LED device and display screen

Abstract

An LED device comprises a substrate part and a light-emitting chip. The substrate part comprises a plate body, a circuit line, a conductive ink layer and a metal layer; the metal layer is laid on the board body to form the circuit line; the conductive ink layer is at least laid on the outer side of a part of the metal layer; and the light-emitting chip is electrically connected with the conductive ink layer. In addition, the utility model further provides a display screen formed by arranging the LED devices. Compared with the prior art, the LED device and the display screen thereof provided by the utility model can improve the contrast ratio between the circuit of the LED device and the surrounding environment.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic device technical field, in particular to a kind of LED device and display screen. BACKGROUND

[0002] Nowadays, electronic equipment has been integrated into every corner of life. Electronic equipment is generally composed of multiple electronic devices. The manufacture of electronic devices is mostly to pre-design and print circuits on a substrate, and then to solder chips, resistors, capacitors and other components to the predetermined positions of the circuits, thereby forming electronic devices with certain electrical properties.

[0003] On the other hand, virtual shooting is increasingly popular due to its seamless scene changes, short cycle and realistic advantages. In virtual shooting, the LED display control system including multiple LED devices displays different virtual backgrounds or scenes, and the characters complete various actions in the virtual scene. All shots are completed in the computer virtual scene, and the scene, characters, lighting and other elements are integrated in the computer for post-production. However, during post-production of virtual shooting, it is often found that there are some noise points in the shooting picture that are not coordinated with the scene tone, resulting in a significant increase in post-production time and affecting the shooting cycle and difficulty. SUMMARY

[0004] Therefore, the purpose of the utility model is to overcome the defects or deficiencies of the prior art and provide an LED device.

[0005] The utility model realizes the following technical solutions:

[0006] An LED device includes:

[0007] A substrate portion includes a board body, a circuit line, a conductive ink layer and a metal layer. The metal layer is laid on the board body to form the circuit line. The conductive ink layer is laid on at least one side of the metal layer.

[0008] A light-emitting chip is electrically connected to the conductive ink layer.

[0009] Compared with the prior art, the LED device of the utility model forms a circuit by replacing the existing anti-oxidation metal with a conductive ink layer, thereby improving the contrast between the circuit and the surrounding environment and reducing the cycle of post-production of virtual shooting.

[0010] In some embodiments, the substrate part further comprises a die-bonding area; the circuit line is laid on the front and back surfaces of the plate body to form front and back circuit lines, including a solid welding functional area, a non-solid welding functional area and a conductive hole, the metal layer is laid on the front and back surfaces of the plate body to form the solid welding functional area and the non-solid welding functional area on the front and back surfaces of the plate body, and the conductive hole is electrically connected with the metal layer on the front and back surfaces of the plate body; the conductive ink layer is laid outside the metal layer of the solid welding functional area of the front circuit line; the die-bonding area is arranged on the solid welding functional area of the front circuit line, and the light emitting chip is welded on the die-bonding area to realize power supply for the light emitting chip.

[0011] In some embodiments, the conductive ink layer is laid outside the metal layer of the back circuit line to increase the contrast of the overall LED device.

[0012] In some embodiments, the die-bonding area is provided with an ablation layer with uneven surface to simplify the step of realizing uneven surface of the die-bonding area.

[0013] In some embodiments, the area of the ablation layer is less than or equal to 4 times the area of the light emitting chip, and the thickness of the ablation layer is less than or equal to two-thirds of the thickness of the light emitting chip to ensure strong connection between the light emitting chip and the die-bonding area.

[0014] In some embodiments, the ablation layer is distributed with pockmarks, and the light emitting chip is used to increase the soldering area of the solder.

[0015] In some embodiments, the positive electrode pin and the negative electrode pin are arranged on the plate body and are electrically connected with the circuit line to supply power to the light emitting chip; the first positive electrode pin and the first negative electrode pin are arranged on the same side of the plate body and extend away from the plate body, and are electrically connected with the positive electrode pin and the negative electrode pin; the reflector cup is arranged on the plate body away from the first positive electrode pin and the first negative electrode pin; the conductive ink layer is laid on the positive electrode pin, the negative electrode pin, the first positive electrode pin and the first negative electrode pin, the first positive electrode pin and the first negative electrode pin facilitate the arrangement of the LED device into a display screen, the reflector cup can improve the brightness, and the positive electrode pin, the negative electrode pin, the first positive electrode pin and the first negative electrode pin covered by the conductive ink layer can form a clear contrast with the surrounding environment.

[0016] In some embodiments, a second positive electrode pin and a second negative electrode pin are further included; the second positive electrode pin is located between the first positive electrode pin and the positive electrode pin, the extension direction of the second positive electrode pin is parallel to the extension direction of the first positive electrode pin and is electrically connected with the first positive electrode pin, the second negative electrode pin is located between the first negative electrode pin and the negative electrode pin, the extension direction of the second negative electrode pin is parallel to the extension direction of the first negative electrode pin and is electrically connected with the first negative electrode pin, and the distance between the first positive electrode pin and the first negative electrode pin is greater than the distance between the second positive electrode pin and the second negative electrode pin, so as to form a stepped portion between the first positive electrode pin and the second positive electrode pin and between the first negative electrode pin and the second negative electrode pin, and the reflective cup is arranged on the stepped portion, so that the reflective cup is stably mounted.

[0017] In some embodiments, the conductive ink layer is not laid on the second positive electrode pin and the second negative electrode pin, so as to save the material for laying the conductive ink layer.

[0018] In addition, the utility model discloses a display screen using the above-mentioned LED device, and the technical scheme is as follows:

[0019] A display screen comprises a plurality of the above-mentioned LED devices and a control system electrically connected with the LED devices, and the plurality of LED devices are arranged in an array and emit light under the control of the control system.

[0020] In order to better understand and implement, the utility model is described in detail below with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0021] Fig. 1 (a) is a front view of the LED device with a positive light emitting chip in the embodiment one of the utility model;

[0022] Fig. 1 (b) is a front view of the LED device after removing the positive light emitting chip in the embodiment one of the utility model;

[0023] Fig. 2 (a) is a front view of the LED device with a flip light emitting chip in the embodiment one of the utility model;

[0024] Fig. 2 (b) is a front view of the LED device after removing the flip light emitting chip in the embodiment one of the utility model;

[0025] Figure 3 Fig. 3 is a back view of the LED device with the positive light emitting chip in the embodiment one of the utility model;

[0026] Figure 4 Fig. 4 is a partial sectional view of the LED device along the line A-A in Fig. 1 (b);

[0027] Figure 5 is a partial exploded view of the LED device after being cut along line B-B of Fig. 2(a);

[0028] Figure 6 is a front view of the LED device after the light emitting chip is removed in Embodiment Two of the present application;

[0029] Figure 7 is a sectional view of the LED device after being cut along line C-C of Fig. 3(a); Figure 5

[0030] Figure 8 is a front view of the LED device after the light emitting chip is removed in Embodiment Three of the present application;

[0031] Figure 9 is a sectional view of the LED device after being cut along line D-D of Fig. 4(a). Figure 7 DETAILED DESCRIPTION

[0032] After analyzing the existing virtual shooting pictures, the applicant found that the virtual shooting is completed in the LED display screen display scene, and the existing LED display screen includes a plurality of LED devices, and the circuit of each LED device is formed by electroplating an anti-oxidation metal layer on the surface layer of the substrate. Even after the encapsulation, a large part of the metal area is still clearly visible. These metal areas do not form a sharp contrast in color tone with the virtual scene, and the number is large, so it is difficult to quickly remove them from the shooting picture to form noise points. Moreover, the applicant further studies the structure of the LED device and finds that the conductive ink can be used to replace the existing anti-oxidation metal layer to form the circuit on the substrate. The conductive ink close to black color is easy to form a strong contrast with the virtual scene.

[0033] According to the above finding, the applicant proposes an LED device and a display formed by an array of a plurality of the LED devices, at least a part of the circuit and / or the pin of which is covered with a conductive ink layer, which can form a sharp contrast with the surrounding environment. This can not only ensure the conductive performance of the circuit, but also increase the contrast between the extremely black circuit and the virtual scene, so that the circuit part in the shooting picture can be quickly selected and deleted during the later production, thereby reducing the difficulty of editing in the later production.

[0034] Embodiment One:

[0035] Please refer to Figs. 1 to Figure 3 The LED device 100 of the present application includes a substrate part 10 and a light emitting chip 20.

[0036] ​​The substrate 10 is provided with a circuit, including a board body 11, a circuit line 12, a die bonding area 13, a conductive ink layer 14 and a metal layer 15.

[0037] The board body 11 can be one of BT substrate, FR4 substrate, aluminum substrate, ceramic substrate or a mixture of several kinds.

[0038] In the embodiment, the circuit line 12 is laid on the front and back surfaces of the board body 11 according to design requirements, forming front and back circuit lines, including a solid welding functional area 121, a non-solid welding functional area (not shown in the figure) and a conductive hole 122. The metal layer 15 is laid on the front and back surfaces of the board body 11 respectively to form the solid welding functional area 121 and the non-solid welding functional area on the front and back surfaces of the board body 11 respectively. The conductive hole 122 is connected between the metal layers 15 on the front and back surfaces of the board body 11, and is filled with conductive metal material or non-conductive material inside to realize the electrical connection between the front and back circuit lines.

[0039] The conductive ink layer 14 is laid outside the metal layer 15 of the solid welding functional area 121 of the front circuit line, and its color can be dark color such as black, dark gray or gray; preferably black. Further, the metal layer 15 outside the back circuit line can also be laid with the conductive ink layer 14.

[0040] Please refer to Figure 4The solid crystal region 13 is arranged in the solid welding functional area 121 and electrically connected with the solid welding functional area 121, and is used for welding the light emitting chip 20. The light emitting chip 20 can be a positive chip, a flip chip, or a mixed chip including a positive chip and a flip chip. Further, according to the mounting position of the light emitting chip 20, a laser etching machine is used to perform metal ablation treatment on the conductive ink layer 14 to form a surface uneven solid crystal region 13, so as to increase the welding area of the welding material of the light emitting chip 20. In the embodiment, an ablation layer 131 is formed on the solid crystal region 13 by metal ablation, the ablation layer 131 is a plurality of circular grooves with parallel extension directions, so as to increase the welding area, thereby realizing strong connection between the light emitting chip 20 and the solid crystal region 13. The light emitting chip 20 is a flip chip. The light emitting chip 20 can be one or three of the red LED chip, the green LED chip or the blue LED chip in the prior art. The area S2 of the ablation layer 131 is less than or equal to 4 times the area S1 of the light emitting chip 20. The thickness L2 of the ablation layer 131 is less than two-thirds of the thickness L1 of the light emitting chip 20. Further, the ablation layer 131 of the solid crystal region 13 can be further provided with distributed irregular ablation parts such as dimples and small depressions, so as to further increase the welding area and improve the connection strength. For the positions of the red positive LED chip, the red / green / blue flip LED chip, the ablation of the solid crystal region 13 needs to ensure that the chip electrode is electrically connected with the circuit line 12, and the green / blue positive LED chip can be mounted on the plate body 11.

[0041] Embodiment two:

[0042] Please refer to Figure 5 and Figure 6The structure of the LED device 100 in the embodiment is basically the same as that of the LED device in Embodiment One, except that the LED device further comprises a positive electrode pin 30, a negative electrode pin 40, a first positive electrode lead 50, a first negative electrode lead 60 and a reflecting cup 70. The positive electrode pin 30 and the negative electrode pin 40 are located on the plate body 11 and are connected between the circuit line 12 and the light emitting chip 20 respectively to supply power to the light emitting chip 20. The first positive electrode lead 50 and the first negative electrode lead 60 are electrically connected with the positive electrode pin 30 and the negative electrode pin 40 respectively, are oppositely arranged on one side of the plate body 11 and extend away from the plate body 11 in a direction perpendicular to the plate surface of the plate body 11 to support the substrate part 10. The reflecting cup 70 is arranged on the plate surface of the plate body 11 opposite to the positive electrode lead 50 and the negative electrode lead 60 to reflect the light emitted by the light emitting chip 20. The specific structure of the reflecting cup 40 can refer to the structure of the reflecting cup in the prior art. The positive electrode pin 30, the negative electrode pin 40, the positive electrode lead 50 and the negative electrode lead 60 are paved with the conductive ink layer 14.

[0043] In addition, the first positive electrode lead 50 and the first negative electrode lead 60 can be integrally formed with the substrate part 10 or are in a separate structure from the substrate part 10.

[0044] Embodiment Three:

[0045] Please refer to Figure 7 and Figure 8The structure of the LED device 100 in the embodiment is basically the same as that of the LED device 100 in Embodiment Two, except that the second positive electrode pin 80 and the second negative electrode pin 90 are further included, and the second positive electrode pin 80 and the second negative electrode pin 90 extend away from the board body 11 in a direction perpendicular to the board surface of the board body 11. The second positive electrode pin 80 is located between the first positive electrode pin 50 and the positive electrode pin 30 and is electrically connected with the first positive electrode pin 50; the second negative electrode pin 90 is located between the first negative electrode pin 60 and the negative electrode pin 40 and is electrically connected with the first negative electrode pin 60, and the distance between the first positive electrode pin 50 and the first negative electrode pin 60 is greater than the distance between the second positive electrode pin 80 and the second negative electrode pin 90, so that a stepped portion (not labeled) is formed between the first positive electrode pin 50 and the second positive electrode pin 80 and between the first negative electrode pin 60 and the second negative electrode pin 90. The reflective cup 70 is arranged on the stepped portion and surrounds the second positive electrode pin 80, the second negative electrode pin 90 and the substrate portion 10. The second positive electrode pin 80 and the second negative electrode pin 90 wrapped in the reflective cup 70 can not be paved with the conductive ink layer 14.

[0046] As one of the embodiments, the processing method of the LED device 100 of Embodiment One of the utility model is described below, which includes the following steps:

[0047] S1: The circuit line 12 is arranged on the substrate portion 10.

[0048] The circuit line 12 is made on the substrate portion 10 by etching, punching and copper plating process.

[0049] S2: The conductive ink layer 14 is printed on the circuit line 12.

[0050] It includes: the substrate portion 10 provided with the circuit line 12 is sent into an ink printing machine; the conductive ink layer 14 is covered on the circuit line 12; and the conductive ink layer 14 is dried and hardened by heating or UV irradiation.

[0051] S3: The die bonding area 13 is arranged on the conductive ink layer 14.

[0052] The metal ablation treatment is performed on part of the conductive ink layer 14 by using a laser etching machine, so as to obtain the uneven die bonding area 13.

[0053] S4: Quality inspection is performed.

[0054] In addition, the processing method of the LED device 100 in Embodiment Two includes the following steps

[0055] S1: disposing the circuit line 12 on the substrate 10 provided with the first positive electrode pin 50 and the first negative electrode pin 60.

[0056] The substrate 10, the first positive electrode pin 50 and the first negative electrode pin 60 are punched out in an integrated structure by a punching process, and the circuit line 12 is disposed on the substrate 10.

[0057] S2: printing the conductive ink layer 14 on the substrate 10 provided with the circuit line 12, the first positive electrode pin 50 and the first negative electrode pin 60.

[0058] The substrate 10 with the circuit line 12 is sent into an ink printer together with the first positive electrode pin 50 and the first negative electrode pin 60, the conductive ink layer 14 is laid on the circuit line 12, the first positive electrode pin 50 and the first negative electrode pin 60, and the conductive ink layer 14 is dried and hardened by heating or UV irradiation.

[0059] S3: disposing the reflective cup 70.

[0060] The substrate 10 with the circuit line 12 is put into a plastic machine together with the first positive electrode pin 50 and the first negative electrode pin 60, and the reflective cup 70 is injection molded on the first positive electrode pin 50 and the first negative electrode pin 60.

[0061] S4: disposing the die bonding area 13 on the conductive ink layer 14.

[0062] The metal ablation treatment is performed on part of the conductive ink layer 14 by using a laser etching machine, so that the uneven die bonding area 13 is obtained.

[0063] S5: quality inspection.

[0064] In addition, the utility model also provides a display screen, including several embodiment one to three disclosed LED device 100 and control system, several LED device 100 are arranged in array according to required screen area size and with control system electricity is connected, and different colored light is respectively sent under the control of control system to present different picture.

[0065] Compared with prior art, the LED device and the display screen have the following advantages:

[0066] 1. It can form a sharp contrast with the surrounding environment, reduce the difficulty of virtual shooting post-processing and shorten the production cycle.

[0067] 2. Strong connection can be formed between the light emitting chip and the substrate, and the installation stability is good.

[0068] 3. The existing LED device is improved to realize, low cost, wide applicability.

[0069] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more

[0070] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the utility model patent. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of protection of the present application.

Claims

1. An LED device, characterized by, The substrate part comprises a plate body, a circuit line, a conductive ink layer and a metal layer. The metal layer is laid on the plate body to form the circuit line. The conductive ink layer is laid on at least a part of the outer side of the metal layer. The light emitting chip is electrically connected with the conductive ink layer. The substrate part further comprises a die bonding area; the circuit line is laid on the front and back surfaces of the plate body to form a front circuit line and a back circuit line, which comprises a solid welding functional area, a non-solid welding functional area and a conductive hole; the metal layer is laid on the front and back surfaces of the plate body to form the solid welding functional area and the non-solid welding functional area on the front and back surfaces of the plate body; the conductive hole is electrically connected with the metal layer on the front and back surfaces of the plate body; the conductive ink layer is laid on the outer side of the metal layer of the solid welding functional area of the front circuit line; the die bonding area is arranged on the solid welding functional area of the front circuit line, and the light emitting chip is welded on the die bonding area.

2. The LED device of claim 1, wherein: The conductive ink layer is laid on the outer side of the metal layer of the back circuit line.

3. The LED device of claim 2, wherein: An ablation layer with uneven surface is arranged on the die bonding area.

4. The LED device of claim 2, wherein: The area of the ablation layer is less than or equal to 4 times the area of the light emitting chip; the thickness of the ablation layer is less than or equal to two-thirds of the thickness of the light emitting chip.

5. The LED device of claim 4, wherein: The ablation layer is distributed with pitting.

6. The LED device of claim 5, wherein: Further comprising a positive electrode pin, a negative electrode pin, a first positive electrode lead, a first negative electrode lead and a reflecting cup; the positive electrode pin and the negative electrode pin are arranged on the plate body and are electrically connected with the circuit line to supply power to the light emitting chip; the first positive electrode lead and the first negative electrode lead are arranged on the same side of the plate body and extend away from the plate body, and are electrically connected with the positive electrode pin and the negative electrode pin; the reflecting cup is arranged on the plate surface of the plate body away from the first positive electrode lead and the first negative electrode lead; the conductive ink layer is laid on the positive electrode pin, the negative electrode pin, the positive electrode lead and the negative electrode lead.

7. The LED device of claim 1, wherein: Further comprising a second positive electrode lead and a second negative electrode lead; the second positive electrode lead is located between the first positive electrode lead and the positive electrode pin, and the extension direction of the second positive electrode lead is parallel to the extension direction of the first positive electrode lead and is electrically connected with the first positive electrode lead; the second negative electrode lead is located between the first negative electrode lead and the negative electrode pin, and the extension direction of the second negative electrode lead is parallel to the extension direction of the first negative electrode lead and is electrically connected with the first negative electrode lead; the distance between the first positive electrode lead and the first negative electrode lead is greater than the distance between the second positive electrode lead and the second negative electrode lead, so that a stepped part is formed between the first positive electrode lead and the second positive electrode lead and between the first negative electrode lead and the second negative electrode lead, and the reflecting cup is arranged on the stepped part.

8. The LED device of claim 7, wherein: The conductive ink layer is not laid on the second positive electrode lead and the second negative electrode lead.

9. The LED device of claim 8, wherein: ​ 10. A display screen, characterized by: An array of a plurality of LED devices according to any one of claims 1 to 9 and a control system electrically connected to the LED devices, respectively, are arranged and emit light under control of the control system.

Images