpendicular to the wheel surface of the cutting wheel and is threadedly connected to the wire cutting unit. The screw rod driving source is used to drive the screw rod to rotate. In some other implementations, the distance adjusting mechanism comprises a telescopic member and a telescopic member driving source, the telescopic member is arranged in a direction perpendicular to the wheel surface of the cutting wheel and is associated with the wire cutting unit, and the telescopic member driving source is used to drive the telescopic member to perform telescopic movement in a direction perpendicular to the wheel surface of the cutting wheel. In some other implementations, the distance adjusting mechanism comprises a rack, a transmission gear, and a gear driving source, the rack is arranged in a direction perpendicular to the wheel surface of the cutting wheel, the transmission gear is engaged with the rack, and the gear driving source is used to drive the transmission gear to rotate.

[0077] In an embodiment, the first cutting wire 435 and the second cutting wire 436 each comprise a cutting wire driving device for driving the first cutting wire 435 or the second cutting wire 436 to run at a high speed to perform the cutting of the first silicon rod 10 or the second silicon rod. In an implementation, the cutting wire driving device is configured as a servo motor, the servo motor has a power output shaft, and the power output shaft is connected to the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, or a related transition wheel, so that the first cutting wire 435 and the second cutting wire 436 can pass through the cutting wheel and the transition wheel wound thereon and run in a winding direction. Of course, the cutting wire driving device can also be another driving source such as a hydraulic motor, as long as the corresponding cutting wire can be driven to run, which is not limited in the present application.

[0078] In another embodiment, the first cutting wire saw 435a and the second cutting wire saw 435b are configured as a single wire cutting wire saw. In an example, the single wire cutting wire saw is formed by a single cutting wire wound between the cutting wheels and the transition wheels in a first end-to-end loop. Specifically, as shown in FIG. 4, the first cutting wire 435 is sequentially wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the first transition wheel 433a to form the first cutting wire saw 435a between the first cutting wheel 431a and the second cutting wheel 431b, and the second cutting wire saw 435b between the third cutting wheel 431c and the second cutting wheel 431b. Of course, in another example, the single wire cutting wire saw can be formed by the second cutting wire 436 sequentially wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the second transition wheel 433b to form the first cutting wire saw between the first cutting wheel 431a and the second cutting wheel 431b, and the second cutting wire saw between the third cutting wheel 431c and the second cutting wheel 431b. Figure 4

[0079] In the above embodiment, the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the transition wheel form a quadrilateral layout. In another embodiment, the cutting wire can be sequentially wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, the first transition wheel 433a, and the second transition wheel 433b to form a pentagonal layout. At this time, the first cutting wire saw is formed between the first cutting wheel 431a and the second cutting wheel 431b, and the second cutting wire saw is formed between the third cutting wheel 431c and the second cutting wheel 431b.

[0080] In some embodiments, the single wire cutting wire saw is provided with a cutting wire driving device and a tension adjusting mechanism, which can be understood from the foregoing embodiments and will not be described here.

[0081] In the above embodiment, the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the transition wheel form a quadrilateral layout. In another embodiment, the cutting wire can be sequentially wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, the first transition wheel 433a, and the second transition wheel 433b to form a pentagonal layout. At this time, the first cutting wire saw is formed between the first cutting wheel 431a and the second cutting wheel 431b, and the second cutting wire saw is formed between the third cutting wheel 431c and the second cutting wheel 431b. Figure 3 Figure 4 In the above embodiment, the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, and the transition wheel form a quadrilateral layout. In another embodiment, the cutting wire can be sequentially wound around the first cutting wheel 431a, the second cutting wheel 431b, the third cutting wheel 431c, the first transition wheel 433a, and the second transition wheel 433b to form a pentagonal layout. At this time, the first cutting wire saw is formed between the first cutting wheel 431a and the second cutting wheel 431b, and the second cutting wire saw is formed between the third cutting wheel 431c and the second cutting wheel 431b.

[0082] ​​In one embodiment, the cutting seat 41 is disposed on a third guide rail, and the third guide rail is parallel to the first guide rail and the second guide rail. Further, the third guide rail is located between the first guide rail and the second guide rail, and the first cutting wire saw 435a and the second cutting wire saw 435b are perpendicular to the first silicon rod 10 and the second silicon rod, respectively, and are driven by the station switching mechanism to cut the first silicon rod 10 or the second silicon rod, respectively.

[0083] In one embodiment, the plurality of cutting wire devices 4 are disposed on the third guide rail in the first direction and can be simultaneously switched to the first station or the second station by the station switching mechanism 45. In one implementation, the station switching mechanism 45 includes a swing driver located at the top of the cutting mounting structure 42 and a passive rotation shaft located at the bottom of the cutting mounting structure 42. The swing driver drives the cutting mounting structure 42 to swing around the passive rotation shaft, so that the cutting mounting structure 42 can be switched between the first station and the second station.

[0084] In one embodiment, the swing driver can be configured to include an arc-shaped guide rail disposed at the top of the cutting mounting structure 42 and a swing driving source. The swing driving source drives the cutting mounting structure 42 to move on the arc-shaped guide rail to achieve the swing of the cutting wire device 4 around the passive rotation shaft, thereby achieving the switching of the cutting wire device 4 between the first station and the second station, so as to selectively cut the first silicon rod 10 or the second silicon rod. Compared with disposing the swing driver at the bottom of the cutting mounting structure 42, this embodiment makes the swing of the cutting mounting structure 42 around the passive rotation shaft more labor-saving. In some examples, the swing driving source can be configured as a pneumatic cylinder, a servo motor, a hydraulic motor, etc.

[0085] In one embodiment, the angle of the swing of the cutting wire device 4 between the first station and the second station is 85°-95°, for example, about 85°, 85.5°, 86°, 86.5°, 87°, 87.5°, 88°, 88.5°, 89°, 89.5°, 90°, 90.5°, 91°, 91.5°, 92°, 92.5°, 93°, 93.5°, 94°, 94.5°, or 95°, etc. Preferably, the angle of the swing of the cutting wire device 4 between the first station and the second station is 91.5°. In one implementation, according to the mathematical relationship between the arc length and the corresponding angle, the angle of the swing of the cutting wire device 4 between the first station and the second station can be controlled by controlling the length of the arc-shaped guide rail.

[0086] In one embodiment, as shown in FIG. 1, the cutting wire device 4 is disposed on the third guide rail in the first direction and can be simultaneously switched to the first station or the second station by the station switching mechanism 45. Figure 3 and Figure 4As shown, the wire cutting device 4 further comprises a cutting displacement mechanism 44 for driving the at least one wire cutting device 4 to move along the third guide rail so as to adjust the cutting position or the wire withdrawal position. It should be understood that during the cutting process, the silicon rod needs to be cut at a specific cutting position to obtain a silicon rod segment of a specific length according to the actual processing requirement. After the cutting is completed, the wire cutting device 4 needs to move a certain distance to a suitable wire withdrawal position to avoid interference between the silicon rod segment and the wire saw, so as to avoid damage to the silicon rod segment and ensure the quality of the cutting operation. Therefore, the wire cutting device 4 needs to move along the first direction on the third guide rail to adjust the cutting position or the wire withdrawal position of the cutting wire saw.

[0087] In an embodiment, the cutting displacement mechanism 44 comprises a displacement guide rail 441, a sliding block 442, and a displacement driving unit. The displacement guide rail 441 is configured as two parallel displacement guide rails arranged along the first direction on the processing platform of the machine base 1, and the length of the two displacement guide rails 441 can extend through the entire processing platform. The sliding block 442 is matched with the displacement guide rail 441 and is arranged at the bottom of the cutting seat 41. In an example, the displacement driving unit comprises a displacement rack 443, a driving gear (not shown), and a gear driving motor 445, wherein the displacement rack 443 can be arranged in parallel with the two displacement guide rails 441, the driving gear is engaged with the displacement rack 443, and the gear driving motor 445 is associated with the driving gear and arranged on the cutting seat 41 of the corresponding wire cutting device 4. Specifically, the gear driving motor 445 drives the driving gear connected thereto to rotate, and drives the wire cutting device 4 to move along the first direction on the displacement guide rail 441 on the processing platform through the engagement between the driving gear and the displacement rack 443. In some other examples, the movement driving unit can comprise a movement screw and a driving motor, wherein the movement screw is arranged along the first direction and associated with the cutting seat in the at least one wire cutting device, and the driving motor is used to drive the movement screw to rotate so as to drive the associated at least one wire cutting device to move along the first direction on the displacement guide rail.

[0088] Of course, the cutting displacement mechanism 44 can still be changed in other ways. For example, in other embodiments, the cutting displacement mechanism can be configured to comprise a chain conveying mechanism or a conveyor belt mechanism, and the person skilled in the art can set the specific structure of the cutting displacement mechanism under the inspiration of the present application.

[0089] In an embodiment, as Figure 1As shown, the wire cutting device 4 is configured as 9, of which the wire cutting device at the feeding end of the processing platform is fixedly arranged, and the remaining 8 wire cutting devices can move along the third guide rail. Specifically, the third guide rail is provided with 9 wire cutting devices, each wire cutting device can be configured in the same manner, and each has an independent cutting displacement mechanism. In an example, the cutting displacement mechanism is provided with a locking structure, and the wire cutting device can be locked by the locking structure so that the wire cutting device at the feeding end is fixed, and the remaining 8 wire cutting devices can move on the third guide rail. In another embodiment, the wire cutting device at the discharging end of the processing platform can be fixedly arranged, and the remaining 8 wire cutting devices can move along the third guide rail. Of course, the number of wire cutting devices fixedly arranged at the feeding end or the discharging end can also be multiple, which is determined according to actual production needs. For example, when the length of the silicon rod to be cut off is short, all wire cutting devices are not needed to participate in the cutting-off operation of the silicon rod, and then the excess wire cutting devices can be fixedly arranged at the feeding end or the discharging end to avoid affecting the cutting-off operation.

[0090] In an embodiment, the 8 wire cutting devices move towards the discharging end of the processing platform in sequence, and the moving distance is sequentially reduced. Specifically, before the cutting-off operation is performed, all wire cutting devices can be first gathered to the feeding end of the processing platform, wherein the wire cutting devices close to the feeding end are fixed, and then the cutting displacement mechanisms of the 8 wire cutting devices are sequentially driven to move in the first direction towards the discharging end starting from the wire cutting device close to the discharging end, and the moving distance of the 8 wire cutting devices is sequentially reduced, until each wire cutting device reaches the cutting position. In an example, the moving distance of each of the 8 wire cutting devices is an arithmetic sequence. It should be noted that the specific moving mode of each wire cutting device during the feeding or discharging process of the silicon rod double-station cutting machine described in the present application can be referred to the description in the subsequent embodiments, which will not be repeated here.

[0091] In an embodiment, the first cutting wire saw 435a and the second cutting wire saw 435b of the wire cutting device 4 at the feeding end or the discharging end can be configured as parallel double wire cutting wire saws for tail slice sampling or head slice sampling. Specifically, the work station switching mechanism 45 drives the wire cutting device 4 to swing around the passive rotation shaft, so that the first cutting wire saw 435a swings to the first work station to perform tail slice sampling or head slice sampling on the first silicon rod 10, or drives the wire cutting device 4 to swing around the passive rotation shaft, so that the second cutting wire saw 435b swings to the second work station to perform tail slice sampling or head slice sampling on the second silicon rod.

[0092] As mentioned above, in the process of cutting off the silicon rod, it is necessary to cut a sample from the silicon rod to obtain a sample wafer for testing the material properties of the silicon rod to be cut. The specific configuration of the double-wire cutting wire saw can be referred to the description in the foregoing embodiments. In an example, the first cutting wire saw and the second cutting wire saw of the wire cutting device at the feeding end are configured as a double-wire cutting wire saw, which can simultaneously perform the cutting-off operation and the sample cutting operation on the tail of the silicon rod. In another example, the first cutting wire saw and the second cutting wire saw of the wire cutting device at the discharging end are configured as a double-wire cutting wire saw, which can simultaneously perform the cutting-off operation and the sample cutting operation on the head of the silicon rod. Of course, the double-wire cutting wire saw can be arranged on the wire cutting device at any position to cut a sample at any position of the silicon rod, which is determined according to actual production requirements.

[0093] In an embodiment, the first cutting wire saw 435a and the second cutting wire saw 435b of the wire cutting device 4 at the middle position are configured as single-wire cutting wire saws to perform the cutting-off operation on the first silicon rod 10 and the second silicon rod, respectively. Specifically, the work position switching mechanism 45 drives the wire cutting device 4 to swing around the passive rotation shaft, so that the first cutting wire saw 435a swings to the first work position to perform the cutting-off operation on the first silicon rod 10, or drives the wire cutting device 4 to swing around the passive rotation shaft, so that the second cutting wire saw 435b swings to the second work position to perform the cutting-off operation on the second silicon rod. The specific configuration of the single-wire cutting wire saw can be referred to the foregoing description, which is not repeated here.

[0094] It should be noted that when feeding the silicon rod, most manufacturers use robots or mechanical arms to carry the silicon rod to the processing area to cut the silicon rod into multiple silicon rod segments. However, this feeding method is laborious, and the silicon rod may fall or be damaged during the carrying process. In addition, after completing the cutting-off operation, the cutting wire needs to be quickly taken out for the next cutting. In this process, the cutting wire needs to be prevented from contacting the silicon rod segment to avoid damage to the surface of the silicon rod segment, thereby ensuring product quality.

[0095] In view of the above, the present application provides a feeding and discharging mechanism of a silicon rod cutting device, comprising a plurality of support structures and a control device. The plurality of support structures are arranged on a machining platform and used to support a horizontal silicon rod to be cut during feeding and a silicon rod segment after cutting during discharging. The support structures comprise a support frame for carrying the silicon rod or the silicon rod segment, a support frame shifting mechanism for driving the support frame to move the silicon rod or the silicon rod segment in a first direction, and a silicon rod shifting mechanism for driving the silicon rod or the silicon rod segment to move relative to the support frame in the first direction. The control device is connected to a plurality of wire cutting devices and the plurality of support structures and used to control the plurality of support structures to move sequentially towards a discharging end of the machining platform under a first instruction to perform feeding and control the plurality of wire cutting devices and the plurality of support structures to move sequentially towards the discharging end under a second instruction to perform discharging.

[0096] In the present application, the support structures are for the Figures 1-2 support structures in the embodiment shown, and the wire cutting devices are for the wire cutting devices in the embodiment shown. The foregoing description can be referred to in the following description, which will not be repeated here. Figures 1-4

[0097] In an embodiment, the control device comprises a processing unit, a storage unit and a plurality of interface units. Each of the interface units is a device or component or mechanism independently encapsulated in a silicon rod double-station cutting machine and transmitting data through an interface. The control device further comprises at least one of the following: a prompting device, a human-computer interaction device, etc. The interface unit determines its interface type according to the connected device or component or mechanism, which includes but is not limited to: a universal serial bus, a video interface, an industrial control interface, a wireless communication port, etc. The storage unit is used to store a printing program, and the processing unit is connected to the storage unit and used to control the components or components or structures in the silicon rod double-station cutting machine to coordinate the cutting of the first silicon rod or the second silicon rod during the cutting operation.

[0098] The following describes in detail the specific process of the control device controlling the plurality of support structures and the plurality of wire cutting devices to perform feeding or discharging in the feeding and discharging mechanism provided by the present application. For ease of description, the feeding and discharging of a plurality of first support structures in a first station are taken as examples in the following embodiments.

[0099] Please refer to Figure 5 , which shows a flowchart of the control device controlling the plurality of support structures to perform feeding under a first instruction in an embodiment of the present application. As Figure 5 ​As shown, the loading operation includes steps S110, S120 and S130. The following description of each embodiment is based on the loading operation performed by a control device.

[0100] In step S110, the control device drives the carrier displacement mechanism to gather all the support structures to the loading end of the processing platform.

[0101] It should be understood that the gathering refers to the abutment of the respective first support structures at the loading end of the processing platform, or the sequential arrangement with a certain spacing. Still taking the loading operation of the plurality of first support structures 2 as an example, in an embodiment, the driving of the corresponding carrier displacement mechanism 22 of all the first support structures 2 causes all the first support structures to move in the first direction toward the loading end, so that all the first support structures are gathered to the loading end to form an integral loading conveying group. In this embodiment, all the ten first support structures on the first station are movable.

[0102] In another embodiment, the driving of the corresponding carrier displacement mechanism 22 of part of the first support structures 2 causes the movable first support structures to move in the first direction toward the loading end until they are gathered to the loading end to form an integral loading conveying group. In an example, one first support structure located at the loading end of the processing platform is fixedly arranged, and the remaining nine first support structures are movable along the first guide rail. Please refer to Figure 6 , which shows a schematic diagram of the gathering of the plurality of first support structures to the loading end in an embodiment of the present application. In Figure 6 the example shown, the nine movable first support structures 2 are driven by the respective carrier displacement mechanism 22 to move along the first guide rail toward the loading end until they are all gathered to the loading end and present the state shown in Figure 6 . It should be noted that Figure 6 this is only a schematic illustration and should not be understood as a limitation of the present application. For example, one first support structure located at the loading end of the processing platform can be fixedly arranged, and the remaining nine first support structures can be movable along the first guide rail; or the first support structures located at the loading end and the unloading end of the processing platform can be fixedly arranged, respectively, and the remaining eight first support structures can be movable along the first guide rail.

[0103] Please continue to refer to Figure 5 In step S120, the control device drives the silicon rod transfer mechanism to transfer the to-be-cut silicon rod to the support structure, and drives the carrier displacement mechanism to cause the plurality of movable support structures to move in the first direction toward the unloading end until the to-be-cut silicon rod reaches the cutting region and each support structure reaches the respective carrier position.

[0104] In an embodiment, as shown in Figure 1As shown, the silicon rod dual-station cutting machine described in this application further includes a feeding conveyor 7 connected to the feeding end. Specifically, it may include a first feeding conveyor 7 connected to the feeding end of the first station and a second feeding conveyor 7 connected to the feeding end of the second station. Taking the first feeding conveyor 7 as an example, in... Figure 1 In the example shown, the first or second feeding conveyor 7 may include a support frame, with a support platform at the top. Two rows of rollers are arranged on opposite sides of the support platform. Each roller group includes multiple rollers arranged sequentially along the length of the support frame. Each roller is connected to the support platform via a bearing seat and protrudes from the support platform. The rollers in the two rows of rollers form a support surface for supporting the silicon rod. After the silicon rod is horizontally placed on the two rows of rollers on the support platform, the silicon rod can be directly pushed by the two rows of rollers to transport the silicon rod and complete the silicon rod feeding operation. In some embodiments, the first feeding conveyor 7 includes a silicon rod pushing mechanism. Using the silicon rod pushing mechanism, the first silicon rod 10 can be pushed independently or in conjunction with manual force to move on the two rows of rollers. In some embodiments, the silicon rod pushing mechanism may be, for example, a chain drive mechanism, including a ring chain, a pusher on the ring chain, and a chain drive unit for moving the ring chain. The pusher may include a push block or a push rod, and the chain drive unit may include a drive gear meshing with the ring chain and a drive motor associated with the drive gear. In practical applications, the drive motor drives the drive gear to rotate, which in turn drives the ring chain and the pusher block or push rod on it. The moving pusher block or push rod pushes the first silicon rod 10 to move along the ring chain.

[0105] In some embodiments, in the second direction, the rollers in the first roller group and the rollers in the second roller group are paired up to form a roller pair. The two rollers in a roller pair can be connected by a rotating shaft. The silicon rod pushing mechanism includes a cascaded chain drive mechanism, which includes multiple cascaded chains and a drive motor. Specifically, the silicon rod pushing mechanism is arranged on one side of the two roller groups as the drive side, and the roller on the drive side of each roller pair is equipped with a double drive gear. The cascading of all rollers in the two roller groups is achieved by connecting two adjacent rollers along the first direction through a cascaded chain (e.g., a short annular chain) to the corresponding drive gear. The drive motor is also connected to the two roller groups through the short annular chain and the drive gear. In practical applications, the drive motor drives the drive gear to rotate, which drives all the rollers in the two roller groups to roll through the cascaded chain. The friction between the rollers and the first silicon rod 10 drives the first silicon rod 10 to move. Compared to ordinary chain drive mechanisms, cascaded chain drive mechanisms can generate greater power, and all rollers rotate synchronously, which can ensure that the first silicon rod 10 moves more smoothly and steadily.

[0106] For the convenience of description and illustration, the first support structure closest to the discharging end (i.e. the rightmost end) of the ten first support structures is referred to as the first support structure, and the direction from the discharging end to the feeding end is sequentially the second support structure, the third support structure, the fourth support structure, the fifth support structure, the sixth support structure, the seventh support structure, the eighth support structure, the ninth support structure, and so on. Therefore, the first support structure closest to the feeding end (i.e. the leftmost end) is referred to as the tenth support structure.

[0107] Specifically, in step S120, first, the roller set driving unit in the silicon rod transfer mechanism 23 of all the first support structures 2 gathered at the feeding end is driven to rotate the rollers, then the horizontally placed first silicon rod 10 is transported by the first feeding conveyor 7 and the head thereof is transferred to the roller set of the silicon rod transfer mechanism 23 in the tenth support structure, and thereafter, the first silicon rod 10 to be cut can be sequentially transported to each of the gathered first support structures by the rotation friction of the roller set in the silicon rod transfer mechanism 23 in each of the gathered first support structures and the first feeding conveyor 7. Then, while the roller set in the silicon rod transfer mechanism 23 in each of the gathered first support structures rotates, the corresponding support structure is driven by the support frame shifting mechanism 22 to move along the first guide rail toward the discharging end, so that the first silicon rod 10 is transported toward the discharging end while each of the gathered first support structures at the feeding end also moves toward the discharging end and gradually disperses from each other, and finally, each of the first support structures is moved to the respective support position under the driving of the support frame shifting mechanism, and the first silicon rod 10 is moved to the corresponding cutting zone.

[0108] In an embodiment, in step S120, the moving distance of the plurality of movable support structures remains sequentially decreasing. In the example that the ten first support structures are all gathered at the feeding end, the first support structure is first driven to move a first distance along the first guide rail toward the discharging end, after a preset time interval, the second support structure is then driven to move a second distance along the first guide rail toward the discharging end, and thereafter, the third support structure is driven to move a third distance along the first guide rail toward the discharging end, the fourth support structure is driven to move a fourth distance along the first guide rail toward the discharging end, the fifth support structure is driven to move a fifth distance along the first guide rail toward the discharging end, the sixth support structure is driven to move a sixth distance along the first guide rail toward the discharging end, the seventh support structure is driven to move a seventh distance along the first guide rail toward the discharging end, the eighth support structure is driven to move an eighth distance along the first guide rail toward the discharging end, the ninth support structure is driven to move a ninth distance along the first guide rail toward the discharging end, and the tenth support structure is driven to move a tenth distance along the first guide rail toward the discharging end. The first distance, the second distance, the third distance, the fourth distance, the fifth distance, the sixth distance, the seventh distance, the eighth distance, the ninth distance, and the tenth distance sequentially decrease.

[0109] In an embodiment, the distances each of the plurality of movable support structures moves is an arithmetic sequence. That is, in the above embodiment, the first distance, the second distance, the third distance, the fourth distance, the fifth distance, the sixth distance, the seventh distance, the eighth distance, the ninth distance, and the tenth distance is an arithmetic sequence.

[0110] Further, the cutting displacement mechanism is driven to operate, thereby driving the nine wire cutting devices 4 to move to respective cutting positions. For the convenience of description and illustration, the wire cutting device closest to the discharging end (i.e., the rightmost end) of the nine wire cutting devices is referred to as the first wire cutting device, and the direction from the discharging end to the feeding end is sequentially the second wire cutting device, the third wire cutting device, the fourth wire cutting device, the fifth wire cutting device, the sixth wire cutting device, the seventh wire cutting device, the eighth wire cutting device, the ninth wire cutting device, and so on. Therefore, the wire cutting device closest to the feeding end (i.e., the leftmost end) is referred to as the tenth wire cutting device, and the subsequent embodiments will not be described in detail.

[0111] Please continue to refer to Figure 5 In step S130, the control device drives the top pressing mechanism to press the top of the to-be-cut silicon rod, drives the bottom jacking mechanism to ascend and touch the bottom of the to-be-cut silicon rod, and then removes the top pressing mechanism and the silicon rod transfer mechanism, so that the to-be-cut silicon rod is only supported by the bottom jacking mechanism to perform the cutting operation to form a plurality of silicon rod segments.

[0112] Specifically, please refer to Figure 7 , which shows the state diagram of the first support structure in an embodiment of the present application when performing the cutting operation. As shown in Figure 7 a, after each first support structure 2 moves to the corresponding supporting position and the first silicon rod 10 moves to the corresponding cutting position, the top pressing mechanism in each first support structure 2 is driven to act, so that the pressing driving unit 243 drives the pressing piece 241 to move towards the first silicon rod 10 until the top of the first silicon rod 10 is pressed, and the first silicon rod 10 is positioned by the cooperation of the top pressing mechanism and the silicon rod transfer mechanism 23. Then, as shown in Figure 7 b, the jacking driving unit 253 in the bottom jacking mechanism of each first support structure 2 drives the jacking column 251 to ascend and touch the bottom of the first silicon rod 10.

[0113] Then, as shown in Figure 7 c, the roller set folding unit in each first support structure 2 is driven to fold the roller set downward and away from the bottom of the first silicon rod 10. After that, as shown in Figure 7As shown in diagram d, the clamping drive unit 243 drives the top clamping mechanism in each of the first support structures 2, causing the clamping member 241 to lift and move away from the first silicon rod 10. In this way, the first silicon rod 10 is cut off only under the support of the lifting column 251 of the bottom lifting mechanism.

[0114] Then, as Figure 7 As shown in Figure e, the station switching mechanism, driven by the oscillating driver, causes the nine wire cutting devices 4 to oscillate around the passive rotation axis, causing the first wire saw 435a to oscillate to the first station and perform cutting or slicing sampling on the first silicon rod 10, forming eight silicon rod segments 20. At this time, the lifting columns 251 in each of the first support structures 2 can form a supporting surface that fits against the bottom circumferential surface of the first silicon rod 10. When the first silicon rod 10 is cut, it will not be interfered with by the rollers of the roller group in the first support structure or any other possible contact components, which can effectively prevent edge chipping during the cutting process, ensure the flatness of the cut surface, and thus improve the quality of silicon rod cutting.

[0115] Meanwhile, during the first silicon rod 10 cutting operation at the first station, the second silicon rod can be loaded at the second station. Specifically, the multiple second support structures 3 located at the second station execute steps S110 to S130, so that the second silicon rod moves to the corresponding cutting area. Only under the support of the bottom lifting mechanism of the second support structure, the second cutting wire saw 435b is driven by the station switching mechanism to swing to the second station to cut or slice the second silicon rod.

[0116] After the cutting operation is completed, the control device controls multiple wire cutting devices and multiple support structures to move sequentially toward the unloading end under the second command to perform the unloading operation.

[0117] Please see Figure 8 The diagram illustrates a process in one embodiment of this application where a control device controls multiple support structures and multiple wire cutting devices to perform a material cutting operation under a second command. Figure 8 As shown, the material feeding operation includes steps S210, S220, S230, S240, and S250. The following description uses the example of the material feeding operation being executed by a control device to illustrate various embodiments.

[0118] In step S210, the control device drives the top clamping mechanism to press the top surface of the silicon rod segment, so that the silicon rod segment can be fixed by both the top clamping mechanism and the bottom lifting mechanism at the same time.

[0119] Specifically, such as Figure 7As shown in FIG. 10, when the first silicon rod 10 is cut into eight silicon rod segments 20 by the first wire saw 435a, the top pressing mechanism of each first support structure 2 (for example, the second support structure to the ninth support structure) supporting the eight silicon rod segments 20 is actuated, so that the pressing driving unit 243 drives the pressing member 241 to move towards the silicon rod segments 20 and press the top of the silicon rod segments 20. The silicon rod segments 20 are fixed by the cooperation of the top pressing mechanism and the bottom jacking mechanism. At this time, the silicon rod double-station cutting machine is in the state shown in FIG. 11, wherein, Figure 9 Figure 9 FIG. 11 shows a state diagram of the silicon rod double-station cutting machine after step S210 is performed in an embodiment of the present application.

[0120] Please continue to refer to Figure 8 In step S220, the control device drives the supporting frame displacement mechanism to move the support structure and the carried silicon rod segment towards the discharge end of the processing platform, and drives the wire cutting device to move towards the discharge end to adjust the distance, leaving a wire returning space for the wire saw.

[0121] In the embodiment described in the present application, the nine wire cutting devices 4 and the eight first support structures 2 (the second support structure to the ninth support structure) supporting the eight silicon rod segments 20 are moved along the first guide rail towards the discharge end to adjust the distance.

[0122] In an embodiment, step S220 further includes simultaneously starting the wire cutting device and the support structure, and sequentially stopping the wire cutting device and the support structure from the discharge end of the processing platform, so that the moving distance of each of the wire cutting device and the support structure is sequentially reduced. Please refer to Figure 10 FIG. 12 shows a state diagram of the silicon rod double-station cutting machine after step S220 is performed in an embodiment of the present application.

[0123] ​Specifically, from the beginning of the blanking end, the first wire cutting device is driven to move in the first direction towards the blanking end by a first cutting distance, the second support structure and the first segment of the silicon rod section 20 supported thereby are driven to move in the first direction towards the blanking end by a first supporting distance, at this time the first cutting distance is greater than the first supporting distance, thereby leaving a first wire retreat space for the first cutting wire saw of the first wire cutting device. The second wire cutting device is driven to move in the first direction towards the blanking end by a second cutting distance, the third support structure and the second segment of the silicon rod section 20 supported thereby are driven to move in the first direction towards the blanking end by a second supporting distance, at this time the first supporting distance is greater than the second cutting distance, the second cutting distance is greater than the second supporting distance, thereby leaving a second wire retreat space for the first cutting wire saw of the second wire cutting device. The third wire cutting device is driven to move in the first direction towards the blanking end by a third cutting distance, the fourth support structure and the third segment of the silicon rod section 20 supported thereby are driven to move in the first direction towards the blanking end by a third supporting distance, at this time the second supporting distance is greater than the third cutting distance, the third cutting distance is greater than the third supporting distance, thereby leaving a third wire retreat space for the first cutting wire saw of the third wire cutting device. The fourth wire cutting device is driven to move in the first direction towards the blanking end by a fourth cutting distance, the fifth support structure and the fourth segment of the silicon rod section 20 supported thereby are driven to move in the first direction towards the blanking end by a fourth supporting distance, at this time the third supporting distance is greater than the fourth cutting distance, the fourth cutting distance is greater than the fourth supporting distance, thereby leaving a fourth wire retreat space for the first cutting wire saw of the fourth wire cutting device. The fifth wire cutting device is driven to move in the first direction towards the blanking end by a fifth cutting distance, the sixth support structure and the fifth segment of the silicon rod section 20 supported thereby are driven to move in the first direction towards the blanking end by a fifth supporting distance, at this time the fourth supporting distance is greater than the fifth cutting distance, the fifth cutting distance is greater than the fifth supporting distance, thereby leaving a fifth wire retreat space for the first cutting wire saw of the fifth wire cutting device. The sixth wire cutting device is driven to move in the first direction towards the blanking end by a sixth cutting distance, the seventh support structure and the sixth segment of the silicon rod section 20 supported thereby are driven to move in the first direction towards the blanking end by a sixth supporting distance, at this time the fifth supporting distance is greater than the sixth cutting distance, the sixth cutting distance is greater than the sixth supporting distance, thereby leaving a sixth wire retreat space for the first cutting wire saw of the sixth wire cutting device. The seventh wire cutting device is driven to move in the first direction towards the blanking end by a seventh cutting distance, the eighth support structure and the seventh segment of the silicon rod section 20 supported thereby are driven to move in the first direction towards the blanking end by a seventh supporting distance, at this time the sixth supporting distance is greater than the seventh cutting distance, the seventh cutting distance is greater than the seventh supporting distance, thereby leaving a seventh wire retreat space for the cutting wire saw of the seventh wire cutting device.The eighth wire cutting device is driven to move an eighth cutting distance along the first direction toward the unloading end, and the ninth support structure and the eighth silicon rod segment 20 it supports are driven to move an eighth supporting distance along the first direction toward the unloading end. At this time, the seventh supporting distance is greater than the eighth cutting distance, and the eighth cutting distance is greater than the eighth supporting distance, thus leaving an eighth retraction space for the first cutting wire saw of the eighth wire cutting device. The ninth wire cutting device is driven to move a ninth cutting distance along the first direction toward the unloading end, and at this time, the eighth supporting distance is greater than the ninth cutting distance, thus leaving a ninth retraction space for the first cutting wire saw of the ninth wire cutting device. At this time, the nine wire cutting devices 4 and each first support structure 2 are positioned as shown. Figure 10 The state shown.

[0124] In one embodiment, the moving distances of the wire cutting device and the support structure are respectively arithmetic sequences. That is, the first cutting distance, the first supporting distance, the second cutting distance, the second supporting distance, the third cutting distance, the third supporting distance, the fourth cutting distance, the fourth supporting distance, the fifth cutting distance, the fifth supporting distance, the sixth cutting distance, the sixth supporting distance, the seventh cutting distance, the seventh supporting distance, the eighth cutting distance, the eighth supporting distance, and the ninth cutting distance described in the above embodiment form a decreasing arithmetic sequence.

[0125] Please continue reading. Figure 8 In step S230, the control device drives the station switching mechanism to make the wire cutting device swing so that the wire saw can complete the wire retraction through the wire retraction space.

[0126] Specifically, please refer to Figure 11 The image shows a schematic diagram of the state after step S230 is performed by the silicon rod dual-station cutting machine in one embodiment of this application. Figure 11 In the example shown, the station switching mechanism, driven by the oscillating actuator, causes the nine wire cutting devices 4 to oscillate around the passive rotation axis to move away from the first station, allowing the first wire saw in each wire cutting device to retract its wire unimpeded through the corresponding retraction space. In another example, the station switching mechanism can cause the nine wire cutting devices 4 to oscillate directly to the second station, allowing the first wire saw to retract its wire while the second wire saw performs a cutting operation or slice sampling operation on the second silicon rod.

[0127] Please continue reading. Figure 8 In step S240, the control device removes the top clamping mechanism to move away from the silicon rod segment, drives the roller group folding unit to make the silicon rod transfer mechanism support the silicon rod segment, and removes the bottom lifting mechanism so that the silicon rod segment is unloaded only under the support of the silicon rod transfer mechanism.

[0128] As mentioned above, in the process of spacing adjustment to realize the retreat of each first cutting wire saw, the top pressing mechanism in the corresponding first support structure presses the top of each silicon rod segment 20 and positions the silicon rod segment 20 in cooperation with the bottom jacking mechanism, so before cutting each silicon rod segment 20, the top pressing mechanism of each first support structure 2 needs to be removed, the silicon rod transfer mechanism is returned to re-support the silicon rod segment 20, and the bottom jacking mechanism is also removed.

[0129] Specifically, the top pressing mechanism of the second support structure to the ninth support structure 2 is actuated, the pressing driving unit 243 drives the pressing piece 241 to move away from each silicon rod segment 20, the roller group folding unit in the silicon rod transfer mechanism 23 is driven to fold the roller group upward to re-support each silicon rod segment 20, and the jacking driving unit 253 in the bottom jacking mechanism is driven to lower the jacking column 251 to move away from each silicon rod segment 20.

[0130] Please continue to refer to Figure 8 In step S250, the control device drives the support frame displacement mechanism to sequentially gather all the movable support structures to the cutting end of the processing platform, and the silicon rod transfer mechanism near the cutting end continues to work until all the silicon rod segments are cut.

[0131] In an embodiment, as Figure 1 shown, the silicon rod double-station cutting machine described in the present application further comprises a cutting delivery device 8 connected to the cutting end, specifically, a first cutting delivery device 8 connected to the cutting end of the first station and a second cutting delivery device 8 connected to the cutting end of the second station. The cutting delivery device 8 and the feeding delivery device 7 can have the same configuration, and the specific structure can be referred to the description in the foregoing embodiments, which will not be repeated here.

[0132] Specifically, please refer to Figure 12 , which shows the state diagram of the silicon rod double-station cutting machine in an embodiment of the present application when executing step S250. As Figure 12 shown, the roller group in the silicon rod transfer mechanism of each first support structure 2 continues to rotate, and each silicon rod segment 20 is sequentially pushed to the first cutting delivery device 8, which is sequentially unloaded by the first cutting delivery device 8.

[0133] In an embodiment, the time for cutting the first silicon rod 10 or the second silicon rod is equal to the time for loading or unloading. That is, while the first silicon rod 10 is being cut, the second silicon rod can be loaded; after the second silicon rod reaches the cutting position, the first silicon rod 10 is cut into the silicon rod segments 20, and the unloading can continue; while the silicon rod segments 20 are being unloaded, the wire saws 4 can swing to the second station to cut the second silicon rod. In this way, the first station and the second station of the silicon rod double-station cutting machine and the continuous loading, cutting, and unloading of the silicon rod are achieved, thereby greatly improving the cutting efficiency of the silicon rod.

[0134] The execution process of the silicon rod double-station cutting machine in the foregoing embodiment will be described below with reference to the accompanying drawings.

[0135] First, the control device controls the first support structures 2 to perform steps S110-S130 under the first instruction to load the first silicon rod 10 in the first station, so that the first silicon rod 10 to be cut reaches the cutting position and is ready to be cut under the support of the bottom lifting mechanism. Then, the wire saws 4 reach the cutting position under the drive of the cutting displacement mechanism, swing to the first station under the drive of the swing driver, and cut the first silicon rod 10 or take a sample, forming the silicon rod segments 20. While the first silicon rod 10 is being cut, the control device controls the second support structures 3 to repeatedly perform steps S110-S130 under the first instruction to load the second silicon rod in the second station, so that the second silicon rod to be cut reaches the cutting position and is ready to be cut under the support of the bottom lifting mechanism. Thereafter, the control device controls the first support structures 2 and the wire saws 4 to perform steps S210-S250 under the second instruction to unload the silicon rod segments 20 obtained by cutting the first silicon rod 10. While the silicon rod segments 20 are being unloaded, the wire saws 4 swing to the second station under the drive of the swing driver and cut the second silicon rod or take a sample, forming the silicon rod segments. Subsequently, the control device controls the second support structures 3 and the wire saws 4 to repeatedly perform steps S210-S250 under the second instruction to unload the silicon rod segments obtained by cutting the second silicon rod. The control device repeatedly performs the above steps to achieve the uninterrupted loading, cutting, and unloading of the silicon rod in the two stations of the silicon rod double-station cutting machine.

[0136] To sum up, in order to overcome the technical problem that the support structure in the prior art does not contact or insufficiently contacts the silicon rod, resulting in the silicon rod being broken during cutting, the support structure provided by the application realizes the support of the silicon rod during cutting by arranging a bottom lifting mechanism. By arranging a plurality of lifting columns capable of being independently controlled in the bottom lifting mechanism, each lifting column can be lifted to a different height to adaptively touch the circumferential surface of the silicon rod, thereby realizing sufficient contact with the silicon rod, stably supporting the silicon rod, avoiding displacement of the silicon rod during cutting, avoiding the generation of the broken edge phenomenon, and improving the quality of the silicon rod processing.

[0137] Further, the silicon rod double-station cutting machine provided by the application can simultaneously realize the bearing of two silicon rods by arranging a first station and a second station parallel to each other on the machining platform. The first cutting wire saw and the second cutting wire saw capable of cutting two silicon rods respectively are arranged on the cutting installation structure of the online cutting device, so that the cutting operation of the two silicon rods can be simultaneously realized. The station switching mechanism capable of driving the cutting installation structure to swing between the first station and the second station is arranged, so that the first cutting wire saw and the second cutting wire saw can be switched between the two stations, thereby realizing the cutting operation of the silicon rods in the two stations by using the same set of wire cutting devices, improving the utilization rate of the wire cutting device while ensuring the machining efficiency, optimizing the equipment layout, and reducing the production cost.

[0138] In addition, the feeding and discharging mechanism provided by the application can support the silicon rods to be cut during feeding and support the silicon rod segments formed by cutting during discharging by arranging a plurality of support structures on the machining platform. The control device connecting the support structure and the wire cutting device can realize the automation of the feeding and discharging operations, thereby improving the machining efficiency. The support frame, the support frame displacement mechanism, and the silicon rod transfer mechanism are arranged on each support structure, so that each support structure can independently move the silicon rod or the silicon rod segment on the machining platform, thereby making the feeding process more labor-saving, and the support structures can move respectively to leave the wire withdrawal space during discharging, thereby avoiding the contact between the cutting wire and the silicon rod segment, so as to ensure the product quality. During the whole machining process, the support structure stably supports the silicon rod or the silicon rod segment, thereby improving the stability of feeding and discharging.

[0139] The above embodiments only exemplarily illustrate the essence of the application and the obtained beneficial effects, and are not used to limit the application. Any person skilled in the art can modify or change the above embodiments without departing from the principles and categories of the application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical thought of the application should be covered by the claims of the application.

Claims

1. A support structure for silicon rod cutting operations, characterized in that, The device includes a support frame mounted on a processing platform for carrying a silicon rod to be cut, and a bottom lifting mechanism mounted on the support frame for providing support for the silicon rod to be cut; wherein the bottom lifting mechanism includes a plurality of lifting columns arranged in parallel in two rows along a second direction, and a lifting drive unit that can independently control the lifting columns so that each lifting column can rise to touch or fall away from the outer circumferential surface of the silicon rod.

2. The support structure according to claim 1, characterized in that, The bottom lifting mechanism is configured as two rows of cylinders arranged in parallel along the second direction.

3. The support structure according to claim 2, characterized in that, Each row of lifting columns is configured with at least one.

4. The support structure according to claim 3, characterized in that, The lifting column has an inward tilt angle, which provides a stable support surface for the silicon rod when it contacts the outer circumferential surface of the silicon rod.

5. The support structure according to claim 1, characterized in that, It also includes a top clamping mechanism disposed on the support frame for clamping the top of the silicon rod.

6. The support structure according to claim 5, characterized in that, The top clamping mechanism includes a clamping element and a clamping drive unit for driving the clamping element to clamp or release the silicon rod.

7. The support structure according to claim 1, characterized in that, It also includes a silicon rod transfer mechanism adjacent to the bottom lifting mechanism for transporting the silicon rod to be cut into place.

8. The support structure according to claim 7, characterized in that, The silicon rod transfer mechanism includes two rows of rollers arranged in parallel along a second direction, and a roller drive unit for driving the rollers to rotate so as to move the silicon rod along a first direction.

9. The support structure according to claim 8, characterized in that, The silicon rod transfer mechanism further includes a roller assembly folding unit for folding the roller assembly downwards away from the silicon rod, so that the silicon rod is cut off only under the support of the bottom lifting mechanism.

10. The support structure according to claim 7, characterized in that, It also includes a support frame shifting mechanism for driving the support frame to move the silicon rod along a first direction to cooperate with the silicon rod transfer mechanism to deliver the silicon rod into place.

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