Heat dissipation plate for testing light emitter and testing device
By designing multiple test holes and solder joint exposure holes on the optical emitter test board, the heat dissipation area is increased, solving the problem of excessively high optical emitter temperature and achieving rapid cooling and cost savings.
Patent Information
- Application Number
- CN202422629782.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-10-29
AI Technical Summary
The existing light emitter test board has poor heat dissipation, resulting in excessively high temperatures. It requires external cooling equipment to lower the temperature, which increases the testing cost.
Design a heat sink for testing a light emitter. The heat sink body has multiple circular test holes and solder joint exposure holes with a diameter of 4.5±0.1mm to increase the contact area with the light emitter. These include ear exposure holes and side exposure holes. The material is stainless steel or aluminum alloy.
By increasing the contact area, the temperature of the light emitter drops rapidly to below 50°C, eliminating the need for external heat dissipation equipment, reducing testing costs, and extending product lifespan.
Smart Images
Figure CN223584542U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to optical transmitter test technical field especially relates to a heat sink and testing device for optical transmitter test. BACKGROUND
[0002] A kind of optical transmitter test board on market, its round hole size is 5mm, and the area contacted with optical transmitter is less, when actual electrical property test, optical transmitter temperature is at 55-60 ℃, temperature is higher, it does not meet the temperature requirement of subsequent detection and recovery, need to be assisted by external cooling equipment to make its temperature drop to 50 ℃ below, need to add other equipment and power consumption, increase detection cost.
[0003] Therefore, we provide a heat sink and testing device for optical transmitter test. SUMMARY
[0004] The utility model embodiment solves the technical problem that when actual electrical property test, optical transmitter temperature is at 55-60 ℃, temperature is higher, it does not meet the temperature requirement of subsequent detection and recovery, need to be assisted by external cooling equipment to make its temperature drop to 50 ℃ below, need to add other equipment and power consumption, increase detection cost.
[0005] To solve the above problem, the utility model embodiment provides a heat sink for optical transmitter test, including heat sink body, a plurality of placement detection holes are set up on the heat sink body, the placement detection hole is circular hole and diameter is 4.5±0.1mm, a plurality of solder point exposure holes are set up on the periphery of placement detection hole, and the solder point exposure hole is communicated with placement detection hole respectively.
[0006] Optionally, the solder point exposure hole includes two ear exposure holes, and the two ear exposure holes are arranged on opposite sides of the placement detection hole.
[0007] Optionally, the ear exposure hole is a circular hole with a diameter of 1mm.
[0008] Optionally, the solder point exposure hole further includes a left-biased side exposure hole, and the left-biased side exposure hole is arranged at a left-biased position of 30° from the perpendicular bisector of the line connecting the two ear exposure holes.
[0009] Optionally, the left-biased side exposure hole is a circular hole with a diameter of 0.5mm.
[0010] Optionally, the solder point exposure hole further includes a right-biased side exposure hole, and the right-biased side exposure hole is arranged at a right-biased position of 28° from the perpendicular bisector of the line connecting the two ear exposure holes.
[0011] Optionally, the left-biased side exposure hole and the right-biased side exposure hole are arranged on one side of the line connecting the two ear exposure holes.
[0012] Optionally, the material of the heat dissipation plate body is stainless steel or aluminum alloy.
[0013] Optionally, 20-40% of the ear exposure hole is overlapped with the placement detection hole.
[0014] The utility model embodiment further provides a light emitter testing device, including the heat dissipation plate of light emitter testing.
[0015] Compared with the prior art, the technical effects that can be achieved by the utility model embodiment include:
[0016] The utility model embodiment increases the contact area of the heat dissipation plate body and the light emitter, accelerates the heat dissipation speed of the light emitter, maintains the temperature of the light emitter below 50 DEG C, facilitates subsequent detection and recovery, does not need to rely on external heat dissipation equipment, saves detection cost, and simultaneously, since the temperature of the light emitter does not become too high for a long time during detection, reduces the possibility of damage, and is favorable for improving product life. BRIEF DESCRIPTION OF DRAWINGS
[0017] The drawings in the specification are incorporated into the specification and form part of the specification, show the embodiments consistent with the utility model, and are used together with the specification to explain the principle of the utility model.
[0018] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, for those skilled in the art, other drawings can also be obtained without creative labor.
[0019] One or more embodiments are exemplarily illustrated by the pictures in the drawings corresponding thereto, and these exemplary illustrations do not constitute the limitation of the embodiments, and the elements with the same reference numerals in the drawings represent the similar elements, and unless specially stated, the drawings in the drawings do not constitute the proportional limitation.
[0020] Figure 1 It is the structural diagram of the utility model.
[0021] Figure 2 It is the plan view of the utility model.
[0022] Figure 3 It is Figure 2 The enlarged view of A part in the middle.
[0023] Reference signs
[0024] 1, heat dissipation plate body;2, placement detection hole;3, welding point exposure hole;4, ear exposure hole;5, left bias side exposure hole;6, right bias side exposure hole. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments will be apparently and completely described below with reference to the drawings in the embodiments of the present application, and similar components are denoted by similar reference numerals in the drawings. Obviously, the following described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without any creative work fall within the scope of protection of the present application.
[0026] It should be understood that the terms "comprising" and "including" as used in the specification and the appended claims indicate the presence of the described features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.
[0027] It should also be understood that the terms used in the present application embodiment specification are only for the purpose of describing specific embodiments and are not intended to limit the present application embodiments. As used in the present application embodiment specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.
[0028] Please refer to Figures 1-3 The present application embodiment provides a heat sink for testing light emitter, which is used for placing and heat dissipation of the light emitter, comprising a heat sink body 1, the light emitter is placed on the heat sink body 1 by external devices or by the staff for heat dissipation during the testing process. Specifically, a plurality of placing detection holes 2 are formed on the heat sink body 1, a plurality of solder exposure holes 3 are formed on the circumferential side of the placing detection hole 2, the solder exposure hole 3 is communicated with the placing detection hole 2, the light emitter is placed at the placing detection hole 2, and the solder points to be detected or the solder wires connected with the solder points are exposed through the placing detection hole 2 and the solder exposure hole 3, so as to facilitate the testing. Preferably, the material of the heat sink body 1 is stainless steel or aluminum alloy, which has high structural strength and good heat dissipation performance.
[0029] Please continue to refer to Figure 3 The placing detection hole 2 of the present application is a circular hole with a diameter of 4.5±0.1mm, and compared with the hole structure with a diameter of 5mm, the area is about 3.7mm2, that is, the area of the light emitter in contact with the heat sink body 1 is about 20% more, which increases the heat dissipation rate, so that the temperature can be quickly reduced to the required temperature range, which is beneficial to the subsequent detection and recovery.
[0030] Please continue to refer to Figure 3, the two ear exposure holes 4 are circular holes and have a diameter of 1 mm. Compared with the strip-shaped exposure hole with a position width of 1.5 mm on the market, the contact area with the light reflector is appropriately increased, and heat dissipation is facilitated. Preferably, 20-40% of the ear exposure hole 4 overlaps with the placement detection hole 2, that is, the ear exposure hole 4 still has a plurality of parts that do not overlap, which can ensure the exposure of the solder joint corresponding to the ear exposure hole 4, and avoid the possibility of shielding and affecting the test.
[0031] The solder joint exposure hole 3 further comprises a left-biased side exposure hole 5, which is arranged at a left-biased position of 30° from the perpendicular line of the connecting line of the two ear exposure holes 4, and the left-biased side exposure hole 5 is a circular hole with a diameter of 0.5 mm; the solder joint exposure hole 3 further comprises a right-biased side exposure hole 6, which is arranged at a right-biased position of 28° from the perpendicular line of the connecting line of the two ear exposure holes 4, and the right-biased side exposure hole 6 is a circular hole with a diameter of 0.5 mm. By additionally providing the left-biased side exposure hole 5 and the right-biased side exposure hole 6, the situation that the solder joint to be detected by the light reflector is shielded when the size of the placement detection hole 2 is reduced is solved. The sizes of the left-biased side exposure hole 5 and the right-biased side exposure hole 6 are relatively small, which is used to provide exposure of the solder joint position and also will not reduce the heat dissipation contact area due to the excessively large hole diameter. The placement detection hole 2 and the solder joint exposure hole 3 are both circular structures, which facilitates reduction of the time cost in the opening process.
[0032] The connecting line of the two ear exposure holes 4 is the connecting line of the centers of the two ear exposure holes 4 in the utility model, which is line one, and the perpendicular line of line one is line two, wherein line two passes through the center of the placement detection hole 2, the connecting line of the center of the left-biased side exposure hole 5 and the center of the placement detection hole 2 forms an angle of 30° with line two, the connecting line of the center of the right-biased side exposure hole 6 and the center of the placement detection hole 2 forms an angle of 28° with line two, and the left-biased side exposure hole 5 and the right-biased side exposure hole 6 are arranged on one side of the connecting line of the two ear exposure holes 4.
[0033] The utility model also provides a light emitter testing device (not shown in the figure), which comprises the heat dissipation plate for light reflector testing.
[0034] Compared with the prior art, the technical effects that can be achieved by the utility model embodiment include:
[0035] The utility model embodiment increases the contact area between the heat dissipation plate body and the light emitter, accelerates the heat dissipation speed of the light emitter, maintains the temperature of the light emitter below 50℃, facilitates subsequent detection and recovery, does not need to rely on external heat dissipation equipment, saves detection cost, and reduces the possibility of damage due to the fact that the temperature of the light emitter is not excessively high for a long time during detection, which is conducive to improving the product life.
[0036] In the above embodiments, the description of each embodiment is focused on, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.
[0037] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.
[0038] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0039] In the utility model, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be connected, or it can be detachable, or it can be integrated; it can be mechanical connection, or it can be electrical connection; it can be directly connected, or it can be indirectly connected through intermediate medium, or it can be the communication or interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0040] In the utility model, unless otherwise specifically defined and limited, the "upper" or "lower" of the first feature to the second feature can include the direct contact of the first and second features, or the indirect contact of the first and second features through other features between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include the vertical and inclined upward of the first feature above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include the vertical and inclined downward of the first feature below the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.
[0041] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.
[0042] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, these modifications and variations of the present application are intended to be included within the scope of the claims of the present application and equivalents thereof. Therefore, the present application is intended to include these modifications and variations.
[0043] The above is a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A heat sink for optical transmitter testing for placement and heat dissipation of optical transmitters, characterized by: The heat dissipation plate body is provided with a plurality of placement detection holes, which are circular holes with a diameter of 4.5±0.1 mm, and a plurality of solder exposure holes are arranged on the side of the placement detection holes, and the solder exposure holes are communicated with the placement detection holes respectively.
2. The heat sink for testing optical transmitters according to claim 1, wherein: The solder exposure holes include two ear exposure holes, and the two ear exposure holes are arranged on opposite sides of the placement detection hole.
3. The heat sink for testing optical transmitters as recited in claim 2, wherein: The ear exposure hole is a circular hole with a diameter of 1 mm.
4. The heat sink for testing optical transmitters of claim 2, wherein: The solder exposure hole also includes a left side exposure hole, and the left side exposure hole is arranged at a left 30° of the median line of the connecting line of the two ear exposure holes.
5. The heat sink for testing optical transmitters as recited in claim 4, wherein: The left side exposure hole is a circular hole with a diameter of 0.5 mm.
6. The heat sink for testing optical transmitters of claim 4, wherein: The solder exposure hole also includes a right side exposure hole, and the right side exposure hole is arranged at a right 28° of the median line of the connecting line of the two ear exposure holes.
7. The heat sink for testing optical transmitters according to claim 6, wherein: The left side exposure hole and the right side exposure hole are arranged on one side of the connecting line of the two ear exposure holes.
8. The heat sink for testing optical transmitters of claim 1, wherein: The material of the heat dissipation plate body is stainless steel or aluminum alloy.
9. The heat sink for testing optical transmitters of claim 2, wherein: 20-40% of the ear exposure hole is overlapped with the placement detection hole.
10. An optical transmitter test apparatus, characterized by: The heat dissipation plate for testing the light emitter includes the heat dissipation plate according to any one of claims 1-9.