Automatic adhesive tape pasting equipment in semiconductor chip packaging process

Abstract

The utility model relates to the technical field of semiconductor chip packaging equipment, and discloses an automatic adhesive tape pasting device in a semiconductor chip packaging process, which comprises a clamping base station, a baffle plate is fixedly arranged at the top of the clamping base station, a sliding plate is fixedly arranged at the top of the base station, a U-shaped sliding frame is connected with the inner side of the sliding plate in a sliding manner, and the U-shaped sliding frame is fixedly connected with the clamping base station. A compression spring is fixedly installed on the side, facing the baffle, of the sliding plate, the other end of the compression spring is fixedly connected with a clamping plate fixedly connected with the U-shaped sliding frame, a driving assembly for driving the U-shaped sliding frame to slide is fixedly installed outside the baffle, and a U-shaped product displacement frame is fixedly installed at the moving end of the driving assembly. And a signal repeater is fixedly mounted at the top of the clamping base station. The automatic adhesive tape pasting equipment in the semiconductor chip packaging process has the advantage that the product can be conveniently discharged after the pasting operation is completed through clamping, so that the subsequent pasting operation is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor chip packaging equipment, specifically to automatic rubber strip pasting equipment in the packaging process of semiconductor chip. BACKGROUND

[0002] Semiconductor chip packaging is an important link of semiconductor manufacturing, has the purposes such as protecting chip, facilitating identification tracing, adapting different application scenarios. Its packaging type is various, including tray packaging, commonly used for large-scale integrated circuit chip, facilitating storage, transportation and automatic production line access, in the process of packaging, usually the outer package is pasted with rubber strip containing chip information.

[0003] In the process of packaging and labeling of the packaging equipment, the product is usually clamped by the equipment and then pasted by the pneumatic mechanical suction cup, but after pasting, the product is usually manually taken out before the next pasting operation, which is very troublesome. Therefore, an automatic rubber strip pasting equipment in the packaging process of semiconductor chip is proposed to solve the above problems. UTILITY MODEL CONTENT

[0004] (I) Technical problem solved

[0005] In view of the deficiencies of the prior art, the utility model provides an automatic rubber strip pasting equipment in the packaging process of semiconductor chip, which has the advantages of convenient clamping and product discharge after pasting operation, and solves the problem that the product is usually manually taken out after pasting by the packaging equipment in the process of packaging and labeling, and then the next pasting operation is performed, which is very troublesome.

[0006] (II) Technical scheme

[0007] The technical scheme for solving the above technical problems is as follows: an automatic rubber strip pasting equipment in the packaging process of semiconductor chip, comprising a clamping base, a baffle is fixedly installed on the top of the clamping base, a sliding plate is fixedly installed on the top of the base, a U-shaped sliding frame is slidably connected to the inner side of the sliding plate, a compression spring is fixedly installed on the side of the sliding plate facing the baffle, the other end of the compression spring is fixedly connected with a clamping plate fixedly connected with the U-shaped sliding frame, a driving assembly for driving the U-shaped sliding frame to slide is fixedly installed on the outside of the baffle, a U-shaped product displacement frame is fixedly installed on the moving end of the driving assembly, and a signal repeater is fixedly installed on the top of the clamping base.

[0008] The utility model has the advantages of:

[0009] The automatic adhesive tape attaching equipment in the semiconductor chip packaging process has the advantages that the product can be conveniently clamped, the attaching operation is completed, the product is conveniently discharged, and subsequent attaching operation is facilitated.

[0010] On the basis of the above technical scheme, the utility model further can make improvement as follows.

[0011] Further, the driving assembly comprises a baffle motor, an output shaft of the motor is fixedly connected with a threaded transmission shaft, and the outer side of the threaded transmission shaft is threadedly connected with a pushing frame extending to the other side of the baffle and forming linkage with the U-shaped sliding frame.

[0012] The beneficial effect of the above further scheme is that the driving assembly facilitates linkage with the U-shaped sliding frame.

[0013] Further, the driving assembly further comprises a photoelectric switch connected with a signal repeater, and a blocking sensing sheet passing through the inner side of the photoelectric switch in a movement process is fixedly installed at the top of the pushing frame.

[0014] The beneficial effect of the above further scheme is that, through the arrangement of the photoelectric switch and the signal repeater, the motion information of the device as a whole can be connected with other equipment ports, facilitating equipment expansion.

[0015] Further, the number of the photoelectric switches is three, and the three photoelectric switches are zero limit, relaxation limit and pushing-out limit respectively, and the blocking sensing sheet is located at the zero limit.

[0016] The beneficial effect of the above further scheme is that the arrangement of the three limits facilitates the operation of the device as a whole and facilitates the judgment of the position of the pushing frame.

[0017] Further, when the blocking sensing sheet is located at the pushing-out limit, the front side of the pushing frame is located at the front side of the clamping base, and a storage frame is fixedly installed at the bottom of the clamping base.

[0018] The beneficial effect of the above further scheme is that the arrangement can ensure that the product after attaching can be effectively pushed into the storage frame for automatic recycling.

[0019] Further, the middle part of the pushing frame is in a convex shape, and the right end of the pushing frame extends to the right side of the end of the U-shaped sliding frame.

[0020] The beneficial effect of the above further scheme is that the pushing frame in a convex shape can effectively extrude the U-shaped sliding frame during the pushing process, facilitating the pushing and movement of the connected components. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a structural schematic view of the utility model;

[0022] Figure 2 This is an enlarged view of point A in the figure of this utility model;

[0023] Figure 3 This is a diagram showing the connection between the push frame and the U-shaped product displacement frame of this utility model;

[0024] Figure 4 This is a top view of the connection between the sliding plate and the compression spring of this utility model.

[0025] In the diagram: 1. Clamping base; 2. Baffle; 3. Sliding plate; 4. U-shaped sliding frame; 5. Compression spring; 6. Clamping plate; 7. Drive assembly; 71. Motor; 72. Threaded drive shaft; 73. Push frame; 74. Photoelectric switch; 75. Interruption sensor; 8. Signal repeater; 9. U-shaped product displacement frame. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In the embodiments, by Figures 1-4 The present invention discloses an automated adhesive strip application device for semiconductor chip packaging. The device includes a clamping base 1, a baffle 2 fixedly installed on the top of the clamping base 1, a sliding plate 3 fixedly installed on the top of the base 1, a U-shaped sliding frame 4 slidably connected to the inner side of the sliding plate 3, a compression spring 5 fixedly installed on the side of the sliding plate 3 facing the baffle 2, a clamping plate 6 fixedly connected to the other end of the compression spring 5 and fixedly connected to the U-shaped sliding frame 4, a driving assembly 7 for driving the U-shaped sliding frame 4 to slide fixedly installed on the outside of the baffle 2, a U-shaped product displacement frame 9 fixedly installed on the moving end of the driving assembly 7, and a signal repeater 8 fixedly installed on the top of the clamping base 1.

[0028] Furthermore, the drive assembly 7 includes a motor 71 fixed to the baffle 2, the output shaft of the motor 71 is fixedly connected to a threaded drive shaft 72, and the outer side of the threaded drive shaft 72 is threadedly connected to a push frame 73 that extends to the other side of the baffle 2 and forms a linkage with the U-shaped sliding frame 4.

[0029] In particular, the heights of the U-shaped product displacement frame 9 and the clamping plate 6 do not interfere with each other.

[0030] Furthermore, the drive assembly 7 also includes a photoelectric switch 74 connected to the signal repeater 8, and a blocking sensor 75 that passes through the inside of the photoelectric switch during movement is fixedly installed on the top of the push frame 73.

[0031] The driving assembly 7 is driven by the motor 71 to rotate the threaded transmission shaft 72, so that the pusher 73 starts to move. When the interrupter 75 passes each photoelectric switch 74, the corresponding motor 71 works, and the signal repeater 8 controls.

[0032] Further, the number of photoelectric switches 74 is three, which are zero limit, relaxation limit and push-out limit respectively, and the interrupter 75 is located at the zero limit.

[0033] Further, when the interrupter 75 is located at the push-out limit, the front side of the pusher 73 is located at the front side of the clamping base 1, and the bottom of the clamping base 1 is fixedly installed with a storage rack.

[0034] Further, the middle of the pusher 73 is convex, and the right end of the pusher 73 extends to the right end of the U-shaped sliding rack 4.

[0035] When the interrupter 75 is located at the zero limit and the push-out limit, the pusher 75 is located at the two end limits of the threaded transmission shaft 72 respectively, at this time, the distance between the clamping plate 6 and the baffle 2 is the closest, which guarantees the clamping effect, when the interrupter 75 is located at the relaxation limit, the right end of the pusher 75 contacts the U-shaped sliding rack 4, at this time, the distance between the clamping plate 6 and the baffle 2 is the farthest.

[0036] Working principle:

[0037] In use, the interrupter 75 should be placed at the relaxation limit, at this time, the pusher 73 provides support, the U-shaped sliding rack 4 pushes the compression spring 5 to compress, and the distance between the baffle 2 and the clamping plate 6 is pulled to the farthest, at this time, the workpiece to be packaged can be placed inside the U-shaped product displacement rack 9, after the placement is completed, the motor 71 starts to drive the pusher 73 to move to the zero limit through the threaded transmission shaft 72, at this time, under the influence of the shape of the pusher 73 and the U-shaped product displacement rack 9, the product can be clamped and moved to the coating point, after the coating is completed, the motor 71 starts and pushes the pusher 73 to the push-out limit again and immediately returns to the relaxation limit, so that the product can be discharged, which is convenient for subsequent clamping.

[0038] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the described embodiments. That is, although the present application is described in terms of particular embodiments and implementations, it is to be understood that the terminology used is for the purpose of descriptive clarity and that it is intended to be limited only by the words recited in the appended claims. The scope of the present application shall be limited only by the claims.

[0039] While the embodiments of the present application have been shown and described with respect to particular embodiments thereof, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope of the application. Therefore, the scope of the application should not be limited by the embodiments, but should be defined only in accordance with the following claims and their equivalents.

Claims

1. An automated taping device for use in a semiconductor die packaging process, comprising a clamping base (1), characterized in that: The top of the clamping base (1) is fixedly installed with a baffle (2), the top of the base (1) is fixedly installed with a sliding plate (3), the inner side of the sliding plate (3) is slidingly connected with a U-shaped sliding frame (4), the side of the sliding plate (3) towards the baffle (2) is fixedly installed with a compression spring (5), the other end of the compression spring (5) is fixedly connected with a clamping plate (6) fixedly connected with the U-shaped sliding frame (4), the outer side of the baffle (2) is fixedly installed with a driving assembly (7) driving the sliding of the U-shaped sliding frame (4), the moving end of the driving assembly (7) is fixedly installed with a U-shaped product displacement frame (9), the top of the clamping base (1) is fixedly installed with a signal repeater (8).

2. The apparatus according to claim 1, wherein: The driving assembly (7) comprises a motor (71) fixed to the side wall of the baffle (2), the output shaft of the motor (71) is fixedly connected with a threaded transmission shaft (72), the outer side of the threaded transmission shaft (72) is threadedly connected with a pushing frame (73) extending to the other side of the baffle (2) and forming linkage with the U-shaped sliding frame (4).

3. The apparatus of claim 2, wherein: The driving assembly (7) further comprises a photoelectric switch (74) connected with the signal repeater (8), the top of the pushing frame (73) is fixedly installed with a blockage sensing sheet (75) passing through the inside of the photoelectric switch during movement.

4. The apparatus of claim 3, wherein: The number of the photoelectric switch (74) is three and respectively zero limit, relaxation limit and push-out limit, the blockage sensing sheet (75) is located at the zero limit.

5. The apparatus of claim 4, wherein: the adhesive tape is applied to the semiconductor chip in a pattern that is substantially the same as the pattern of the adhesive tape applied to the semiconductor wafer. When the blockage sensing sheet (75) is located at the push-out limit, the front side of the pushing frame (73) is located at the front side of the clamping base (1), the bottom of the clamping base (1) is fixedly installed with a storage frame. ​ 6. The apparatus of claim 2, wherein: The middle of the pushing frame (73) is convex, the right end of the pushing frame (73) extends to the right side of the end of the U-shaped sliding frame (4).

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