LED packaging die blanking device
By designing a negative pressure adsorption and cylinder-driven material handling mechanism, the problem of inconvenient manual picking after LED packaging mold demolding was solved, realizing automated workpiece picking and placing, reducing workload and product contamination, and improving demolding efficiency.
Patent Information
- Application Number
- CN202423201429.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing LED packaging molds require manual picking up and placing each piece into a tray after demolding, resulting in a large workload and easy contamination of the products, especially for small products where operation is inconvenient.
An LED packaging mold unloading device was designed, which adopts a negative pressure adsorption and cylinder-driven material handling mechanism to automatically place the demolded workpiece into the material tray, reducing manual operation and avoiding product contamination.
It achieves automated workpiece handling, reduces manual operation, avoids product contamination, and improves demolding efficiency and work efficiency.
Smart Images

Figure CN223575606U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to LED packaging technical field, concretely relates to a LED packaging mould blanking device. BACKGROUND
[0002] LED packaging is a key link in LED industry chain, needs to carry out mould pressing packaging after point gum, fills glue and seals. In mould pressing procedure, in order to make the packaging piece better and die, usually by manual operation before mould pressing and sprays release agent on the mould surface, frequently sprays release agent not only increases workload, and cannot control the spraying amount and uniformity of release agent, brings a lot of inconvenience for mould pressing packaging work.
[0003] Therefore, part of the existing LED packaging mould has a demolding mechanism, improves the demolding efficiency and saves the labor cost. For example, the utility model patent with the authorized announcement No. CN217617287U discloses an easy-to-disassemble LED packaging mold, which sprays air into the airflow channel to use the impact force of the airflow to disassemble the workpiece. For example, the utility model patent with the authorized announcement No. CN208093587U discloses an LED silica gel chip packaging mold, which uses a spring-driven push rod to eject the LED chip processed in the groove, improving the mold efficiency. However, the above-mentioned patents still have certain functional defects in actual application. Although they realize automatic demolding, the demolded workpieces need to be manually picked up one by one and then placed in the material supporting tray one by one. The process is complicated, which can easily contaminate the surface of the workpiece, and the operation is particularly inconvenient for small products. Therefore, it is urgent to provide an LED packaging mold blanking device to replace manual picking up of demolded workpieces and placing them in the material supporting tray one by one, reduce the workload of workers, and avoid product contamination. UTILITY MODEL CONTENTS
[0004] The utility model provides a LED packaging mould blanking device to replace manual picking up of demolded workpieces and placing them in the material supporting tray one by one, reduce the workload of workers, and avoid product contamination.
[0005] To achieve the above-mentioned purpose, the utility model technical solution is as follows:
[0006] The utility model provides a kind of LED packaging mould blanking device, it is characterized by: including substrate, the upper end of the substrate is sequentially provided with mould pressing mechanism for realizing mould pressing package, pick-up mechanism for picking up package after demoulding along its length direction, material supporting tray for storing package, the pick-up mechanism includes movable frame, lifting cylinder, vacuum pump, negative pressure main pipe and multiple negative pressure branch pipes, the movable frame is horizontally slidably connected along the length direction of substrate, the lifting cylinder is arranged on the upper end of movable frame, and its lower end is connected with negative pressure main pipe, the lower end of negative pressure main pipe is connected with multiple negative pressure branch pipes, the lower end of each negative pressure branch pipe is connected with suction cup, and negative pressure main pipe is connected with vacuum pump, and the material supporting tray is provided with multiple groups of containing units for containing package sequentially distributed along the length direction of substrate, each group of the containing unit includes multiple containing grooves sequentially distributed along the width direction of substrate, and the number and position of containing groove in each group of containing unit are one-to-one corresponding with the number and position of negative pressure branch pipe.
[0007] Preferably, the negative pressure main pipe includes a negative pressure hose and a negative pressure hard pipe, the upper end of the negative pressure hard pipe is connected with the lifting cylinder, the lower end is connected with multiple negative pressure branch pipes, one end of the negative pressure hose is connected with the negative pressure hard pipe, the other end is connected with the vacuum pump, and an electric valve is provided on the negative pressure hose.
[0008] Preferably, two L-shaped positioning strips are provided on the substrate, and the material supporting tray is located between the two L-shaped positioning strips.
[0009] Preferably, a travel switch is provided on the movable frame, a first stop block is provided on the mould pressing mechanism and cooperates with the travel switch, a plurality of second stop blocks are provided on one of the L-shaped positioning strips and cooperates with the travel switch, and the second stop blocks are sequentially arranged on one side of each group of containing units.
[0010] Preferably, two slide bars are connected to the lower end of the movable frame, the two slide bars are slidably connected with slide grooves provided on both sides of the substrate, a cross bar is connected between the two slide bars, a translation cylinder is provided on the side of the substrate away from the mould pressing mechanism, and the translation cylinder is connected with the cross bar.
[0011] Preferably, the mould pressing mechanism includes a fixed frame, an upper die, a lower die and a pressing die cylinder, the pressing die cylinder is installed on the fixed frame, the lower end of the pressing die cylinder is connected with the upper die, the lower die is located directly below the upper die, and a plurality of positioning grooves are provided on the upper end surface of the lower die.
[0012] Preferably, a clamping groove is formed in the bottom wall of the positioning groove, a demoulding top plate is arranged in the clamping groove, a top rod is connected to the lower end of the demoulding top plate, the top rod is slidably connected with a jacking hole provided at the lower end of the clamping groove, and the top rod is connected with a demoulding cylinder provided below the lower die.
[0013] Preferably, a mounting groove is provided on the substrate, and the demoulding cylinder is embedded in the mounting groove.
[0014] Preferably, a guide rod is connected to the upper end of the upper die, and the guide rod is slidably connected with a guide hole arranged on the fixing frame.
[0015] Preferably, two fixing blocks are arranged on the two sides of the lower die, a fixing hole is arranged on each of the fixing blocks, a fixing rod is arranged on the base plate, the fixing rod penetrates through the fixing hole and is threadedly connected with a fixing nut.
[0016] Compared with the prior art, the utility model has the beneficial effects as follows:
[0017] (1) The utility model discloses a horizontal sliding of the movable frame on the base plate is driven by the translation air cylinder, and the LED packaging piece is adsorbed and taken by the suction cup under negative pressure, so that the workpiece after demolding is picked up one by one by artificial, and is sequentially placed into the containing groove of the material supporting tray, so that the work amount of the staff is reduced, the staff does not need to contact the product, and the pollution of the surface of the LED product is avoided.
[0018] (2) The utility model discloses that the demolding cylinder drives the ejector rod and the demolding top plate to move upwards, and the packaging piece is lifted upwards to realize automatic demolding, so that the LED die pressing packaging efficiency is improved, the practicality is strong, and the utility model is suitable for promotion. BRIEF DESCRIPTION OF DRAWINGS
[0019] Other characteristics, objects and advantages of the utility model will become more apparent through reading the following detailed description of the non-restrictive embodiments with reference to the accompanying drawings.
[0020] Figure 1 It is a structural schematic diagram of the utility model;
[0021] Figure 2 It is a structural schematic diagram of the die pressing mechanism of the utility model;
[0022] Figure 3 It is a structural schematic diagram of the utility model Figure 2 It is an enlarged structural schematic diagram of A in the utility model;
[0023] Figure 4 It is a structural schematic diagram of the L-shaped positioning strip and the material supporting tray of the utility model;
[0024] In the figure: 1, base plate, 2, moulding mechanism, 201, fixed frame, 202, upper die, 203, lower die, 204, moulding cylinder, 205, positioning groove, 206, clamping groove, 207, demoulding top plate, 208, ejector pin, 209, ejector hole, 2010, demoulding cylinder, 2011, guide rod, 2012, guide hole, 3, material taking mechanism, 301, movable frame, 302, lifting cylinder, 303, vacuum pump, 304, negative pressure hose, 305, negative pressure hard pipe, 306, negative pressure branch pipe, 307, suction cup, 308, electric valve, 4, material supporting disc, 401, accommodating groove, 5, L-shaped positioning strip, 6, travel switch, 7, first stop block, 8, second stop block, 9, sliding strip, 10, sliding groove, 11, cross rod, 12, translation cylinder, 13, mounting groove, 14, fixed block, 15, fixed hole, 16, fixed rod, 17, fixed nut, 18, controller. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.
[0026] In the description of the present application, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0027] In the present application, unless otherwise explicitly specified and limited, the terms "provision", "installation", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected; it can be mechanically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.
[0028] As Figure 1As shown, an LED packaging mold unloading device includes a substrate 1. The upper end of the substrate is provided with a molding mechanism 2 for molding and packaging, a picking mechanism 3 for picking up the packaged parts after demolding, and a tray 4 for storing the packaged parts. The picking mechanism uses negative pressure to vacuum adsorb the molded workpiece, moves it to the top of the tray, and then puts it into the tray. The material handling mechanism includes a movable frame 301, a lifting cylinder 302, a vacuum pump 303, a negative pressure main pipe, and multiple negative pressure branch pipes 306. The movable frame is horizontally slidable along the length of the substrate. The lifting cylinder is located at the upper end of the movable frame, and its lower end is connected to the negative pressure main pipe. Multiple negative pressure branch pipes are connected to the lower end of the negative pressure main pipe, and each negative pressure branch pipe is connected to a suction cup 307 at its lower end. The negative pressure main pipe is connected to the vacuum pump. The negative pressure main pipe includes a negative pressure flexible tube 304 and a negative pressure rigid tube 305. The upper end of the negative pressure rigid tube is connected to the lifting cylinder, and the lower end is connected to multiple negative pressure branch pipes. One end of the negative pressure flexible tube is connected to the negative pressure rigid tube, and the other end is connected to the vacuum pump. An electric valve 308 is provided on the negative pressure flexible tube. The vacuum pump evacuates the negative pressure main pipe, creating a vacuum in the negative pressure main pipe, negative pressure branch pipes, and suction cups. The suction cups adhere to the surface of the workpiece for adsorption. The vacuum level in the negative pressure main pipe is controlled by the electric valve. Vacuum adsorption is existing technology and will not be described further. Figure 4 As shown, the substrate has two L-shaped positioning strips 5, and the material tray is located between the two L-shaped positioning strips to achieve fast and accurate positioning of the material tray. The material tray has multiple sets of receiving units for accommodating the packaged parts, which are arranged sequentially along the length of the substrate. Each set of receiving units includes multiple receiving slots 401 arranged sequentially along the width of the substrate. The number and position of the receiving slots in each set of receiving units correspond one-to-one with the number and position of the negative pressure branch pipes. Sliding strips 9 are connected to the lower ends of the movable frame on both sides. The two sliding strips are slidably connected to the sliding grooves 10 on both sides of the substrate. A crossbar 11 is connected between the two sliding strips. A translation cylinder 12 is provided on the side of the substrate away from the molding mechanism. The translation cylinder is connected to the crossbar. The translation cylinder drives the crossbar to move horizontally, thereby driving the sliding strips and the movable frame to slide horizontally. The picking mechanism places the adsorbed workpieces sequentially into the receiving slots along the length of the material tray.
[0029] like Figure 1 and Figure 2 As shown, the molding mechanism includes a fixed frame 201, an upper mold 202, a lower mold 203, and a molding cylinder 204. The molding cylinder is mounted on the fixed frame, and its lower end is connected to the upper mold. A guide rod 2011 is connected to the upper end of the upper mold. The guide rod is slidably connected to a guide hole 2012 on the fixed frame to ensure the stability of the upper mold's lifting movement. The lower mold is located directly below the upper mold. The upper surface of the lower mold has multiple positioning grooves 205. Multiple encapsulated parts to be molded are placed sequentially into the multiple positioning grooves. The molding cylinder drives the upper mold to descend and engage with the lower mold to complete the molding process. Figure 3As shown, the bottom wall of the positioning groove is provided with a clamping groove 206, a demolding top plate 207 is arranged in the clamping groove, a top rod 208 is connected to the lower end of the demolding top plate, the top rod is slidably connected with a jacking hole 209 arranged at the lower end of the clamping groove, and is connected with a demolding cylinder 2010 arranged below the lower mold; after the compression mold is completed, the output shaft of the demolding cylinder is elongated upward, so as to drive the top rod and the demolding top plate to move upward, thereby realizing the demolding treatment of the workpiece; the base plate is provided with a mounting groove 13, and the demolding cylinder is embedded in the mounting groove, so that the demolding cylinder is convenient to install and saves the occupied space.
[0030] As shown in Figures 1 to 3 The movable frame is provided with a travel switch 6, and the mold pressing mechanism is provided with a first stop block 7 matched with the travel switch; a plurality of second stop blocks 8 matched with the travel switch are arranged on one of the L-shaped positioning strips, and the plurality of second stop blocks are arranged on one side of each group of containing units in sequence, so that the position of the movable frame can be accurately controlled, the material taking and placing operations can be realized, and the work efficiency is improved.
[0031] The positioning groove, the negative pressure branch pipe and the suction disc on the lower mold, and the containing groove of each group of containing units are one-to-one corresponding in position and quantity, so that the material taking mechanism can realize batch material taking and placing operations. In the embodiment, the number of each is two, which is only exemplary.
[0032] The working principle of the utility model is as follows:
[0033] As shown in Figures 1 to 4As shown, in use, the workpiece to be molded packaging is placed in the positioning groove 205 on the upper end of the lower die 203, the mold cylinder 204 drives the upper die 202 to descend and cooperate with the lower die 203 to realize the molding packaging operation, after the molding is completed, the upper die 202 is raised to restore to the original position, the demolding cylinder 2010 works, drives the demolding top plate 207 to move upward with the ejector rod 208, the packaging piece is lifted from the positioning groove 205 and separated from the positioning groove 205, then the translation cylinder 12 works to drive the cross bar 11 to move to the side close to the base plate 1, the cross bar 11 drives the movable frame 301 to move to the molding mechanism through the sliding bar 9, when the travel switch 6 reaches the position of the first stop block 7, the signal is fed back to the controller 18, the controller 18 controls the movable frame 301 to stop moving by using the translation cylinder 12, the lifting cylinder 302 and the vacuum pump 303 work, the electric valve 308 is opened, the suction cup 307 moves downward and adsorbs the corresponding packaging piece, then the translation cylinder 12 drives the movable frame 301 to move to the side of the material supporting disc 4, when the travel switch 6 reaches the position of the specified second stop block 8, the signal is fed back to the controller 18, the controller 18 controls the movable frame 301 to stop moving by using the translation cylinder 12, the electric valve 308 is closed, the vacuum in the negative pressure main pipe, the negative pressure branch pipe 306 and the suction cup 307 disappears, the packaging piece falls into the corresponding accommodating groove 401, and the material placing work is completed; then by analogy, until the multiple groups of accommodating units on the material supporting disc 4 are filled, then the worker replaces the new material supporting disc 4.
[0034] The basic principle and main features of the utility model and the advantages of the utility model are shown and described above, for those skilled in the art, obviously, the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be realized in other specific forms without departing from the spirit or basic features of the utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the utility model is defined by the appended claims rather than the above description, therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model.
Claims
1. An LED packaging mold feeding device, characterized in that: The system includes a substrate. Along its length, the upper end of the substrate is sequentially provided with a molding mechanism for compression molding, a material-picking mechanism for picking up the packaged components after demolding, and a material tray for storing the packaged components. The material-picking mechanism includes a movable frame, a lifting cylinder, a vacuum pump, a negative pressure main pipe, and multiple negative pressure branch pipes. The movable frame is horizontally slidably connected along the length of the substrate. The lifting cylinder is located at the upper end of the movable frame, and its lower end is connected to the negative pressure main pipe. Multiple negative pressure branch pipes are connected to the lower end of the negative pressure main pipe, and each negative pressure branch pipe is connected to a suction cup at its lower end. The negative pressure main pipe is connected to the vacuum pump. The material tray is provided with multiple sets of receiving units for accommodating the packaged components, sequentially distributed along the length of the substrate. Each set of receiving units includes multiple receiving slots sequentially distributed along the width of the substrate. The number and position of the receiving slots in each set of receiving units correspond one-to-one with the number and position of the negative pressure branch pipes.
2. The LED packaging mold feeding device as described in claim 1, characterized in that: The negative pressure main pipe includes a negative pressure hose and a negative pressure rigid pipe. The upper end of the negative pressure rigid pipe is connected to a lifting cylinder, and the lower end is connected to multiple negative pressure branch pipes. One end of the negative pressure hose is connected to the negative pressure rigid pipe, and the other end is connected to a vacuum pump. An electric valve is provided on the negative pressure hose.
3. The LED packaging mold feeding device as described in claim 1, characterized in that: The substrate is provided with two L-shaped positioning strips, and the material tray is located between the two L-shaped positioning strips.
4. The LED packaging mold feeding device as described in claim 3, characterized in that: The movable frame is equipped with a limit switch, and the molding mechanism is equipped with a first stop block that cooperates with the limit switch. One of the L-shaped positioning bars is equipped with multiple second stop blocks that cooperate with the limit switch. The multiple second stop blocks are arranged one by one on one side of each set of accommodating units.
5. The LED packaging mold feeding device as described in claim 1, characterized in that: The lower ends of the movable frame are connected to sliding bars on both sides respectively. The two sliding bars are slidably connected to the sliding grooves on both sides of the substrate. A crossbar is connected between the two sliding bars. A translation cylinder is provided on the side of the substrate away from the molding mechanism. The translation cylinder is connected to the crossbar.
6. The LED packaging mold feeding device as described in claim 1, characterized in that: The molding mechanism includes a fixed frame, an upper mold, a lower mold, and a molding cylinder. The molding cylinder is mounted on the fixed frame and its lower end is connected to the upper mold. The lower mold is located directly below the upper mold, and the upper surface of the lower mold is provided with multiple positioning grooves.
7. The LED packaging mold feeding device as described in claim 6, characterized in that: A slot is provided on the bottom wall of the positioning groove, and a demolding top plate is provided in the slot. A push rod is connected to the lower end of the demolding top plate. The push rod is slidably connected to the lifting hole located at the lower end of the slot and is connected to the demolding cylinder located below the lower mold.
8. The LED packaging mold feeding device as described in claim 7, characterized in that: The substrate is provided with a mounting groove, and the demolding cylinder is embedded in the mounting groove.
9. The LED packaging mold feeding device as described in claim 6, characterized in that: The upper end of the upper mold is connected to a guide rod, which is slidably connected to a guide hole provided on the fixed frame.
10. The LED packaging mold feeding device as described in claim 6, characterized in that: The lower mold has fixing blocks on both sides, each fixing block has a fixing hole, and the base plate has a fixing rod, which passes through the fixing hole and is threaded with a fixing nut.
Citation Information
Patent Citations
LED silica gel chip package mould
CN208093587U
LED packaging mold easy to disassemble and assemble
CN217617287U