Multi-point dispensing rod for field effect transistor die bonding process

Abstract

The utility model discloses a multi-point dispensing rod for a field effect transistor die bonding process. The multi-point dispensing rod comprises a bearing frame and guide sliding grooves formed in the left side and the right side of the interior of the bearing frame. Main two-way screws are rotationally arranged in the middles of the guide sliding grooves in the left side and the right side of the interior of the bearing frame through bearings, and the front ends of the main two-way screws are connected in a meshed mode through a chain wheel mechanism; a main distance adjusting platform is arranged in the center of the interior of the bearing frame, and auxiliary distance adjusting platforms are arranged on the front side and the rear side of the interior of the bearing frame in a sliding mode. According to the multi-point type dispensing rod for the field-effect tube die bonding process, the main distance adjusting platform and the auxiliary distance adjusting platform which can move in the bearing frame are convenient to adapt to work of field-effect tube chips with different column widths; and meanwhile, the first dispensing rod body and the second dispensing rod body moving in the main distance adjusting platform and the auxiliary distance adjusting platform are matched according to the distance between the field-effect tube chips arranged differently, so that the dispensing range is widened, and the adaptability is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to field effect tube fixed point technology field, concretely is a kind of field effect tube fixed point process multipoint type dispensing rod. BACKGROUND

[0002] Field effect tube fixed point refers to the process that chip of field effect tube (FET) is pasted to specified substrate using fixed point machine in packaging process, forms heat passage or electric passage, usually uses conductive glue or insulating glue to stick field effect tube in specified area of support, provides condition for subsequent wire bonding connection, and glue body is mainly controlled by dispensing machine to be coated on substrate.

[0003] The utility model with publication number CN212120641U discloses a multipoint type dispensing equipment, three dispensing heads are arranged on dispensing head fixing plate, three dispensing heads can simultaneously dispense three points on circuit board and other products, greatly improve the efficiency of the dispensing machine dispensing, save the workload and time of operating personnel.

[0004] But the above-mentioned multipoint type dispensing equipment still has the following problems in actual use process: although multiple dispensing heads are arranged to realize dispensing work, but field effect tube chips required to be dispensed in existing packaging operation process exist different specifications and different spacing arrangement modes, so multiple dispensing heads cannot adapt to multiple specifications and spacing, and field effect tube fixed point operation work is affected.

[0005] Therefore, we propose a field effect tube fixed point process multipoint type dispensing rod to solve the problems in the above. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a field effect tube fixed point process multipoint type dispensing rod, to solve the problem that multiple dispensing heads are arranged to realize dispensing work in existing technology, but field effect tube required to be dispensed in existing packaging operation process exists different specifications and different spacing arrangement modes, so multiple dispensing heads cannot adapt to multiple specifications and spacing, and field effect tube fixed point operation work is affected.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a field effect tube fixed point process multipoint type dispensing rod, including bearing frame and guide sliding slot opened in left and right sides of bearing frame interior;

[0008] Main bidirectional screw rod is rotatably arranged in the middle of guide sliding slot in left and right sides of bearing frame interior through bearing, and the front end of main bidirectional screw rod is connected by chain wheel mechanism intermeshing;Further comprising:

[0009] Main distance adjusting platform is arranged at the inner central position of bearing frame, and vice distance adjusting platform is slidably arranged on the front and back sides of bearing frame interior.

[0010] Preferably, the main pitch platform is fixedly installed inside the guide sliding groove, and the outer ends of the front and rear side sub-pitch platforms of the main pitch platform are slidably arranged inside the guide sliding groove, and the outer ends of the symmetrically arranged sub-pitch platforms are threadedly connected to the outer wall of the main bidirectional screw rod.

[0011] Preferably, the inside of the pitch platform and the sub-pitch platform is provided with a pitch sliding groove, and the bottom surface of the main pitch platform and the sub-pitch platform is rotatably provided with a sub-bidirectional screw rod through a bearing, and a first dispensing rod body is fixedly arranged at the center position of the pitch sliding groove inside the main pitch platform and the sub-pitch platform.

[0012] Preferably, the bottom surface right side of the bearing frame is rotatably provided with a driving shaft, the middle part of the driving shaft is connected to the outer end of the sub-bidirectional screw rod on the bottom surface of the main pitch platform through first bevel gear meshing, and the front and rear sides of the driving shaft are connected to the outer ends of the sub-bidirectional screw rods on the bottom surfaces of the sub-pitch platforms through second bevel gear meshing.

[0013] Preferably, the second bevel gears between the driving shaft and the outer wall realize sliding and following rotation through the concave-convex structure, and the second bevel gears between the driving shaft and the outer wall of the sub-bidirectional screw rod are connected to each other through a positioning support to prevent the second bevel gears from being separated.

[0014] Preferably, the left and right sides of the pitch sliding groove inside the main pitch platform and the sub-pitch platform are slidably provided with a second dispensing rod body, and the outer walls below the symmetrically arranged second dispensing rod bodies are fixedly provided with guide sliding blocks.

[0015] Preferably, the outer end of the guide sliding block is threadedly connected to the outer wall of the sub-bidirectional screw rod, and the guide sliding block and the second dispensing rod body are moved by the rotation of the sub-bidirectional screw rod, so as to adjust the spacing of the second dispensing rod body.

[0016] Compared with the prior art, the field effect transistor die bonding process multi-point dispensing rod has the advantages that: the movable main pitch platform and the sub-pitch platform inside the bearing frame can adapt to different column widths of field effect transistor chips, the first dispensing rod body and the second dispensing rod body inside the main pitch platform and the sub-pitch platform can adapt to the spacing of field effect transistor chips arranged in different ways, the range and adaptability of dispensing are improved, and the specific contents are as follows:

[0017] 1. The main bidirectional screw rod is rotated by the chain wheel mechanism connected by the servo motor, so as to drive the front and rear side sub-pitch platforms to move, so as to adjust the spacing between the main pitch platform, and then adapt to the needs of different column widths of field effect transistor chip die bonding process.

[0018] 2. The sub-adjustment platform drives the second bevel gear of the sub-bidirectional screw to move during movement, and the second bevel gear slides through the concave-convex structure and rotates following the driving shaft, and the second bevel gear is prevented from disengaging during movement through the positioning support ensuring mutual engagement.

[0019] Meanwhile, the driving shaft rotates through the first bevel gear and the second bevel gear to drive the sub-bidirectional screw to rotate, and the sub-bidirectional screw drives the left and right guide sliders and the second dispensing rod body to move, so as to adapt to the spacing of different arranged field effect transistor chips, and improve the dispensing range and adaptability. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a whole three-dimensional structure schematic view of the utility model;

[0021] Figure 2 It is a whole bottom view structure schematic view of the utility model;

[0022] Figure 3 It is a driving shaft installation structure schematic view of the utility model;

[0023] Figure 4 It is a sub-adjustment platform and main bidirectional screw installation structure schematic view of the utility model;

[0024] Figure 5 It is a guide slider and second dispensing rod body connection structure schematic view of the utility model;

[0025] Figure 6 It is a sub-bidirectional screw and driving shaft connection structure schematic view of the utility model;

[0026] Figure 7 It is a whole three-dimensional structure schematic view of the utility model Figure 6 It is a structure schematic view of A place of the utility model.

[0027] In the drawing: 1, bearing frame; 2, guide sliding slot; 3, main bidirectional screw; 4, chain wheel mechanism; 5, main adjustment platform; 6, sub-adjustment platform; 7, adjustment sliding slot; 8, sub-bidirectional screw; 9, first dispensing rod body; 10, driving shaft; 11, first bevel gear; 12, second bevel gear; 13, positioning support; 14, second dispensing rod body; 15, guide slider. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0029] Referring to Figures 1-7 The utility model provides the following technical scheme:

[0030] Embodiment 1: in order to solve the problem that the existing field effect transistor die bonding process multipoint type dispensing rod exists when using, therefore the embodiment is through the following technical scheme, a field effect transistor die bonding process multipoint type dispensing rod, including bearing frame 1 and the guide chute 2 that sets up in the inside left and right sides of bearing frame 1, the middle part of guide chute 2 in the inside left and right sides of bearing frame 1 is provided with main bidirectional screw rod 3 by bearing rotation, and the front end of main bidirectional screw rod 3 is connected by chain wheel mechanism 4 intermeshing.

[0031] The inside center position of bearing frame 1 is provided with main pitch platform 5, and the inside front and back sides of bearing frame 1 are slidably provided with vice pitch platform 6;Main pitch platform 5 is fixedly installed in the inside of guide chute 2, and the outer end of vice pitch platform 6 on the front and back sides of main pitch platform 5 is slidably arranged in the inside of guide chute 2, and the outer end of symmetrically arranged vice pitch platform 6 is screw connected to the outer wall of main bidirectional screw rod 3.

[0032] As Figures 2-4 As shown, when the distance between main pitch platform 5 and vice pitch platform 6 in the inside of bearing frame 1 needs to be adjusted, main bidirectional screw rod 3 driven by servo motor installed in front of bearing frame 1 is connected by chain wheel mechanism 4 intermeshing and rotates in the inside of guide chute 2, and then the outer end of symmetrically arranged vice pitch platform 6 is screw connected between main bidirectional screw rod 3, so as to drive vice pitch platform 6 on the front and back sides to slide in the inside of guide chute 2, so as to adjust the distance between main pitch platform 5 and vice pitch platform 6 according to different pitch field effect transistor chips, improve the adaptation range and the efficiency of dispensing.

[0033] Embodiment 2: in order to solve the problem that the existing field effect transistor die bonding process multipoint type dispensing rod exists when using, therefore the embodiment is through the following technical scheme, the inside of main pitch platform 5 and vice pitch platform 6 is provided with pitch slide groove 7, and the bottom surface of main pitch platform 5 and vice pitch platform 6 is rotatably provided with vice bidirectional screw rod 8 by bearing, and the center position of pitch slide groove 7 in the inside of main pitch platform 5 and vice pitch platform 6 is fixedly provided with first dispensing rod body 9;The left and right sides of pitch slide groove 7 in the inside of main pitch platform 5 and vice pitch platform 6 are slidably provided with second dispensing rod body 14, and the outer wall below symmetrically arranged second dispensing rod body 14 is fixedly provided with guide block 15;The outer end of symmetrically arranged guide block 15 is screw connected to the outer wall of vice bidirectional screw rod 8, and guide block 15 and second dispensing rod body 14 are moved by the rotation of vice bidirectional screw rod 8, so as to adjust the distance of second dispensing rod body 14.

[0034] The bottom right side of the bearing frame 1 is rotatably provided with a driving shaft 10 through a bearing, and the middle part of the driving shaft 10 is connected to the outer end of the secondary bidirectional screw rod 8 on the bottom of the main pitch adjusting platform 5 through the first bevel gear 11, and the front and rear sides of the driving shaft 10 are connected to the outer end of the secondary bidirectional screw rod 8 on the bottom of the secondary pitch adjusting platform 6 through the second bevel gear 12; the driving shaft 10 and the second bevel gear 12 of the outer wall are connected through a concave-convex structure to realize sliding and following rotation, and the driving shaft 10 and the second bevel gear 12 of the outer wall of the secondary bidirectional screw rod 8 are connected through the positioning bracket 13, so as to prevent the second bevel gear 12 from being disengaged.

[0035] As shown in Figures 5-7 When adjusting the distance between the first glue dispensing rod body 9 and the second glue dispensing rod body 14, the secondary pitch adjusting platform 6 after sliding adjustment is moved by the second bevel gear 12 on the outer end of the bottom secondary bidirectional screw rod 8, and the second bevel gear 12 is connected through the positioning bracket 13, so as to avoid disengagement and non-engagement in the subsequent transmission process, and the driving shaft 10 is rotated by the servo motor, the secondary bidirectional screw rod 8 on the bottom of the main pitch adjusting platform 5 is rotated by the first bevel gear 11 in the middle part of the driving shaft 10, and the secondary bidirectional screw rod 8 on the bottom of the secondary pitch adjusting platform 6 is rotated by the second bevel gear 12, so that the secondary bidirectional screw rod 8 drives the outer wall threaded connecting guide block 15 to drive the second glue dispensing rod body 14 to move, so as to adjust the distance between the first glue dispensing rod body 9 and the second glue dispensing rod body 14, and adapt to the glue dispensing operation requirements of different distances.

[0036] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A multi-point dispensing rod for field effect transistor die bonding process, comprising a bearing frame (1), and guide grooves (2) opened on the left and right sides of the bearing frame (1); a main bidirectional screw (3) is rotatably arranged in the middle of the guide grooves (2) on the left and right sides of the bearing frame (1), and the front end of the main bidirectional screw (3) is connected by chain wheel mechanisms (4). Further comprising: characterized in that A main pitch adjusting platform (5) is arranged at the center of the inside of the bearing frame (1), and a secondary pitch adjusting platform (6) is slidably arranged on the front and back sides of the inside of the bearing frame (1). The main pitch adjusting platform (5) is fixedly installed in the inside of the guide groove (2), the outer ends of the secondary pitch adjusting platforms (6) on the front and back sides of the main pitch adjusting platform (5) are slidably arranged in the inside of the guide groove (2), and the outer ends of the symmetrically arranged secondary pitch adjusting platforms (6) are threadedly connected to the outer wall of the main bidirectional screw (3).

2. The multi-point dispensing stick for field effect transistor die bonding process according to claim 1, wherein: The inside of the main pitch adjusting platform (5) and the secondary pitch adjusting platform (6) is provided with a pitch adjusting groove (7), the bottom surface of the main pitch adjusting platform (5) and the secondary pitch adjusting platform (6) is rotatably provided with a secondary bidirectional screw (8) through a bearing, and the center position of the pitch adjusting groove (7) in the inside of the main pitch adjusting platform (5) and the secondary pitch adjusting platform (6) is fixedly provided with a first dispensing rod body (9).

3. The multi-point dispensing stick for field effect transistor die bonding process according to claim 1, wherein: The bottom right side of the bearing frame (1) is rotatably provided with a driving shaft (10) through a bearing, the middle part of the driving shaft (10) is connected to the outer end of the secondary bidirectional screw (8) on the bottom surface of the main pitch adjusting platform (5) through a first bevel gear (11), and the front and back sides of the driving shaft (10) are connected to the outer ends of the secondary bidirectional screws (8) on the bottom surfaces of the secondary pitch adjusting platforms (6) through second bevel gears (12).

4. The multi-point dispensing stem for field effect transistor die bonding process according to claim 1, wherein: The second bevel gears (12) between the driving shaft (10) and the outer wall are slidably and rotationally connected through a concave-convex structure, the second bevel gears (12) between the driving shaft (10) and the outer wall of the secondary bidirectional screw (8) are connected to each other through a positioning bracket (13), and the second bevel gears (12) are prevented from being separated.

5. The multi-point dispensing bar for field effect transistor die bonding process according to claim 4, wherein: The left and right sides of the pitch adjusting grooves (7) in the inside of the main pitch adjusting platform (5) and the secondary pitch adjusting platform (6) are slidably provided with a second dispensing rod body (14), and the outer walls below the symmetrically arranged second dispensing rod bodies (14) are fixedly provided with guide slides (15).

6. The multi-point dispensing stem for a field effect transistor die bonding process according to claim 3, wherein: The outer ends of the symmetrically arranged guide slides (15) are threadedly connected to the outer wall of the secondary bidirectional screw (8), the guide slides (15) and the second dispensing rod bodies (14) are moved by the rotation of the secondary bidirectional screw (8), so as to adjust the pitch of the second dispensing rod bodies (14).

7. The multi-point dispensing bar for field effect transistor die bonding process according to claim 6, wherein: ​

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