Mixing mill for encapsulating material of electronic component

By designing an anti-sticking mechanism and stirring components, the problems of uneven heat distribution and unmelted material at the discharge port in the electronic component encapsulation material mixing machine were solved, thereby improving the stability and efficiency of the mixing process.

CN223573492UActive Publication Date: 2025-11-21XIANYANG XINWEIHUA INSULATION MATERIAL CO LTD
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Patent Information

Application Number
CN202422517558.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-17
Publication Date
2025-11-21
Estimated Expiration
2034-10-17

AI Technical Summary

Technical Problem

Existing electronic component encapsulation material mixing machines suffer from uneven heat distribution during operation, leading to localized overheating and scorching at the bottom of the mixing tank. Furthermore, the material at the discharge port cannot be fully mixed and melted, affecting product quality and production efficiency.

Method used

The anti-sticking mechanism includes a rotating drum, scraper, and stirring assembly. Heat is provided by a spiral heating wire, combined with the rotating and reciprocating stirring assembly, to ensure uniform heating and mixing of the encapsulating material, prevent adhesion, and push the material to the discharge port through the spiral blades to achieve comprehensive mixing.

Benefits of technology

It effectively prevents the bottom scorching phenomenon, ensures stable mixing quality, significantly shortens the material melting time, improves mixing efficiency, avoids the problem of unmelted material at the discharge port, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an electronic component encapsulating material mixing mill, which belongs to the technical field of electronic component encapsulating materials, and comprises a mixing tank and a bottom pasting prevention mechanism arranged in the mixing tank, and the bottom pasting prevention mechanism comprises a rotating cylinder rotationally connected to the middle part of the top wall surface of the mixing tank; mounting plates which are vertically and symmetrically distributed are arranged at the left end and the right end of the outer arc surface of the rotating cylinder, a scraping plate is arranged at the end of the outer side between every two vertically adjacent mounting plates, the scraping plates are matched with the inner wall of the mixing tank, and a stirring assembly is further arranged in the mixing tank. According to the utility model, through the bottom-pasting-preventing mechanism, an encapsulating material positioned in a spiral heating wire area is effectively prevented from being adhered to the inner wall of the mixing tank due to long-time heating, so that the quality stability in the mixing process is ensured, and the phenomenon of bottom pasting of the electronic component encapsulating material mixing mill is prevented; and meanwhile, the encapsulating material in the mixing tank can be comprehensively and deeply stirred, so that the time required by material smelting is remarkably shortened.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of electronic component package material, specifically relates to electronic component package material mixing mill. BACKGROUND

[0002] Electronic component package material is a kind of key material for electronic component packaging process, mainly used to protect electronic component from external environmental factors, and ensure the electrical insulation and stability of internal structure, at present, electronic component package material is usually processed by special electronic component package material mixing mill when mixing;

[0003] The existing electronic component package material mixing mill mainly relies on one or several groups of stirring mechanisms driven by motor to ensure the uniform mixing of package material in mixing tank during operation, although the mixing effect can be realized, but there are some problems to be solved in actual application, firstly, due to the relative position between fixedly installed stirring blade and tank body does not change with mixing process, leading to uneven heat distribution, the package material close to heating element area is more prone to rapid heating and thus local overheating phenomenon, thereby increasing the risk of adhering to the inner wall of mixing tank, resulting in the phenomenon of paste bottom, secondly, the material in mixing tank is limited by stirring mode, especially at discharge port, due to weakening or insufficient covering of stirring force, this part of package material can not be fully mixed, thereby unable to melt in time, affecting the quality and production efficiency of final product. SUMMARY

[0004] Therefore, the utility model provides electronic component package material mixing mill, can prevent package material in spiral heating wire area from adhering to the inner wall of mixing tank due to long-time heating by anti-paste bottom mechanism, ensures the quality stability of mixing process, prevents the phenomenon of paste bottom of electronic component package material mixing mill, can carry out comprehensive and in-depth stirring treatment to package material in mixing tank, significantly shortens the time required for material melting, improves the mixing efficiency of electronic component package material, avoids the phenomenon that electronic component package material at the discharge port of mixing tank cannot be melted.

[0005] To solve the above technical problems, the utility model provides electronic component package material mixing mill, including mixing tank and anti-paste bottom mechanism arranged in mixing tank, anti-paste bottom mechanism includes rotation cylinder rotationally connected to the middle part of the top wall surface of mixing tank, the outer arc surface left and right ends of rotation cylinder are each equipped with vertically symmetrical distribution mounting plate, the outer side end of each two vertically adjacent mounting plates is equipped with scraper, scraper is matched with the inner wall of mixing tank, stirring assembly is further arranged in mixing tank, electric ball valve is arranged at the lower end discharge port of mixing tank, and spiral heating wire is arranged at the lower end of mixing tank.

[0006] The stirring assembly comprises a rotating hole arranged at the middle part of the upper end of the mixing kettle, a rotating rod rotatably connected in the rotating hole, a rectangular sliding groove arranged at the middle part of the lower end surface of the rotating rod, a rectangular sliding rod slidably connected in the rectangular sliding groove, a mounting rod arranged on the lower surface of the rectangular sliding rod, a circular hole arranged at the middle part of the lower end of the rotating cylinder and matched with the mounting rod, a plurality of uniformly distributed mixing plates arranged on the outer arc surface of the mounting rod, a motor arranged at the middle part of the upper end surface of the mixing kettle, a fixing connection between the lower end of the output shaft of the motor and the upper end of the rotating rod, a linkage assembly arranged between the mounting rod and the rotating cylinder, and a reciprocating driving assembly arranged at the middle part of the top wall of the mixing kettle and located in the rotating cylinder and used for driving the mounting rod to move up and down.

[0007] The linkage assembly comprises a limiting sliding block arranged at the right side of the inner arc surface of the circular hole, and the outer arc surface of the mounting rod is further provided with a limiting sliding groove, and the limiting sliding block is slidably connected with the limiting sliding groove.

[0008] The outer arc surface of the mixing kettle is provided with a plurality of horizontally symmetrically distributed assembly plates at the lower end.

[0009] The outer arc surface of the mixing kettle is provided with a single-chip microcomputer at the right side of the upper end, the single-chip microcomputer is electrically connected with the outside, and the motor, the electric ball valve and the spiral heating wire are electrically connected with the single-chip microcomputer.

[0010] The above technical scheme of the utility model has the following beneficial effects:

[0011] 1、The relevant staff controls the motor and the spiral heating wire operation through the single-chip microcomputer, wherein the spiral heating wire generates heat to melt the encapsulating material in the tank, and the motor output shaft rotation drives the rotating rod, the rectangular slide rod, the mounting rod and the mixing plate, the spiral piece one and the spiral piece two attached thereto to rotate synchronously, the mixing plate stirs and mixes the encapsulating material in the rotating process, and the spiral piece one can turn the electronic component encapsulating material upward, so that the electronic component encapsulating material can fully contact and absorb heat, thereby accelerating the melting process, so that the electronic component encapsulating material quickly reaches the ideal melting state, on the other hand, the spiral piece two can push the electronic component encapsulating material in the mixing tank discharge port upward, avoiding the phenomenon that the electronic component encapsulating material in the mixing tank discharge port cannot be melted, and at the same time, the reciprocating wire tube drives the rectangular slide cylinder, the rectangular slide rod, the mounting rod, the mixing plate, the spiral piece one, the limiting sliding groove and the spiral piece two to move up and down synchronously through the internal thread pipe connected with the reciprocating wire tube in rotation, so that the encapsulating material in the mixing tank can be fully and deeply stirred, thereby significantly shortening the melting time of the material and improving the mixing efficiency of the electronic component encapsulating material.

[0012] 2、When the limiting sliding groove rotates with the overall structure, the rotating cylinder, the mounting plate and the scraper are driven to rotate through the sliding connection with the limiting sliding block, which can effectively prevent the encapsulating material in the spiral heating wire area from adhering to the inner wall of the mixing tank due to long-time heating, thereby ensuring the quality stability of the mixing process and preventing the electronic component encapsulating material mixing machine from being pasted. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a schematic view of the main body structure of the electronic component encapsulating material mixing machine of the utility model;

[0014] Figure 2 It is a schematic view of the anti-pasting mechanism structure of the utility model;

[0015] Figure 3 It is a schematic view of the A structure of the utility model;

[0016] Figure 4 It is a schematic view of the B structure of the utility model.

[0017] Explanation of reference numerals: 100, mixing tank; 200, electric ball valve; 300, rotating cylinder; 301, mounting plate; 302, scraper; 400, rotating rod; 401, rectangular slide rod; 402, mounting rod; 403, mixing plate; 404, spiral piece one; 405, spiral piece two; 406, motor; 500, rectangular pipe; 501, rectangular slide cylinder; 502, internal thread pipe; 503, reciprocating wire tube; 600, assembly plate; 700, single-chip microcomputer; 800, spiral heating wire; 900, limiting sliding block; 901, limiting sliding groove. DETAILED DESCRIPTION

[0018] For the purpose, technical scheme and advantages of the embodiments of the present application, the following will be combined with the drawings of the embodiments of the present application to make a detailed description. Figures 1-4 The technical scheme of the embodiments of the present application is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the present application, not all the embodiments. Based on the described embodiments of the present application, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present application.

[0019] As shown in the drawings: Figures 1-4

[0020] The present embodiment provides an electronic component encapsulating material mixing machine, which comprises a mixing tank 100 and a anti-sticking mechanism arranged in the mixing tank 100. The anti-sticking mechanism comprises a rotating cylinder 300 rotatably connected to the middle part of the top wall of the mixing tank 100. The outer arc surface of the rotating cylinder 300 is provided with two vertically symmetrical mounting plates 301 at the left and right ends. The outer side end of each of the two vertically adjacent mounting plates 301 is provided with a scraper 302. The scraper 302 is arranged in cooperation with the inner wall of the mixing tank 100. The mixing tank 100 is also provided with a stirring assembly. The lower end of the mixing tank 100 is provided with an electric ball valve 200, and the lower end of the mixing tank 100 is provided with a spiral heating wire 800.

[0021] As shown in the drawings: Figures 1-4 ​As shown, the stirring assembly comprises a rotating hole arranged at the middle of the upper end of the mixing tank 100, a rotating rod 400 is rotatably connected in the rotating hole, a rectangular sliding rod 401 is slidably connected in a rectangular sliding groove arranged at the middle of the lower end surface of the rotating rod 400, the lower surface of the rectangular sliding rod 401 is provided with a mounting rod 402, the lower end middle of the rotating cylinder 300 is also provided with a circular hole matched with the mounting rod 402, the outer arc surface of the mounting rod 402 is provided with uniformly distributed mixing plates 403, the middle of the upper end surface of the mixing tank 100 is provided with a motor 406, the lower end of the output shaft of the motor 406 is fixedly connected with the upper end of the rotating rod 400, a linkage assembly is further arranged between the mounting rod 402 and the rotating cylinder 300, and a reciprocating driving assembly for driving the mounting rod 402 to move up and down is further arranged in the rotating cylinder 300 at the middle of the top wall surface of the mixing tank 100; the stirring assembly further comprises spiral fins one 404 and spiral fins two 405 arranged in sequence from top to bottom on the outer arc surface of the mounting rod 402; the reciprocating driving assembly comprises a rectangular tube 500 arranged in the rotating cylinder 300 at the middle of the top wall surface of the mixing tank 100, a rectangular sliding cylinder 501 is slidably connected to the outside of the rectangular tube 500, a through hole arranged at the middle of the bottom wall surface of the rectangular sliding cylinder 501 is rotatably connected with the upper end of the outer arc surface of the mounting rod 402, an internally threaded tube 502 is arranged at the middle of the bottom wall surface of the rectangular sliding cylinder 501, the internally threaded tube 502 is located between the rectangular tube 500 and the rotating rod 400, a reciprocating silk tube 503 is arranged in an annular groove arranged on the outer arc surface of the rotating rod 400, and the reciprocating silk tube 503 is threadedly connected with the internally threaded tube 502.

[0022] As shown in Figures 2-4 , the linkage assembly comprises a limiting sliding block 900 arranged at the right side of the inner arc surface of the circular hole, and the right side of the outer arc surface of the mounting rod 402 is further provided with a limiting sliding groove 901, and the limiting sliding block 900 and the limiting sliding groove 901 are slidably connected.

[0023] As shown in Figures 1-2 , the right side of the upper end of the outer arc surface of the mixing tank 100 is provided with a single-chip microcomputer 700, the single-chip microcomputer 700 is electrically connected with the outside, and the motor 406, the electric ball valve 200 and the spiral heating wire 800 are electrically connected with the single-chip microcomputer 700.

[0024] The working principle of the electronic component encapsulating material mixing machine is as follows: first, relevant staff members pour the multi-element electronic component encapsulating material into the mixing tank 100 according to the required proportion, then the relevant staff members control the motor 406 and the spiral heating wire 800 to operate through the single-chip microcomputer 700, wherein the spiral heating wire 800 generates heat to melt the encapsulating material in the tank, and the output shaft of the motor 406 rotates to drive the rotating rod 400, the rectangular sliding rod 401, the mounting rod 402, the mixing plate 403, the spiral piece one 404 and the spiral piece two 405 attached thereto to rotate synchronously, the mixing plate 403 performs basic stirring and mixing of the encapsulating material during the rotating process, and the spiral piece one 404 can turn the electronic component encapsulating material upward, so that the electronic component encapsulating material can fully contact and absorb heat, thereby accelerating the melting process, so that it quickly reaches the ideal melting state, on the other hand, the spiral piece two 405 can push the electronic component encapsulating material in the discharge port of the mixing tank 100 upward, avoiding the phenomenon that the electronic component encapsulating material at the discharge port of the mixing tank 100 cannot be melted, at the same time, the reciprocating wire tube 503 drives the rectangular sliding cylinder 501, the rectangular sliding rod 401, the mounting rod 402, the mixing plate 403, the spiral piece one 404, the limiting sliding groove 901 and the spiral piece two 405 to move up and down synchronously through the inner thread tube 502 connected with the reciprocating wire tube 503 in rotation, so that the encapsulating material in the mixing tank 100 can be fully and deeply stirred, the time required for material melting is significantly shortened, and the mixing efficiency of the electronic component encapsulating material is improved, in addition, when the limiting sliding groove 901 rotates with the overall structure, the rotating cylinder 300, the mounting plate 301 and the scraper 302 are driven to rotate through the sliding connection with the limiting sliding block 900, which can effectively prevent the encapsulating material in the region of the spiral heating wire 800 from adhering to the inner wall of the mixing tank 100 due to long-time heating, and ensures the quality stability of the mixing process, after the mixing process is completed, the relevant staff members again control the opening and closing of the electric ball valve 200 through the single-chip microcomputer 700, so as to discharge the fully mixed encapsulating material from the discharge port, and thus the whole mixing process is completed.

[0025] As Figures 1-2 shown, the outer arc surface lower end of the mixing tank 100 is provided with the assembly plate 600 distributed transversely symmetrically, which facilitates the relevant staff members to quickly fix and install the mixing tank 100 and its auxiliary mechanisms.

[0026] In addition, it needs to be explained that, in the description of the present application, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] The above is the preferred embodiment of the present application, it should be pointed out that, for those skilled in the art, without departing from the principles described in the present application, a number of improvements and refinements can be made, these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. An electronic component encapsulation material mixing machine, characterized in that: The system includes a mixing tank (100) and an anti-sticking mechanism disposed within the mixing tank (100). The anti-sticking mechanism includes a rotating cylinder (300) rotatably connected to the middle of the top wall of the mixing tank (100). The rotating cylinder (300) has vertically symmetrically distributed mounting plates (301) at both ends of its outer arc surface. Scrapers (302) are provided at the outer ends of two vertically adjacent mounting plates (301). The scrapers (302) are fitted into the inner wall of the mixing tank (100). The mixing tank (100) is also equipped with a stirring assembly. An electric ball valve (200) is located at the lower outlet of the mixing tank (100). A spiral heating wire (800) is located at the lower end of the mixing tank (100). The stirring assembly includes a rotating hole located in the middle of the upper end of the mixing tank (100). A rotating rod (400) is rotatably connected within the rotating hole. A rectangular sliding rod (401) is slidably connected within a rectangular groove located in the middle of the lower end face of the rotating rod (400). A mounting rod is located on the lower surface of the rectangular sliding rod (401). 402), the lower end of the rotating cylinder (300) is provided with a circular hole that matches the mounting rod (402). The outer arc surface of the mounting rod (402) is provided with uniformly distributed mixing plates (403). The upper end face of the mixing tank (100) is provided with a motor (406). The lower end of the output shaft of the motor (406) is fixedly connected to the upper end of the rotating rod (400). A linkage assembly is also provided between the mounting rod (402) and the rotating cylinder (300). The middle part of the top wall of the mixing tank (100) The rotating cylinder (300) is also provided with a reciprocating drive assembly for driving the mounting rod (402) to move up and down. The stirring assembly also includes a spiral blade one (404) and a spiral blade two (405) arranged sequentially from top to bottom on the outer arc surface of the mounting rod (402). The linkage assembly includes a limiting slider (900) arranged on the right side of the inner arc surface of the circular hole. The right side of the outer arc surface of the mounting rod (402) is also provided with a limiting groove (901). The limiting slider (900) is slidably connected to the limiting groove (901).

2. The electronic component encapsulation material mixing machine as described in claim 1, characterized in that: The reciprocating drive assembly includes a rectangular tube (500) disposed in the middle of the top wall of the mixing tank (100) and located inside the rotating cylinder (300). A rectangular slide cylinder (501) is slidably connected to the outside of the rectangular tube (500). A through hole in the middle of the bottom wall of the rectangular slide cylinder (501) is rotatably connected to the upper end of the outer arc surface of the mounting rod (402). An internally threaded tube (502) is provided in the middle of the bottom wall of the rectangular slide cylinder (501). The internally threaded tube (502) is located between the rectangular tube (500) and the rotating rod (400). A reciprocating threaded tube (503) is provided in the annular groove in the outer arc surface of the rotating rod (400). The reciprocating threaded tube (503) is threadedly connected to the internally threaded tube (502).

3. The electronic component encapsulation material mixing machine as described in claim 1, characterized in that: The lower end of the outer arc surface of the mixing tank (100) is provided with horizontally symmetrically distributed assembly plates (600).

4. The electronic component encapsulation material mixing machine as described in claim 1, characterized in that: A microcontroller (700) is provided on the upper right side of the outer arc surface of the mixing tank (100). The microcontroller (700) is electrically connected to the outside. The motor (406), electric ball valve (200) and spiral heating wire (800) are all electrically connected to the microcontroller (700).