Turnover device for semiconductor part processing

Abstract

The utility model discloses a turnover device for processing semiconductor parts, which comprises a base, moving seats are symmetrically and slidably mounted at two ends of the base, and a servo motor is fixedly mounted on one side of the top of each moving seat. The semiconductor parts in different shapes can be effectively fixed through extrusion of the two extrusion rings on the semiconductor parts, the semiconductor parts are continuously conveyed through the conveying belt, the semiconductor parts are driven to be lifted to the position between the two extrusion rings by controlling the jacking frame to ascend, and the semiconductor parts are driven to be lifted to the position between the two extrusion rings by controlling the moving seat to slide to be close to each other. And after machining is completed, the jacking frame is controlled to ascend, then the moving seat is controlled to be far away, the semiconductor parts are placed on the positioning clamping blocks, then the jacking frame is controlled to descend, the semiconductor parts are placed on the conveying belt, and the discharging device is used for discharging the semiconductor parts. And uninterrupted feeding and discharging during processing of the semiconductor parts are facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor spare processing technical field, concretely is a kind of turnover device for semiconductor spare processing. BACKGROUND

[0002] Semiconductor refers to the electric conductivity between conductor and insulator at normal temperature, when carrying out the semiconductor production of various types, the parts of semiconductor are carefully processed, so the device for clamping and overturning semiconductor parts is used.

[0003] In the "semiconductor spare processing turnover device" with the authorization announcement No.

[0004] In the above prior art, only by elastic strip and the clamping seat to semiconductor parts are extruded, only certain shape semiconductor parts can be fixed, and at the same time, when fixing semiconductor parts, people also need to hold the position of semiconductor parts, which is not convenient for the installation and fixation of semiconductor parts. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of semiconductor spare processing turnover device, to solve the problems raised in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of semiconductor spare processing turnover device, including base, the both ends of the base are symmetrically slidably installed with moving seat, the top side of the moving seat is fixedly installed with servo motor, the output of the servo motor is fixedly installed with rotating block passing through moving seat, the one side of the rotating block is movably installed with extrusion ring, the middle part of the base is fixedly installed with conveying belt, conveying belt is used to the conveying of semiconductor parts, the position of the lower side of the conveying belt is installed with jacking frame, the top of jacking frame is fixedly installed with positioning clamping block, and positioning clamping block is used to the jacking of semiconductor parts.

[0007] As a further preferred of the technical solution, the two ends of the base are symmetrically fixedly installed with limiting rods, the moving seat is provided with limiting holes corresponding to the positions of the limiting rods, the limiting holes are in sliding connection with the limiting rods, the bottom end of the moving seat is rotatably installed with connecting rods through shaft pins, a moving block is rotatably installed between the ends of the two connecting rods away from the moving seat, the upper surface of the base is fixedly installed with a first hydraulic rod corresponding to the position of the moving block, and the moving end of the first hydraulic rod is fixedly connected with the middle part of the moving block.

[0008] As a further preferred of the technical solution, the one side of the extrusion ring is fixedly installed with movable rods in an annular array mode with the central axis of the extrusion ring as the shaft, the middle part of the rotating block is provided with movable holes corresponding to the positions of the movable rods, the movable holes are in sliding connection with the movable rods, the outer side of the one end of the movable rod close to the extrusion ring is sleeved with a pressure relief spring, one end of the pressure relief spring is fixedly connected with the extrusion ring, and the other end of the pressure relief spring is fixedly connected with the rotating block.

[0009] As a further preferred of the technical solution, the one end of the extrusion ring away from the movable rod is fixedly installed with a rubber pad.

[0010] As a further preferred of the technical solution, the bottom end of the base is fixedly installed with a second hydraulic rod in the middle part, and the output end of the second hydraulic rod is fixedly connected with the jacking frame through the base.

[0011] As a further preferred of the technical solution, the top end of the positioning clamping block is in a shape suitable for the shapes of different semiconductor parts, and the positioning clamping block is replaceable.

[0012] The utility model provides a kind of turnover device for semiconductor parts processing, with the following beneficial effects:

[0013] (1) the utility model discloses a semiconductor part is lifted to between two extrusion rings, and the extrusion of two extrusion rings to semiconductor part can effectively fix different shapes of semiconductor parts.

[0014] (2) the utility model discloses that semiconductor part is continuously conveyed by conveying belt, by controlling jacking frame to rise, semiconductor part is lifted to between two extrusion rings, by controlling moving seat to slide close, for the clamping and fixing of extrusion ring to semiconductor part, after processing, by controlling jacking frame to rise, semiconductor part is placed on positioning clamping block after controlling moving seat to move away, and jacking frame is lowered, semiconductor part is placed on conveying belt, for the blanking of semiconductor part, it is convenient to continuously feed and discharge when semiconductor part is processed. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the whole structure schematic diagram of the utility model;

[0016] Figure 2 The whole explosion structure diagram of the utility model;

[0017] Figure 3 The local explosion structure diagram of the utility model;

[0018] Figure 4 The Figure 3 The enlarged view of A in the middle;

[0019] In the figure: 1, base; 2, moving seat; 3, servo motor; 4, rotating block; 5, extrusion ring; 6, conveying belt; 7, jacking frame; 8, positioning clamp block; 9, limiting rod; 10, limiting hole; 11, connecting rod; 12, moving block; 13, first hydraulic rod; 14, movable rod; 15, movable hole; 16, pressure relief spring; 17, rubber pad; 18, second hydraulic rod. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model.

[0021] The utility model provides technical schemes: as Figures 1 to 4 The utility model discloses a turnover device for semiconductor parts machining, which comprises a base 1, moving seats 2 are symmetrically and slidably installed at both ends of the base 1, servo motors 3 are fixedly installed at the top side of the moving seats 2, rotating blocks 4 are fixedly installed at the output ends of the servo motors 3 and pass through the moving seats 2, extrusion rings 5 are movably installed at one side of the rotating blocks 4, conveying belts 6 are fixedly installed at the middle part of the base 1 and are used for conveying semiconductor parts, jacking frames 7 are installed at the position below the conveying belts 6, positioning clamp blocks 8 are fixedly installed at the top of the jacking frames 7 and are used for jacking semiconductor parts, the conveying belts 6 are used for continuously conveying semiconductor parts, the jacking frames 7 are controlled to ascend, so that the semiconductor parts are lifted to the space between the two extrusion rings 5, the extrusion of the two extrusion rings 5 on the semiconductor parts can effectively fix semiconductor parts of different shapes, the moving seats 2 are controlled to slide and approach, so that the extrusion rings 5 clamp and fix the semiconductor parts, after machining, the jacking frames 7 are controlled to ascend, then the moving seats 2 are controlled to move away, the semiconductor parts are placed on the positioning clamp blocks 8, then the jacking frames 7 are controlled to descend, and the semiconductor parts are placed on the conveying belts 6, so as to unload the semiconductor parts, and the uninterrupted unloading during the machining of the semiconductor parts is facilitated.

[0022] As Figures 1 to 4As shown, the two ends of the base 1 are symmetrically fixedly installed with limit rods 9, the moving seat 2 is provided with limit holes 10 corresponding to the positions of the limit rods 9, the limit holes 10 are in sliding connection with the limit rods 9, the bottom end of the moving seat 2 is rotatably installed with connecting rods 11 through shaft pins, the moving blocks 12 are rotatably installed between the ends of the two connecting rods 11 away from the moving seat 2, the upper surface of the base 1 is fixedly installed with first hydraulic rods 13 corresponding to the positions of the moving blocks 12, and the moving end of the first hydraulic rod 13 is fixedly connected with the middle part of the moving block 12.

[0023] The moving block 12 is driven to move by the first hydraulic rod 13, and the moving seat 2 is driven to slide along the two limit rods 9 and approach by the connection of the connecting rod 11 to the moving block 12 and the moving seat 2, so that the clamping and fixing of the semiconductor components by the extrusion ring 5 can be conveniently controlled.

[0024] As shown in the figure, Figures 1 to 4 The extrusion ring 5 is fixedly installed with movable rods 14 in an annular array on one side of the extrusion ring 5 with the central axis of the extrusion ring 5 as the shaft, the middle part of the rotating block 4 is provided with movable holes 15 corresponding to the positions of the movable rods 14, the movable holes 15 are in sliding connection with the movable rods 14, the outer side of the end of the movable rod 14 close to the extrusion ring 5 is sleeved with a pressure relief spring 16, one end of the pressure relief spring 16 is fixedly connected with the extrusion ring 5, and the other end of the pressure relief spring 16 is fixedly connected with the rotating block 4.

[0025] When the moving seat 2 drives the extrusion ring 5 to clamp and fix the semiconductor components, the movable rod 14 installed on the extrusion ring 5 will slide inside the movable hole 15, and the setting of the pressure relief spring 16 ensures that the extrusion ring 5 extrudes the semiconductor components while preventing the semiconductor components from being excessively extruded and fixed by the movement of the extrusion ring 5.

[0026] As shown in the figure, Figures 1 to 4 The end of the extrusion ring 5 away from the movable rod 14 is fixedly installed with a rubber pad 17.

[0027] The rubber pad 17 is used to protect the semiconductor components extruded between the two extrusion rings 5, preventing extrusion wear between the extrusion ring 5 and the semiconductor components.

[0028] As shown in the figure, Figures 1 to 4 The bottom end of the base 1 is fixedly installed with a second hydraulic rod 18 in the middle part, and the output end of the second hydraulic rod 18 is fixedly connected with the jacking frame 7 through the base 1.

[0029] The jacking frame 7 can be raised and lowered by the second hydraulic rod 18, which is used for feeding and discharging the semiconductor components.

[0030] As shown in the figure, Figures 1 to 4 The top end of the positioning clamping block 8 is shaped to adapt to the shape of different semiconductor components, and the positioning clamping block 8 can be replaced.

[0031] Different positioning blocks 8 can be selected to stably store different semiconductor components on the top of the positioning blocks 8, and the stability of lifting the semiconductor components is improved.

[0032] The utility model provides a kind of turnover device for semiconductor component processing, and specific working principle is as follows:

[0033] When the device is used, the semiconductor components are conveyed to the position corresponding to the extrusion ring 5 in the middle of the conveying belt 6, the second hydraulic rod 18 drives the jacking frame 7 to rise, at the same time, the semiconductor components will be clamped on the top of the positioning block 8, which will drive the semiconductor components to be lifted between the two extrusion rings 5, the first hydraulic rod 13 drives the moving block 12 to move, the connection of the connecting rod 11 to the moving block 12 and the moving seat 2 will drive the moving seat 2 to slide close along the two limit rods 9, for the clamping and fixing of the semiconductor components by the extrusion ring 5, and then the second hydraulic rod 18 drives the jacking frame 7 to descend;

[0034] When the moving seat 2 moves to clamp and fix the semiconductor components by the extrusion ring 5, the movable rod 14 installed on the extrusion ring 5 will slide inside the movable hole 15, and the setting of the decompression spring 16 ensures that the extrusion ring 5 extrudes the semiconductor components while preventing the semiconductor components from being excessively extruded and fixed by the movement of the extrusion ring 5;

[0035] The two servo motors 3 drive the rotating block 4 to rotate, which in turn drives the extrusion ring 5 to rotate, thereby controlling the turnover of the semiconductor components;

[0036] After processing is completed, the second hydraulic rod 18 drives the jacking frame 7 to rise, the first hydraulic rod 13 drives the moving block 12 to move reversely, which in turn drives the moving seat 2 to slide away along the two limit rods 9, and the semiconductor components are placed on the positioning block 8, and then the jacking frame 7 is controlled to descend, placing the semiconductor components on the conveying belt 6, for discharging the semiconductor components.

[0037] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A flipping device for processing semiconductor components, characterized in that: The device includes a base (1), with movable seats (2) symmetrically slidably mounted at both ends of the base (1). A servo motor (3) is fixedly mounted on one side of the top of the movable seat (2). A rotating block (4) is fixedly mounted through the output end of the servo motor (3) through the movable seat (2). A compression ring (5) is movably mounted on one side of the rotating block (4). A conveyor belt (6) is fixedly mounted in the middle of the base (1). The conveyor belt (6) is used to transport semiconductor components. A lifting frame (7) is installed below the conveyor belt (6). A positioning block (8) is fixedly mounted on the top of the lifting frame (7). The positioning block (8) is used to lift the semiconductor components.

2. The flipping device for semiconductor component processing according to claim 1, characterized in that: Limiting rods (9) are symmetrically fixedly installed at both ends of the base (1). The movable seat (2) has a limiting hole (10) at the position corresponding to the limiting rod (9). The limiting hole (10) is slidably connected to the limiting rod (9). A connecting rod (11) is rotatably installed at the bottom end of the movable seat (2) through a shaft pin. A movable block (12) is rotatably installed between the ends of the two connecting rods (11) away from the movable seat (2). A first hydraulic rod (13) is fixedly installed on the upper surface of the base (1) at the position corresponding to the movable block (12). The movable end of the first hydraulic rod (13) is fixedly connected to the middle part of the movable block (12).

3. The flipping device for semiconductor component processing according to claim 1, characterized in that: On one side of the extrusion ring (5), movable rods (14) are fixedly installed in a ring array with the central axis of the extrusion ring (5) as the axis. The middle part of the rotating block (4) is provided with a movable hole (15) corresponding to the position of the movable rod (14). The movable hole (15) is slidably connected to the movable rod (14). A pressure-reducing spring (16) is sleeved on the outer side of the end of the movable rod (14) near the extrusion ring (5). One end of the pressure-reducing spring (16) is fixedly connected to the extrusion ring (5), and the other end of the pressure-reducing spring (16) is fixedly connected to the rotating block (4).

4. The flipping device for semiconductor component processing according to claim 3, characterized in that: A rubber pad (17) is fixedly installed at the end of the compression ring (5) away from the movable rod (14).

5. A flipping device for semiconductor component processing according to claim 2, characterized in that: A second hydraulic rod (18) is fixedly installed at the bottom center of the base (1), and the output end of the second hydraulic rod (18) passes through the base (1) and is fixedly connected to the lifting frame (7).

6. The flipping device for semiconductor component processing according to claim 1, characterized in that: The top shape of the positioning block (8) is adapted to the shape of different semiconductor components, and the positioning block (8) is replaceable.

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