Liquid cooling heat dissipation device

Abstract

The utility model relates to a liquid cooling heat dissipation device, which comprises a substrate and a Pinfin structure, the Pinfin structure is arranged on the surface of one side of the substrate, the Pinfin structure comprises a plurality of heat dissipation plates which are arranged side by side at intervals, the heat dissipation plates are erected towards the direction far away from the substrate, the plate surfaces of the heat dissipation plates, which are positioned on two sides of the extension direction of the heat dissipation plates, are alternately provided with flow guide parts at intervals along the extension direction of the heat dissipation plates, and the flow guide parts are communicated with the heat dissipation plates. The flow guide part is used for increasing the contact area of the heat dissipation plate and the cooling liquid and guiding the cooling liquid to the direction away from the heat dissipation plate. In the working process, under the action of the flow guide parts alternately arranged on the two sides, cooling liquid is alternately guided to the heat dissipation plates on the two sides, so that zigzag flow is formed between the two heat dissipation plates, the heat exchange area of the cooling liquid is increased through the structures of the heat dissipation plates and the flow guide parts, meanwhile, the retention time of the cooling liquid in the Pinfin structure is prolonged through the zigzag flow of the cooling liquid, and the heat exchange efficiency of the cooling liquid is improved. Therefore, the purpose of improving the heat dissipation efficiency is finally achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation equipment technical field, especially a liquid cooling heat dissipation device. BACKGROUND

[0002] Liquid cooling heat dissipation device with Pinfin (pin fin) structure is often used in the heat dissipation of power module in electrical equipment, but the current Pinfin structure is generally composed of multiple heat dissipation columns, and the heat exchange between power module and cooling heat is realized through the contact of heat dissipation column and cooling liquid, and in actual application, the efficiency of liquid cooling heat dissipation mainly depends on the contact area and contact time of Pinfin structure and cooling liquid, the larger the contact area is, the longer the contact time is, and the better the heat dissipation efficiency is, therefore, how to increase the contact area and contact time of Pinfin structure and cooling liquid in limited space is the key to improve the heat dissipation efficiency of power module. SUMMARY

[0003] The utility model discloses a liquid cooling heat dissipation device to increase the contact area and contact time of Pinfin structure and cooling liquid in limited space and improve the heat dissipation efficiency.

[0004] To achieve the above object, the utility model provides the following technical scheme:

[0005] A liquid cooling heat dissipation device, comprising:

[0006] A substrate;

[0007] Pinfin structure, the Pinfin structure is arranged on the one side surface of the substrate, the Pinfin structure includes multiple heat dissipation plates arranged side by side and spaced, the heat dissipation plate stands up to the direction away from the substrate, the plate surface on both sides of the heat dissipation plate in the extension direction is alternately arranged with the flow guide part in the extension direction of the heat dissipation plate, the flow guide part is used to increase the contact area of the heat dissipation plate and cooling liquid and guide the cooling liquid to the direction away from the heat dissipation plate.

[0008] In one embodiment of the application, at least one of the plate surfaces on both sides of the heat dissipation plate in the extension direction is a zigzag surface, the zigzag surface includes multiple peak portions and multiple valley portions, the peak portion protrudes in the direction away from the heat dissipation plate, the valley portion is recessed to the inside of the heat dissipation plate, and each peak portion and each valley portion are alternately connected in the extension direction of the heat dissipation plate.

[0009] In one embodiment of the application, the zigzag surfaces are arranged on the plate surfaces on both sides of the heat dissipation plate in the extension direction, and the peak portions of the zigzag surface on one side of the heat dissipation plate are arranged in position correspondence with the valley portions of the zigzag surface on the other side of the heat dissipation plate.

[0010] In one embodiment of the present application, the flow guide part is arranged at the peak top of the peak part.

[0011] In one embodiment of the present application, the flow guide part is a flow guide column which stands away from the substrate, and the flow guide column is in the same height as the heat dissipation plate.

[0012] In one embodiment of the present application, the cross-sectional shape of the flow guide column is circular or elliptical, and the flow guide column is connected to the peak top of the peak part in a smooth transition.

[0013] In one embodiment of the present application, the flow guide part is a flow guide plate, the flow guide plates on the opposite plate surfaces of the adjacent two heat dissipation plates are partially overlapped, and the flow guide plates are inclined to the downstream side along the flow direction of the cooling liquid, and the flow guide plates are in the same height as the heat dissipation plates.

[0014] In one embodiment of the present application, the flow guide plate is an arc-shaped plate, and the connecting line of the two ends of the flow guide plate is inclined to the downstream side along the flow direction of the cooling liquid.

[0015] In one embodiment of the present application, the flow guide plate is connected to a flow guide column which stands away from the substrate at one end of the flow guide plate, the flow guide column is in the same height as the flow guide plate, and the cross-sectional shape of the flow guide plate is circular or elliptical.

[0016] In one embodiment of the present application, it further comprises a fence which is arranged around the Pinfin structure, and the two ends of the heat dissipation plate are respectively connected to the two inner walls of the fence which are oppositely arranged.

[0017] As can be seen from the above technical solutions, the liquid cooling heat dissipation device disclosed in the present application comprises a substrate and a Pinfin structure, wherein the Pinfin structure is arranged on one side surface of the substrate, the Pinfin structure comprises a plurality of heat dissipation plates which are arranged side by side and spaced apart, the heat dissipation plates stand away from the substrate, the plate surfaces on both sides of the heat dissipation plates in the extension direction of the heat dissipation plates are alternately and spaced apart arranged with flow guide parts, the flow guide parts are used for increasing the contact area of the heat dissipation plates with the cooling liquid, and the cooling liquid is guided to the direction away from the heat dissipation plates.

[0018] When the cooling liquid flows through the gap between the adjacent two heat dissipation plates, under the action of the flow guide parts which are alternately arranged on both sides, the cooling liquid is alternately guided to the heat dissipation plates on both sides, so that the cooling liquid forms a zigzag flow between the two heat dissipation plates, and the structure of the heat dissipation plates and the flow guide parts increases the heat exchange area of the cooling liquid, and the zigzag flow of the cooling liquid prolongs the residence time of the cooling liquid in the Pinfin structure, so as to finally achieve the purpose of improving the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description, obviously, the drawings described in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the premise of the drawings.

[0020] Figure 1 The structural schematic view of the liquid cooling heat dissipation device provided by an embodiment of the present application is shown in the figure.

[0021] Figure 2 The front view of the liquid cooling heat dissipation device provided by an embodiment of the present application is shown in the figure.

[0022] Figure 3 The side view of the liquid cooling heat dissipation device and the power module after being assembled provided by an embodiment of the present application is shown in the figure.

[0023] Figure 4 The working schematic view of the liquid cooling heat dissipation device provided by an embodiment of the present application is shown in the figure.

[0024] Figure 5 The front view of the liquid cooling heat dissipation device provided by another embodiment of the present application is shown in the figure.

[0025] Figure 6 The front view of the liquid cooling heat dissipation device provided by another embodiment of the present application is shown in the figure.

[0026] Figure 7 The front view of the liquid cooling heat dissipation device provided by an embodiment of the present application is shown in the figure.

[0027] In the figure:

[0028] 1 is a substrate; 2 is a heat dissipation plate; 3 is a flow guide part; 4 is a fence; 5 is a ceramic copper-clad plate; 6 is a semiconductor chip. DETAILED DESCRIPTION

[0029] The core of the present application is to provide a liquid cooling heat dissipation device, the structural design of the liquid cooling heat dissipation device can increase the contact area and contact time of the Pinfin structure and the cooling liquid in a limited space, and the heat dissipation efficiency is improved.

[0030] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application, obviously, the described embodiments are only some embodiments of the present application, and not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0031] Please refer to Figures 1 to 3 , Figure 1 The structure diagram of the liquid cooling heat dissipation device is provided in an embodiment of the utility model, Figure 2 The front view of the liquid cooling heat dissipation device is provided in an embodiment of the utility model, Figure 3 The side view of the liquid cooling heat dissipation device and power module after assembly is provided in an embodiment of the utility model.

[0032] A liquid cooling heat dissipation device is disclosed in the embodiment of the utility model, and the liquid cooling heat dissipation device is a kind of equipment that utilizes and cooling liquid contact, the heat generated by heat generating module and cooling liquid heat exchange to dissipate heat, the liquid cooling heat dissipation device includes substrate 1 and Pinfin structure.

[0033] Wherein, substrate 1 and Pinfin structure adopt the material with good heat conduction performance, such as metal material, metal material includes but is not limited to aluminum alloy, copper, stainless steel, substrate 1 usually includes two oppositely arranged surfaces, one surface is used to set Pinfin structure, another surface is used to weld ceramic copper-clad plate 5, ceramic copper-clad plate 5 is a kind of electronic base material that copper foil is directly sintered on ceramic surface using DCB (Direct Copper Bonding, directly copper bonding) technology, it has excellent heat conduction performance and can help heat dissipation, the side surface of ceramic copper-clad plate 5 away from substrate 1 is used to weld the device to be cooled, i.e. heat generating module such as semiconductor chip 6, as shown in Figure 3 The heat generated by the device to be cooled is transmitted to substrate 1 and Pinfin structure through ceramic copper-clad plate 5, and heat exchange is carried out through the contact of substrate 1 and Pinfin structure with cooling liquid, to realize heat dissipation.

[0034] Pinfin structure is arranged on one side surface of substrate 1, Pinfin structure includes a plurality of heat dissipation plates 2 arranged side by side and spaced apart, heat dissipation plate 2 stands away from substrate 1, and the plate surface of heat dissipation plate 2 located on both sides of the extension direction of heat dissipation plate 2 is alternately and spaced apart from the flow guide part 3 along the extension direction of heat dissipation plate 2, the flow guide part 3 is used to increase the contact area of heat dissipation plate 2 and cooling liquid, and guide the cooling liquid to the direction away from heat dissipation plate 2.

[0035] Compared with prior art, when the liquid cooling heat dissipation device provided in the embodiment of the utility model works, the cooling liquid flows through the gap between the adjacent two heat dissipation plates 2, and under the action of the flow guide part 3 alternately arranged on both sides, the cooling liquid is alternately guided to the heat dissipation plate 2 on both sides, so that the tortuous flow is formed between the two heat dissipation plates 2, so that the structure of heat dissipation plate 2 and flow guide part 3 increases the heat exchange area of cooling liquid, and the tortuous flow of cooling liquid prolongs its residence time in Pinfin structure, so that the purpose of improving heat dissipation efficiency is finally achieved.

[0036] In order to further increase the flow effect of the cooling liquid, increase the heat exchange area of the Pinfin structure in contact with the cooling liquid, and prolong the residence time of the cooling liquid in the Pinfin structure, in an embodiment of the present application, as shown in Figure 1 , Figure 2 and Figure 4 , at least one of the plate surfaces on both sides of the heat dissipation plate 2 in the extension direction of the heat dissipation plate 2 is a curved surface, the curved surface includes a plurality of peak portions and a plurality of valley portions, the peak portions protrude away from the heat dissipation plate 2, the valley portions are recessed towards the inside of the heat dissipation plate 2, and each peak portion and each valley portion are alternately connected along the extension direction of the heat dissipation plate 2. This structure can further increase the length of the flow channel in the Pinfin structure, and promote the full contact of the cooling liquid with the heat dissipation plate 2 and the flow guide portion 3, thereby improving the heat exchange efficiency and heat exchange time, so as to achieve the purpose of improving the heat dissipation efficiency and heat dissipation effect.

[0037] Further optimization of the above technical solution, in an embodiment of the present application, the plate surfaces on both sides of the heat dissipation plate 2 in the extension direction of the heat dissipation plate 2 are respectively provided with curved surfaces, the peak portions of the curved surface on one side of the heat dissipation plate 2 are correspondingly arranged with the valley portions of the curved surface on the other side of the heat dissipation plate 2, that is, the heat dissipation plate 2 as a whole is in a curved structure, and a curved cooling liquid flow channel is formed between the adjacent two heat dissipation plates 2. After the cooling liquid enters the cooling liquid flow channel, under the joint action of the flow guide portion 3 and the heat dissipation plate 2, the cooling liquid alternately contacts and exchanges heat with the plate surface of the heat dissipation plate 2 and the flow guide portion 3. Not only the contact area of the heat dissipation plate 2 and the cooling liquid is increased, but also the length of the cooling liquid flow channel is prolonged, so as to effectively improve the heat exchange efficiency and heat exchange effect.

[0038] As shown in Figure 1 and Figure 2 , in an embodiment of the present application, the flow guide portion 3 is arranged at the peak top of the peak portion, and the flow guide portion 3 is used for guiding the cooling liquid to flow to the heat dissipation plate 2 on the other side, so that the cooling liquid collides with and changes direction to the heat dissipation plate 2 on the other side.

[0039] Exemplarily, in the embodiments shown in Figure 1 and Figure 2 , the flow guide portion 3 is a flow guide column standing away from the substrate 1, the flow guide column is in the same height as the heat dissipation plate 2, and the flow guide column is in an integrated structure with the substrate 1 and the heat dissipation plate 2.

[0040] In the above embodiments, the cross-sectional shape of the flow guide column is circular or elliptical, and the flow guide column is smoothly and transitionally connected with the peak top of the peak portion. In this way, when the cooling liquid is about to flow from the valley portion to the peak portion along the heat dissipation plate 2, under the action of the flow guide column, it can change direction to flow to the starting position of the valley portion of the heat dissipation plate 2 on the other side, so as to fully exchange heat with the heat dissipation plate 2 on the other side.

[0041] Of course, it should be noted that the flow guide portion 3 is not limited to the above columnar structure, in other embodiments, for example,Figure 5 As shown in the figure, the flow guide part 3 is a flow guide plate rising away from the substrate 1, and the flow guide plates on the opposite surfaces of the two adjacent heat dissipation plates 2 partially overlap, so that the flowing cooling liquid can be diverted by the flow guide plates, and the flow guide plates are inclined to the downstream side along the direction of the cooling liquid flow. In this case, the heat dissipation plate 2 can be a straight plate, or it can also be a Figure 1 、 Figure 2 and Figure 4 bent plate as shown in the figure. In this embodiment, the heat dissipation plate 2 cooperates with the flow guide plate to form a tortuous flow channel, thereby increasing the residence time of the cooling liquid in the flow channel and the heat exchange area, and thus improving the heat dissipation effect.

[0042] Further optimization of the above technical solutions, as shown in Figure 6 , the flow guide plate is an arc-shaped plate, and the connecting line of the two ends of the flow guide plate is inclined to the downstream side along the direction of the cooling liquid flow. It should be noted that the two sides of the arc-shaped plate are concave and convex arcs respectively, Figure 6 , the concave arc of the arc-shaped plate faces the direction of the incoming cooling liquid in the embodiment shown in the figure, and in other embodiments, the convex arc of the arc-shaped plate can also face the direction of the incoming cooling liquid. Compared with the straight flow guide plate, the surface area of the arc-shaped flow guide plate is larger, which can further increase the heat exchange area, improve the heat dissipation effect, and better guide the cooling liquid, reduce the kinetic energy loss of the cooling liquid, and make the cooling liquid more fully contact with the heat dissipation plates 2 on both sides.

[0043] Further, in an embodiment of the present application, a flow guide column rising away from the substrate 1 is connected to the end of the flow guide plate away from the heat dissipation plate 2, and the flow guide column is the same height as the flow guide plate. The cross-sectional shape of the flow guide plate is circular or elliptical, which can further improve the flow guiding effect on the cooling liquid and further increase the heat exchange area.

[0044] Of course, the Pinfin structure is not limited to the above-mentioned embodiments. In another embodiment of the present application, as shown in Figure 7 , the isosceles triangular protrusions are alternately and staggeringly arranged on both sides of the heat dissipation plate 2. The two equal-length sides of the isosceles triangular protrusion are concave arcs, one end of the concave arc is smoothly connected to the heat dissipation plate 2, and the other end is smoothly connected to the other concave arc. In this way, the isosceles triangular protrusions between the two adjacent heat dissipation plates 2 cooperate to form a tortuous flow channel. The isosceles triangular protrusion can not only guide the cooling liquid, but also increase the heat exchange area with the cooling liquid, thereby achieving the purpose of improving the heat dissipation efficiency.

[0045] As a preferred, as shown in Figures 1 to 7As shown, the liquid cooling heat dissipation device further comprises a surrounding fence 4, which is arranged around the Pinfin structure, and two ends of the heat dissipation plate 2 are respectively connected with two inner walls of the surrounding fence 4 arranged oppositely, so as to form a circumferential closed structure around the Pinfin structure, thereby facilitating the installation of the liquid cooling heat dissipation device.

[0046] As shown in the present application and claims, unless the context clearly indicates otherwise, "one", "a", "an", and / or "the" do not necessarily refer to the singular, but can also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements. The element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, product or device comprising the element.

[0047] In the description of the present application, unless otherwise explicitly defined, the words such as arrangement, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0048] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0049] The principles and implementation modes of the present application are described by applying specific examples in the present application. The above description of the embodiments is only used to help understand the method of the present application and its core idea. It should be noted that for those skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A liquid cooling heat dissipation device, characterized in that, include: substrate(1); The Pinfin structure is disposed on one side surface of the substrate (1). The Pinfin structure includes multiple heat sinks (2) arranged side by side at intervals. The heat sinks (2) stand upright in the direction away from the substrate (1). The heat sinks (2) are provided with flow guides (3) alternately at intervals on the plate surfaces on both sides of the extension direction of the heat sinks (2). The flow guides (3) are used to increase the contact area between the heat sinks (2) and the coolant and to guide the coolant in the direction away from the heat sinks (2).

2. The liquid cooling heat dissipation device according to claim 1, characterized in that, At least one of the surfaces of the heat sink (2) located on both sides of the extension direction of the heat sink (2) is a zigzag surface. The zigzag surface includes multiple peaks and multiple valleys. The peaks protrude in a direction away from the heat sink (2), and the valleys are recessed into the interior of the heat sink (2). Each of the peaks and each of the valleys are alternately connected along the extension direction of the heat sink (2).

3. The liquid cooling heat dissipation device according to claim 2, characterized in that, The heat sink (2) has folded surfaces on both sides of its extension direction. The peak of the folded surface on one side of the heat sink (2) corresponds to the valley of the folded surface on the other side of the heat sink (2).

4. The liquid cooling heat dissipation device according to claim 3, characterized in that, The guide section (3) is located at the top of the peak.

5. The liquid cooling heat dissipation device according to claim 4, characterized in that, The flow guide (3) is a flow guide column that stands in the direction away from the substrate (1), and the flow guide column is at the same height as the heat sink (2).

6. The liquid cooling heat dissipation device according to claim 5, characterized in that, The cross-sectional shape of the guide column is circular or elliptical, and the guide column is smoothly connected to the peak of the peak.

7. The liquid cooling heat dissipation device according to claim 1, characterized in that, The flow guide (3) is a flow guide plate. The flow guide plates on the opposite surfaces of two adjacent heat dissipation plates (2) partially overlap, and the flow guide plate is inclined to the downstream side along the flow direction of the coolant. The flow guide plate is at the same height as the heat dissipation plate (2).

8. The liquid cooling heat dissipation device according to claim 7, characterized in that, The guide plate is an arc-shaped plate, and the line connecting the two ends of the guide plate is inclined to the downstream side along the flow direction of the coolant.

9. The liquid cooling heat dissipation device according to claim 7, characterized in that, The end of the guide plate away from the heat sink (2) is connected to a guide column that stands upright in the direction away from the substrate (1). The guide column is at the same height as the guide plate, and the cross-sectional shape of the guide plate is circular or elliptical.

10. The liquid cooling heat dissipation device according to any one of claims 1-9, characterized in that, It also includes a enclosure (4), which is arranged around the Pinfin structure, and the two ends of the heat sink (2) are respectively connected to the two inner walls of the enclosure (4) that are arranged opposite to each other.

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