Power semiconductor reliability test device

Abstract

The embodiment of the utility model relates to the technical field of semiconductor processing, and discloses a power semiconductor reliability test device. The power semiconductor reliability test device comprises a heat dissipation piece, a pressure bearing device, a transmission structure and a control device. The heat dissipation piece is integrally formed by a plurality of heat dissipation plates and is used for bearing a plurality of devices to be tested; the pressure-bearing device is provided with a connecting hole, the connecting hole penetrates through the pressure-bearing device along a preset direction, and one surface, close to the heat dissipation piece, of the pressure-bearing device abuts against the plurality of to-be-tested devices; the transmission structure penetrates through the connecting hole and is movably connected with the heat dissipation piece, and the transmission structure is movably arranged on the pressure bearing device; the control device is arranged at the end, away from the heat dissipation piece, of the transmission structure and used for controlling the transmission structure to reciprocate in the preset direction, and the pressure bearing device is driven by the transmission structure to reciprocate in the preset direction. According to the power semiconductor reliability test device provided by the embodiment of the invention, stable pressure can be applied to the to-be-tested device in the reliability test process, and real-time monitoring can be realized.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to the technical field of semiconductor processing, in particular to a power semiconductor reliability test device. BACKGROUND

[0002] Power semiconductor device reliability test is a test conducted to determine, verify or improve product reliability. Such tests aim to detect whether the device will experience performance degradation or failure during long-term operation, thereby determining whether the device can meet the expected reliability standards and ensuring its excellent performance in actual use. To verify the reliability of power semiconductor devices in harsh environments, reliability tests are usually conducted in accordance with the requirements of Table 2 in AEC-Q101 standard. The standard detects the performance of the device by applying a blocking voltage to the device under high temperature conditions, thereby evaluating the durability of the terminal and passivation layer of the device. However, high leakage devices may experience thermal runaway when subjected to high temperature reverse bias tests, resulting in thermal breakdown of the device. Therefore, heat sinks need to be installed on the device to dissipate heat, ensuring stable operation of the device in high temperature environments.

[0003] Currently, heat sinks are usually connected to devices by screwing, but this connection method has several drawbacks. First, it is time-consuming to install a heat sink for a device, which takes 50 seconds. The number of devices used for reliability tests is large, and both installation and removal require a long time, resulting in low efficiency. Second, the torque control requirement for screwing is high, and excessive torque can cause damage to the power device, while insufficient torque can easily cause poor heat dissipation. Third, the threads on the heat sink are prone to "sliding" after being screwed multiple times, thereby shortening the service life of the heat sink. In addition, the existing aging test board wiring method only supports the device to be fixed on the test board, and cannot apply stable pressure to the device during testing, thereby limiting the reliability test under simulated actual working pressure environment. Therefore, how to design a power device reliability connection device that is easy to operate and has high consistency of test results is an important problem. Practical new type content

[0004] The embodiment of the present application aims to provide a power semiconductor reliability test device that can apply stable pressure to the device under test during the reliability test and realize real-time monitoring, thereby enhancing the evaluation of the reliability of the device under test under different stress conditions.

[0005] To solve the above technical problems, the embodiment of the present application provides a power semiconductor reliability test device, which comprises a heat dissipation piece, a pressure bearing device, a transmission structure and a control device. The heat dissipation piece is integrally formed by a plurality of heat dissipation plates and is used for bearing a plurality of devices to be tested; the pressure bearing device is provided with a connecting hole penetrating through the pressure bearing device along a preset direction, and one side of the pressure bearing device close to the heat dissipation piece abuts against the plurality of devices to be tested; the transmission structure penetrates through the connecting hole and is movably connected with the heat dissipation piece; and the control device is arranged at an end of the transmission structure away from the heat dissipation piece and is used for controlling the transmission structure to move back and forth along the preset direction, so that the pressure bearing device moves back and forth along the preset direction through the driving of the transmission structure and is used for applying a preset pressure to the plurality of devices to be tested.

[0006] The power semiconductor reliability test device provided by the embodiment of the present application is used for solving the problem that it is difficult to apply stable pressure to a working device in a reliability test process. The power semiconductor reliability test device is composed of a heat dissipation piece, a pressure bearing device, a transmission structure and a control device. The control device instructs the transmission structure to act, and then drives the pressure bearing device. Meanwhile, the pressure bearing device is directly connected with the heat dissipation piece, so that the step of screwing the devices to be tested and the heat dissipation plates is omitted. Therefore, stable pressure can be applied to the devices to be tested in the reliability test process and real-time monitoring can be realized, and the reliability of the devices to be tested under different stress conditions can be evaluated.

[0007] In some embodiments, the number of the connecting holes, the transmission structure and the control device is greater than or equal to 2.

[0008] In some embodiments, the pressure bearing device further comprises a metal pressing plate, a force value sensor and a plurality of support columns, which are sequentially fixedly connected along the preset direction, and the plurality of support columns are movably connected with the plurality of devices to be tested one by one.

[0009] In some embodiments, the plurality of heat dissipation pieces comprises a first heat dissipation part and a second heat dissipation part, the transmission structure enters the first heat dissipation part along the preset direction, and the plurality of devices to be tested are arranged on the second heat dissipation part.

[0010] In some embodiments, the bottom of the second heat dissipation part is provided with heat dissipation fins, and the top of the second heat dissipation part is provided with a plurality of grooves for bearing the plurality of devices to be tested.

[0011] In some embodiments, heat-conducting silicone grease is arranged in the plurality of grooves.

[0012] In some embodiments, the number of the plurality of grooves and the plurality of support columns is greater than or equal to 2 and less than or equal to 10.

[0013] In some embodiments, the heat dissipation piece is made of metal.

[0014] In some embodiments, the transmission structure is a threaded stud.

[0015] In some embodiments, a scale is provided on the threaded stud. BRIEF DESCRIPTION OF DRAWINGS

[0016] One or more embodiments are illustrated by way of example in the figures that form a part of this disclosure and which do not limit the scope of embodiments in which like references indicate similar elements. Examples of the specification illustrate embodiments and do not exhaust the scope of embodiments. The figures in the drawings are not necessarily to scale and the dimensions of certain features can have been exaggerated for the sake of clarity.

[0017] Figure 1 FIG. 1 is a schematic diagram of a power semiconductor reliability test device according to some embodiments of the present application. DETAILED DESCRIPTION

[0018] To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below with reference to the drawings. However, those skilled in the art can understand that in the embodiments of the present application, many technical details are proposed in order to make the readers better understand the present application. However, the technical solutions claimed by the present application can be implemented even without these technical details and various changes and modifications based on the following embodiments. The division of the following embodiments is for the convenience of description and should not constitute any limitation on the specific embodiments of the present application. The embodiments can be combined and referenced to each other without contradiction.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application; the description and the claims of this application and the above description of drawings, the terms "comprising" and "having" and any variations thereof, are intended to cover not exclusively inclusive.

[0020] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified.

[0021] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents a "or" relationship between the front and rear associated objects.

[0022] In the description of the embodiments of the present application, unless specifically defined and limited otherwise, the terms "mounting", "connected", "connection" and the like should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through an intermediate medium, can be internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0023] Some embodiments of the present application provide a power semiconductor reliability test device. The power semiconductor reliability test device is aimed at the problem that it is difficult to apply stable pressure to the working device during the reliability test process. The power semiconductor reliability test device drives the pressure bearing device through the action of the transmission structure instructed by the control device, and the pressure bearing device is directly connected to the heat dissipation piece, thereby eliminating the step of screwing the device under test and the heat sink. Thus, stable pressure can be applied to the device under test during the reliability test process and real-time monitoring can be realized, and the reliability of the device under test under different stress conditions can be evaluated.

[0024] The power semiconductor reliability test device provided by some embodiments of the present application will be described below in combination with Figure 1

[0025] The power semiconductor reliability test device provided by some embodiments of the present application includes a heat dissipation piece, a pressure bearing device 30, a transmission structure, and a control device. The heat dissipation piece is integrally formed by a plurality of heat dissipation plates and is used to bear a plurality of devices under test 20; the pressure bearing device 30 is provided with a connecting hole, the connecting hole penetrates the pressure bearing device 30 along a preset direction, and one side of the pressure bearing device 30 close to the heat dissipation piece abuts against the plurality of devices under test 20; the transmission structure penetrates the connecting hole and is movably connected with the heat dissipation piece, and the transmission structure is movably arranged on the pressure bearing device 30; the control device is arranged at an end of the transmission structure away from the heat dissipation piece, and the control device is used to control the transmission structure to move back and forth along the preset direction, and the pressure bearing device 30 moves back and forth along the preset direction through the driving of the transmission structure, and is used to apply a preset pressure to the plurality of devices under test 20. The power semiconductor reliability test device provided by the embodiments of the present application can apply stable pressure to the device during the reliability test process and realize real-time monitoring, and the reliability of the device under test under different stress conditions can be evaluated.

[0026] ​The heat dissipation piece is integrally formed by a plurality of heat dissipation plates, used for bearing a plurality of devices to be tested 20 and providing heat dissipation function. The pressure bearing device 30 is arranged above the heat dissipation piece, and a connecting hole is arranged in the structure of the pressure bearing device 30, the connecting hole penetrates the pressure bearing device 30 in the vertical direction, and the bottom surface of the pressure bearing device 30 is directly in contact with the plurality of devices to be tested 20. The transmission structure penetrates the connecting hole of the pressure bearing device 30 and is movably connected with the heat dissipation piece. The transmission structure can drive the pressure bearing device 30 to move up and down along a preset direction, and flexibly adjust the distance between the pressure bearing device 30 and the heat dissipation piece.

[0027] The control device is arranged at one end of the transmission structure away from the heat dissipation piece. By controlling the motion track of the transmission structure, the control device can realize the reciprocating motion of the pressure bearing device 30 in a specific direction. By adjusting the distance between the control device and the heat dissipation piece, the size of the pressure applied to the devices to be tested 20 can be flexibly adjusted to meet the needs of different test conditions. This adjustment method ensures the accuracy of the pressure value and simplifies the test operation process.

[0028] In some embodiments, the number of connecting holes, transmission structures and control devices can be greater than or equal to 2.

[0029] As shown in Figure 1 The heat dissipation piece is integrally formed by a plurality of heat dissipation plates, used for bearing a plurality of devices to be tested 20.

[0030] The pressure bearing device 30 can be provided with a first connecting hole and a second connecting hole, which can be located at the left and right ends of the pressure bearing device 30, and can penetrate the pressure bearing device 30 in a preset direction. Not only is it convenient for the installation and adjustment of the transmission structure, but also ensures the stability of the pressure bearing device 30 during the test.

[0031] The transmission structure can include a first transmission member 41 and a second transmission member 42, one end of the first transmission member 41 close to the heat dissipation piece can penetrate the first connecting hole and be movably connected with the heat dissipation piece, one end of the second transmission member 42 close to the heat dissipation piece can penetrate the second connecting hole and be movably connected with the heat dissipation piece, and the first transmission member 41 and the second transmission member 42 are movably arranged on the pressure bearing device 30. By adjusting the positions of the first transmission member 41 and the second transmission member 42 on the pressure bearing device 30, the distance between the heat dissipation piece and the devices to be tested 20 can be accurately controlled, and the pressure applied to the devices to be tested 20 can be adjusted.

[0032] The control device can include a rotatable first control member 51 and a second control member 52, the first control member 51 can be arranged at one end of the first transmission member 41 away from the heat dissipation member, and the second control member 52 can be arranged at one end of the second transmission member 42 away from the heat dissipation member, the first control member 51 can be used to control the reciprocating movement of the first transmission member 41 along the preset direction, and the second control member 52 can be used to control the reciprocating movement of the second transmission member 42 along the preset direction. The preset direction can be the vertical direction. This rotary adjustment mode enables the pressure bearing device 30 to reciprocate with the rotation of the control device. When the control device is rotated downward and tightened, the pressure bearing device 30 will move downward accordingly, thereby increasing the pressure applied to the plurality of devices under test 20. The bottom surface of the pressure bearing device 30 can directly contact the plurality of devices under test 20, ensuring that uniform and consistent pressure distribution can be provided to each device under test 20 during the test process. By precisely controlling the up-and-down movement of the pressure bearing device 30, precise adjustment of the pressure value applied to the device under test 20 can be achieved, thereby improving the accuracy and repeatability of the test results.

[0033] In actual situations, the pressure bearing device 30 can be provided with a number of connection holes greater than or equal to two, which not only provides a mounting and fixing position for the transmission structure, but also enables the entire test system to be more flexible in adapting to different test requirements. Correspondingly, the number of transmission structures and control devices needs to be consistent with the number of connection holes on the pressure bearing device 30. This is because each connection hole requires a corresponding transmission member to transmit control signals and forces, and a corresponding control member for rotary adjustment. Only in this way can it be ensured that the transmission and control at each connection hole are independent and adjustable, thereby achieving precise control and pressure application to the device under test 20.

[0034] In some embodiments, the pressure bearing device 30 further includes a metal pressure plate 31, a force value sensor 32, and a plurality of support columns 33, which are sequentially fixedly connected along the preset direction, and the plurality of support columns 33 are movably connected one-to-one with the plurality of devices under test 20.

[0035] The metal pressure plate 31, as the top component of the pressure bearing device 30, plays an important role in fixing and transmitting pressure. The metal material can ensure that the pressure from the control device and the transmission structure can be stably borne and transmitted during the test process.

[0036] The force value sensor 32 is closely mounted below the metal pressure plate 31 and is used to measure and display the pressure value applied by the pressure bearing device 30 to the device under test 20 in real time. Through the precise measurement of the force value sensor 32, researchers can accurately understand the pressure change during the test process, thereby ensuring the accuracy and reliability of the test results.

[0037] The plurality of support columns 33 serve as a connecting bridge between the pressure bearing device 30 and the devices under test 20, not only supporting and transmitting pressure, but also effectively relieving stress damage to the devices under test 20 through special material and structural design. In these embodiments, the plurality of support columns 33 are preferably made of nylon, which has good elasticity and wear resistance, can effectively absorb and disperse pressure during testing, thereby protecting the devices under test 20 from stress damage. Each support column 33 corresponds to one device under test 20 and is precisely docked with the device under test 20 through a movable connection, so that each device under test 20 can be subjected to uniform and consistent pressure distribution, and it is also convenient to replace or adjust the devices under test 20 during testing.

[0038] By precisely adjusting the distance between the control device and the heat dissipation member, the pressure of the transmission structure on the plurality of support columns 33 can be controlled. According to the physical formula P = F / S, where P is the pressure, F is the force applied to the device under test 20, and S is the cross-sectional area of the nylon support column (a fixed value). Since S is constant, by changing the distance between the control device and the heat dissipation member to adjust the size of F, the pressure P applied to the device under test can be precisely controlled and adjusted to meet the specific requirements of different test scenarios for pressure size.

[0039] In some embodiments, the plurality of heat dissipation members includes a first heat dissipation portion 11 and a second heat dissipation portion 12, and the transmission structure can enter the first heat dissipation portion 11 along a predetermined direction, and the plurality of devices under test 20 can be arranged on the second heat dissipation portion 12.

[0040] The first heat dissipation portion 11 can cooperate with the transmission structure and provide a passage for the transmission structure along a predetermined direction, so that the transmission structure can pass through the first heat dissipation portion 11 and form a stable connection therewith. Thus, not only the stability and reliability of the transmission structure are ensured, but also the heat dissipation member can be closely integrated into the entire test system, improving the overall integrity and compactness of the system.

[0041] The second heat dissipation portion 12 is used to carry and dissipate heat from the plurality of devices under test 20, and generally has sufficient area and heat dissipation capacity to ensure that the heat generated by the devices under test 20 can be effectively dissipated during testing, thereby maintaining the normal operating temperature and performance of the devices under test 20. The second heat dissipation portion 12 can be flexibly adjusted according to parameters such as the number, size and power density of the devices under test 20 to meet the needs of different test scenarios.

[0042] In some embodiments, the bottom of the second heat dissipation portion 12 can be provided with heat dissipation fins, and the top of the second heat dissipation portion 12 can be provided with a plurality of grooves for carrying the plurality of devices under test 20.

[0043] The heat dissipation fins can further increase the heat dissipation area and improve the heat dissipation efficiency, thereby ensuring that the device under test 20 maintains a stable temperature during a long testing process. Meanwhile, the top of the second heat dissipation part 12 is also provided with a plurality of grooves, which are specially designed for carrying a plurality of devices under test 20. Thus, not only can the devices under test 20 be more stably placed on the heat dissipation part, but also each device under test can obtain uniform and effective heat dissipation.

[0044] In some embodiments, the plurality of grooves can be provided with heat-conducting silicone grease.

[0045] The heat-conducting silicone grease is a high-efficiency heat-conducting material that can fill the tiny gap between the device under test 20 and the groove, thereby significantly improving the heat-conducting efficiency. Applying the heat-conducting silicone grease in the groove can ensure that the heat generated by the device under test 20 can be quickly and uniformly transferred to the second heat dissipation part 12, and then dissipated to the environment through structures such as heat dissipation fins.

[0046] In some embodiments, the number of the plurality of grooves and the plurality of support columns 33 can each be greater than or equal to 2 and less than or equal to 10.

[0047] By adjusting the number of grooves and support columns 33, different numbers and sizes of devices under test 20 can be accommodated, thereby meeting diversified testing needs. Meanwhile, keeping the number between 2 and 10 can not only ensure the efficiency and accuracy of the test, but also avoid excessive components increasing the complexity and cost of the system.

[0048] In some embodiments, the heat dissipation member can be a metal material.

[0049] Metal materials, such as copper and aluminum, have good heat-conducting performance and mechanical strength, and are ideal choices for making heat dissipation members. Metal heat dissipation members can quickly absorb and disperse the heat generated by the device under test 20, ensuring the stable operation of the testing system. In addition, metal materials also have good processability and corrosion resistance, which helps to prolong the service life of the heat dissipation member.

[0050] In some embodiments, the transmission structure can be a stud.

[0051] The stud, as a transmission structure, not only has the function of transmitting pressure and controlling the position of the device under test 20, but also provides precise adjustment and measurement means through the scale on it.

[0052] In some embodiments, the stud can be provided with a scale.

[0053] The scale enables researchers to accurately control the rotation angle and displacement of the stud, thereby achieving precise pressure application and position adjustment of the device under test 20.

[0054] Those skilled in the art can understand that the above-mentioned embodiments are specific examples for implementing the present application, and in actual applications, various changes can be made in form and details without departing from the spirit and scope of the present application.

Claims

1. A power semiconductor reliability test apparatus, characterized by, The application relates to a heat dissipation device. The heat dissipation device comprises a plurality of heat dissipation plates, a pressure bearing device, a transmission structure and a control device. The pressure bearing device is provided with a connecting hole which penetrates the pressure bearing device along a preset direction. The pressure bearing device is in abutment with the plurality of devices to be tested on one side close to the heat dissipation device. The transmission structure is movably arranged on the pressure bearing device and is in active connection with the heat dissipation device through the connecting hole.

2. The power semiconductor reliability test apparatus according to claim 1, wherein The control device is arranged at the end of the transmission structure away from the heat dissipation device.

3. A power semiconductor reliability test apparatus according to claim 2, wherein The control device is used for controlling the transmission structure to reciprocally move along the preset direction.

4. The power semiconductor reliability test apparatus according to claim 3, wherein The pressure bearing device reciprocally moves along the preset direction through the driving of the transmission structure and is used for applying a preset pressure to the plurality of devices to be tested.

5. A power semiconductor reliability test apparatus according to claim 4, wherein The number of the connecting hole, the transmission structure and the control device is greater than or equal to 2.

6. A power semiconductor reliability test apparatus according to claim 5, wherein The pressure bearing device further comprises a metal pressure plate, a force value sensor and a plurality of support columns.

7. A power semiconductor reliability test apparatus according to claim 6, wherein The metal pressure plate, the force value sensor and the plurality of support columns are sequentially fixedly connected along the preset direction.

8. The power semiconductor reliability test apparatus of claim 7, wherein The plurality of support columns are in active connection with the plurality of devices to be tested one by one.

9. A power semiconductor reliability test apparatus according to claim 8, wherein The plurality of heat dissipation devices comprise a first heat dissipation part and a second heat dissipation part.

10. The power semiconductor reliability test apparatus of claim 9, wherein The transmission structure enters the first heat dissipation part along the preset direction. The plurality of devices to be tested are arranged on the second heat dissipation part. The bottom of the second heat dissipation part is provided with heat dissipation fins. The top of the second heat dissipation part is provided with a plurality of grooves. The plurality of grooves are used for bearing the plurality of devices to be tested. The plurality of grooves are provided with heat-conducting silicone grease. The number of the plurality of grooves and the plurality of support columns is greater than or equal to 2 and less than or equal to 10. The heat dissipation device is made of metal. The transmission structure is a threaded stud. The threaded stud is provided with a scale.

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