Integrated circuit chip carrier tape

Abstract

The utility model belongs to the technical field of carrier tapes, and particularly relates to an integrated circuit chip carrier tape which comprises a carrier strip for accommodating a chip and a cover tape for covering the carrier strip, and further comprises a diaphragm arranged between the carrier strip and the cover tape, the diaphragm is arranged on the upper surface of the carrier strip in an attached mode and forms a cavity capable of accommodating the chip, and the cover tape covers the carrier strip. The diaphragm is connected with the carrier strip and the cover tape in a bonding manner; when the cover tape is torn apart, the diaphragm in which the chip is placed is driven to be taken out from the carrier strip at the same time; it can be understood that the diaphragm arranged between the carrier strip and the cover tape can not only ensure the accommodation of the chip, but also bring the chip out of the carrier strip when the cover tape is torn, so that great convenience is provided for manual operation, and the phenomenon that other chips fall off due to tearing of the cover tape is avoided.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of carrier tape, especially relates to an integrated circuit chip carrier tape. BACKGROUND

[0002] The integrated circuit chip carrier tape is a special material for packaging, transporting and storing integrated circuit (IC) chips. The carrier tape is usually made of plastic or other synthetic materials and has a certain structure designed to facilitate the protection and handling of chips. It is widely used in the electronics manufacturing industry, especially in the mass production and assembly process of integrated circuits (ICs). In the process of manufacturing electronic components, IC chips usually need to be transported through carrier tapes to realize batch automated production. The carrier tape ensures that the chips can be delivered to automatic placement machines and other equipment in the predetermined order;

[0003] However, in actual production, not all manufacturers and models require mass production. In some small-batch production, customized production or sample production, components may not be processed through a complete automated production line and require manual intervention. At this time, it is more common to manually remove components from the carrier tape, especially when handling, calibrating, inspecting or assembling small batches of samples;

[0004] To solve the above problems, the present application provides an integrated circuit chip carrier tape. SUMMARY

[0005] The utility model aims at providing an integrated circuit chip carrier tape, which solves the problems raised in the background.

[0006] To solve the above technical problems, the utility model is implemented by the following technical solutions:

[0007] The utility model relates to an integrated circuit chip carrier tape, which comprises a carrier strip containing chips and a cover tape covering the carrier strip, and further comprises a septum arranged between the carrier strip and the cover tape. The septum is arranged on the upper surface of the carrier strip and forms a chamber capable of containing chips. The septum is connected to the carrier strip and the cover tape by adhesion. When the cover tape is torn, the septum containing the chips is removed from the carrier strip at the same time.

[0008] Further, the carrier strip is formed with grooves containing chips and bosses separating the chips.

[0009] Further, the septum comprises a sunken part arranged in the groove and a flat part arranged on the boss. An opening zone is arranged between the sunken part and the flat part, which is open on one side and inclined.

[0010] Further, the side of the sinking part connected with the opening area and the plane part is provided with the plane part, when the chip is located in the sinking part, the sinking part and the chip are pinched and taken out, at this time, the breakpoint area is disconnected to take out the chip.

[0011] Further, the bottom surface of the plane part is provided with a first glue area for bonding the diaphragm on the boss and connecting with the carrier strip, and the top surface of the plane part is provided with a second glue area for bonding the diaphragm and the cover tape.

[0012] Further, the first glue area and the second glue area are oppositely arranged, and both adopt heating to form adhesive force.

[0013] Further, the second glue area is larger than the first glue area.

[0014] The utility model has the following beneficial effects:

[0015] The utility model discloses a diaphragm is arranged between the carrier strip and the cover tape, and the diaphragm is connected with the carrier strip in the form of sticking and forms a chip containing space, and the carrier strip is packaged by the cover tape bonded with the diaphragm, so that the chip protection effect and reliability are ensured.

[0016] The second glue area is larger than the first glue area, when the cover tape is torn, the diaphragm is peeled off from the carrier strip, and under the action of the second glue area, the diaphragm and the chip in the corresponding groove position are taken up together, so that the one-groove one-taking effect is realized, manual operation of small batches is facilitated, and the taking mode does not need to buckle and turn the carrier strip, and the operation is more simple and efficient.

[0017] Of course, any product implementing the utility model does not necessarily need to achieve all the advantages mentioned above. DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creating labor.

[0019] Figure 1 It is the overall appearance structure schematic diagram of the utility model;

[0020] Figure 2 It is Figure 1 The split structure schematic diagram;

[0021] Figure 3 It is Figure 2 The structure schematic diagram of the bottom view;

[0022] Figure 4 It isFigure 2 Enlarged structural schematic view of middle A part;

[0023] In the drawings, the components represented by each reference numeral are listed as follows:

[0024] In the drawings: 1, carrier strip; 11, groove; 12, boss; 2, diaphragm; 21, sunken part; 22, flat part; 23, opening area; 24, breakpoint area; 3, cover tape; 4, first glue area; 5, second glue area. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] In the description of the present application, it should be understood that the terms "hole", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery" and the like indicate the orientation or positional relationship, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0027] Please refer to Figures 1-4 As shown in the drawings, the present application is an integrated circuit chip carrier tape, which comprises a carrier strip 1 accommodating chips and a cover tape 3 covering the carrier strip 1, and further comprises a diaphragm 2 arranged between the carrier strip 1 and the cover tape 3, the diaphragm 2 is arranged on the upper surface of the carrier strip 1 and forms a chamber capable of accommodating chips, and the diaphragm 2 is connected with the carrier strip 1 and the cover tape 3 through adhesion. When the cover tape 3 is torn off, the diaphragm 2 with the chips inside is taken out of the carrier strip 1 at the same time. Since the linkage structure is adopted, the operator can easily take out the chips in the corresponding slot by tearing off the cover tape. This operation method is convenient for small-batch manual operation, saves time and effort, and is particularly suitable for efficient manual processing on the production line.

[0028] Among them, the carrier strip 1 is formed with a groove 11 accommodating chips and a boss 12 separating the chips.

[0029] The diaphragm 2 comprises a sunken part 21 fitted in the groove 11 and a flat part 22 fitted on the boss 12, an opening area 23 is arranged between the sunken part 21 and the flat part 22, and the sunken part 21 is provided with the flat part 22 on one side connected with the opening area 23, when the chip is placed in the sunken part 21, the sunken part 21 and the chip are pinched and taken out, at this time, the breakpoint area 24 is disconnected to take out the chip, in the embodiment, the opening area 23 and the breakpoint area 24 are arranged in cooperation, the opening area 23 can shorten the length of the first glue area 4, so that the first glue area 4 can be easily disconnected, and finally the chip can be easily taken out.

[0030] The bottom surface of the flat part 22 is provided with the first glue area 4 for bonding the diaphragm 2 on the boss 12 and connecting with the carrier strip 1, and the top surface of the flat part 22 is provided with the second glue area 5 for bonding the diaphragm 2 and the cover tape 3, the first glue area 4 and the second glue area 5 are arranged oppositely, and both are heated to form adhesive force, in the embodiment, the first glue area 4 and the second glue area 5 are first heated and fitted on the lower end and the upper end of the flat part 22, and then the carrier strip 1, the diaphragm 2 and the cover tape 3 are completely assembled and fitted, at this time, the first glue area 4 and the second glue area 5 are heated from the surface of the cover tape 3, so as to form the final integral bonding.

[0031] The second glue area 5 is larger than the first glue area 4, in the embodiment, the first glue area 4 is smaller than the second glue area 5, when the cover tape 3 is torn, the adhesive force of the second glue area 5 is greater than that of the first glue area 4, so that the first glue area 4 is torn, therefore, the diaphragm 2 can be driven upward and the chip inside can be taken out at the same time when the cover tape 3 is torn, which is convenient for manual taking out.

[0032] It can be understood that the diaphragm arranged between the carrier strip and the cover tape can not only accommodate the chip, but also take out the chip from the carrier strip at the same time when the cover tape is torn, which provides great convenience for manual operation, and other chips will not fall off due to the tearing of the cover tape.

[0033] One specific application of the embodiment is that the diaphragm 2 is produced to the state shown in the figure and embedded on the carrier strip 1, the chip is placed in the sunken part 21, and the cover tape 3 is covered on the upper end of the carrier strip 1, the flat part 22 is heated from above the cover tape 3, the first glue area 4 and the second glue area 5 are heated, and then the carrier strip 1, the diaphragm 2 and the cover tape 3 are integrally formed after cooling and solidification;

[0034] In use: tear the cover tape 3 from the right side as shown in the figure, because the area of the second adhesive area 5 is larger than the first adhesive area 4, the cover tape 3 will tear the first adhesive area 4 between the diaphragm 2 and the carrier strip 1 and drive, the planar part 22 is torn upward at the same time driving the sunken part 21 to move upward, the chip inside the sunken part 21 is also taken out from the inside of the groove 11, at this time the other hand enters from the side of the sunken part 21 and performs a pinching action on the upper and lower ends of the sunken part 21, the chip is pinched, and then the chip is directly taken out in the pinched state, at this time the breakpoint area 24 will be automatically disconnected under the action of tension, the sunken part 21 is separated from the hand, and the chip remains in the hand, so that the single taking-out action of the chip is completed;

[0035] Because the first adhesive area 4 and the second adhesive area 5 on the side of the part of the chip that is not removed are still in a bonded state, other chips will not fall off.

[0036] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The preferred embodiments of the application disclosed above are only used to help explain the application. The preferred embodiments do not describe all the details and do not limit the application to the specific embodiments described. Obviously, according to the content of the specification, many modifications and changes can be made. The present specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the application, so that those skilled in the art can well understand and utilize the application. The application is limited by the claims and their entire scope and equivalents.

Claims

1. An integrated circuit chip carrier tape comprising a carrier strip (1) for accommodating chips and a cover tape (3) for covering the carrier strip (1), characterized in that, Also include: The diaphragm (2) is arranged on the upper surface of the carrier strip (1) and is formed with a cavity capable of accommodating the chip, and the diaphragm (2) is connected with the carrier strip (1) and the cover tape (3) by adhesion. When the cover tape (3) is torn, the diaphragm (2) with the chip inside is taken out from the carrier strip (1) at the same time.

2. An integrated circuit chip carrier as claimed in claim 1, characterized in that: The carrier strip (1) is formed with a groove (11) for accommodating the chip and a boss (12) for separating the chips.

3. An integrated circuit chip carrier as claimed in claim 2, characterized in that: The diaphragm (2) includes a sunken part (21) fitted in the groove (11) and a flat part (22) fitted on the boss (12), and an opening area (23) is arranged between the sunken part (21) and the flat part (22) and is inclined.

4. An integrated circuit chip carrier as claimed in claim 3, characterized in that: The side of the opening area (23) connected between the sunken part (21) and the flat part (22) is provided with the flat part (22), and when the chip is in the sunken part (21), the sunken part (21) and the chip are pinched and taken out at the same time. At this time, the breakpoint area (24) is disconnected to take out the chip.

5. An integrated circuit chip carrier as claimed in claim 3, characterized in that: The bottom surface of the flat part (22) is provided with a first glue area (4) for bonding the diaphragm (2) to the boss (12) and connecting with the carrier strip (1), and the top surface of the flat part (22) is provided with a second glue area (5) for bonding the diaphragm (2) and the cover tape (3).

6. An integrated circuit chip carrier as claimed in claim 5, characterized in that: The first glue area (4) and the second glue area (5) are arranged opposite to each other, and both are formed by heating to generate adhesion.

7. An integrated circuit chip carrier as claimed in claim 5, characterized in that: The second glue area (5) is larger than the first glue area (4).

Images