Single wafer thinning device

Abstract

The utility model discloses a single wafer thinning device, and relates to the technical field of monocrystalline silicon wafer processing. The device comprises a mounting box, a fixing frame, an electric telescopic rod, a cutting and grinding assembly, a clamping assembly, a supporting assembly and a dust collecting system. Wherein the cutting and grinding assembly is supported above the mounting box through an electric telescopic rod, and an annular air inlet assembly is arranged on the periphery of the cutting and grinding assembly and used for collecting dust; the clamping assembly is located on the inner side of an opening in the upper end of the installation box and used for fixing a single wafer. The supporting assembly is arranged in the mounting box, the supporting assembly and the clamping assembly jointly define a closed cavity, it is ensured that efficient cutting and grinding and dust management are conducted on the single wafer, and the air exhaust assembly is arranged on the lower portion of the mounting box so that the dust collecting effect can be enhanced. According to the design, the equipment structure is simplified, the manufacturing cost and the maintenance difficulty are reduced, the machining precision is improved through accurate clamping and positioning, and the consistency and the quality of wafer surface treatment are guaranteed. Meanwhile, dust is effectively controlled, environmental pollution is reduced, and the health of operators is protected.

Description

TECHNICAL FIELD

[0001] The utility model relates to single wafer thinning device of single wafer wafer processing technical field. BACKGROUND

[0002] Single wafer, single crystal of silicon, is a kind of crystal with substantially complete lattice structure, different directions have different properties, it is a kind of good semi-conductor material, purity requirement reaches 99.9999%, even reaches 99.9999999% or more, for manufacturing semiconductor devices, solar cells etc., with high-purity polycrystalline silicon is drawn in single crystal furnace;

[0003] In the process of single wafer processing production, often need to use end face grinding cutting machine to polish the end face of single wafer, this process improves the quality and flatness of product, but also accompanied by a problem: a large number of fine silicon crystal particles will be produced, if not properly handled, these dust not only pollute the environment, also can affect the air quality in workshop, and then threaten the health and safety of operating personnel.

[0004] The Chinese invention patent with application number 202311726261.7 discloses a kind of single wafer thinning machine, the invention adopts large box structure to capture and collect the silicon crystal particles generated in polishing process.Although this method can reduce environmental pollution to some extent, but its complex mechanical structure leads to the equipment volume is huge, occupies too much space, and increases manufacturing cost and maintenance difficulty, therefore there is certain limitation in actual industrial application.

[0005] In view of the deficiencies of prior art, there is an urgent need in the market for a new device that can effectively perform single wafer thinning operation and efficiently collect silicon crystal particles. UTILITY MODEL CONTENT

[0006] To solve the above technical problems, the utility model provides a kind of single wafer thinning device.

[0007] The utility model adopts the technical scheme: including installation box, the installation box both sides are equipped with fixed frame, its characterized in that, the fixed frame is equipped with electric telescopic handle, cut and grind component is supported by electric telescopic handle and located the top of installation box, the outer periphery of cut and grind component is equipped with annular air inlet component for collecting single wafer dust, the inside of installation box upper end opening is equipped with clamping component for clamping single wafer, the inside of installation box is also equipped with support component for supporting single wafer, the support component and clamping component, cut and grind component jointly form the cavity for cutting and grinding and dust collection to single wafer.

[0008] As a preferred scheme, the cutting and grinding assembly comprises an air suction cover, a second motor and a grinding and cutting disc, the electric telescopic rod is connected with the upper surface of the air suction cover, a plurality of air inlets are arranged on the circumferential surface of the outer ring of the air suction cover, and the power end of the second motor is connected with the grinding and cutting disc arranged in the air suction cover.

[0009] As a preferred scheme, the air suction assembly comprises a plurality of air suction assemblies and a ring-shaped pipe, the air suction assembly comprises an inclined air inlet group and an air outlet pipe, the inclined air inlet group is arranged on the inner side of the air inlet of the air suction cover, the air outlet pipe is arranged on the outer side of the air inlet of the air suction cover, and the ring-shaped pipe is connected with the inside of the air suction cover through the air suction assembly.

[0010] Further, at least one air guide pipe for connecting the ring-shaped pipe and the mounting box is arranged on the outer side of the ring-shaped pipe.

[0011] As a preferred scheme, the holding assembly comprises a fixed frame, a clamping block, a bidirectional screw rod and a first motor, the fixed frame is arranged in the opening on the upper end of the mounting box, the clamping block is connected with the fixed frame through the bidirectional screw rod, the outer end of the fixed frame is provided with the first motor for driving the bidirectional screw rod to rotate, and the power output end of the first motor is connected with the bidirectional screw rod through the fixed frame.

[0012] As a preferred scheme, a limiting rod for limiting the moving direction of the clamping block is arranged in the fixed frame, one end of the limiting rod is fixed on one side of the fixed frame, the other end of the limiting rod passes through a limiting hole arranged on the clamping block and is fixed on the other side of the fixed frame, and an anti-skid strip for preventing the movement of the single wafer is arranged on the outer side of the clamping block.

[0013] As a preferred scheme, the lower part of the mounting box is provided with an air suction assembly for providing suction, and the air suction assembly comprises a connecting frame, a fixed plate and an air suction fan, the connecting frame is fixed on the lower side of the mounting box, and the air suction fan is arranged in the connecting frame through the fixed plate.

[0014] As a preferred scheme, the supporting assembly comprises a mesh ring, a conical frustum and a storage column, the opening on the lower end of the mounting box is a ring-shaped opening, the mesh ring is arranged in the ring-shaped opening, the lower end of the storage column is fixed in the lower end of the mounting box through the conical frustum, the upper end of the storage column is located in the middle of the holding assembly, and the upper surface of the storage column corresponds to the cutting and grinding assembly.

[0015] The single wafer thinning device has the following technical effects:

[0016] Based on the deficiencies of the prior art, the single wafer thinning device has the following technical effects:

[0017] One, the utility model discloses through optimizing structure design, and the cutting and grinding assembly is fixed above the installation box through the telescopic link, and the cutting and grinding assembly outer periphery is equipped with annular air intake assembly for collecting monolithic wafer dust. Such structure composition makes the whole device when performing the thinning operation of monolithic wafer, can effectively limit and collect the dust generated, avoid its diffusion to the surrounding environment. This not only reduces the pollution to the environment, also improves the air quality in the workshop, protects the health of the operator, solves the problem that silicon crystal particles are difficult to control in the traditional polishing process.

[0018] Second, the supporting assembly in the utility model is fixed at one end at the bottom of the installation box, and the other end and the clamping assembly, cutting and grinding assembly jointly constitute the cavity for cutting and grinding and dust collection of monolithic wafer. This structure simplifies the overall design, compared with the large box structure, reduces unnecessary mechanical structure, thereby reducing the floor area of equipment, reducing manufacturing cost and maintenance difficulty. This solves the problem of large size, excessive space occupation and high cost caused by complex structure in the prior art, makes the device more suitable for actual industrial application, improves production efficiency and economic benefit.

[0019] Third, the clamping assembly in the utility model is composed of a fixed frame, a clamping block, a bidirectional screw rod, a first motor and an anti-skid strip, wherein the clamping block is connected with the fixed frame through the bidirectional screw rod, and the first motor drives the bidirectional screw rod to rotate to realize the clamping action. The fixed frame is also provided with a limiting rod to ensure the accuracy of the moving direction of the clamping block, and the outer side of the clamping block is provided with an anti-skid strip to prevent the wafer from moving. This structure provides a stable and accurate monolithic wafer positioning method, improves the machining precision, ensures the consistency and quality of wafer surface treatment, and solves the problems of inaccurate positioning and wafer sliding in the traditional clamping method. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings according to these drawings without creating creative labor.

[0021] Figure 1 It is the structural schematic diagram of the utility model;

[0022] Figure 2 It is the structural schematic diagram of the clamping assembly in the utility model;

[0023] Figure 3 It is the structural schematic diagram of the cutting and grinding assembly and the air intake assembly in the utility model;

[0024] Figure 4It is the structure schematic view of support assembly and air extraction assembly in the utility model.

[0025] In the drawing: 1, mounting box; 2, clamping assembly; 201, fixed frame; 202, clamping block; 203, bidirectional screw rod; 204, first motor; 205, anti-skid strip; 3, cutting and grinding assembly; 301, air suction cover; 302, second motor; 303, grinding and cutting disc; 4, air inlet assembly; 401, oblique air inlet box; 402, air outlet pipe; 403, annular pipe; 404, air guide pipe; 5, support assembly; 501, net ring; 502, conical frustum; 503, storage column; 6, air extraction assembly; 601, connecting frame; 602, fixed plate; 603, air extraction fan; 7, fixed frame; 8, electric telescopic rod; 9, limiting rod. DETAILED DESCRIPTION

[0026] The utility model will be described in detail below through exemplary embodiments. However, it should be understood that the elements, structures and features in one embodiment can also be beneficially combined into other embodiments without further description.

[0027] It should be noted that: unless otherwise defined, the technical terms or scientific terms used in the present utility model should be understood as the usual meaning by those skilled in the art to which the present utility model belongs. The "one", "a" or "the" and similar words used in the utility model patent application description and claims do not represent quantity limitation, but indicate that there is at least one; "include" or "contain" and similar words indicate that the elements or objects appearing before "include" or "contain" cover the elements or objects listed after "include" or "contain" and their equivalents, but do not exclude other elements or objects with the same function.

[0028] In order to more clearly describe the specific structural composition of the single wafer thinning device, the accompanying drawings are combined Figure 1 - the accompanying drawings Figure 4 The present embodiment is described as follows:

[0029] A single wafer thinning device, comprising a mounting box 1, both sides of the mounting box 1 are provided with a fixed frame 7, the fixed frame 7 is provided with an electric telescopic rod 8, a cutting and grinding assembly 3 is fixed above the mounting box 1 through the electric telescopic rod 8, an annular air inlet assembly 4 for collecting single wafer dust is further provided on the outer periphery of the cutting and grinding assembly 3, both ends of the mounting box 1 are provided with openings, the inner side of the upper end opening of the mounting box 1 is provided with a clamping assembly 2 for clamping a single wafer, an air extraction assembly 6 is arranged at the lower end of the mounting box 1, the inner side of the mounting box 1 is further provided with a support assembly 5 for supporting a single wafer, one end of the support assembly 5 is fixed at the bottom of the mounting box 1, and the other end of the support assembly 5, together with the clamping assembly 2 and the cutting and grinding assembly 3, constitutes a cavity for cutting and grinding a single wafer and collecting dust.

[0030] In the embodiment, the clamping assembly 2 comprises a fixed frame 201, a clamping block 202, a bidirectional screw 203, a first motor 204 and an anti-skid strip 205, the inside of the mounting box 1 is fixed with the fixed frame 201, the inside of the fixed frame 201 is provided with two corresponding clamping blocks 202, the left side of the clamping block 202 is provided with a threaded hole, the two threaded holes are opposite in thread, the inside of the two threaded holes is threadedly connected with the bidirectional screw 203, the bidirectional screw 203 is rotatably connected in the inside of the fixed frame 201, the rear side of the fixed frame 201 is provided with the first motor 204, the output shaft of the first motor 204 is fixed at the rear end of the bidirectional screw 203, the right side of the clamping block 202 is provided with a limiting hole, the inside of the two limiting holes is slidably connected with a limiting rod 9, the limiting rod 9 is fixed in the inside of the fixed frame 201, the side of the clamping block 202 is fixed with the anti-skid strip 205, the input end of the first motor 204 is electrically connected with the output end of the external control switch group, and the single crystal silicon wafer is clamped and fixed by arranging the clamping assembly 2.

[0031] Further, in the embodiment, the cutting and grinding assembly 3 comprises a fixed frame 7, an electric telescopic rod 8, an air suction cover 301, a second motor 302 and a grinding and cutting disc 303, the left and right sides of the mounting box 1 are fixed with two corresponding fixed frames 7, the upper side of the fixed frame 7 is provided with the electric telescopic rod 8, the telescopic arm of the two electric telescopic rods 8 is fixed with the air suction cover 301, the upper end of the air suction cover 301 is provided with the second motor 302, the output shaft of the second motor 302 is fixed with the grinding and cutting disc 303, the input end of the second motor 302 is electrically connected with the output end of the external control switch group, and the single crystal silicon wafer is ground and cut by arranging the cutting and grinding assembly 3.

[0032] In the embodiment, the air inlet assembly 4 is provided, the air inlet assembly 4 comprises an inclined air inlet box 401, an air outlet pipe 402, an annular pipe 403 and an air guide pipe 404, the circumferential surface of the air suction cover 301 is provided with uniformly distributed air inlets, the inside of the air inlet is fixed with the inclined air inlet box 401, the side of the inclined air inlet box 401 is provided with an air outlet, the inside of the air outlet is fixed with the air outlet pipe 402, all the air outlet pipes 402 are connected through the annular pipe 403, the circumferential surface of the annular pipe 403 is provided with an air guide hole, the inside of the air guide hole is fixed with the air guide pipe 404, the lower end of the air guide pipe 404 is fixed at the rear side of the mounting box 1, the air guide pipe 404 communicates with the inner cavity of the mounting box 1, and the silicon crystal particles generated in the grinding and cutting process are injected into the inside of the mounting box 1 by arranging the air inlet assembly 4.

[0033] Further, the support assembly 5 in the embodiment comprises a mesh ring 501, a conical frustum 502 and a storage column 503. The lower side of the mounting box 1 is provided with an annular opening, the mesh ring 501 is fixed inside the annular opening, the conical frustum 502 is fixed to the lower side inside the mounting box 1, the storage column 503 is fixed to the upper end of the conical frustum 502, the storage column 503 is located between the two clamping blocks 202, and the storage column 503 corresponds to the grinding and cutting disc 303. The support assembly 5 is arranged to support the single crystal silicon wafer to be ground and cut.

[0034] Further, the air extraction assembly 6 comprises a connecting frame 601, a fixed plate 602 and an air extraction fan 603. The lower side of the mounting box 1 is fixed with the connecting frame 601, the fixed plate 602 is fixed inside the connecting frame 601, and the air extraction fan 603 is installed on the upper side of the fixed plate 602. The input end of the air extraction fan 603 is electrically connected to the output end of the external control switch group. The air extraction assembly 6 is arranged to extract the silicon crystal particles into the inside of the mounting box 1.

[0035] In the embodiment, the mounting box 1 is provided with a discharge port for discharging silicon crystal particles. When the cavity in the mounting box 1 is full, the silicon crystal particle waste is discharged through the discharge port.

[0036] In work, the staff places the single wafer on the support assembly 5, and the support assembly 5 is composed of the mesh ring 501, the conical frustum 502 and the storage column 503. These parts work together to ensure that the single wafer is in the correct position for processing. Then, the clamping assembly 2 starts to work. Through the rotation of the bidirectional screw rod 203 in the fixed frame 201, the two corresponding clamping blocks 202 move inward under the drive of the first motor 204, and finally fasten the single wafer. The anti-slip strip 205 prevents any displacement of the wafer during processing, ensuring the accuracy of processing.

[0037] Subsequently, the cutting and grinding assembly 3 starts to work, and the air extraction assembly 6 is started at the same time. The second motor 302 drives the grinding and cutting disc 303 to rotate, and the grinding and cutting disc 303 is brought into contact with the surface of the single wafer through the adjustment of the electric telescopic rod 8, so as to realize the thinning treatment of the single wafer. At the same time, the air inlet on the air suction cover 301 captures the fine silicon crystal particles generated during the grinding and cutting process in real time.

[0038] The silicon crystal particles generated in the grinding and cutting process are first sucked by the oblique air inlet assemblies 4 located inside the air inlet of the air suction cover 301. The silicon crystal particles then enter the inside of the air suction cover 301 and are sucked into the annular pipe 403 through the air outlet pipe 402. The annular pipe 403 is connected to the inside of the air suction cover 301 through a plurality of air suction assemblies 4, so as to ensure that all the silicon crystal particles are effectively collected. After coming out of the annular pipe 403, the silicon crystal particles are guided to the inside space of the installation box 1 through the air guide pipe 404, and the bottom of the installation box 1 retains the collected silicon crystal particles in the inside of the installation box 1 through the ring network arranged thereon, so as to prevent the silicon crystal particles from overflowing. When the silicon crystal particles are collected to the full, the silicon crystal particles are discharged through the discharge port arranged on the installation box 1.

[0039] It should be noted that although the utility model has been described through the above embodiments, the utility model can also have other various embodiments. Those skilled in the art can obviously make various corresponding changes and modifications to the utility model without departing from the spirit and scope of the utility model, but these changes and modifications should all belong to the scope protected by the appended claims and equivalents of the utility model.

Claims

1. A single wafer thinning device comprising a mounting box (1) provided with a fixing frame (7) on both sides, characterized in that, The fixed frame (7) is provided with an electric telescopic rod (8), the cutting and grinding assembly (3) is supported by the electric telescopic rod (8) and located above the mounting box (1), the cutting and grinding assembly (3) is provided with an annular air inlet assembly (4) for collecting single wafer dust, the mounting box (1) is provided with a clamping assembly (2) for clamping a single wafer on the inner side of the opening at the upper end, and the mounting box (1) is further provided with a supporting assembly (5) for supporting a single wafer, which together with the clamping assembly (2) and the cutting and grinding assembly (3) forms a cavity for cutting and grinding a single wafer and collecting dust.

2. The single wafer thinning apparatus of claim 1 wherein The cutting and grinding assembly (3) comprises an air suction cover (301), a second motor (302) and a grinding and cutting disc (303), the electric telescopic rod (8) is connected to the upper surface of the air suction cover (301), a plurality of evenly distributed air inlets are further arranged on the circumferential surface of the outer ring of the air suction cover (301), and the power end of the second motor (302) penetrates through the air suction cover (301) and is connected to the grinding and cutting disc (303) arranged inside the air suction cover (301).

3. The apparatus of claim 2, wherein The air inlet assembly (4) comprises a plurality of air suction assemblies and an annular pipe (403), the air suction assembly comprises an inclined air inlet group (401) and an air outlet pipe (402), the inclined air inlet group (401) is arranged inside the air inlet of the air suction cover (301), the air outlet pipe (402) is arranged outside the air inlet of the air suction cover (301), and the annular pipe (403) is connected in communication with the inside of the air suction cover (301) through the air suction assembly.

4. The apparatus of claim 3, wherein At least one air guide pipe (404) is further arranged outside the annular pipe (403) and connected in communication with the mounting box (1).

5. The apparatus of claim 1, wherein The clamping assembly (2) comprises a fixed frame (201), a clamping block (202), a bidirectional screw rod (203) and a first motor (204), the fixed frame (201) is arranged in the opening at the upper end of the mounting box (1), the clamping block (202) is connected to the fixed frame (201) through the bidirectional screw rod (203), and the power output end of the first motor (204) penetrates through the fixed frame (201) and is connected to the bidirectional screw rod (203).

6. The apparatus of claim 5, wherein A limiting rod (9) is further arranged in the fixed frame (201) and used for limiting the moving direction of the clamping block (202), one end of the limiting rod (9) is fixed on one side of the fixed frame (201), the other end penetrates through a limiting hole arranged on the clamping block (202) and is fixed on the other side of the fixed frame (201).

7. The apparatus of claim 5, wherein A non-slip strip (205) is further arranged outside the clamping block (202) and used for preventing the movement of a single wafer.

8. The single wafer thinning apparatus of claim 1 wherein The support assembly (5) comprises a net ring (501), a cone (502) and a storage column (503), the lower end of the installation box (1) is an annular opening, the net ring (501) is installed in the annular opening, the lower end of the storage column (503) is fixed in the lower end of the installation box (1) through the cone (502), and the upper end of the storage column (503) is located in the middle of the clamping assembly (2) and the upper surface of the storage column (503) corresponds to the cutting and grinding assembly (3).

9. The apparatus of claim 1, wherein The lower part of the installation box (1) is further provided with a suction assembly (6) for providing suction, the suction assembly (6) comprises a connecting frame (601), a fixed plate (602) and a suction fan (603), the connecting frame (601) is fixed to the lower side of the installation box (1), and the suction fan (603) is arranged in the connecting frame (601) through the fixed plate (602).

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