PCBA heat dissipation aluminum cover structure

Abstract

The utility model relates to the technical field of water pumps, in particular to a PCBA heat dissipation aluminum cover structure, when the PCBA heat dissipation aluminum cover structure is used, a control circuit in a printed circuit board assembly is responsible for adjusting the operation state of a motor part, so that a pump head part conveys water, heat generated in the use process of the printed circuit board assembly is subjected to heat conduction and dissipation through a heat dissipation cover, and the heat dissipation efficiency is improved. The V-shaped heat dissipation ribs increase the heat dissipation surface area on one hand and increase the turbulent flow capacity of the heat dissipation aluminum cover to gas on the other hand, so that the heat transfer capacity between gas is improved, the printed circuit board assembly is rapidly cooled and dissipated, and the service life is prolonged; comprising a heat dissipation cover, a printed circuit board assembly, a motor part and a pump head part, the motor part is arranged in the pump head part, the heat dissipation cover is installed at the top end of the pump head part, the printed circuit board assembly is installed at the bottom end of the heat dissipation cover, multiple sets of heat dissipation ribs are arranged at the top end of the heat dissipation cover, and the heat dissipation ribs are in a V shape.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of water pump especially relates to a PCBA heat dissipation aluminum cover structure. BACKGROUND

[0002] With the increasingly high energy saving and environmental protection requirement, as the key power source, the pump must also meet the high efficiency, low energy consumption standard.

[0003] The water pump is the mechanical of conveying liquid or making liquid pressure. It transmits the mechanical energy of prime mover or other external energy to liquid, makes the liquid energy increase, and is mainly used to convey liquid including water, oil, acid and alkali liquid, emulsion, suspension emulsion and liquid metal etc.

[0004] The integrated water pump is composed of three parts, the pump head part containing impeller and volute, the motor part containing stator and rotor, and the PCBA (printed circuit board assembly) part containing PCBA and heat dissipation aluminum cover. In working, the MCU and MOS tube on the control board PCBA will generate heat through high-frequency current. If the heat accumulates, the temperature rise of MCU and MOS will increase, resulting in increased resistance and abnormal control. If the heat continues to accumulate and the temperature rise continues to rise, the PCBA will be burned due to over-temperature.

[0005] As shown in Figure 4 The heat dissipation aluminum cover is provided with heat dissipation ribs arranged horizontally or vertically, and the heat dissipation area is small, and the gas disturbance capacity needs to be further improved. INVENTION CONTENTS

[0006] To solve the above technical problems, the utility model provides a kind of PCBA heat dissipation aluminum cover structure for improving heat dissipation efficiency.

[0007] The PCBA heat dissipation aluminum cover structure of the utility model, including heat dissipation cover, printed circuit board assembly, motor part and pump head part, the motor part is arranged inside the pump head part, the heat dissipation cover is installed at the top of pump head part, and the printed circuit board assembly is installed at the bottom of heat dissipation cover, further including heat dissipation rib, the heat dissipation cover top is provided with multiple groups of heat dissipation ribs, and the heat dissipation rib is in V shape;When using, the control circuit in printed circuit board assembly is responsible for adjusting the running state of motor part, so that pump head part transports water, and the heat generated in the use process of printed circuit board assembly is conducted and dissipated by heat dissipation cover, the heat dissipation rib in V shape increases heat dissipation surface area, according to Fourier heat transfer law, the heat flow density of heat dissipation and heat dissipation surface area are proportional, so the improved structure increases heat dissipation area compared with original structure, the second is to increase the disturbance capacity of heat dissipation aluminum cover to gas, gas changes from laminar flow to turbulent flow, and gas changes from order to disorder, therefore, the heat transfer capacity between gas increases, and printed circuit board assembly is rapidly cooled and dissipated, to improve service life.

[0008] Preferably, the heat dissipation cover material is aluminum.

[0009] Compared with the prior art, the beneficial effects of the utility model are as follows: in use, the control circuit in the printed circuit board assembly is responsible for adjusting the running state of the motor part, so that the pump head part transports water, in the use process of the printed circuit board assembly, the generated heat is conducted and dissipated through the heat dissipation cover, the heat dissipation ribs in V-shaped design increase the heat dissipation surface area, according to Fourier heat conduction law, the heat flow density of heat dissipation is proportional to the heat dissipation surface area, therefore, the improved structure increases the heat dissipation area compared with the original structure, and the heat dissipation aluminum cover increases the ability of disturbing the gas flow, the gas flow changes from laminar flow to turbulent flow, and the gas flow changes from order to disorder, therefore, the heat transfer capacity between the gases increases, the printed circuit board assembly is rapidly cooled and dissipated, and the service life is improved. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is the axonometric structure schematic view of the utility model;

[0011] Figure 2 is the cross section structure schematic view of the utility model;

[0012] Figure 3 is the enlarged structure schematic view of the heat dissipation cover and the heat dissipation rib structure of the utility model;

[0013] Figure 4 is the structure schematic view of the prior art of the heat dissipation cover.

[0014] Marked in the drawing: 1, heat dissipation cover;2, printed circuit board assembly;3, motor part;4, pump head part;5, heat dissipation rib. DETAILED DESCRIPTION

[0015] In order to facilitate understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings.The utility model can be realized in many different forms, and is not limited to the embodiments described herein.Contrarily, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0016] EMBODIMENT

[0017] As Figures 1 to 3 shown, the PCBA heat dissipation aluminum cover structure of the utility model includes heat dissipation cover 1, printed circuit board assembly 2, motor part 3 and pump head part 4, the motor part 3 is arranged in the pump head part 4, the heat dissipation cover 1 is installed at the top of pump head part 4, the printed circuit board assembly 2 is installed at the bottom of heat dissipation cover 1, further includes heat dissipation rib 5, the heat dissipation cover 1 top is provided with multiple groups of heat dissipation rib 5, the heat dissipation rib 5 is V-shaped

[0018] The material of heat dissipation cover 1 is aluminum.

[0019] In the embodiment, when in use, the control circuit in the printed circuit board assembly 2 is responsible for adjusting the operating state of the motor part 3, so that the pump head part 4 transports water, and the heat generated during the use of the printed circuit board assembly 2 is conducted and dissipated through the heat dissipation cover 1. The heat dissipation ribs 5 in V-shaped design increase the heat dissipation surface area. According to Fourier's heat conduction law, the heat flow density of heat dissipation is proportional to the heat dissipation surface area, so the improved structure increases the heat dissipation area compared with the original structure. Secondly, the heat dissipation aluminum cover increases the ability to disturb the flow of gas. The gas changes from laminar flow to turbulent flow, and the gas changes from order to disorder. Therefore, the heat transfer capacity between the gases increases, the printed circuit board assembly 2 is rapidly cooled and dissipated, and the service life is improved.

[0020] The main function realized by the utility model is:

[0021] 1. Increase the heat dissipation surface area. According to Fourier's heat conduction law, the heat flow density of heat dissipation is proportional to the heat dissipation surface area, so the improved structure increases the heat dissipation area compared with the original structure.

[0022] 2. The heat dissipation aluminum cover increases the ability to disturb the flow of gas. The gas changes from laminar flow to turbulent flow, and the gas changes from order to disorder.

[0023] The printed circuit board assembly 2 of the PCBA heat dissipation aluminum cover structure of the utility model is purchased on the market. The technical personnel in the industry only needs to install and operate according to the use instruction book attached, without the technical personnel in the field paying creative labor.

[0024] The above is only the preferred embodiment of the utility model, and it should be pointed out that for ordinary technical personnel in the technical field, without departing from the technical principle of the utility model, a number of improvements and modifications can be made, and these improvements and modifications should be regarded as the protection range of the utility model.

Claims

1. A PCBA heat dissipation aluminum cover structure, comprising a heat dissipation cover (1), a printed circuit board assembly (2), a motor part (3), and a pump head part (4), wherein the motor part (3) is disposed inside the pump head part (4), the heat dissipation cover (1) is mounted on the top of the pump head part (4), and the printed circuit board assembly (2) is mounted on the bottom of the heat dissipation cover (1), characterized in that, It also includes heat dissipation ribs (5), and the top of the heat dissipation cover (1) is provided with multiple sets of heat dissipation ribs (5), which are V-shaped.

2. The PCBA heat dissipation aluminum cover structure as described in claim 1, characterized in that, The heat sink (1) is made of aluminum.

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