Semiconductor memory chip laser cutting machine convenient to replace
By designing a fixed platform and clamping plate structure on the laser cutting machine, and utilizing components such as positioning protrusions and grooves, and card blocks and slots, the problem of low cutting efficiency during semiconductor memory chip replacement was solved, and the cutting accuracy continuity and efficiency were improved during the chip replacement process.
Patent Information
- Application Number
- CN202423200924.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-25
AI Technical Summary
When replacing semiconductor memory chips, existing laser cutting machines suffer from low cutting efficiency due to positional differences, requiring frequent adjustments to the cutting position.
A semiconductor memory chip laser cutting machine was designed, comprising a fixed stage, a clamping plate, and a guide rail structure. The clamping plate can move elastically, and the fixed stage is positioned by positioning protrusions and grooves to ensure that the center of the placement groove coincides with the center of the clamping area. It is fixed by a locking block and a locking slot, and the slider moves elastically on the guide rail to ensure that the accuracy remains unchanged when the chip is replaced.
This achieves continuity of cutting precision during semiconductor chip replacement, improves cutting efficiency, and reduces the frequency of position adjustments.
Smart Images
Figure CN223588571U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the production technical field of laser cutting machine more specifically, the utility model relates to a kind of semiconductor memory chip laser cutting machine of convenient replacement. BACKGROUND
[0002] With the continuous development of science and technology, the use frequency of semiconductor memory chip will be higher and higher.
[0003] Semiconductor memory chip needs to be cut during production, so that the use of chip is facilitated, and laser cutting machine is needed for cutting. Currently, laser cutting machine mostly cuts chip one by one, which requires frequent replacement of chip on laser cutting machine. When chip is replaced, the position will be different, resulting in the need to adjust the cutting position of chip each time, which affects the cutting efficiency of chip. SUMMARY
[0004] In order to overcome the above-mentioned defects of the prior art, the embodiments of the utility model provide a semiconductor memory chip laser cutting machine convenient to replace.
[0005] To achieve the above-mentioned purpose, the utility model provides a semiconductor memory chip laser cutting machine convenient to replace, which comprises a cutting table. The utility model has the following beneficial effects: the utility model discloses a semiconductor memory chip laser cutting machine convenient to replace, which comprises a cutting table, a fixing platform of semiconductor, a cutting station of semiconductor chip on the cutting table, two clamping plates moving elastically towards or reversely on the cutting station, a clamping area formed between the two clamping plates, the fixing platform positioned and clamped inside the clamping area, a placing groove of semiconductor chip on the surface of the fixing platform, and the center position of the placing groove always coincides with the center position of the clamping area.
[0006] Further, the bottom of the fixing platform is provided with a base, the center position of the bottom of the base is provided with a positioning protrusion, the positioning protrusion coincides with the center position of the placing groove, the center position of the clamping area is provided with a positioning groove, and the positioning protrusion is embedded in the inside of the positioning groove, so that the fixing platform is positioned in the clamping area.
[0007] Further, the two sides of the base are provided with symmetrical clamping grooves, the clamping plates are provided with clamping blocks, the clamping blocks are clamped in the inside of the clamping grooves, so that the fixing platform is clamped and fixed in the clamping area.
[0008] Further, the two sides of the cutting station are provided with symmetrical guide rails, the bottom of the clamping plate is provided with a sliding block, and the sliding block is slidingly arranged on the guide rail.
[0009] The inside of the guide rail is provided with a guide groove, and the sliding block is elastically arranged in the inside of the guide groove.
[0010] Further, the end of the guide groove is provided with a spring seat, and a buffer spring is arranged on the spring seat and fixed with the end surface of the sliding block.
[0011] The technical effects and advantages of the utility model are that during the taking out or putting in of the fixed platform, the center position of the placing groove always coincides with the center of the clamping area, ensuring the precision of continuous cutting of the semiconductor chip. BRIEF DESCRIPTION OF DRAWINGS
[0012] Fig. 1 It is a surface sectional view of the cutting table of the utility model.
[0013] Fig. 2 It is a side view of the fixed platform of the utility model. DETAILED DESCRIPTION
[0014] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0015] As Figs. 1-2 It is a specific embodiment of the utility model, and the structure comprises a cutting table 1, and the structure further comprises a fixed platform 11 of a semiconductor, the cutting table 1 is provided with a cutting station 12 of a semiconductor chip, the cutting station 12 is provided with two clamping plates 13 elastically moving towards or reversely, a clamping area 14 is formed between the two clamping plates 13, the fixed platform 11 is positioned and clamped in the inside of the clamping area 14, the surface of the fixed platform 11 is provided with a placing groove 15 of a semiconductor chip, and the center position of the placing groove 15 always coincides with the center of the clamping area 14.
[0016] In the utility model, when the semiconductor chip needs to be replaced, the fixed platform 11 is first taken out from the clamping area 14, then the semiconductor chip to be cut is placed on the placing groove 15 again, and finally the fixed platform 11 is placed back to the clamping area 14, the fixed platform 11 is positioned and clamped again by the two clamping plates 13, and the elastic movement of the clamping plate 13 facilitates the taking out or putting in of the fixed platform 11 in the clamping area 14, and during the taking out or putting in of the fixed platform 11, the center position of the placing groove 15 always coincides with the center of the clamping area 14, ensuring the precision of continuous cutting of the semiconductor chip.
[0017] In the utility model, as preferred scheme, the bottom of the fixed platform 11 is equipped with the base 2, the central position of the bottom of the base 2 is equipped with the positioning protrusion 21, the central position of the positioning protrusion 21 and the placing groove 15 coincide, the central position of the clamping area 14 is equipped with the positioning recess 22, the positioning protrusion 21 is embedded in the inside of the positioning recess 22, so that the fixed platform 11 is positioned in the clamping area 14.
[0018] In the utility model, through the positioning protrusion 21 is embedded in the inside of the positioning recess 22, realize the positioning of the position of the fixed platform 11 in the clamping area 14, to ensure that the central position of the placing groove 15 always coincides with the center of the clamping area 14.
[0019] In the utility model, as preferred scheme, the both sides of the base 2 are equipped with the symmetrical clamping groove 3, the clamping plate 13 is equipped with the clamping block 31, the clamping block 31 is clamped in the inside of the clamping groove 3, so that the fixed platform 11 is clamped and fixed in the clamping area 14.
[0020] In the utility model, the setting of the clamping groove 3 and the clamping block 31 is convenient for the fixed platform 11 to be fixed between the two clamping plates 13, avoids the fixed platform 11 to move and dislocate between the two clamping plates 13.
[0021] In the utility model, as preferred scheme, the both sides of the cutting station 12 are equipped with the symmetrical slide rail 4, the bottom of the clamping plate 13 is equipped with the sliding block 41, the sliding block 41 is slidably arranged on the slide rail 4;
[0022] The inside of the slide rail 4 is equipped with the guide groove 42, and the sliding block 41 is movably arranged in the inside of the guide groove 42.
[0023] In the utility model, the setting of the sliding block 41 and the slide rail 4 ensures the stability of the clamping plate 13.
[0024] In the utility model, as preferred scheme, the end of the guide groove 42 is equipped with the spring seat 5, the spring seat 5 is equipped with the buffer spring 51, and the buffer spring 51 is fixed to the end face of the sliding block 41.
[0025] In the utility model, when the sliding block 41 slides on the slide rail 4, the buffer spring 51 is elastically arranged on the spring seat 5, and the elastic movement of the sliding block 41 is realized.
[0026] Finally, it should be pointed out that: first, in the description of the present application, it should be pointed out that, unless otherwise specified and limited, the terms "installation", "connection", "connection" should be understood broadly, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, "up", "down", "left", "right" and the like are only used to indicate the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change;
[0027] Secondly: the utility model discloses the embodiment in the drawing, only relate to the structure with the embodiment of the utility model, other structures can refer to the usual design, under the condition of not conflict, the same embodiment and different embodiment of the utility model can be combined with each other.
[0028] Finally: the above only for the preferred embodiment of the utility model has, and does not use to limit the utility model, any modification, equivalent replacement, improvement etc. that is made within the spirit and principle of the utility model, should include in the protection scope of the utility model.
Claims
1. A laser cutting machine for semiconductor memory chip which is convenient to replace, its structure includes cutting table (1), its characterized in that: The structure further comprises a fixed platform (11) of semiconductor, the cutting station (1) is provided with a cutting station (12) of semiconductor chip, the cutting station (12) is provided with two facing or reverse elastic movement clamping plates (13), the clamping area (14) is formed between the two clamping plates (13), the fixed platform (11) is positioned and clamped in the inside of the clamping area (14), the surface of the fixed platform (11) is provided with a placing groove (15) of semiconductor chip, the center position of the placing groove (15) always coincides with the center of the clamping area (14).
2. The laser cutting machine for semiconductor memory chip with easy replacement according to claim 1, characterized in that: The bottom of the fixed platform (11) is provided with a base (2), the center position of the bottom of the base (2) is provided with a positioning protrusion (21), the positioning protrusion (21) coincides with the center position of the placing groove (15), the center position of the clamping area (14) is provided with a positioning groove (22), the positioning protrusion (21) is embedded in the inside of the positioning groove (22), so that the fixed platform (11) is positioned in the clamping area (14).
3. The laser cutting machine for semiconductor memory chip with easy replacement according to claim 2, characterized in that: The both sides of the base (2) are provided with symmetrical clamping grooves (3), the clamping plate (13) is provided with clamping blocks (31), the clamping blocks (31) are clamped in the inside of the clamping grooves (3), so that the fixed platform (11) is clamped and fixed in the clamping area (14).
4. The laser cutting machine for semiconductor memory chip with easy replacement according to claim 1, characterized in that: The both sides of the cutting station (12) are provided with symmetrical sliding rails (4), the bottom of the clamping plate (13) is provided with sliding blocks (41), the sliding blocks (41) are slidingly arranged on the sliding rails (4); The inside of the sliding rail (4) is provided with a guide groove (42), the sliding block (41) is elastically arranged in the inside of the guide groove (42).
5. The laser cutting machine for semiconductor memory chip with easy replacement according to claim 4, characterized in that: The end of the guide groove (42) is provided with a spring seat (5), the spring seat (5) is provided with a buffer spring (51), the buffer spring (51) is fixed with the end surface of the sliding block (41).