Activation tank of horizontal plating line
By designing the water jet outlet below the chemical solution surface in the activation tank of a horizontal electroplating line, and combining this with chemical solution control measures, the problem of foam affecting the electroplating process was solved, resulting in higher quality electroplating effects.
Patent Information
- Application Number
- CN202422836432.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-11-20
AI Technical Summary
In the activation tank of a horizontal electroplating line, foam introduced by the prepreg during production affects the production environment and product quality, leading to a decline in the quality and reliability of the encapsulated substrate.
Design an activation tank for a horizontal electroplating line, with the water jet outlet located below the chemical solution surface. Combine chemical solution replenishment and discharge control, and maintain a constant chemical solution level through overflow holes to reduce foam generation.
It effectively reduces foam generation, ensures the quality of subsequent electroplating, and improves the quality and reliability of the packaging substrate.
Smart Images
Figure CN223576626U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electroplating equipment technical field, concretely relates to a horizontal type electroplating line's activation groove. BACKGROUND
[0002] The packaging substrate (also called IC carrier plate) is the core material in the chip packaging link, has the characteristics such as high density, high precision, high performance, miniaturization and thin type, and is commonly used with wafer, lead wire etc. after packaging test to form a chip. The packaging substrate not only provides support, heat dissipation and protection for the chip, but also provides electronic connection between the chip and the PCB, plays the role of " connecting upper and lower", and can even be embedded into passive and active devices to realize certain system functions. In the production process of the packaging substrate, the copper layer in the circuit needs to be made by electroplating line, and electroplating mainly includes vertical electroplating line and horizontal electroplating line. In the process of horizontal electroplating production, the pre-dip agent is brought into the activation groove with the product, and the pre-dip agent composition in the activation groove is impacted by the water jet, so that a large amount of foam is generated in the activation groove. The foam itself and the impurities wrapped in it affect the production process environmental control requirements and the product through-hole electroplating copper effect, and further affect the quality and reliability of the packaging substrate. Therefore, there is an urgent need for an activation groove of horizontal electroplating line capable of reducing the generation of foam. SUMMARY
[0003] The utility model aims at at least one of the technical problems in the above-mentioned technology. To this end, the utility model provides an activation groove of horizontal electroplating line, which has a simple structure and can effectively reduce the generation of foam, thereby ensuring the quality of subsequent electroplating.
[0004] To achieve the above-mentioned purpose, the utility model provides an activation groove of horizontal electroplating line, which comprises a groove body, a water jet and a conveying line arranged in the groove body.
[0005] The conveying line is suitable for conveying the substrate.
[0006] The water jet is arranged above the substrate, and the water outlet of the water jet is located below the liquid level of the chemical liquid in the groove body to cut and punch the substrate.
[0007] According to the activation groove of horizontal electroplating line provided by the utility model, the water outlet of the water jet is located below the liquid level to cut and punch the substrate, which can avoid the mixing of air into the chemical liquid, reduce the impact of the water jet on the chemical liquid during operation, and reduce the generation of foam, thereby ensuring the quality of subsequent substrate electroplating.
[0008] In addition, the activation groove of horizontal electroplating line provided by the above-mentioned embodiment of the utility model can also have the following additional technical features:
[0009] Optionally, the liquid medicine supply member and the liquid medicine discharge member are further included, and the discharge amount of the liquid medicine discharge member is not greater than the supply amount of the liquid medicine supply member, so that the water outlet of the water jet is kept below the liquid level of the liquid medicine in the tank.
[0010] Further, the tank is provided with an overflow hole above the plane where the water outlet of the water jet is located, so that the liquid level of the liquid medicine in the tank is kept at a constant height.
[0011] Further, the liquid medicine discharge member is a liquid leakage hole arranged at the bottom of the tank.
[0012] Optionally, the height difference between the liquid level of the liquid medicine and the water outlet of the water jet is 20-50 mm. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 FIG. 1 is a structural schematic view of an activation tank of a horizontal type electroplating line according to an embodiment of the present application;
[0014] Figure 2 FIG. 2 is a sectional view along A-A of the activation tank of the horizontal type electroplating line according to the embodiment of the present application; Figure 1
[0015] BRIEF DESCRIPTION OF DRAWINGS
[0016] Tank 1, water jet 2, conveying line 3, substrate 4, liquid medicine supply member 5, liquid medicine discharge member 6, overflow hole 7. DETAILED DESCRIPTION
[0017] The embodiments of the present application will be described in detail below with reference to the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application, and should not be understood as limiting the present application.
[0018] In order to better understand the above technical solutions, the exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.
[0019] In order to better understand the above technical solutions, the above technical solutions will be described in more detail below with reference to the drawings and specific embodiments.
[0020] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: Figures 1-2 The application discloses a horizontal type electroplating line activation tank.
[0021] The horizontal type electroplating line activation tank comprises a tank body 1, a water cutter 2 and a conveying line 3 arranged in the tank body 1.
[0022] Specifically, the conveying line 3 is suitable for conveying a substrate 4; the water cutter 2 is arranged above the substrate 4, and a water outlet of the water cutter 2 is below a liquid level of a chemical liquid in the tank body 1, so as to cut and punch the substrate 4.
[0023] That is to say, the water outlet of the water cutter 2 is above the liquid level of the chemical liquid, air is mixed in the water cutter 2 during spraying, and the liquid level of the chemical liquid is impacted, so that foam is easily generated; by arranging the water outlet of the water cutter 2 below the liquid level of the chemical liquid, air can be prevented from being mixed in the chemical liquid, and the impact of the water cutter 2 on the chemical liquid during working can be reduced, so that the generation of foam is reduced, and the quality of subsequent electroplating of the substrate 4 is ensured.
[0024] Therefore, by cutting and punching the substrate 4 through the water outlet of the water cutter 2 below the liquid level, air can be prevented from being mixed in the chemical liquid, and the impact of the water cutter 2 on the chemical liquid during working can be reduced, so that the generation of foam is reduced, and the quality of subsequent electroplating of the substrate 4 is ensured.
[0025] Optionally, the horizontal type electroplating line activation tank further comprises a chemical liquid supplementing part 5 and a chemical liquid discharging part 6; a discharging amount of the chemical liquid discharging part 6 is not greater than a supplementing amount of the chemical liquid supplementing part 5, so as to keep the water outlet of the water cutter 2 below the liquid level of the chemical liquid in the tank body 1.
[0026] Further, the tank body 1 is provided with overflow holes 7 above a plane where the water outlet of the water cutter 2 is located, so as to keep the liquid level of the chemical liquid in the tank body 1 at a constant height.
[0027] Further, the medicine liquid discharging member 6 is a leakage hole, which is arranged at the bottom of the groove body 1. It can be understood that, by arranging the leakage hole, the medicine liquid in the groove body 1 can be conveniently discharged, and the leakage hole can be machined together when machining the groove body 1, which is simple in structure and low in machining cost. The number of the leakage holes can be 12, which are arranged in groups of three at the bottom of the groove body 1.
[0028] Alternatively, the height difference between the liquid level of the medicine liquid and the water outlet of the water jet is 20mm-50mm. It can be understood that, by the above arrangement, the water jet 2 can work below the liquid level of the medicine liquid, and at the same time, the water jet 2 can have sufficient impact force to cut and punch the substrate 4. The height difference between the liquid level of the medicine liquid and the water outlet of the water jet 2 can be 40mm.
[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0030] In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "several" is two or more, unless otherwise specifically limited.
[0031] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0032] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can include the first and second features directly contacting, or the first and second features not directly contacting but contacting through another feature between them. Moreover, the first feature "on", "above" and "on the surface" of the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0033] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or several embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present application.
[0034] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can change, modify, replace and modify the above embodiments within the scope of the present application.
Claims
1. An activation tank for a horizontal electroplating line, characterized in that, Includes: the tank body, the water jet and the conveyor line installed inside the tank; The conveyor line is suitable for conveying substrates; The water jet is positioned above the substrate, and the outlet of the water jet is located below the liquid level of the medicine in the tank, so as to cut and punch holes in the substrate. It also includes a liquid supply component and a liquid discharge component, wherein the discharge amount of the liquid discharge component is not greater than the supply amount of the liquid supply component, so that the water jet outlet is kept below the liquid level of the liquid in the tank. The tank is provided with an overflow hole, which is located above the plane where the water jet outlet is located, so as to keep the liquid level of the medicine in the tank at a constant height.
2. The activation tank of the horizontal electroplating line as described in claim 1, characterized in that, The liquid discharge device is a leakage hole, which is located at the bottom of the tank.
3. The activation tank of the horizontal electroplating line as described in claim 1, characterized in that, The height difference between the liquid level of the medicine and the outlet of the water jet is 20mm to 50mm.