Energy storage device

Abstract

The utility model provides energy storage equipment, and relates to the technical field of power system energy storage, and the energy storage equipment comprises a case, and a power board and a radiator which are arranged in the case. The radiator comprises a radiator body and at least one heat conduction pipe, the radiator body is connected to the power board, and the at least one heat conduction pipe is embedded in the side, facing the power board, of the radiator body; the heat conductivity of the heat conduction pipe is greater than that of the radiator body; the heat conduction pipe is provided with a heat absorption end and a heat dissipation end, the power board is provided with at least one high heating area and at least one low heating area, the heat absorption end abuts against the at least one high heating area of the power board, and the heat dissipation end abuts against the at least one low heating area of the power board. The heat of each area of the power board is averaged through the heat conduction pipes, the heat dissipation uniformity of the radiator body to each area of the power board can be improved, the problem that the heat dissipation effect is affected due to the fact that local heat of the power board is too high is not prone to occurring, and stable operation of energy storage equipment is guaranteed.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of energy storage of power systems, and more particularly relates to an energy storage device. BACKGROUND

[0002] The energy storage device is mainly applied to power systems, can store excess electric energy, and releases energy at a demand peak to balance the supply and demand of the power system, and improve the stability and reliability of the power system. The energy storage device is mainly composed of a case and a power board arranged in the case. When the energy storage device is running, the power devices on the power board generate a large amount of heat during operation, and a heat dissipation structure needs to be used to dissipate heat and cool the power board to avoid damage caused by abnormally running due to excessively high temperature of the power board.

[0003] At present, heat dissipation fins with high thermal conductivity are usually installed on one side of the power board to absorb the heat generated by the power board, or heat dissipation fans are arranged on one side of the power board to continuously transport external cold air to the power board for heat exchange to achieve heat dissipation and cooling of the power board.

[0004] However, since different components on the power board generate different temperatures during operation, and the distribution positions of the components on the power board are also relatively dense, the area of the power board with high heat generating components or a large number of densely arranged components generates a large amount of heat. The conventional heat dissipation mode such as the heat dissipation fin or the heat dissipation fan can only dissipate heat of the power board as a whole, and the heat dissipation and cooling effect of the area with a large amount of heat on the power board is limited, and there is a defect of uneven heat dissipation and poor heat dissipation efficiency. CONTENT OF THE INVENTION

[0005] The purpose of the embodiment of the application is to provide an energy storage device to solve the problems of uneven heat dissipation and poor heat dissipation efficiency of the energy storage device in the prior art.

[0006] To achieve the above-mentioned purpose, the application provides an energy storage device, which comprises a case, a power board arranged in the case, and a heat sink; the heat sink comprises a heat sink body and at least one heat pipe, the heat sink body is connected to the power board, and at least one heat pipe is embedded on one side of the heat sink body facing the power board; the thermal conductivity of the heat pipe is greater than that of the heat sink body; the heat pipe has a heat absorbing end and a heat dissipating end, the power board has at least one high heat generating area and at least one low heat generating area, the heat absorbing end abuts against at least one high heat generating area of the power board, and the heat dissipating end abuts against at least one low heat generating area of the power board.

[0007] In some embodiments, the heat sink body comprises a plurality of heat dissipation fins arranged at intervals, and a heat dissipation channel is formed between two adjacent heat dissipation fins.

[0008] In some embodiments, the cabinet comprises a first cabinet body and a second cabinet body connected to the first cabinet body; the first cabinet body has a first cavity, the second cabinet body has a second cavity, and the first cavity is in communication with the second cavity; the power board is connected to the first cavity and covers the communication between the first cavity and the second cavity; the heat sink is located in the second cavity, and the second cabinet body is provided with a ventilation structure for communicating the second cavity with an external space.

[0009] In some embodiments, at least one first heat dissipation fan is arranged in the first cavity, and the first heat dissipation fan is used to form a first heat dissipation airflow circulating between the high heat generation area and the low heat generation area in the first cavity.

[0010] In some embodiments, at least one second heat dissipation fan is arranged in the second cavity, the ventilation structure comprises a first air inlet and a first air outlet, the first air inlet, the second heat dissipation fan, the heat sink and the first air outlet are arranged in a first direction, the second heat dissipation fan is used to form a second heat dissipation airflow flowing towards the first air outlet in the second cavity, and the extension direction of the heat dissipation channel is the same as the flow direction of the second heat dissipation airflow.

[0011] In some embodiments, the energy storage device further comprises at least one inverter inductor, the inverter inductor is arranged in the second cavity and electrically connected to the power board, and the inverter inductor is located between the first air inlet and the second heat dissipation fan.

[0012] In some embodiments, the ventilation structure further comprises a second air inlet, the second air inlet is distributed on a different side of the second cabinet body from the first air inlet, and the inverter inductor is located between the second air inlet and the second heat dissipation fan.

[0013] In some embodiments, the energy storage device further comprises at least one boost inductor, the boost inductor is arranged in the second cavity and connected to the power board, and the boost inductor is located between the second fan and the first air outlet.

[0014] In some embodiments, the ventilation structure further comprises a second air outlet, the second air outlet is distributed on a different side of the second cabinet body from the first air outlet, the heat sink is arranged close to the first air outlet, the boost inductor is arranged close to the second air outlet, and the second heat dissipation fan is further used to form a third heat dissipation airflow flowing towards the second air outlet in the second cavity.

[0015] In some embodiments, the first box comprises a support plate, a first cover plate and a plurality of first side plates; the plurality of first side plates are arranged around the support plate, the first cover plate is arranged on the side of the plurality of first side plates away from the support plate, and the support plate, the plurality of first side plates and the first cover plate together form the first cavity; the second box comprises a second cover plate and a plurality of second side plates, the plurality of second side plates are arranged on the side of the support plate away from the first side plates, and the second cover plate is arranged on the side of the plurality of second side plates away from the support plate, and the support plate, the plurality of second side plates and the second cover plate together form the second cavity; the part of the support plate corresponding to the second cavity is provided with a through hole to communicate the first cavity and the second cavity.

[0016] The energy storage device provided by the application has the beneficial effects that: in the process of operation of the power board, the heat generated by the power board during operation is absorbed by the heat sink, wherein the heat sink is composed of a heat sink body and a heat pipe, and the heat pipe has a larger thermal conductivity, so that the high heat generated by the high heat generation area of the power board is preferentially absorbed by the heat absorption end of the corresponding heat pipe and then transmitted to the low heat generation area of the power board through the heat dissipation end of the heat pipe, so as to average the heat generation of each area of the power board, and then the heat sink body is used to uniformly absorb the heat of each area of the power board, so as to realize the heat dissipation and cooling of the power board. Compared with the prior art, the heat of each area of the power board is first averaged by the heat pipe, so that the problem of affecting the heat dissipation effect due to the excessive local heat of the power board is less likely to occur, thereby improving the heat dissipation effect of the heat sink on the power board and ensuring the stable operation of the energy storage device. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 The structure diagram of the energy storage device in an exemplary embodiment of the application is shown in the figure.

[0019] Figure 2 The exploded view of the energy storage device is shown in the figure. Figure 1

[0020] Figure 3 The structure diagram of the energy storage device in another view of an exemplary embodiment of the application is shown in the figure.

[0021] Figure 4 The exploded view of the energy storage device is shown in the figure. Figure 3

[0022] ​​Figure 5 Fig. 1 is a perspective view of a power supply device according to an example embodiment of the present application; Figure 4 Fig. 2 is a partial enlarged view of part A in Fig. 1;

[0023] Figure 6 Fig. 3 is a partial view of the connection relationship between a heat sink and a power board in an example embodiment of the present application;

[0024] Figure 7 Fig. 4 is a partial view of the arrangement of heat pipes in an example embodiment of the present application.

[0025] In the drawings, the reference signs refer to the following items:

[0026] 100 - cabinet; 110 - first cabinet; 1101 - first cavity; 111 - support plate; 112 - first side plate; 113 - first cover plate; 120 - second cabinet; 121 - second side plate; 1211 - partition plate; 122 - second cover plate; 1201 - second cavity; 1202 - first air inlet; 1203 - first air outlet; 1204 - second air inlet; 1205 - second air outlet; 200 - power board; 201 - high heat generation area; 202 - low heat generation area; 300 - heat sink; 310 - heat dissipation fin; 3101 - heat dissipation channel; 320 - heat pipe; 3201 - heat absorption end; 3202 - heat dissipation end; 400 - first heat dissipation fan; 500 - second heat dissipation fan; 600 - inverse inductor; 700 - boost inductor. DETAILED DESCRIPTION

[0027] In order to make the technical problems to be solved by the present application, the technical solutions and the beneficial effects clearer, the present application will be further described in detail below with reference to the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and not to limit the present application.

[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0029] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0030] In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and do not denote or imply relative importance or a number of indicated technical features. Thus, features defined with "first", "second", etc. can include one or more such features explicitly or implicitly. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0031] In order to make the purpose, technical scheme and advantages of the utility model more clear, the utility model is further described in detail below with the help of the drawings and examples.

[0032] As shown in Figures 1-7 The present application provides a kind of energy storage equipment, including case 100, the power board 200 of being arranged in case 100 and for the radiator 300 of heat dissipation to power board 200;Radiator 300 includes radiator body and at least one heat pipe 320, radiator body is connected to power board 200, at least one heat pipe 320 is embedded in the side of radiator body towards power board 200;The heat conductivity of heat pipe 320 is greater than the heat conductivity of radiator body;Heat pipe 320 has heat absorption end 3201 and heat dissipation end 3202, power board 200 has at least one high heat area 201 and at least one low heat area 202, heat absorption end 3201 is abutted to at least one high heat area 201 of power board 200, heat dissipation end 3202 is abutted to at least one low heat area 202 of power board 200.

[0033] Specifically, case 100 is the shell structure with a certain volume, so that the cavity structure capable of installing power board 200 is formed in the inside of case 100.The shape of case 100 and the shape of cavity can be arbitrary, can be adapted to set according to the structure of power board 200 required to be installed.

[0034] Power board 200 is printed circuit board (PBC, Printed Circuit Board) with a plurality of components welded on one side, components can be power supply, resistance, capacitor or inductor etc. electronic device, a plurality of components are connected to each other by wire on power board 200 and constitute energy storage circuit, to execute corresponding energy storage work by energy storage circuit.

[0035] In the running process of power board 200, wire and each component on power board 200 will generate heat. High heat area 201 refers to the part that power board 200 is provided with components with larger heat or component arrangement is dense, low heat area 202 refers to the part that power board 200 is provided with components with lower heat, component arrangement is sparse or is not provided with component. The number and size of high heat area 201 and low heat area 202 can be determined according to the arrangement of each component on power board 200.

[0036] The heat sink body can be made of metal materials with good thermal conductivity, such as aluminum, copper, or stainless steel, and is bonded to the power board 200 with thermally conductive adhesive, so that the heat generated by the power board 200 can be absorbed by the heat sink body. Figure 5 As shown, in some embodiments, the heat sink body may include multiple spaced-apart heat dissipation fins 310, with a heat dissipation channel 3101 formed between adjacent heat dissipation fins 310. Each heat dissipation fin 310 is a flat plate structure made of a metal material with good thermal conductivity, such as aluminum, copper, or stainless steel. The shape of the heat dissipation fin 310 can be arbitrary, for example, rectangular. The heat dissipation fins 310 can be perpendicular to the power board 200, and multiple heat dissipation fins 310 can be parallel to each other. Multiple heat dissipation fins 310 can be directly connected to the power board 200, or they can be first fixed together using connectors of the same material before being connected to the power board 200. The structure of the connectors is not specifically limited. After absorbing the temperature of the power board 200, the heat dissipation fins 310 will transfer the heat away from the power board 200 and dissipate the heat into the adjacent heat dissipation channel 3101, thereby achieving the heat dissipation and cooling effect on the power board 200.

[0037] like Figure 6 As shown, the heat pipe 320 is a tubular component made of a metal material with good thermal conductivity, such as aluminum, copper, or stainless steel. The shape of the heat pipe 320 can be arbitrary; for example, the cross-sectional shape of the heat pipe 320 can be circular or rectangular. Each heat dissipation fin 310 can have a groove adapted to the shape of the heat pipe 320 on the side facing the power plate 200, so that the heat pipe 320 can be embedded in the groove and contact the back of the power plate 200. The thermal conductivity of the heat pipe 320 should be greater than the heat dissipation rate of the heat sink body. For example, when the heat dissipation fins 310 in the heat sink body are made of aluminum, the heat pipe 320 can be made of copper.

[0038] like Figure 7 As shown, the heat-absorbing end 3201 and the heat-dissipating end 3202 are the two extensions of the heat pipe 320, respectively. The heat-absorbing end 3201 and the heat-dissipating end 3202 face the high-heat-generating region and the low-heat-generating region 202 of the power board 200, respectively. The number of heat pipes 320 can be arbitrary. One or more heat pipes 320 can be arranged between a high-heat-generating region 201 and a low-heat-generating region 202. A high-heat-generating region 201 can also correspond to multiple different low-heat-generating regions 202 through multiple heat pipes 320, or multiple high-heat-generating regions 201 can correspond to a single low-heat-generating region 202 through multiple heat pipes 320. The arrangement shape of the heat pipes 320 can also be arbitrary, such as straight or curved, and can be adapted based on the relative positions of the high-heat-generating region 201 and the low-heat-generating region 202 corresponding to the heat-absorbing end 3201 and the heat-dissipating end 3202.

[0039] Since the heat conductivity of the heat conduction pipe 320 is greater than the heat dissipation rate of the heat dissipation body, the heat generated by the power plate 200 will be preferentially absorbed by the heat conduction pipe 320, wherein the high heat generated by the high heat generation area 201 will be absorbed by the heat absorption end 3201 of the heat conduction pipe 320, and then transmitted to the corresponding low heat generation area 202 of the power plate 200 through the heat dissipation end 3202 after conduction by the heat conduction pipe 320, so as to balance the temperature of the power plate 200 in the high heat generation area 201 and the low heat generation area 202, thereby improving the heat dissipation effect of the heat dissipation body on each area of the power plate 200, and better heat dissipation uniformity of the power plate 200, so that the power plate 200 is less likely to have a problem of local temperature being too high to affect the heat dissipation effect.

[0040] In combination Figures 1-4 As shown in FIG. 1, in some embodiments, the cabinet 100 includes a first cabinet 110 and a second cabinet 120 connected to the first cabinet 110; the first cabinet 110 has a first cavity 1101, and the second cabinet 120 has a second cavity 1201, the first cavity 1101 and the second cavity 1201 are arranged in communication; the power plate 200 is connected in the first cavity 1101 and shields the communication between the first cavity 1101 and the second cavity 1201; the heat dissipation body 300 is located in the second cavity 1201, and the second cabinet 120 is provided with a ventilation structure for communicating the second cavity 1201 with the outside space.

[0041] Specifically, the first cabinet 110 and the second cabinet 120 are both shell structures with a certain volume, and the shapes of the first cabinet 110 and the second cabinet 120 can be arbitrary, which can be adapted according to the shape of the power plate 200, the shape of the heat dissipation body 300 and other required built-in components, for example, the first cabinet 110 and the second cabinet 120 are both rectangular shell structures. Among them, the first cabinet 110 and the second cabinet 120 can be integrally formed, or can be connected and fixed by screws or other connecting members.

[0042] The first cabinet 110 can include a support plate 111, a first cover plate 113 and a plurality of first side plates 112; the plurality of first side plates 112 are arranged around the four sides of the support plate 111, and the first cover plate 113 is covered on the side of the plurality of first side plates 112 away from the support plate 111, and the support plate 111, the plurality of first side plates 112 and the first cover plate 113 together form the first cavity 1101.

[0043] Specifically, the support plate 111 can be a rectangular flat plate structure, the number of the first side plates 112 is four and the first side plates 112 are arranged around the support plate 111, the first side plates 112 are perpendicular to the support plate 111, the first side plates 112 form an opening on the side away from the support plate 111, the first cover plate 113 has the same shape as the opening and covers the opening to close the opening, thereby forming a rectangular first box 110 and forming a first cavity 1101 between the support plate 111, the first side plates 112 and the first cover plate 113. The support plate 111 and the first side plates 112 can be integrally formed, and the first cover plate 113 can be connected to the first side plates 112 by buckling members or fasteners, so as to facilitate the installation and disassembly of the first cover plate 113.

[0044] The second box 120 can include a second cover plate 122 and a plurality of second side plates 121, the plurality of second side plates 121 are arranged on the side of the support plate 111 away from the first side plates 112, and the second cover plate 122 covers the side of the plurality of second side plates 121 away from the support plate 111, and the support plate 111, the plurality of second side plates 121 and the second cover plate 122 together form a second cavity 1201.

[0045] Specifically, the number of the second side plates 121 can also be four and the second side plates 121 form a rectangular structure on the support plate 111, and the second side plates 121 form an opening on the side away from the support plate 111, the second cover plate 122 has the same shape as the opening and covers the plurality of second side plates 121 to close the opening, thereby forming a rectangular second box 120 on the side of the support plate 111 away from the first side plates 112 through the plurality of second side plates 121 and the second cover plate 122, and the support plate 111, the plurality of second side plates 121 and the second cover plate 122 together form a second cavity 1201. The plurality of second side plates 121 and the support plate 111 can be integrally formed, and the plurality of second side plates 121 and the support plate 111 can also be connected and fixed by screws and other fasteners. The second cover plate 122 can be connected to the plurality of second side plates 121 by screws and other fasteners, so as to facilitate the installation and disassembly of the second cover plate 122.

[0046] The part of the support plate 111 corresponding to the second cavity 1201 can be provided with a through hole to communicate the first cavity 1101 and the second cavity 1201. The power board 200 can be installed on the surface of the support plate 111 facing the first side plates 112, so that the front surface of the power board 200 faces the first cavity 1101 and the back surface of the power board 200 faces the second cavity 1201 through the through hole in the support plate 111, and the heat sink 300 is located in the second cavity 1201 and can be connected to the back surface of the power board 200 through the through hole in the support plate 111. The front surface of the power board 200 refers to the surface on which a plurality of components are welded, and the back surface of the power board 200 refers to the surface away from the components.

[0047] After the power board 200 is shielded by the through hole, the first cavity 1101 and the second cavity 1201 are relatively independent, and the plurality of components on the front surface of the power board 200 and the heat sink 300 connected to the back surface of the power board 200 can be independently protected, and the heat sink 300 can not retransmit the heat to the components on the power board 200 after absorbing the heat. The ventilation structure can be a plurality of ventilation holes arranged on the second box 120 to communicate the second cavity 1201 with the outside space, so that the air in the second cavity 1201 flows smoothly, and the heat sink 300 can dissipate the heat to the outside of the second cavity 1201 through the ventilation structure after absorbing the heat on the power board 200, thereby ensuring the heat dissipation effect of the heat sink 300.

[0048] In some embodiments, at least one first cooling fan 400 is arranged in the first cavity 1101, and the first cooling fan 400 is used to form a first cooling airflow circulating between the high heat area 201 and the low heat area 202 in the first cavity 1101.

[0049] Specifically, the first cooling fan 400 can be an axial fan or a centrifugal fan, and the first cooling fan 400 has rotatable blades that can generate airflow in a corresponding direction through rotation of the blades. The first cooling fan 400 can be fixed on the case 100, for example, the first cooling fan 400 is connected to the inner surface of one of the first side plates 112 of the first box 110. The first cooling fan 400 can also be directly installed on the front surface of the power board 200 through a screw, and connected to the power circuit or the control circuit on the power board 200 through a wire, so as to supply power to the first cooling fan 400 by the power board 200 and control the operation of the first cooling fan 400. The first cooling fan 400 can be located between the high heat area 201 and the low heat area 202, or arranged on the side of the high heat area 201 away from the low heat area 202, so as to blow the heat generated by the high heat area 201 of the power board 200 to the low heat area 202 by the first cooling airflow generated by the first cooling fan 400, thereby further improving the heat uniformity of the power board 200.

[0050] The number of the first cooling fan 400 can be arbitrary, for example Figure 2As shown, the first heat dissipation assembly includes two first heat dissipation fans 400, which are arranged in an interval and face opposite directions. The two first heat dissipation fans 400 respectively generate two air flows in opposite directions and parallel to each other in the first cavity 1101. Since the first cavity 1101 is relatively closed, it cannot exchange air with the outside air of the case 100. When the first heat dissipation fans 400 transport air flow to the front side, negative pressure is generated at the rear side of the first heat dissipation fans 400 to absorb air. Therefore, the two first heat dissipation fans 400 generate the first heat dissipation air flow circulating in the first cavity 1101 in the clockwise direction or the counterclockwise direction, thereby circulating between different high-heat areas 201 and low-heat areas 202 to achieve heat averaging of each area of the power board 200. In addition, the directions of the two first heat dissipation fans 400 can also be other directions, for example, one of the first heat dissipation fans 400 faces the longitudinal direction of the first cavity 1101, and the other first heat dissipation fan 400 faces the transverse direction of the first cavity 1101, both of which can generate the first heat dissipation air flow circulating.

[0051] In some embodiments, at least one second heat dissipation fan 500 is arranged in the second cavity 1201, and the air passage structure includes a first air inlet hole 1202 and a first air outlet hole 1203. The first air inlet hole 1202, the second heat dissipation fan 500, the heat sink 300, and the first air outlet hole 1203 are arranged in an interval along a first direction. The second heat dissipation fan 500 is used to form a second heat dissipation air flow flowing toward the first air outlet hole 1203 in the second cavity 1201.

[0052] Specifically, the second heat dissipation fan 500 can be an axial fan or a centrifugal fan. The second heat dissipation fan 500 also has rotatable blades and drives the air flow in the second cavity 1201 to flow through the rotation of the blades. The first direction can be the extension direction of the second case 120. The first air inlet hole 1202 and the second air inlet hole 1204 can be respectively arranged on the second side plate 121 on both sides of the extension direction of the second case 120. The shapes of the first air inlet hole 1202 and the second air inlet hole 1204 can be any shape, such as a circular shape or a regular polygonal shape. The number of the first air inlet hole 1202 and the second air inlet hole 1204 can be set to be multiple and arranged in an array to communicate the second cavity 1201 with the outside space through the first air inlet hole 1202 and the first air outlet hole 1203. The second heat dissipation fan 500 can be arranged between the first air inlet hole 1202 and the first air outlet hole 1203 and transport air flow toward the direction of the first air outlet hole 1203, thereby forming the second heat dissipation air flow flowing from the direction of the first air inlet hole 1202 to the direction of the first air outlet hole 1203.

[0053] The heat sink 300 can be arranged between the second heat dissipation fan 500 and the first air outlet 1203 or between the second heat dissipation fan 500 and the first air inlet 1202. For example, when the second heat dissipation fan 500 is arranged close to the first air outlet 1203, the heat sink 300 can be arranged between the second heat dissipation fan 500 and the first air outlet 1203. The extension direction of the heat dissipation channels 3101 formed between the plurality of heat dissipation fins 310 in the heat sink 300 should be the same as the flow direction of the second heat dissipation airflow, so that the second heat dissipation airflow can pass through the plurality of heat dissipation channels 3101 in the heat sink 300 and then be discharged from the first air outlet 1203, thereby accelerating the airflow flow speed in the second cavity 1201, accelerating the discharge of heat on the heat sink 300, and further improving the heat dissipation efficiency of the power board 200.

[0054] The number of the second heat dissipation fans 500 and the arrangement manner in the second cavity 1201 can be arbitrary. For example Figure 4 As shown, the second heat dissipation assembly includes three second heat dissipation fans 500, the three second heat dissipation fans 500 are arranged perpendicular to the flow direction of the second heat dissipation airflow, and the three second heat dissipation fans 500 are arranged on one side of the heat sink 300, so as to generate more second heat dissipation airflow in the second cavity 1201 and ensure the flow rate through each heat dissipation channel 3101 in the heat sink 300, thereby improving the heat dissipation effect of the heat sink 300. The second heat dissipation fan 500 can be mounted on the second box 120. For example, a partition plate 1211 is arranged in the second box 120, the partition plate 1211 is arranged perpendicular to the flow direction of the second heat dissipation airflow, and the plurality of second heat dissipation fans 500 are mounted on the partition plate 1211. The partition plate 1211 is provided with a through slot structure corresponding to each second heat dissipation fan 500, so as to ensure the flow of the airflow. In addition, the second heat dissipation fan 500 can also be directly fixed on the back of the power board 200 by screws. The second heat dissipation fan 500 can also be connected to the power board 200 by wires, so as to supply power and control the second heat dissipation fan 500 by the power board 200.

[0055] As Figure 4 shown, in some embodiments, the energy storage device further includes at least one inverter inductor 600, the inverter inductor 600 is arranged in the second cavity 1201 and electrically connected to the power board 200, and the inverter inductor 600 is arranged between the first air inlet 1202 and the second heat dissipation fan.

[0056] Specifically, the inverter inductor 600 is composed of a magnetic core and a winding coil. The inverter inductor 600 can be fixed on the back of the second cabinet 120 or the power board 200 and connected to the power circuit on the power board 200 through a wire, so as to realize stable output of current by using the magnetic hysteresis effect of the magnetic core and the self-induction effect of the coil, smooth the current during the charging and discharging process of the energy storage device, reduce the current fluctuation, and protect other electronic components in the energy storage device from damage.

[0057] The number and distribution of the inverter inductors 600 can be arbitrary. For example Figure 4 As shown, three inverter inductors 600 are arranged uniformly along the transverse direction of the second cavity 1201 between the partition plate 1211 and the first air inlet hole 1202. It can be understood that the inverter inductor 600 has a gap between the inside and the adjacent two inverter inductors 600, so that the cold air flow of the external air will first pass through the inverter inductor 600 during the process of the plurality of second cooling fans 500 sucking air through the first air inlet hole 1202, so as to cool and dissipate heat of the inverter inductor 600.

[0058] In addition, when the heat sink 300 is located between the second cooling fan 500 and the first air inlet hole 1202, the inverter inductor 600 can be arranged between the second heat sink 300 and the first air outlet hole 1203.

[0059] In some embodiments, the ventilation structure further comprises a second air inlet hole 1204, the second air inlet hole 1204 is distributed on different sides of the second cabinet 120 with the first air inlet hole 1202, and the inverter inductor 600 is located between the second air inlet hole 1204 and the second cooling fan 500.

[0060] Specifically, the second air inlet hole 1204 can be arranged on the second cover plate 122 in the second cabinet 120, the shape of the second air inlet hole 1204 can be arbitrary, for example, circular or polygonal, and the number of the second air inlet hole 1204 can be multiple and arranged in an array on the part of the second cover plate 122 corresponding to each inverter inductor 600. When the plurality of second cooling fans 500 are running, cold air can be sucked in at the first air inlet hole 1202 and the second air inlet hole 1204, so as to pass through the inverter inductor 600 in different directions, improve the cooling effect of the inverter inductor 600, and increase the flow of the second cooling air flow. In addition, the second air inlet hole 1204 can also be arranged on the second side plate 121 close to the inverter inductor 600.

[0061] As Figure 4As shown, in some embodiments, the energy storage device further comprises at least one boost inductor 700, which is arranged in the second cavity 1201 and connected with the power board 200, and the boost inductor 700 is located between the second cooling fan 500 and the first air outlet 1203.

[0062] Specifically, the boost inductor 700 is composed of a magnetic core and a plurality of windings wound on the magnetic core, and is used to improve the voltage level of the energy storage device and work cooperatively with the inverter inductor 600 to optimize the working performance of the entire energy storage device. The boost inductor 700 can be located near the inverter inductor 600 to facilitate energy conversion and transmission between the boost inductor 700 and the inverter inductor 600. The boost inductor 700 can be located between the heat sink 300 and the second side plate 121 on the lateral side of the second box 120, so that part of the second cooling airflow blown by the second cooling fan 500 also passes through the boost inductor 700 to cool and heat the boost inductor 700.

[0063] In some embodiments, the case 100 is further provided with a second air outlet 1205 for connecting the second cavity 1201 with the external space, and the second air outlet 1205 and the first air outlet 1203 are distributed on different sides of the second box 120. The heat sink 300 is arranged close to the first air outlet 1203, and the boost inductor 700 is arranged close to the second air outlet 1205. The second cooling fan 500 is further used to form a third cooling airflow in the second cavity 1201 towards the second air outlet 1205.

[0064] Specifically, the second air outlet 1205 can be arranged on the second side plate 121 corresponding to the boost inductor 700, and the shape of the second air outlet 1205 can be arbitrary, such as circular or polygonal, and the number of the second air outlet 1205 can be multiple and arranged in an array on the part of the second side plate 121 corresponding to each inverter inductor 600. In addition, the second air outlet 1205 can also be arranged on the part of the second cover plate 122 corresponding to each inverter inductor 600. Most of the cooling airflow formed by the second cooling fan 500 passes through the heat dissipation fins 310 and is discharged from the first air outlet 1203, and a small part of the airflow can pass through the plurality of boost inductors 700 and be discharged from the second air outlet 1205, thereby accelerating the cooling and heat dissipation of the boost inductor 700 and reducing the impact of the heat generated by the boost inductor 700 on the heat dissipation of the heat sink 300.

[0065] In summary, the energy storage device provided by the embodiments of the present application balances the temperature of each region of the power board 200 by using the heat conduction pipe 320 in the heat sink 300 and the first heat dissipation fan 400 located in the first cavity 1101, improves the heat dissipation uniformity of the heat sink body on each region of the power board 200, and avoids the problem that the heat dissipation effect is affected by the excessive local heat of the power board 200, and uses the second heat dissipation fan 500 to accelerate the airflow flow speed in the second cavity 1201, and improve the heat dissipation efficiency of the heat sink 300, thereby further improving the heat dissipation efficiency of the power board 200. Moreover, under the premise of ensuring good heat dissipation effect of the components, the layout of each component in the case 100 is compact, which can reduce the internal space size of the energy storage device, facilitate the shape and structure design of the energy storage device, and reduce the production cost of the energy storage device.

[0066] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An energy storage device, characterized in that, Includes a chassis, a power board disposed within the chassis, and a heat sink; The heat sink includes a heat sink body and at least one heat pipe. The heat sink body is connected to the power board, and at least one heat pipe is embedded in the side of the heat sink body facing the power board. The thermal conductivity of the heat pipe is greater than that of the heat sink body. The heat pipe has a heat-absorbing end and a heat-dissipating end, and the power plate has at least one high-heat-generating region and at least one low-heat-generating region. The heat-absorbing end abuts against at least one of the high-heat-generating regions of the power plate, and the heat-dissipating end abuts against at least one of the low-heat-generating regions of the power plate.

2. The energy storage device according to claim 1, characterized in that, The radiator body includes multiple spaced-apart heat dissipation fins, with heat dissipation channels formed between adjacent heat dissipation fins.

3. The energy storage device according to claim 2, characterized in that, The chassis includes a first enclosure and a second enclosure connected to the first enclosure; the first enclosure has a first cavity, the second enclosure has a second cavity, and the first cavity and the second cavity are connected in communication; the power board is connected to the first cavity and shields the communication between the first cavity and the second cavity; the heat sink is located in the second cavity, and the second enclosure is provided with a ventilation structure that connects the second cavity to the external space.

4. The energy storage device according to claim 3, characterized in that, The first cavity is provided with at least one first cooling fan, which is used to form a first cooling airflow that circulates between the high-heat area and the low-heat area within the first cavity.

5. The energy storage device according to claim 3, characterized in that, The second cavity is provided with at least one second cooling fan. The ventilation structure includes a first air inlet and a first air outlet. The first air inlet, the second cooling fan, the radiator, and the first air outlet are arranged along a first direction. The second cooling fan is used to form a second cooling airflow in the second cavity that flows toward the first air outlet. The extension direction of the heat dissipation channel is the same as the flow direction of the second cooling airflow.

6. The energy storage device according to claim 5, characterized in that, The energy storage device further includes at least one inverter inductor, which is disposed in the second cavity and electrically connected to the power board, and is located between the first air inlet and the second cooling fan.

7. The energy storage device according to claim 6, characterized in that, The ventilation structure also includes a second air inlet, which is distributed on different sides of the second housing along with the first air inlet, and the inverter inductor is located between the second air inlet and the second cooling fan.

8. The energy storage device according to claim 5, characterized in that, The energy storage device further includes at least one boost inductor, which is disposed in the second cavity and connected to the power board, and is located between the second cooling fan and the first air outlet.

9. The energy storage device according to claim 8, characterized in that, The ventilation structure also includes a second vent, which is distributed on different sides of the second housing along with the first vent. The radiator is located near the first vent, the boost inductor is located near the second vent, and the second cooling fan is also used to form a third cooling airflow in the second cavity that flows toward the second vent.

10. The energy storage device according to any one of claims 3-9, characterized in that, The first housing includes a support plate, a first cover plate, and a plurality of first side plates; the plurality of first side plates surround the support plate, and the first cover plate covers the side of the plurality of first side plates facing away from the support plate. The support plate, the plurality of first side plates, and the first cover plate together form the first cavity. The second housing includes a second cover plate and a plurality of second side plates. The plurality of second side plates surround the side of the support plate facing away from the first side plate. The second cover plate covers the side of the plurality of second side plates facing away from the support plate. The support plate, the plurality of second side plates and the second cover plate together form the second cavity. The support plate has a through hole corresponding to the second cavity to connect the first cavity and the second cavity.

Images