Stop mechanism of semiconductor device

Abstract

The utility model discloses a material blocking mechanism of a semiconductor device, which comprises a mounting arm, one end in the mounting arm is provided with a cavity, the mounting arm is internally provided with a telescopic arm, the center of one side of the telescopic arm is provided with a thread groove, the center in the mounting arm is provided with a screw rod, and the screw rod is provided with a screw rod. An adjusting rod is movably connected to the position, close to one side, of the top of the telescopic arm, and an adjusting knob is fixedly installed at the top of the adjusting rod. According to the material blocking mechanism of the semiconductor device, through the design of the telescopic arm, the threaded groove, the threaded rod, the adjusting rod, the driving gear, the driven gear and the adjusting knob, the defect that a traditional material blocking mechanism lacks an adjusting function after being installed is thoroughly overcome, and an operator only needs to simply rotate the adjusting knob to drive the driving gear to rotate; and then the driven gear drives the screw rod to rotate and ascend and descend in the threaded groove, precise telescopic adjustment of the telescopic arm is achieved, and the material blocking piece can extend to the proper material blocking position.

Description

TECHNICAL FIELD

[0001] The utility model relates to material blocking mechanism technical field, concretely is a kind of semiconductor device's material blocking mechanism. BACKGROUND

[0002] The semiconductor device's material blocking mechanism is a kind of device for accurate positioning, blocking and guiding semiconductor material or device movement in semiconductor manufacturing or testing process, ensure that semiconductor material or device can move stably according to predetermined path and position in processing or testing process, avoid position deviation or damage, to improve production efficiency and product quality.

[0003] The existing semiconductor device material blocking mechanism, after installation is completed, often lack necessary adjustment function, once in production or testing process, semiconductor device's material blocking distance needs to be fine-tuned, operator has to disassemble the whole material blocking mechanism from existing position, then according to new material blocking demand, find a suitable position and install again, this kind of design lacking flexibility and convenience, not only greatly increase the time cost and manpower cost of production operation, but also possibly lead to new error in disassembly and reinstallation process, to affect the precision and consistency of semiconductor device. SUMMARY

[0004] The utility model aims at providing a kind of semiconductor device's material blocking mechanism, to solve the problem that the existing semiconductor device material blocking mechanism lacks necessary adjustment function after installation is completed in the above background art, once in production or testing process, semiconductor device's material blocking distance needs to be fine-tuned, operator has to disassemble the whole material blocking mechanism from existing position, then according to new material blocking demand, find a suitable position and install again, this kind of design lacking flexibility and convenience, not only greatly increase the time cost and manpower cost of production operation, but also possibly lead to new error in disassembly and reinstallation process, to affect the precision and consistency of semiconductor device.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a material blocking mechanism for a semiconductor device, comprising a mounting arm, a cavity at one end of the mounting arm, a telescopic arm inside the mounting arm, a threaded groove at the center of one side of the telescopic arm, a screw at the center of the mounting arm, an adjusting rod movably connected to one side of the top of the telescopic arm, an adjusting knob fixedly mounted on the top of the adjusting rod, a driven gear fixedly mounted on one side of the screw surface, a driving gear meshing with the upper end of the driven gear, a buffer head at one end of the telescopic arm, a spring fixedly connected to the center of one side of the buffer head, a material blocking plate fixedly mounted on one side of the buffer head, and a rubber pad fixedly connected to one side of the material blocking plate.

[0006] Compared with the prior art, the beneficial effects of this utility model are:

[0007] The semiconductor device's blocking mechanism, through the design of a telescopic arm, threaded groove, screw, adjusting rod, driving gear, driven gear, and adjusting knob, completely eliminates the drawback of traditional blocking mechanisms lacking adjustment function after installation. Operators simply rotate the adjusting knob to drive the driving gear, which in turn drives the screw to rotate and rise / fall within the threaded groove via the driven gear, achieving precise telescopic adjustment of the telescopic arm. This allows the blocking plate to extend to the appropriate blocking position. This design not only eliminates the tedious steps of disassembling the entire blocking mechanism for position adjustment but also significantly improves the accuracy and convenience of adjustment, effectively reducing production operation time and labor costs. The design of the buffer head, spring, and rubber pad, due to the characteristics of the spring and rubber pad, effectively absorbs the impact force that may be generated during blocking, reducing the risk of device damage caused by hard contact. The rubber pad not only increases the friction between the blocking surface and the semiconductor device but also helps to more firmly position the device, preventing accidental movement during processing or testing. Attached Figure Description

[0008] Figure 1 This is a three-dimensional view of the structure of this utility model;

[0009] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0010] Figure 3 This is a three-dimensional view of the telescopic arm of this utility model;

[0011] Figure 4 This is a top view of the structure of this utility model.

[0012] In the figure: 1, mounting arm; 2, telescopic arm; 3, screw groove; 4, screw rod; 5, first sliding groove; 6, first sliding block; 7, adjusting rod; 8, driving gear; 9, driven gear; 10, adjusting knob; 11, buffer head; 12, spring; 13, second sliding groove; 14, second sliding block; 15, material blocking piece; 16, rubber pad. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0014] Please refer to Figures 1-4 The utility model provides a kind of technical solutions: a kind of material blocking mechanism of semiconductor device, including mounting arm 1, the cavity is set in one end in mounting arm 1, the inside of mounting arm 1 is provided with telescopic arm 2, the center of one side of telescopic arm 2 is provided with screw groove 3, the center in mounting arm 1 is provided with screw rod 4, adjusting rod 7 is movably connected with the position of one side on the top of telescopic arm 2, adjusting knob 10 is fixedly installed at the top of adjusting rod 7, driven gear 9 is fixedly installed on the side of the surface of screw rod 4, driving gear 8 is engagedly connected to the upper end of driven gear 9, buffer head 11 is provided at one end of telescopic arm 2, spring 12 is fixedly connected to the center of one side in buffer head 11, material blocking piece 15 is fixedly installed on the side of buffer head 11, rubber pad 16 is fixedly connected to the side of material blocking piece 15.

[0015] The side of telescopic arm 2 is penetrated to the outside of mounting arm 1, one end of screw rod 4 is penetrated to the inside of screw groove 3 and is threadedly connected with the inner wall of screw groove 3, the other end of screw rod 4 is movably connected with the bearing fixedly installed at the center of other side in mounting arm 1, so that telescopic arm 2 can be accurately telescopic adjusted by the rotation of screw rod 4, to adjust the working range of material blocking mechanism, increase the flexibility and applicability of material blocking mechanism.

[0016] The side of top and inner bottom in mounting arm 1 is provided with first sliding groove 5, the side of top and bottom of telescopic arm 2 is fixedly installed with first sliding block 6, two first sliding blocks 6 are slidably connected with the inner wall of two first sliding grooves 5 respectively, to ensure that telescopic arm 2 can move stably along the preset trajectory during telescopic process, avoid deviation or jam, improve the stability and reliability of material blocking mechanism.

[0017] The adjusting knob 10 is provided in a columnar structure, and vertical lines are formed on the outer wall of the adjusting knob 10. The columnar design and vertical line texture of the adjusting knob 10 not only facilitate the operator to hold and rotate, but also increase the friction during rotation, so that the adjusting process is more smooth and accurate.

[0018] The bottom of the adjusting rod 7 penetrates into the inside of the mounting arm 1 and is fixedly connected with the center of the top of the driving gear 8, so that the rotation of the adjusting rod 7 can directly drive the driving gear 8 to rotate, and then the adjustment of the telescopic arm 2 is realized through gear transmission, thereby improving the efficiency and accuracy of the material blocking mechanism adjustment.

[0019] One end of the telescopic arm 2 penetrates into the inside of the buffer head 11 and is fixedly connected with one side of the spring 12, and the other side of the top and bottom of the telescopic arm 2 is fixedly installed with the second sliding block 14, and one side of the inner top and inner bottom of the buffer head 11 is provided with the second sliding groove 13, and the two second sliding blocks 14 are respectively in sliding connection with the inner walls of the two second sliding grooves 13, so that the buffer head 11 can be smoothly moved under the driving of the telescopic arm 2.

[0020] A connecting hole is formed on the side of the front surface of the mounting arm 1, which is used for connecting with the lifting device.

[0021] The mounting arm 1 is fixed on the lifting mechanism through the connecting hole, when the material needs to be blocked, the lifting mechanism pulls the mounting arm 1 to move downward, so that the material blocking piece 15 performs the material blocking operation on the semiconductor device, when the material blocking distance of the material blocking piece 15 needs to be adjusted, the operator first rotates the adjusting knob 10, the adjusting knob 10 drives the adjusting rod 7 to rotate, since the bottom of the adjusting rod 7 is fixedly connected with the driving gear 8, the driving gear 8 also rotates, the driving gear 8 and the driven gear 9 are in meshing with each other, so the driven gear 9 rotates with the driving gear 8, the rotation of the driven gear 9 drives the screw rod 4 fixedly connected with the driven gear 9 to rotate in the threaded groove 3, since the other end of the screw rod 4 is movably connected with the bearing in the mounting arm 1, the rotation of the screw rod 4 will be converted into the linear motion of the telescopic arm 2 along the axial direction of the screw rod 4, so as to realize the accurate telescopic adjustment of the telescopic arm 2, during the telescopic movement of the telescopic arm 2, the first sliding block 6 on the top and bottom of the telescopic arm 2 will smoothly slide along the first sliding groove 5 in the mounting arm 1, so as to ensure that the movement track of the telescopic arm 2 is stable and will not be deviated or jammed, meanwhile, the telescopic movement of the telescopic arm 2 drives the buffer head 11, the spring 12, the material blocking piece 15 and the rubber pad 16 in the buffer head 11 to move together, until the material blocking piece 15 is adjusted to the appropriate position.

[0022] In summary: the semiconductor device material blocking mechanism, through the telescopic arm 2, screw groove 3, screw rod 4, adjusting rod 7, driving gear 8, driven gear 9 and adjusting knob 10 design, this mechanism completely abandon the traditional material blocking mechanism after installation lacks the malpractice of adjusting function, the operator only needs to rotate the adjusting knob 10 simply, can drive driving gear 8 rotation, in turn through driven gear 9 drive screw rod 4 rotates in screw groove 3, realize telescopic arm 2's accurate telescopic adjustment, make the material blocking piece 15 can extend to the appropriate material blocking position, this design not only spares the cumbersome step of disassembling the entire material blocking mechanism for position adjustment, also greatly improves the accuracy and convenience of adjustment, effectively reduces the time cost and labor cost of production operation, the design of buffer head 11, spring 12 and rubber pad 16, due to the characteristics of spring 12 and rubber pad 16, can effectively absorb the impact force that may be generated in the process of material blocking, reduces the risk of device damage caused by hard contact, rubber pad 16 not only increases the friction between the material blocking surface and the semiconductor device, helps to position the device more firmly, prevent accidental movement during processing or testing.

[0023] It should be noted that in this document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0024] Although the embodiments of the present application have been shown and described, it is to be understood that for the purpose of the present application, the embodiments change, modify, replace and vary in many ways without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A feeding mechanism for a semiconductor device, comprising a mounting arm (1), characterized in that: A cavity is provided at one end of the mounting arm (1). A telescopic arm (2) is provided inside the mounting arm (1). A threaded groove (3) is provided at the center of one side of the telescopic arm (2). A screw (4) is provided at the center of the mounting arm (1). An adjusting rod (7) is movably connected to one side of the top of the telescopic arm (2). An adjusting knob (10) is fixedly installed on the top of the adjusting rod (7). A driven gear (9) is fixedly installed on one side of the surface of the screw (4). A driving gear (8) is meshed with the upper end of the driven gear (9). A buffer head (11) is provided at one end of the telescopic arm (2). A spring (12) is fixedly connected to the center of one side of the buffer head (11). A baffle plate (15) is fixedly installed on one side of the buffer head (11). A rubber pad (16) is fixedly connected to one side of the baffle plate (15).

2. The material blocking mechanism for a semiconductor device according to claim 1, characterized in that: One side of the telescopic arm (2) extends through to the outside of the mounting arm (1), one end of the screw (4) extends through to the inside of the threaded groove (3) and is threadedly connected to the inner wall of the threaded groove (3), and the other end of the screw (4) is movably connected to a bearing fixedly installed at the center of the other side of the mounting arm (1).

3. The material blocking mechanism for a semiconductor device according to claim 1, characterized in that: The mounting arm (1) has a first groove (5) on one side of the top and bottom, and the telescopic arm (2) has a first slider (6) fixedly installed on one side of the top and bottom, and the two first sliders (6) are slidably connected to the inner walls of the two first grooves (5) respectively.

4. The material blocking mechanism for a semiconductor device according to claim 1, characterized in that: The adjustment knob (10) is a cylindrical structure, and the outer wall of the adjustment knob (10) has vertical grooves.

5. The material blocking mechanism for a semiconductor device according to claim 1, characterized in that: The bottom of the adjusting rod (7) extends through the interior of the mounting arm (1) and is fixedly connected to the center of the top of the drive gear (8).

6. The material blocking mechanism for a semiconductor device according to claim 1, characterized in that: One end of the telescopic arm (2) extends into the interior of the buffer head (11) and is fixedly connected to one side of the spring (12). The other side of the top and bottom of the telescopic arm (2) is fixedly installed with a second slider (14). The top and bottom sides of the buffer head (11) are provided with a second groove (13). The two second sliders (14) are slidably connected to the inner walls of the two second grooves (13) respectively.

7. The material blocking mechanism for a semiconductor device according to claim 1, characterized in that: A connection hole is provided on one side of the front surface of the mounting arm (1).

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