Heat dissipation structure of heating electric appliance element

By introducing cooling water channels and heat exchange tubes into the heating electrical components, and combining them with a circulating water cooling device, the problem of low efficiency of existing radiators is solved, and a more efficient heat dissipation effect is achieved.

CN223584535UActive Publication Date: 2025-11-21GUANGDONG QIANMA ELECTRONICS CO LTD
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Patent Information

Application Number
CN202421445151.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-24
Publication Date
2025-11-21
Estimated Expiration
2034-06-24

AI Technical Summary

Technical Problem

Existing heat sinks for heat-generating electrical components are inefficient and require improved heat dissipation.

Method used

A heat sink with cooling water channels and heat exchange tubes is used, combined with a circulating water cooling device, to achieve water cooling function and improve heat dissipation efficiency.

Benefits of technology

The design of cooling water channels and heat exchange tubes significantly improves the heat dissipation efficiency of the heat sink, enabling better cooling of circuit boards and heat-generating electrical components.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to a heat dissipation structure of a heating electric appliance element, which comprises a heat dissipation block used for being respectively connected with a circuit board and the heating electric appliance element, a cooling water channel capable of enabling cooling water to circulate in the heat dissipation block for heat exchange is arranged in the heat dissipation block, and the head end and the tail end of the cooling water channel are open. The cooling water channel can be used for guiding cooling water to flow through the heat dissipation block, so that the heat dissipation efficiency of the heat dissipation block is improved, and the heat dissipation block can have a better cooling effect on the circuit board and the electric appliance elements.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of heat dissipation element, concretely relates to a heat dissipation structure of heating electric appliance element. BACKGROUND

[0002] Common heating electric appliance element, for example, silicon controlled rectifier etc., will produce greater heat when working, therefore it needs to configure radiator together with use. The existing radiator is generally through setting up heat dissipation fin cooperation fan mode realizes the heat dissipation effect, but, the efficiency of this kind of heat dissipation mode is relatively low, and the heat dissipation effect of heating electric appliance element still needs to continue to improve.

[0003] Therefore, further improvement is needed. UTILITY MODEL CONTENTS

[0004] The utility model discloses a heat dissipation structure of heating electric appliance element can realize the water cooling function of heat dissipation block, thereby improving the heat dissipation effect of heat dissipation block to circuit board and heating electric appliance element.

[0005] The utility model discloses a heat dissipation structure of heating electric appliance element can realize the water cooling function of heat dissipation block, thereby improving the heat dissipation effect of heat dissipation block to circuit board and heating electric appliance element.

[0006] A heat dissipation structure of heating electric appliance element, including heat dissipation block for installing connection with circuit board and heating electric appliance element respectively, heat dissipation block is equipped with cooling water channel that can make cooling water in heat dissipation block circulation to exchange heat, and the both ends of cooling water channel are open.

[0007] As a specific scheme, the both ends of cooling water channel are connected with circulating water cooling device.

[0008] As a specific scheme, the heat exchange pipe for cooling water circulation to exchange heat with heat dissipation block is equipped on cooling water channel.

[0009] As a specific scheme, the heat exchange pipe first end and tail are connected circulating water cooling device respectively.

[0010] As a specific scheme, the heat exchange pipe inserts cooling water channel and is connected with its close cooperation.

[0011] As a specific scheme, the cross section of cooling water channel is round shape.

[0012] As a specific scheme, the surface of heat dissipation block is distributed with several heat dissipation convex teeth, and the heat dissipation groove is formed between adjacent heat dissipation convex teeth.

[0013] As a specific scheme, the heat dissipation block is integrally formed through metal aluminum material.

[0014] As a specific scheme, the outer side of the heat dissipation block is respectively provided with a first heat exchange surface and a second heat exchange surface for abutting with the circuit board and the heating electrical element, the first heat exchange surface and the second heat exchange surface are both planar structures, the first heat exchange surface and the second heat exchange surface are perpendicular to each other, and the cooling water channel is arranged in parallel with the first heat exchange surface and the second heat exchange surface.

[0015] As a specific scheme, the distance from the first heat exchange surface to the center position of the cooling water channel is d1, the distance from the second heat exchange surface to the center position of the cooling water channel is d2, and d1 < d2.

[0016] The heat dissipation block has the following beneficial effects:

[0017] The cooling water channel can be used for guiding the cooling water to flow through the heat dissipation block, so that the heat dissipation efficiency of the heat dissipation block is improved, and the heat dissipation block can have a better cooling effect on the circuit board and the heating electrical element. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The structure diagram of the heat dissipation block of the utility model embodiment Figure One .

[0019] Figure 2 The structure diagram of the heat dissipation block of the utility model embodiment Figure Two .

[0020] Figure 3 The installation diagram of the heat dissipation block, the circuit board and the heating electrical element of the utility model embodiment Figure One .

[0021] Figure 4 The installation diagram of the heat dissipation block, the circuit board and the heating electrical element of the utility model embodiment Figure Two . DETAILED DESCRIPTION

[0022] The utility model will be further described in connection with the drawings and embodiments.

[0023] Referring to Figures 1-4 , the heat dissipation structure of the heating electrical element, including the heat dissipation block 1 for being connected with the circuit board 2 and the heating electrical element 3 respectively, characterized by that the heat dissipation block 1 is provided with the cooling water channel 11 capable of making the cooling water flow through the heat dissipation block 1 to exchange heat, the two ends of the cooling water channel 11 are both open, the cooling water metal pipe 4 can be arranged in the cooling water channel 11, or the cooling water directly enters the cooling water channel 11, so that the heat dissipation and cooling effect of the heat dissipation block 1 is greatly improved. Wherein, the cooling water channel 11 can also be directly replaced by the heat exchange pipe, and the two ends of the heat exchange pipe are connected with the circulating water cooling device.

[0024] The heat dissipation structure of the heating electric element can also be applied to an electric appliance with a cold water system, such as a hot water machine.

[0025] The cooling water channel 11 can be used to guide the cooling water to flow through the heat dissipation block 1, so as to improve the heat dissipation efficiency of the heat dissipation block 1, and make the heat dissipation block 1 have a better cooling effect on the circuit board 2 and the heating electric element.

[0026] Further, the cooling water channel 11 is connected with the circulating water cooling device at both ends.

[0027] Further, the cooling water channel 11 is provided with a heat exchange pipe 4 for cooling water flow to exchange heat with the heat dissipation block 1, when the heat dissipation block 1 has a small volume, it is not easy to set the joint connected with the circulating water cooling device at both ends, by setting the heat exchange pipe 4, the heat exchange pipe 4 can be bent according to actual needs and connected with the circulating water cooling device at a suitable position.

[0028] Further, the heat exchange pipe 4 is connected with the circulating water cooling device at both ends.

[0029] Further, the heat exchange pipe 4 is inserted into the cooling water channel 11 and connected with it in tight fit.

[0030] Further, the cross section of the cooling water channel 11 is circular in shape, which can relatively improve the water flow of the cooling water channel 11, and when the cooling water channel 11 is matched with the cooling water metal pipe 4, the shape is more matched, and the assembly is more efficient.

[0031] Further, the surface of the heat dissipation block 1 is distributed with a plurality of heat dissipation teeth 12, and the heat dissipation grooves 13 are formed between the adjacent heat dissipation teeth 12, which increases the area of the surface of the heat dissipation block 1 in contact with the air, and further improves the heat dissipation and cooling efficiency of the heat dissipation block 1.

[0032] Further, the heat dissipation block 1 is integrally formed by aluminum material, which simplifies the processing technology of the heat dissipation block 1, and ensures that the heat dissipation block 1 has good heat conduction capacity.

[0033] Further, the heat dissipation block 1 is provided with a first heat exchange surface 14 and a second heat exchange surface 15 for abutting with the circuit board 2 and the heating electric element 3 respectively, the first heat exchange surface 14 and the second heat exchange surface 15 are both planar structures, the first heat exchange surface 14 and the second heat exchange surface 15 are perpendicular to each other, and the cooling water channel 11 is arranged in parallel with the first heat exchange surface 14 and the second heat exchange surface 15, which can ensure that the first heat exchange surface 14 and the second heat exchange surface 15 are in full contact with the circuit board 2 and the heating electric element 3, so that the heat generated by the circuit board 2 and the heating electric element 3 can be better conducted to the heat dissipation block 1.

[0034] Further, the distance from the first heat exchange surface 14 to the center position of the cooling water channel 11 is d1, the distance from the second heat exchange surface 15 to the center position of the cooling water channel 11 is d2, d1 < d2, the part of the heat dissipation block 1 corresponding to the center position of the cooling water channel 11 of the second heat exchange surface 15 is relatively thicker, the screw hole can be conveniently arranged, and the heat generating electric element 3 can be connected and fixed with the heat dissipation block 1 through the screw device.

[0035] The above embodiments are only preferred schemes of the present application, and the present application can have other embodiments. Those skilled in the art can make equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope set by the claims of the present application.

Claims

1. A heat dissipation structure for a heat-generating electrical element, comprising a heat sink (1) for mounting and connecting to a circuit board (2) and a heat-generating electrical element (3) respectively, characterized in that, The heat sink (1) is provided with a cooling water channel (11) that allows cooling water to flow through the heat sink (1) for heat exchange. Both ends of the cooling water channel (11) are open. The heat sink (1) is integrally formed from aluminum metal. The outer side of the heat sink (1) is provided with a first heat exchange surface (14) and a second heat exchange surface (15) for contacting the circuit board (2) and the heat-generating electrical components (3). The first heat exchange surface (14) and the second heat exchange surface (15) are both planar structures. The first heat exchange surface (14) and the second heat exchange surface (15) are perpendicular to each other. The cooling water channel (11) is arranged parallel to the first heat exchange surface (14) and the second heat exchange surface (15).

2. The heat dissipation structure of the heating electrical element according to claim 1, characterized in that: The cooling water channel (11) is connected to a circulating water cooling device at both ends.

3. The heat dissipation structure of the heating electrical element according to claim 1, characterized in that: The cooling water channel (11) is provided with a heat exchange tube (4) for cooling water to flow and exchange heat with the heat sink (1).

4. The heat dissipation structure of the heating electrical element according to claim 3, characterized in that: The heat exchange tube (4) is connected to a circulating water cooling device at both ends.

5. The heat dissipation structure of the heating electrical element according to claim 3, characterized in that: The heat exchange tube (4) is inserted into the cooling water channel (11) and tightly connected thereto.

6. The heat dissipation structure of the heating electrical element according to claim 1, characterized in that: The cross-section of the cooling water channel (11) is circular.

7. The heat dissipation structure of the heating electrical element according to claim 1, characterized in that: The surface of the heat sink (1) is provided with a number of heat dissipation protrusions (12), and heat dissipation grooves (13) are formed between adjacent heat dissipation protrusions (12).

8. The heat dissipation structure of the heating electrical element according to claim 1, characterized in that: The distance from the first heat exchange surface (14) to the center of the cooling water channel (11) is d1, and the distance from the second heat exchange surface (15) to the center of the cooling water channel (11) is d2, where d1 < d2.