Semiconductor processing electroplating equipment

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to semiconductor processing electroplating equipment which comprises an electroplating box, a control panel is installed on the front surface of the electroplating box, a side frame is installed on the back face of the electroplating box, a fixing plate is fixedly connected to the lower surface of the side frame, and an installation block is arranged at the lower end of the fixing plate. A screw rod body is mounted on the left side of the mounting block; and the bottom block is installed at the lower end of the telescopic rod, and a connecting rod is installed on the lower surface of the bottom block. According to the device, semiconductors in the placing frame can be electroplated in the electroplating tank, after the electroplating operation is finished, the telescopic rod is started to drive the connecting rod to ascend, the placing frame is driven to move towards the interior of the washing tank for cleaning, and after cleaning is finished, the connecting rod is driven to ascend through the telescopic rod, so that the semiconductors are cleaned. And then the inserting columns are taken out from the second inserting holes, so that the placing frames can be taken down, and then the semiconductors in the placing frames are poured into the surface of the draining rack.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, concretely to a semiconductor processing electroplating equipment. BACKGROUND

[0002] Semiconductor electroplating is a process of plating a thin layer of other metal or alloy on the semiconductor lead by using electrolysis principle, which is a technology of attaching a metal film to the surface of the semiconductor lead by using electrolysis, so as to prevent the semiconductor lead from oxidizing (such as rusting), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (copper sulfate, etc.), and enhance the appearance, etc. When electroplating the semiconductor, a semiconductor electroplating device needs to be used.

[0003] To this end, Chinese application publication number CN221421263U discloses a semiconductor production and processing electroplating device, which includes an electroplating device shell, a water washing pool and an electroplating pool are arranged inside the electroplating device shell, three fans are fixedly connected inside the electroplating device shell, a dustproof assembly is fixedly connected to one side of the electroplating device shell, a moving assembly is arranged on one side of the electroplating device shell, and a clamping assembly is fixedly connected to one side of the moving assembly. The utility model has the advantages that the third motor drives the semiconductor to rotate in the clamping assembly, the water washing pool is used to clean the semiconductor, the dust and impurities on the surface of the semiconductor are prevented from affecting the electroplating effect, the work efficiency is improved, a dust screen is arranged on one side of the fan, the fan is prevented from blowing the impurities in the air onto the surface of the electroplated semiconductor, and the product quality is improved.

[0004] However, in actual use, the overall electroplating efficiency is slow when the semiconductor is electroplated, and there is still water on the surface of the water-washed semiconductor, which cannot be guided as a whole, so the overall operation process is relatively complicated. Therefore, it is urgent to improve and perfect the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a semiconductor processing electroplating equipment to solve the problem that the overall electroplating efficiency is slow when the semiconductor is electroplated, and there is still water on the surface of the water-washed semiconductor, which cannot be guided as a whole, so the overall operation process is relatively complicated.

[0006] In order to achieve the above object, the utility model provides the following technical scheme: a kind of semiconductor processing electroplating equipment, including electroplating box, the front surface of the electroplating box is equipped with control panel, the back of the electroplating box is equipped with side frame, the lower surface of the side frame is fixedly connected with fixed plate, the lower end of the fixed plate is provided with mounting block, the left side of the mounting block is equipped with screw rod body, the right side of the screw rod body is equipped with motor body in the inside of mounting block, the outer surface of the screw rod body is equipped with movable ring, the movable ring is slidably connected in the lower end inside of fixed plate, the lower end of the movable ring is equipped with telescopic rod;

[0007] Bottom block, the bottom block is installed at the lower end of telescopic rod, the lower surface of the bottom block is equipped with connecting rod, the outer surface of the connecting rod is equipped with first jack, the surface of the connecting rod is equipped with mounting cylinder.

[0008] Preferably, the front surface of the mounting cylinder is fixedly connected with placing frame, the right side surface of the mounting cylinder is equipped with second jack.

[0009] Preferably, the second jack and the first jack are mutually adapted, the mounting cylinder and the connecting rod are mutually adapted, and the second jack and the plug post are mutually adapted.

[0010] Preferably, the inside of the electroplating box is sequentially provided with electroplating bath and washing tank from left to right inside, and the right side surface of the electroplating box is sequentially fixedly connected with drain rack and guide plate from top to bottom.

[0011] Preferably, the front and rear ends of the electroplating box are both inserted and installed with water spray frame, and the front surface of the water spray frame is provided with connecting pipe.

[0012] Preferably, the front surface of the connecting pipe is provided with conveying hose, and the front end surface of the electroplating box is equipped with drain pipe.

[0013] Compared with the prior art, the utility model has the beneficial effects that:

[0014] 1. The semiconductor processing plating equipment, through the setting of the side frame, the fixed plate, the 05, the mounting block, the motor body, the screw body, the movable ring, the telescopic rod, the bottom block, the connecting rod, the first jack, the mounting cylinder, the second jack, the column and the placing frame, in use, first, the placing frame is placed above the plating bath, then the semiconductor to be plated is placed in the placing frame, then the telescopic rod is started, the bottom block and the connecting rod are driven to move downward by the telescopic rod, at this time, the connecting rod drives the placing frame to move to the inside of the plating bath, so that the semiconductor in the placing frame is plated in the plating bath, when the plating operation is completed, the connecting rod is driven to rise by the telescopic rod, then the motor body is started, then the movable ring slides to the right on the surface of the screw body, so that the placing frame moves above the water washing tank, then the telescopic rod is started again, the placing frame is driven to move to the inside of the water washing tank for cleaning, when the cleaning is completed, the connecting rod is driven to rise by the telescopic rod, then the column is taken out from the inside of the second jack, so that the placing frame can be taken off, then the semiconductor in the placing frame is poured onto the surface of the draining rack, after the above operation, the mounting cylinder is connected with the connecting rod, the column is inserted into the inside of the second jack and the first jack, the whole installation effect is good, the water on the surface of the cleaned semiconductor can be guided at the same time, the guided water can slide and fall through the guide plate, the whole plating effect is good, and the cleaned semiconductor can be naturally dried, which reflects the practicability of the design.

[0015] 2. The semiconductor processing plating equipment, through the setting of the water spraying frame, the connecting pipe, the conveying hose and the drain pipe, when cleaning, the water source is conveyed to the inside of the connecting pipe and the water spraying frame through the conveying hose connected with the external water tank, then the water source is sprayed to the surface of the placing frame through the water spraying frame, the semiconductor surface plated in the placing frame can be washed by the sprayed water source, the whole washing effect is good, and the water source contacted with the semiconductor can be discharged through the design of the drain pipe during the washing process, so that cross contamination of the semiconductor during washing is avoided, which reflects the functionality of the design. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic view of the utility model structure;

[0017] Figure 2 It is a split schematic view of the connecting rod and the mounting cylinder structure of the utility model;

[0018] Figure 3 It is a three-dimensional schematic view of the draining rack and the guide plate structure of the utility model;

[0019] Figure 4 It is a three-dimensional schematic view of the water spraying frame and the connecting pipe structure of the utility model.

[0020] In the figure: 1, electroplating box; 2, control panel; 3, side frame; 4, fixed plate; 6, mounting block; 7, motor body; 8, screw body; 9, movable ring; 10, telescopic rod; 11, bottom block; 12, connecting rod; 13, first jack; 14, mounting cylinder; 15, second jack; 16, plug column; 17, placing frame; 18, electroplating tank; 19, washing tank; 20, draining rack; 21, guide plate; 22, water spraying frame; 23, connecting pipe; 24, conveying hose; 25, drain pipe. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0022] Please refer to Figures 1-4 An embodiment provided by the utility model:

[0023] A kind of semiconductor processing electroplating equipment, electroplating box 1 used in the application, control panel 2, motor body 7, telescopic rod 10, electroplating tank 18 and drain pipe 25 are all products that can be directly purchased in market, its principle and connection mode are all prior art that the person skilled in the art is familiar with, so here is not repeated, including electroplating box 1, the front surface of electroplating box 1 is equipped with control panel 2, the back of electroplating box 1 is equipped with side frame 3, the lower surface of side frame 3 is fixedly connected with fixed plate 4, the lower end of fixed plate 4 is provided with mounting block 6, the left side of mounting block 6 is equipped with screw body 8, the right side of screw body 8 is installed with motor body 7 and is penetrated in the inside of mounting block 6, the outer surface of screw body 8 is equipped with movable ring 9, movable ring 9 is slidably connected in the inside of the lower end of fixed plate 4, the lower end of movable ring 9 is equipped with telescopic rod 10, electroplating tank 18 and washing tank 19 are sequentially arranged in the inside of electroplating box 1 from left to right, draining rack 20 and guide plate 21 are sequentially fixedly connected on the right side surface of electroplating box 1 from top to bottom, water spraying frame 22 is inserted and installed in the front and rear ends of electroplating box 1, the front surface of water spraying frame 22 is provided with connecting pipe 23, the front surface of connecting pipe 23 is provided with conveying hose 24, drain pipe 25 is installed on the front end surface of electroplating box 1, when washing, water source is conveyed to the inside of connecting pipe 23 and water spraying frame 22 by conveying hose 24 connecting external water tank, then water source is sprayed to the surface of placing frame 17 by water spraying frame 22, the surface of semiconductor after electroplating in the inside of placing frame 17 can be washed by the sprayed water source, the overall washing effect is good, and the water source that has contacted semiconductor can be discharged by the design of drain pipe 25 during washing process, to ensure that semiconductor is not cross-contaminated during washing.

[0024] The bottom block 11 is installed at the lower end of the telescopic rod 10, the lower surface of the bottom block 11 is provided with a connecting rod 12, the outer surface of the connecting rod 12 is provided with a first insertion hole 13, the surface of the connecting rod 12 is provided with a mounting cylinder 14, the front surface of the mounting cylinder 14 is fixedly connected with a placing frame 17, the right side surface of the mounting cylinder 14 is provided with a second insertion hole 15, the second insertion hole 15 and the first insertion hole 13 are matched with each other, the mounting cylinder 14 and the connecting rod 12 are matched with each other, and the second insertion hole 15 and the insertion column 16 are matched with each other. First, place the placing frame 17 above the electroplating tank 18, then place the semiconductor to be electroplated in the inside of the placing frame 17, then start the telescopic rod 10, drive the bottom block 11 and the connecting rod 12 to move downward, at this time the connecting rod 12 drives the placing frame 17 to move to the inside of the electroplating tank 18, so that the semiconductor in the inside of the placing frame 17 is electroplated in the inside of the electroplating tank 18. When the electroplating operation is completed, the connecting rod 12 is driven to rise at this time, then the motor body 7 is started, then the movable ring 9 slides to the right on the surface of the lead screw body 8, so that the placing frame 17 moves above the water washing tank 19, then the telescopic rod 10 is started again, drives the placing frame 17 to move to the inside of the water washing tank 19 for cleaning, when the cleaning is completed, the connecting rod 12 is driven to rise by the telescopic rod 10, then the insertion column 16 is taken out from the inside of the second insertion hole 15, so that the placing frame 17 can be taken down, then the semiconductor in the inside of the placing frame 17 is poured onto the surface of the draining rack 20. After the above operation, the mounting cylinder 14 is connected with the connecting rod 12, the insertion column 16 is inserted and mounted in the inside of the second insertion hole 15 and the first insertion hole 13, the overall installation effect is good, and it is convenient to guide the water on the surface of the cleaned semiconductor, and the guided water is guided to slide by the guide plate 21. The overall electroplating effect is good, and the cleaned semiconductor can be naturally dried.

[0025] Working principle: when the staff uses the device, first, the device is externally connected to the power supply, thereby providing power support for the device, first, place the placing frame 17 above the electroplating pool 18, then place the semiconductor to be electroplated inside the placing frame 17, then start the telescopic rod 10, drive the bottom block 11 and the connecting rod 12 to move downward, at this time, the connecting rod 12 will drive the placing frame 17 to move inside the electroplating pool 18, so that the semiconductor inside the placing frame 17 will be electroplated inside the electroplating pool 18, when the electroplating operation is completed, at this time, the telescopic rod 10 drives the connecting rod 12 to rise, then start the motor body 7, then the movable ring 9 will slide to the right on the surface of the lead screw body 8, so that the placing frame 17 will move above the water washing pool 19, then start the telescopic rod 10 again, drive the placing frame 17 to move inside the water washing pool 19 for cleaning, when the cleaning is completed, the connecting rod 12 is driven to rise by the telescopic rod 10, then the plug column 16 is taken out from the inside of the second insertion hole 15, so that the placing frame 17 can be taken down, then the semiconductor inside the placing frame 17 is poured onto the surface of the draining rack 20, after the above operation, the mounting cylinder 14 is connected with the connecting rod 12, the plug column 16 is inserted into the second insertion hole 15 and the first insertion hole 13, at the same time, it is convenient to guide the water on the surface of the cleaned semiconductor, when cleaning, the water is transported into the connecting pipe 23 and the water spraying rack 22 through the conveying hose 24 connected with the external water tank, then the water is sprayed onto the surface of the placing frame 17 through the water spraying rack 22, the water washing effect is good, at the same time, the water that has contacted the semiconductor can be discharged through the design of the drain pipe 25 during the water washing process, the above is all the working principle of the utility model.

[0026] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form; any ordinary technical personnel in the industry can implement the utility model according to the drawings and the above description; however, any equivalent changes, modifications and evolution of the above disclosed technical content without departing from the technical scheme of the utility model are equivalent embodiments of the utility model; at the same time, any equivalent changes, modifications and evolution of the above embodiments according to the essential technology of the utility model are still within the protection scope of the technical scheme of the utility model.

Claims

1. A semiconductor processing electroplating apparatus, comprising an electroplating tank (1), wherein a control panel (2) is mounted on the front surface of the electroplating tank (1), a side frame (3) is mounted on the back of the electroplating tank (1), and a fixing plate (4) is fixedly connected to the lower surface of the side frame (3), characterized in that: The lower end of the fixed plate (4) is provided with a mounting block (6), the left side of the mounting block (6) is provided with a lead screw body (8), the right side of the lead screw body (8) is provided with a motor body (7) that penetrates the interior of the mounting block (6), the outer surface of the lead screw body (8) is provided with a movable ring (9), the movable ring (9) is slidably connected inside the lower end of the fixed plate (4), and the lower end of the movable ring (9) is provided with a telescopic rod (10). The bottom block (11) is installed at the lower end of the telescopic rod (10). A connecting rod (12) is installed on the lower surface of the bottom block (11). A first insertion hole (13) is opened on the outer surface of the connecting rod (12). An installation cylinder (14) is installed on the surface of the connecting rod (12).

2. The semiconductor processing electroplating equipment according to claim 1, characterized in that: The front surface of the mounting cylinder (14) is fixedly connected to a placement frame (17), and a second insertion hole (15) is provided on the right side surface of the mounting cylinder (14).

3. The semiconductor processing electroplating equipment according to claim 2, characterized in that: The second socket (15) is adapted to the first socket (13), the mounting cylinder (14) is adapted to the connecting rod (12), and the second socket (15) is adapted to the plug (16).

4. The semiconductor processing electroplating equipment according to claim 1, characterized in that: The electroplating box (1) is provided with an electroplating tank (18) and a washing tank (19) from left to right inside. The right side surface of the electroplating box (1) is fixedly connected with a drain rack (20) and a guide plate (21) from top to bottom.

5. The semiconductor processing electroplating equipment according to claim 1, characterized in that: The electroplating box (1) is equipped with a water spray frame (22) at both the front and rear ends, and a connecting pipe (23) is provided on the front surface of the water spray frame (22).

6. The semiconductor processing electroplating equipment according to claim 5, characterized in that: The front surface of the connecting pipe (23) is provided with a conveying hose (24), and the front surface of the electroplating box (1) is provided with a drain pipe (25).

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