Automatic grinding device for wafer processing
By integrating a rotary table system and a robotic arm with a vacuum chuck into an automated grinding device, the wafer is automatically transported and progressively ground. This solves the problem of wafer damage during the thinning process, ensuring wafer integrity and thickness accuracy, and improving chip heat dissipation and yield.
Patent Information
- Application Number
- CN202422926344.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-11-28
AI Technical Summary
During the rough grinding, fine grinding and polishing processes, wafers become thinner and more fragile, making them susceptible to mechanical damage such as cracks, chipping, and scratches caused by external forces. Damage is especially difficult to avoid during handling.
An automated grinding device is used, which integrates a combined rotary table system and a robotic arm with a vacuum chuck to achieve automated handling and progressive grinding and thinning of wafers. By using the timed rotation of the integrated rotary table system and the adsorption connection of the vacuum chuck, disassembly and positioning are avoided, and wafers can be switched and processed sequentially in different areas.
This effectively avoids the risk of surface damage and breakage caused by warping during the wafer grinding process, achieving wafer integrity, thickness accuracy, and ultra-thinness, and improving chip heat dissipation performance and yield.
Smart Images
Figure CN223589093U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer technical field, specifically is a kind of automatic grinding device for wafer processing. BACKGROUND
[0002] With the increase of wafer size, its thickness is also thickened, in order to ensure that wafer has enough strength in manufacturing process;Such as 6 inch and 8 inch wafer thickness is 625 microns and 725 microns, and 12 inch thickness reaches 775 microns;But on the other hand, with the driving of electronic product miniaturization, integrated circuit size is constantly shrunk, especially the development of 3D, SiP and other advanced packaging technologies, higher requirements are put forward to the thickness of chip, and the basic requirement is that the thinner the better;For a thickness of 725 microns 12 inch wafer, the effective thickness of circuit layer is generally 5-10 microns, and the limit thickness is 20-30 microns, and the substrate material accounting for more than 90% of total thickness is only to ensure that wafer has enough strength in manufacturing, testing and transportation process;Therefore, after the completion of circuit layer manufacturing, back thinning of wafer is carried out first in the test stage, so as to reach the required thickness, and then subsequent slicing and other processes are carried out, and with the increasing complexity of chip structure and the increasing integration, the number of transistors is greatly increased, and heat dissipation has gradually become a key factor affecting chip performance and service life, obviously, thinner chip is beneficial to heat conduction from substrate.
[0003] However, in the thinning process of rough grinding, fine grinding and polishing of wafer, it becomes thinner and more fragile, and is more easily affected by external force to cause mechanical damage such as cracking, edge collapse and scratch, so that in the automatic processing process of wafer, the wafer after rough grinding is disassembled, carried, positioned and installed on the fine grinding platform, and in the carrying process of wafer from fine grinding to polishing, it is easily affected by external force to cause mechanical damage such as cracking, edge collapse and scratch;Therefore, an automatic grinding device for wafer processing is proposed. UTILITY MODEL CONTENT
[0004] The utility model aims at solving the problem that in the thinning process of rough grinding, fine grinding and polishing of wafer in the prior art, it becomes thinner and more fragile, and is more easily affected by external force to cause mechanical damage such as cracking, edge collapse and scratch, and proposes an automatic grinding device for wafer processing.
[0005] To achieve the above purpose, the utility model adopts the following technical scheme:
[0006] An automatic grinding device for wafer processing, comprising a workbench, an integrated combination turntable system is rotatably installed on the workbench;
[0007] The integrated combination turntable comprises a large turntable and four small turntables, the four small turntables are uniformly distributed and rotatably installed on the large turntable, the large turntable carries four functional partitions, which are respectively an upper / lower feeding area, a rough grinding area, a fine grinding area and a polishing area, each functional partition is in a static state relative to the workbench, the four small turntables on the large turntable realize the sequential switching of different areas and the advancement of the work process in a rotating manner, and the rough grinding area, the fine grinding area and the polishing area are respectively provided with a rough grinding disc, a fine grinding disc and a polishing disc above.
[0008] Preferably, the lower outer ring of the large turntable is coaxially connected with a bottom disc through a plurality of connecting columns, the bottom disc is provided below and fixedly connected with a corner motor of the workbench, and the output shaft of the corner motor is coaxially fixedly connected with the bottom disc through a shaft coupling.
[0009] Preferably, the lower outer ring of the large turntable is coaxially connected with a bottom disc through a plurality of connecting columns, the bottom disc is provided below and fixedly connected with a corner motor of the workbench, and the output shaft of the corner motor is coaxially fixedly connected with the bottom disc through a shaft coupling.
[0010] Preferably, the lower outer ring of the large turntable is coaxially connected with a bottom disc through a plurality of connecting columns, the bottom disc is provided below and fixedly connected with a corner motor of the workbench, and the output shaft of the corner motor is coaxially fixedly connected with the bottom disc through a shaft coupling.
[0011] Preferably, the main shaft motor is installed above the workbench through a lifting oil cylinder.
[0012] Preferably, the upper surface of the small turntable is fixedly and inlaidly provided with a vacuum suction cup.
[0013] Compared with the prior art, the automatic grinding device for wafer processing has the following beneficial effects:
[0014] The wafer processing automatic grinding device, through cooperation of the mechanical arm one, the mechanical arm two, the mechanical arm three and the integrated combination turntable system, can realize automatic carrying and gradual grinding and thinning of the wafer, wherein the integrated combination turntable system can realize sequential switching of the wafers connected by the vacuum suction cups on the four small turntables on the large turntable through the timing clockwise rotation of the reduction motor by 90 degrees, sequentially make the ungrounded wafers on the loading / unloading area enter the rough grinding area first to be ground by the upper rotating rough grinding disc, then enter the fine grinding area to be ground by the upper rotating fine grinding disc, then enter the polishing area to be polished by the upper rotating polishing disc, and finally cycle and rotate back to the loading / unloading area, completely overcome the problem that the wafers are difficult to be carried to the polishing machine due to the serious warping after the grinding, and the wafer is connected by the attraction of the vacuum suction cup, so that the process of disassembling, positioning and installing the wafer is omitted during the gradual thinning of the wafer in the rough grinding, fine grinding and polishing, the risk of surface damage expansion or even cracking caused by the serious warping of the wafer is effectively avoided, and the integrated combination turntable system is obtained. BRIEF DESCRIPTION OF DRAWINGS
[0015] Fig. 1 A wafer processing automatic grinding device structural schematic view is provided for the utility model.
[0016] Fig. 2 A wafer processing automatic grinding device top view flow chart is provided for the utility model.
[0017] Fig. 3 A wafer processing automatic grinding device integrated combination turntable system structural schematic view is provided for the utility model.
[0018] In the figure: 1, workbench; 2, storage box; 3, mechanical arm one; 4, cleaning table; 5, mechanical arm two; 6, mechanical arm three; 7, integrated combination turntable system; 71, large turntable; 72, main shaft motor; 73, small turntable; 74, vacuum suction cup; 75, reduction motor; 76, bottom disc; 77, corner motor; 78, lifting oil cylinder; 8, center positioning table. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.
[0020] In the description of the utility model, it is necessary to understand that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.
[0021] Referring to the drawings Figs. 1-3 An automatic grinding device for wafer processing, comprising a workbench 1, an integrated combination turntable system 7 is rotatably installed on the workbench 1, the integrated combination turntable system 7 comprises a large turntable 71 and four small turntables 73, and the four small turntables 73 are uniformly distributed and rotatably installed on the large turntable 71.
[0022] The large turntable 71 carries four functional areas, which are respectively an upper / lower material area, a rough grinding area, a fine grinding area and a polishing area, and each functional area is in a static state relative to the workbench 1, and the four small turntables 73 on the large turntable 71 realize the sequential switching of different areas and the advancement of the work process in a rotating manner.
[0023] A bottom disc 76 is coaxially connected to the outer circle of the large turntable 71 through a plurality of connecting columns, a speed reducer motor 75 is fixedly connected to the bottom of the small turntable 73, the output shaft of the speed reducer motor 75 is fixedly connected to the small turntable 73 through a shaft coupling, a vacuum chuck 74 is fixedly and inlaidly installed on the upper surface of the small turntable 73, a 90° corner motor 77 is fixedly connected to the workbench 1 below the bottom disc 76, the output shaft of the corner motor 77 rotates 90° at a low speed at regular intervals, and the output shaft of the corner motor 77 is coaxially fixedly connected to the bottom disc 76 through a shaft coupling.
[0024] It should be noted that the bottom of the bottom disc 76 in the workbench 1 is fixedly installed with a storage battery and a vacuum pump, the storage battery is connected to an external power source through wires, the vacuum pump and the corner motor 77 are directly connected to the storage battery through a controller and wires, the four speed reducer motors 75 are connected to the storage battery through wires and a gas-electric integrated conductive slip ring downwardly penetrating the central shaft of the bottom disc 76, the lower ends of the four vacuum chucks 74 are fixedly connected to a multi-way valve through a conduit, the multi-way valve is connected to the above-mentioned gas-electric integrated conductive slip ring through a conduit, the gas-electric integrated conductive slip ring is connected to the air inlet of the vacuum pump through a conduit, and the four small turntables 73 can stably clamp and install wafers on the small turntables 73 through the suction force of the four vacuum chucks 74.
[0025] In this embodiment, the upper part of the rough grinding area, the fine grinding area and the polishing area is respectively provided with a rough grinding disc, a fine grinding disc and a polishing disc, the upper part of the rough grinding disc, the fine grinding disc and the polishing disc is provided with a main shaft motor 72, the output shaft of the three main shaft motors 72 is coaxially fixedly connected with the rough grinding disc, the fine grinding disc and the polishing disc through a shaft coupling, and the three main shaft motors 72 are used for grinding the wafers placed on the three vacuum chuck 74 in the rough grinding area, the fine grinding area and the polishing area respectively, the main shaft motor 72 is installed above the workbench 1 and is lifted by a lifting oil cylinder 78, the three lifting oil cylinders 78 drive the rough grinding disc, the fine grinding disc and the polishing disc to be lifted through the three main shaft motors 72, the spacing and the clamping force between the rough grinding disc, the fine grinding disc and the polishing disc and the lower wafer are adjusted, and the three main shaft motors 72 are connected with the wire and the battery.
[0026] The rough grinding disc adopts relatively rough abrasive and is used for quickly removing large defects, uneven parts or excess materials on the surface of a workpiece, thereby laying a foundation for subsequent fine processing, and the rough grinding disc has the characteristics of large grinding force and relatively rough surface after processing.
[0027] The fine grinding disc has fine abrasive granularity, mainly plays a role of further fine grinding on the workpiece after rough grinding, makes the surface more smooth and uniform, reduces traces left by rough grinding, and improves the precision and surface quality of the workpiece.
[0028] The polishing disc uses finer material, through the friction force generated by high-speed rotation and the action of a polishing agent, makes the surface of the workpiece reach a highly smooth effect, and improves the appearance quality and glossiness of the workpiece.
[0029] In this embodiment, the left side of the workbench 1 is fixedly installed with two storage boxes 2 arranged side by side, the storage boxes 2 are vertically and overlapped stacked with wafers before processing, one side of the storage box 2 is provided with a mechanical arm 1 3, the base of the mechanical arm 1 3 is fixedly installed on the workbench 1, the center positioning table 8 is arranged between the mechanical arm 1 3 and the loading and unloading area of the integrated combined turntable system 7, the center positioning table 8 is used for transition placement of the wafer, the center positioning table 8 and the center side of the loading and unloading area are provided with a mechanical arm 3 6, the mechanical arm 3 6 is mainly used for carrying the wafer placed on the center positioning table 8 to the small turntable 73 of the loading and unloading area, a cleaning table 4 is arranged on the side of the center positioning table 8 away from the loading and unloading area, the cleaning table 4 is fixedly connected with the workbench 1, the center side of the loading and unloading area and the cleaning table 4 is provided with a mechanical arm 2 5, the mechanical arm 2 5 is mainly used for carrying the ground wafer on the integrated combined turntable system 7 to the cleaning table 4, and the bases of the mechanical arm 2 5 and the mechanical arm 3 6 are fixedly connected with the workbench 1.
[0030] The utility model discloses, refer to Fig. 2It can be seen that the wafer moving process in the storage box 2 is: the storage box 2 → the first mechanical arm 3 → the center positioning table 8 → the third mechanical arm 6 → the small turntable 73 on which the wafer is not placed in the loading / unloading area → the corner motor 77 rotates 90° clockwise to rotate to the rough grinding area for rough grinding → the corner motor 77 rotates 90° clockwise to rotate to the fine grinding area for fine grinding → the corner motor 77 rotates 90° clockwise to rotate to the polishing area for polishing → the corner motor 77 rotates 90° clockwise to rotate back to the loading / unloading area → the second mechanical arm 5 → the cleaning table 4 → the ground and cleaned wafer is moved to the film laminating machine for film lamination, that is, the wafer between the loading / unloading area, the rough grinding area, the fine grinding area and the polishing area does not need to be disassembled and transported, which completely overcomes the problem that the wafer is difficult to be transported to the polishing machine due to the serious warping of the wafer after the grinding sheet, and also avoids the risk that the wafer is seriously warped during the grinding sheet process of the rough grinding, fine grinding and polishing, so that the surface damage is expanded or even broken.
[0031] As can be seen from the above, the first mechanical arm 3, the second mechanical arm 5 and the third mechanical arm 6 cooperate with the integrated combination turntable system 7, so that the automatic transportation of the wafer can be realized. The integrated combination turntable system 7 rotates 90° clockwise by the timing of the reduction motor 75, so that the wafer adsorbed and connected by the vacuum chuck 74 on the four small turntables 73 on the large turntable 71 can be switched between different areas in sequence, specifically, the four areas of the loading / unloading area → the rough grinding area → the fine grinding area → the polishing area are cyclically switched, so that the wafer not ground in the loading / unloading area is sequentially and timely ground in the rough grinding area by the upper rotating rough grinding disc, then is sequentially and timely ground in the fine grinding area by the upper rotating fine grinding disc, then is sequentially and timely polished in the polishing area by the upper rotating polishing disc, and finally is cyclically and timely rotated back to the loading / unloading area, so that the wafer is sequentially and gradually processed according to the order of rough grinding, fine grinding and polishing, and the whole thinning process of the wafer is completed. Firstly, the wafer can be assisted to meet the requirement of wafer integrity without damage, secondly, the wafer can be assisted to meet the requirement of wafer thickness precision and ultra-thinning ability, thirdly, the wafer can be assisted to meet the requirement of wafer surface roughness, fourthly, the wafer can be assisted to meet the requirement of wafer surface damage layer thickness (SSD), and fifthly, the wafer can be assisted to meet the requirement of wafer thickness consistency. The thinned wafer can improve the chip heat dissipation, reduce the packaging size, reduce the internal stress, improve the device performance of the chip and improve the yield of subsequent scribing processing.
[0032] The above merely describes the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. An automatic polishing apparatus for wafer processing, comprising a table (1), characterized in that: The workbench (1) is rotatably installed with an integrated combination turntable system (7); The integrated combination turntable system (7) comprises a large turntable (71) and four small turntables (73), the four small turntables (73) are rotatably installed on the large turntable (71) in a uniform distribution, the large turntable (71) carries four functional partitions, which are respectively the feeding / discharging area, the rough grinding area, the fine grinding area and the polishing area, each functional partition is in a static state relative to the workbench (1), the four small turntables (73) on the large turntable (71) realize the sequential switching of different areas and the advancement of the work process in a rotating manner, and the rough grinding area, the fine grinding area and the polishing area are respectively provided with a rough grinding disc, a fine grinding disc and a polishing disc above.
2. The automatic polishing apparatus for wafer processing according to claim 1, characterized by: The outer circle of the large turntable (71) is coaxially connected with a bottom disc (76) through a plurality of connecting columns, the bottom disc (76) is provided below with a corner motor (77) fixedly connected with the workbench (1), and the output shaft of the corner motor (77) is coaxially fixedly connected with the bottom disc (76) through a shaft coupling.
3. The automatic polishing apparatus for wafer processing according to claim 2, characterized by: The small turntable (73) is provided below with a speed reducer motor (75) fixedly connected with the bottom disc (76), and the output shaft of the speed reducer motor (75) is fixedly connected with the small turntable (73) through a shaft coupling.
4. The automatic polishing apparatus for wafer processing according to claim 1, characterized by: The rough grinding disc, the fine grinding disc and the polishing disc are all provided above with a main shaft motor (72), and the output shafts of the three main shaft motors (72) are coaxially fixedly connected with the rough grinding disc, the fine grinding disc and the polishing disc through shaft couplings.
5. The automatic polishing apparatus for wafer processing according to claim 4, characterized by: The main shaft motor (72) is installed above the workbench (1) through a lifting oil cylinder (78).
6. The automatic polishing apparatus for wafer processing according to claim 1, characterized by: The upper surface of the small turntable (73) is fixedly embedded with a vacuum chuck (74).