PCB (Printed Circuit Board) side sound inlet silicon microphone

Abstract

The utility model relates to the technical field of acoustics, and specifically relates to a PCB side sound inlet silicon microphone. Comprising a cover plate and a PCB, the cover plate is internally provided with a containing cavity, the PCB is covered with a base material plate, the PCB is internally provided with a sound inlet channel, the sound inlet channel is communicated with the containing cavity, the base material plate is provided with an electro-acoustic conversion chip MEMS and an electric signal processing chip ASIC, the channels are drilled through a drill bit, then a layer of base material plate is covered on the channels for pressing treatment, and the sound inlet channel is communicated with the sound inlet channel. And finally, a sound inlet channel is formed on the PCB. And the sound inlet channel is metallized to prevent chippings generated by cutting from entering the interior of the cavity, so that the capability of preventing particles from entering the interior of the microphone in the production link is greatly improved, the probability of entering the particles is reduced in the use process of a terminal customer, a rubber sleeve used in the assembly of the whole machine is saved, on one hand, the cost is saved, and the production efficiency is improved. Importantly, the service life of the whole machine is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to acoustics technical field especially relates to a PCB side sound -entering silicon microphone. BACKGROUND

[0002] The function of side sound -entering microphone is, can make microphone can receive sound from side, this is very useful in certain specific application scene, such as when the device needs to be placed close to wall or other obstacles, mainly applied to TWS earphone, mobile phone etc., by changing sound -entering channel mode, reduce particle into product internal risk, finally realize the function of silicon microphone side sound -entering.

[0003] But, the present side sound -entering product is that the shell is first opened and then enters the mold compression, resulting in large opening, production and terminal use link is easy to enter particle, resulting in microphone failure. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of PCB side sound -entering silicon microphone, to solve the technical problem of microphone failure in prior art, which is that the present side sound -entering product is that the shell is first opened and then enters the mold compression, resulting in large opening, production and terminal use link is easy to enter particle.

[0005] To achieve the above-mentioned purpose, the utility model adopts a kind of PCB side sound -entering silicon microphone, including cover plate and PCB board, the cover plate has accommodating cavity in, the top of PCB board is covered with substrate board, the PCB board has sound -entering channel in, and the sound -entering channel is communicated with the accommodating cavity, the substrate board is provided with electroacoustic transducer chip MEMS and electrical signal processing chip ASIC, and the electroacoustic transducer chip MEMS is located at the sound outlet of the sound -entering channel, the cover plate is bonded with the substrate board, and is located at the top of the substrate board, and the cover plate is covered on the top of the electroacoustic transducer chip MEMS and the electrical signal processing chip ASIC.

[0006] Wherein, the outer side of the cover plate has bevel.

[0007] Wherein, the bonding material between the cover plate and the substrate board adopts adhesive.

[0008] Wherein, the sound -entering channel is composed of rectangular channel and circular channel, and the electroacoustic transducer chip MEMS is located at the sound outlet of the circular channel.

[0009] Wherein, the material of the PCB board is one or more combinations of FR-4, polypropylene, polytetrafluoroethylene, CEM-3, aluminum-based PCB, ceramic substrate, soft board, high-TG FR-4, metal substrate, radio frequency board, Rogers and carbon fiber.

[0010] The utility model discloses a kind of PCB side sound-in silicon microphones, including cover plate and PCB board, the cover plate has accommodating cavity inside, the top of the PCB board is covered with substrate board, the PCB board has sound-in channel, and the sound-in channel is communicated with the accommodating cavity, electric sound conversion chip MEMS and electric signal processing chip ASIC are provided on the substrate board, and the electric sound conversion chip MEMS is located at the sound-out of the sound-in channel, the cover plate is bonded with the substrate board, and located at the top of the substrate board, and the cover plate is covered on the top of the electric sound conversion chip MEMS and the electric signal processing chip ASIC, by first using drill to drill out channel, then a layer of substrate board is covered to carry out compression processing, finally form a sound-in channel on the PCB board;And also done metallization on the sound-in channel, prevent cutting and enter the cavity inside with chip, so that the ability that production link prevents particle enters the microphone inside greatly improves, and then reduce the probability of particle entry in the process of terminal customer use, save the rubber sleeve used in whole machine assembly, save cost on one hand, important is to prolong the service life of whole machine, in this way effectively solve the technical problem that the present side sound-in product is shell first hole after entering mould compression, leading to large hole, production and terminal use link is easy to enter particle, leading to microphone failure. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the drawings needed to be used in the embodiment or prior art description will be simply introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creating labor.

[0012] Figure 1 It is the front view of the PCB side sound-in silicon microphone of the utility model.

[0013] Figure 2 It is the Figure 1 sectional view of A-A line in the utility model.

[0014] Figure 3 It is the Figure 2 sectional view of B-B line in the utility model.

[0015] Figure 4 It is the structure schematic view of PCB board in the PCB side sound-in silicon microphone of the utility model.

[0016] 1-cover plate, 2-PCB board, 3-housing cavity, 4-substrate board, 5-sound inlet channel, 6-bevel, 7-rectangular channel, 8-circular channel, 9-electrical signal processing chip ASIC, 10-electro-acoustic conversion chip MEMS. DETAILED DESCRIPTION

[0017] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0018] Please refer to Figures 1 to 4 The present application provides a PCB side sound inlet silicon microphone, comprising a cover plate 1 and a PCB board 2, the cover plate 1 has a housing cavity 3, the upper part of the PCB board 2 is covered with a substrate board 4, the PCB board 2 has a sound inlet channel 5, and the sound inlet channel 5 communicates with the housing cavity 3, the substrate board 4 is provided with an electro-acoustic conversion chip MEMS 10 and an electrical signal processing chip ASIC 9, and the electro-acoustic conversion chip MEMS 10 is located at the sound outlet of the sound inlet channel 5, the cover plate 1 is bonded to the substrate board 4 and located above the substrate board 4, and the cover plate 1 covers the electro-acoustic conversion chip MEMS 10 and the electrical signal processing chip ASIC 9.

[0019] In the present embodiment, a channel is first drilled by a drill bit, and then a layer of the substrate board 4 is covered and pressed to form a sound inlet channel 5 on the PCB board 2; and the sound inlet channel 5 is also subjected to a metallization treatment to prevent debris generated by cutting from entering the cavity, thereby greatly improving the ability of the production link to prevent particles from entering the microphone, and further reducing the probability of particle entry during the use of the end customer, saving the rubber sleeve used in the assembly of the whole machine, saving cost on the one hand, and more importantly, prolonging the service life of the whole machine, thereby effectively solving the technical problem that the current side sound inlet product is first punched in the shell and then pressed in the mold, resulting in a large hole, and particles are easy to enter during production and terminal use, causing the microphone to fail.

[0020] Further, the outer side of the cover plate 1 has a bevel 6.

[0021] In the present embodiment, the design of the bevel 6 can avoid scratching the contacted components, and the bevel 6 has a modern design, which can improve the overall aesthetic appearance.

[0022] Further, the adhesive material between the cover plate 1 and the substrate board 4 is an adhesive.

[0023] In the embodiment, the different materials are connected together by the adhesive through adhesion and cohesive strength, so that they form a firm whole, and the sealing property is improved.

[0024] Further, the sound inlet channel 5 is composed of a rectangular channel 7 and a circular channel 8, and the electro-acoustic conversion chip MEMS 10 is located at the sound outlet of the circular channel 8.

[0025] In the embodiment, the sound can be transmitted into the circular channel 8 through the rectangular channel 7, and the circular channel 8 increases the cavity structure, which can better facilitate the transmission of sound into the electro-acoustic conversion chip MEMS 10.

[0026] Further, the material of the PCB board 2 is one or a combination of FR-4, polypropylene, polytetrafluoroethylene, CEM-3, aluminum-based PCB, ceramic substrate, soft board, high-TG FR-4, metal substrate, radio frequency board, Rogers and carbon fiber.

[0027] In the embodiment, the cutting method of the PCB board 2 can be water cutting, which can effectively reduce the cost; and laser cutting can also be used, which can avoid dust entering the product. The electro-acoustic conversion chip MEMS 10 realizes the interaction between the mechanical and electronic, converts the sound pressure into the change of capacitance and finally converts it into an electrical signal. The electrical signal processing chip ASIC 9 has the advantages of high performance, low power consumption, small size, low cost, high integration and customized design.

[0028] The above only discloses a preferred embodiment of the utility model, of course, cannot limit the scope of the utility model, and the person skilled in the art can understand that all or part of the above-mentioned embodiments can be implemented, and equivalent changes made according to the utility model claims still belong to the scope of the utility model.

Claims

1. A PCB-side-entry silicon microphone, characterized in that, The device includes a cover plate and a PCB board. The cover plate has a receiving cavity. A substrate board covers the top of the PCB board. The PCB board has a sound inlet channel that communicates with the receiving cavity. An electroacoustic conversion chip (MEMS) and an electrical signal processing chip (ASIC) are disposed on the substrate board. The MEMS is located at the sound outlet of the sound inlet channel. The cover plate is bonded to the substrate board and is located above the substrate board, covering the MEMS and ASIC.

2. The PCB-side sound-entry silicon microphone as described in claim 1, characterized in that, The outer side of the cover plate has a slope.

3. The PCB-side sound-entry silicon microphone as described in claim 2, characterized in that, The adhesive used to bond the cover plate to the substrate plate is an adhesive.

4. The PCB-side sound-entry silicon microphone as described in claim 3, characterized in that, The sound inlet channel consists of a rectangular channel and a circular channel, and the electroacoustic conversion chip MEMS is located at the sound outlet of the circular channel.

5. The PCB-side sound-entry silicon microphone as described in claim 4, characterized in that, The PCB board is made of one or more of the following materials: FR-4, polypropylene, polytetrafluoroethylene, CEM-3, aluminum-based PCB, ceramic substrate, flexible board, high TG FR-4, metal substrate, radio frequency board, Rogers, and carbon fiber.

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