Carrier plate jig for double-sided circuit board

Abstract

The utility model provides a carrier plate jig for a double-sided circuit board, a carrier plate of the carrier plate jig is provided with a plurality of placing units which are arranged in an array, and the bottom surface of a groove body of each placing unit comprises a hollow part and an edge bearing part. Fixing adhesive tape is attached to the back faces of the outer frame strip and the inner frame strip of the carrier plate, the fixing adhesive tape covers the edge area of the hollow-out part in the width direction of the fixing adhesive tape, the circuit board is placed in the hollow-out part of the groove body, and the back face of the circuit board is attached to the fixing adhesive tape. The area of the chip is larger than that of the circuit board, and the step-shaped structure is formed on the edge bearing part, so that when the chip is attached to the upper surface of the circuit board, the chip can be fully avoided, and interference between the chip and the groove body during chip mounting is avoided. According to the carrier plate jig, the circuit board is borne by the fixing adhesive tape, damage to components on the back face of the circuit board can be avoided, the circuit board can be well attached through the adhesion of the adhesive tape, and position deviation is prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip mounting technical field, in particular to a double -sided circuit board's carrier plate fixture. BACKGROUND

[0002] COB (Chip On Board), also known as chip direct mounting technology, refers to the naked chip is fixed on the printed circuit board, then carries out the wire bonding, and the organic glue is used to the process of chip and wire package protection, thereby realizes the electrical and mechanical connection between the chip and the electrode of circuit board.

[0003] The traditional COB production product is the chip and component (such as resistance, capacitor, transistor etc.) on the same side of the circuit board, i.e. single-sided board, the back is flat, only single-sided operation can meet the requirements, and ordinary carrier plate fixture is used to bear the product, only the corresponding groove on the carrier plate fixture can meet the bearing demand. UTILITY MODEL CONTENTS

[0004] In view of the above-mentioned shortcomings of the prior art, the utility model provides a double -sided circuit board's carrier plate fixture, the carrier plate fixture includes carrier plate, the carrier plate is equipped with a plurality of array arrangement's placement unit, the placement unit includes the groove that is concave to the carrier plate upper surface, the groove bottom includes the hollow part in the central region and the edge bearing portion around the hollow part;

[0005] The carrier plate includes outer frame strip and inner frame strip, and the adjacent placement units are separated by the inner frame strip, the back of the outer frame strip and the inner frame strip is attached with the fixed adhesive tape, along the width direction of the fixed adhesive tape, the fixed adhesive tape covers the edge region of the hollow part with the width d, and the circuit board is placed in the hollow part of the groove, and the back of the circuit board is attached with the fixed adhesive tape.

[0006] Optionally, the value range of d is 5-15mm.

[0007] Optionally, the width w of the edge bearing portion is 0.2-2mm.

[0008] Optionally, the thickness of the edge bearing portion is less than the thickness of the circuit board, and the upper surface of the circuit board protrudes from the upper surface of the groove bottom.

[0009] Optionally, the chip is attached to the upper surface of the circuit board, and the area of the chip is greater than the area of the circuit board.

[0010] Optionally, the projection of the outer contour line of the chip on the bottom of the groove is located in the edge bearing part, and a gap is formed between the outer contour line of the chip and the side wall of the groove.

[0011] Optionally, the carrier plate is provided with two rows of five columns, i.e., 10 placing units.

[0012] Optionally, the fixing tape includes three first tapes and six second tapes.

[0013] Optionally, the corner of the groove is provided with a notch, and the upper edge of the groove is provided with a chamfer.

[0014] Optionally, the back of the outer frame strip of the carrier plate in the length direction is fixed with a supporting vertical plate, and the supporting vertical plate is perpendicular to the carrier plate.

[0015] As described above, the utility model provides a carrier plate jig of double-sided circuit board, the carrier plate of the carrier plate jig is provided with a plurality of arrayed placing units, the bottom surface of the groove of the placing unit includes a hollow part in the central region and an edge bearing part around the hollow part. The back of the outer frame strip and the inner frame strip of the carrier plate is attached with a fixing tape, along the width direction of the fixing tape, the fixing tape covers the edge region of the hollow part, the circuit board is placed in the hollow part of the groove, and the back of the circuit board is attached to the fixing tape. Since the area of the chip is greater than the area of the circuit board, a step-shaped structure is formed in the edge bearing part, so that when the chip is attached to the upper surface of the circuit board, the chip can be fully avoided, and the chip and the groove are prevented from interfering during the attachment. The carrier plate jig relies on the fixing tape to bear the circuit board, can avoid damaging the components on the back of the circuit board, and can form good attachment to the circuit board by using the adhesion of the tape itself, preventing position deviation; in addition, the tape bearing mode can adapt to circuit boards of various sizes, improving the utilization rate of the carrier plate. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It shows the front structure schematic diagram of the carrier plate in the embodiment one of the utility model.

[0017] Figure 2 It shows the back structure schematic diagram of the carrier plate in the embodiment one of the utility model.

[0018] Figure 3 It shows the front structure schematic diagram of a single placing unit in the embodiment one of the utility model.

[0019] Figure 4 It shows the sectional structure schematic diagram of a single placing unit in the embodiment one of the utility model.

[0020] Figure 5 Fig. 1 shows a perspective view of a carrier plate according to an embodiment of the present application.

[0021] Figure 6 Fig. 2 shows a side view of the carrier plate according to an embodiment of the present application.

[0022] Element number explanation

[0023] Carrier plate 10; placement unit 11; hollow part 21; edge bearing part 22; first adhesive tape 411; second adhesive tape 412; circuit board 31; chip 32; notch 121; chamfer 111; support vertical plate 51. DETAILED DESCRIPTION

[0024] The above embodiments are only used to illustrate the technical solutions of the present application, and should not be used to limit the scope of the present application. In addition, those skilled in the art can make various modifications and variations to the present application without departing from the spirit of the present application. Therefore, the scope of the protection of the present application should be subject to the scope of the claims of the present application.

[0025] In the detailed description of the embodiments of the present application, the cross-sectional view of the device structure may be partially enlarged without the general proportion for the convenience of description, and the schematic view is only an example, which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.

[0026] For the convenience of description, spatial relationship words such as "under", "below", "lower", "under", "above", "upper" and the like may be used to describe the relationship between one element or feature and other elements or features shown in the drawings. It will be understood that these spatial relationship words are intended to include other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as "between" two layers, it can be the only layer between the two layers, or one or more intervening layers can also be present. "Between" is used herein to include both end point values.

[0027] In the context of the present application, the structure described as the first feature "above" the second feature can include the embodiment in which the first and second features are formed in direct contact, and can also include the embodiment in which another feature is formed between the first and second features, so that the first and second features can not be in direct contact.

[0028] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0029] Example 1

[0030] like Figures 1 to 6 As shown, this embodiment provides a carrier fixture for a double-sided circuit board, the carrier fixture comprising:

[0031] The carrier plate 10 is provided with a plurality of placement units 11 arranged in an array. Each placement unit 11 includes a groove that is recessed relative to the upper surface of the carrier plate. The bottom of the groove includes a hollow part 21 located in the central region and an edge bearing part 22 surrounding the hollow part.

[0032] Furthermore, the carrier plate 10 includes an outer frame strip and an inner frame strip, and adjacent placement units 11 are separated by the inner frame strip. The back of the outer frame strip and the inner frame strip are attached with fixing tape, which includes a first tape 411 extending along the length direction of the carrier plate and a second tape 412 extending along the width direction of the carrier plate.

[0033] Furthermore, along the width direction of the fixing tape, the fixing tape covers the edge area of ​​the cutout portion with a width d of 5-15mm. The circuit board 31 is placed inside the cutout portion of the groove, and the back of the circuit board 31 is in contact with the fixing tape. Placing the circuit board in the cutout portion can prevent the components on the back of the circuit board from being damaged by pressure. At the same time, the tape supports the circuit board, and the adhesiveness of the tape itself can form a good adhesion to the circuit board, preventing positional displacement.

[0034] The thickness of the edge support portion 22 is less than the thickness of the circuit board 31, meaning the upper surface of the circuit board 31 protrudes beyond the upper surface of the slot bottom. This prevents the chip 32 from contacting the edge support portion 22 during chip mounting. The chip 32 is mounted to the upper surface of the circuit board 31 using a pick-and-place machine, and the projection of the outer contour of the chip 32 onto the slot bottom lies within the edge support portion 22, with a gap between the outer contour of the chip and the sidewall of the slot. Since the area of ​​the chip 32 is larger than the area of ​​the circuit board 31, this embodiment forms a stepped structure in the edge support portion 22, which provides sufficient clearance for the chip and prevents interference between the chip and the slot during mounting. The width w of the edge support portion 22 (i.e., the width of the edge support portion protruding inward relative to the sidewall of the slot) is 0.2-2mm, for example, 0.2mm, 0.5mm, 1mm, or 1.5mm. In this embodiment, 0.5mm is preferred, meaning the clearance for the chip edge protruding beyond the edge of the circuit board is 0.5mm.

[0035] Further, in the embodiment, the carrier plate 10 is provided with two rows of five columns, i.e. 10 placement units. The size of the carrier plate is 253x100mm. Of course, in actual use, the number or arrangement of the placement units can be changed arbitrarily, and no further limitation is made here.

[0036] Further, the cross section of the groove body is a bevelled rectangle with two cutting angles, and the circuit board is also a bevelled rectangle. In the embodiment, the cross section size of the groove body is 42.3x29.3mm, the width of the edge bearing part is set to 0.5mm, and the size of the hollow part is 41.3x28.3mm; the size of the circuit board is 39-41mmx25-28mm, i.e. less than the size of the hollow part, so as to ensure that it can be completely placed in the hollow part, for example, the size of the circuit board can be 40.7x27.76mm or 39.62x25.65mm. Similarly, the size of the groove body also needs to be set according to the size of the circuit board, and is not limited to the above size values.

[0037] Correspondingly, in the embodiment, the number of fixing tapes is designed to be 3 first tapes 411 and 6 second tapes 412. As an example, the size of the 3 first tapes is 7x253mm (attached to the outer frame strip), 22x253mm (attached to the inner frame strip), and 7x253mm (attached to the outer frame strip), and the size of the second tape attached to the inner frame strip is 22x71mm. It should be understood that the size of the fixing tape also needs to be set according to the size of the carrier plate and the groove body, as long as a certain coverage amount is formed on the edge area of the hollow part to meet the use requirements.

[0038] Further, the corner of the groove body is provided with a notch 121 to facilitate taking and placing. The upper edge of the groove body is provided with a chamfer 111 to facilitate the placement of the circuit board 31.

[0039] Further, the outer frame strip of the carrier plate 10 is fixed with a support vertical plate 51 on the back along the length direction, and the support vertical plate 51 is perpendicular to the carrier plate. The support vertical plate 51 serves as a support to form a certain gap between the back of the carrier plate (the back of the circuit board) and the placement table surface when placing, so as to avoid pressing the back of the circuit board to damage the components. The material of the carrier plate is preferably an aluminum alloy plate to ensure strength while realizing light weight.

[0040] In summary, the utility model provides a kind of carrier plate jig of double-sided circuit board, the carrier plate of this carrier plate jig is equipped with multiple arrayed placement units, the groove bottom surface of placement unit includes the hollow part in central region and the edge bearing portion around hollow part.Carrying out the step-shaped structure in edge bearing portion by the back of carrier plate outer frame strip and inner frame strip is attached with fixed adhesive tape, along the width direction of fixed adhesive tape, the edge region of hollow part is covered by fixed adhesive tape, circuit board is placed in the hollow part of groove, and the back of circuit board is attached with fixed adhesive tape.Because the area of chip is greater than the area of circuit board, when chip and circuit board upper surface are attached, the step-shaped structure in edge bearing portion can form sufficient avoidance to chip, avoid interference between chip and groove when patching.The carrier plate jig is loaded to circuit board by fixed adhesive tape, can avoid damaging the component on the back of circuit board, and the adhesion of adhesive tape itself can form better attachment to circuit board, prevent position deviation;In addition, the mode of adhesive tape loading can adapt to circuit board of multiple sizes, improve the utilization of carrier plate.

[0041] The above embodiments only illustrate the principles and effects of the utility model, and are not used to limit the utility model. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A carrier fixture for a double-sided circuit board, characterized in that, The carrier plate fixture includes a carrier plate, which is provided with a plurality of placement units arranged in an array. Each placement unit includes a groove that is recessed relative to the upper surface of the carrier plate. The bottom of the groove includes a hollow part located in the central region and an edge bearing part surrounding the hollow part. The carrier plate includes an outer frame strip and an inner frame strip. Adjacent placement units are separated by the inner frame strip. The back of the outer frame strip and the inner frame strip are attached with fixing tape. Along the width direction of the fixing tape, the fixing tape covers the edge area of ​​the cutout portion with a width of d. The circuit board is placed in the cutout portion of the groove, and the back of the circuit board is attached to the fixing tape.

2. The carrier fixture for double-sided circuit boards according to claim 1, characterized in that: The value of d ranges from 5 to 15 mm.

3. The carrier fixture for double-sided circuit boards according to claim 1, characterized in that: The width w of the edge bearing portion is 0.2-2mm.

4. The carrier fixture for double-sided circuit boards according to claim 1, characterized in that: The thickness of the edge bearing portion is less than the thickness of the circuit board, and the upper surface of the circuit board protrudes beyond the upper surface of the groove bottom.

5. The carrier fixture for double-sided circuit boards according to claim 1, characterized in that: The chip is attached to the upper surface of the circuit board, and the area of ​​the chip is larger than the area of ​​the circuit board.

6. The carrier fixture for double-sided circuit boards according to claim 5, characterized in that: The projection of the outer contour of the chip onto the bottom of the groove is located within the edge bearing portion, and there is a gap between the outer contour of the chip and the side wall of the groove.

7. The carrier fixture for double-sided circuit boards according to claim 1, characterized in that: The carrier plate has two rows and five columns, totaling 10 placement units.

8. The carrier fixture for double-sided circuit boards according to claim 7, characterized in that: The fixing tape includes 3 first tapes and 6 second tapes.

9. The carrier fixture for a double-sided circuit board according to claim 1, characterized in that: The groove has a notch at the corner and a chamfer on the upper edge.

10. The carrier fixture for a double-sided circuit board according to claim 1, characterized in that: A supporting vertical plate is fixed to the back of the outer frame strip along the length direction of the carrier plate, and the supporting vertical plate is perpendicular to the carrier plate.

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