Semiconductor chip tray

Abstract

The utility model relates to the technical field of trays, in particular to a semiconductor chip tray which comprises an object placing plate, a first groove is formed in the top of the object placing plate, a plurality of containing grooves are formed in the bottom end of the first groove at equal intervals, a semiconductor chip is arranged in each containing groove, and a second groove is formed in the bottom of the object placing plate. The top of the second groove communicates with the bottom of the containing groove, a plurality of strip-shaped moving plates are installed in the second groove at equal intervals, a plurality of pairs of limiting blocks are installed at the top of each strip-shaped moving plate, an ejection block is arranged between each pair of limiting blocks, the top of each ejection block extends into the corresponding containing groove, and guide grooves are formed in the two sides of each ejection block; and a guide block is mounted at the top of each limiting block. The ejector block can be driven to move by moving the strip-shaped moving plate, the chip placed in the containing groove is ejected out, a worker can take the chip conveniently, and material taking is convenient.

Description

TECHNICAL FIELD

[0001] The utility model relates to tray technical field especially relates to a kind of semiconductor chip tray. BACKGROUND

[0002] Conductor refers to the material with the electrical conductivity between conductor and insulator at room temperature, and semiconductor is applied in integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion and other fields.

[0003] The existing semiconductor chip is placed in tray for transfer during processing and production, and the existing tray is generally made of plastic plate structure, and the chip is placed in accommodating groove on the tray for transfer. However, since the chip is placed in the accommodating groove on the tray, the chip is blocked by the side wall of the accommodating groove when it needs to be taken out, and the material taking is troublesome. Moreover, when transferring the chip, the trays with chips are usually stacked together for transfer. Since the adjacent two trays rub against each other during transfer, static electricity is easily generated, which damages the chip in the tray and has poor use effect. Therefore, we propose a semiconductor chip tray. SUMMARY

[0004] The utility model aims at solving the above-mentioned shortcomings in the prior art and provides a semiconductor chip tray.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor chip tray is designed, which comprises a placing plate, a first groove is formed in the top of the placing plate, a plurality of accommodating grooves are equidistantly formed in the bottom end of the first groove, and a semiconductor chip is arranged in each accommodating groove;

[0006] A second groove is formed in the bottom of the placing plate, the top of the second groove is communicated with the bottom of the accommodating groove, a plurality of strip-shaped moving plates are equidistantly installed in the second groove, a plurality of pairs of limiting blocks are installed on the top of each strip-shaped moving plate, a top block is arranged between each pair of limiting blocks, and the top of the top block extends into the corresponding accommodating groove;

[0007] A guide groove is formed in each side of each top block, a guide block is installed on the top of each limiting block, one end of each guide block extends into the corresponding guide groove and is in sliding cooperation with the guide groove;

[0008] A plurality of pairs of through grooves are formed in the bottom of the placing plate, the proximal end of each pair of through grooves is communicated with the second groove, and the two ends of the strip-shaped moving plate penetrate through the corresponding through groove. Limiting grooves are formed in the side surfaces of each through groove, and the two ends of the strip-shaped moving plate are located in the corresponding limiting groove.

[0009] The top of the storage plate is provided with positioning holes, and the bottom of the storage plate is vertically provided with positioning rods.

[0010] The bottom of the positioning block is extended into the first groove on the top of the lower storage plate when the storage plates are stacked.

[0011] Preferably, the side surface of the top block is in clearance fit with the inner side wall of the accommodating groove.

[0012] Preferably, when the strip-shaped moving plate is moved into the limiting groove above the through groove, the top of the top block is extended out of the accommodating groove, and when the strip-shaped moving plate is moved into the limiting groove below the through groove, the top of the top block forms an accommodating space with the top opening of the accommodating groove, and the semiconductor chip is placed in the space.

[0013] Preferably, the outer surface of the positioning rod is in clearance fit with the inner wall of the positioning hole.

[0014] Preferably, when the storage plates are stacked, there is a gap between the top end of the second groove on the bottom of the upper storage plate and the bottom end of the first groove on the top of the lower storage plate.

[0015] Preferably, the bottom of each limiting groove is provided with a clamping groove, and the bottom of the two ends of the strip-shaped moving plate is located in the corresponding clamping groove.

[0016] Preferably, the top block is made of conductive plastic.

[0017] The design scheme of the utility model has the beneficial effects in the application process.

[0018] The strip-shaped moving plate can drive the top block to move, and the chip placed in the accommodating groove is ejected, which is convenient for the staff to take and take the material.

[0019] The positioning rod and the positioning hole are matched to limit the adjacent two stacked storage plates, and the positioning block and the side wall of the first groove are matched to prevent the two connected storage plates from moving after being stacked, so that the storage plates do not rub to generate static electricity during transportation, and the use effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The structure of the utility model is shown Figure 1 ;

[0021] Figure 2 The through groove and the strip-shaped moving plate connection structure of the utility model is shown

[0022] Figure 3The utility model discloses a strip moving plate and top block connecting part structure schematic view.

[0023] Figure 4 It is the structure front view of two storage plate of the utility model when stacking.

[0024] In the drawing: 1, storage plate, 2, first recess, 3, containing groove, 4, top block, 5, positioning hole, 6, strip moving plate, 7, limiting groove, 8, clamping groove, 9, positioning rod, 10, through groove, 11, guide groove, 12, guide block, 13, limiting block, 14, positioning block, 15, second recess. Specific implementation

[0025] The technical scheme in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0026] Reference Figures 1-4 A kind of semiconductor chip tray, including storage plate 1, the top of storage plate 1 is equipped with first recess 2, a plurality of containing grooves 3 are equidistantly arranged in the bottom end of first recess 2, semiconductor chip is arranged in each containing groove 3, in actual use process, staff can be placed semiconductor chip in containing groove 3 and store.

[0027] As Figure 1 And Figure 3 As shown in the drawing, the bottom of storage plate 1 is equipped with second recess 15, the top of second recess 15 is communicated with the bottom of containing groove 3, a plurality of strip moving plates 6 are equidistantly installed in second recess 15, the top of each strip moving plate 6 is equipped with a plurality of limiting blocks 13, top block 4 is arranged between each pair of limiting blocks 13, the top of top block 4 extends into corresponding containing groove 3, in actual use process, by moving strip moving plate 6, top block 4 can be controlled to move, so that the chip in containing groove 3 can be pushed out when needing to take material, and taking material is convenient.

[0028] It should be noted that the side surface of top block 4 is gap matched with the inner side wall of containing groove 3, and top block 4 will not shake in containing groove 3, so that the chip placed in containing groove 3 will not be affected.

[0029] As Figure 3 As shown in the drawing, the two sides of each top block 4 are equipped with guide groove 11, the top of each limiting block 13 is equipped with guide block 12, one end of each guide block 12 extends into corresponding guide groove 11 and is slidingly matched with guide groove 11, by the cooperation of guide block 12 and guide groove 11, top block 4 and strip moving plate 6 can be connected together, and strip moving plate 6 can drive guide block 12 to move along guide groove 11, and then the position between strip moving plate 6 and top block 4 can be adjusted.

[0030] As shown in Figure 1 and Figure 2 , the bottom of the storage plate 1 is provided with a plurality of pairs of through grooves 10, the proximal end of each pair of through grooves 10 is communicated with the second groove 15, and the two ends of the strip-shaped moving plate 6 are penetrated through the corresponding through grooves 10, the side of each through groove 10 is provided with a limiting groove 7, and the two ends of the strip-shaped moving plate 6 are located in the corresponding limiting groove 7, in actual use, the position of the top block 4 is adjusted by moving the strip-shaped moving plate 6, after adjustment, the strip-shaped moving plate 6 is moved horizontally to the limiting groove 7 for limiting, and then the top block 4 can be fixed, which is convenient to fix.

[0031] It should be noted that when the strip-shaped moving plate 6 is moved to the limiting groove 7 above the through groove 10, the top of the top block 4 extends out of the accommodating groove 3, and when the strip-shaped moving plate 6 is moved to the limiting groove 7 below the through groove 10, the top of the top block 4 and the top opening of the accommodating groove 3 form an accommodating space, and the semiconductor chip is placed in the space, in actual use, when the chip needs to be stored, the staff moves the strip-shaped moving plate 6 to the limiting groove 7 below the through groove 10, at this time, the top of the top block 4 and the accommodating groove 3 form an accommodating space, the staff can place the chip in the accommodating space, when the material needs to be taken, the staff moves the strip-shaped moving plate 6 to the limiting groove 7 above the through groove 10, so that the top block 4 remains in the position of extending out of the accommodating groove 3, and the staff can take the chip topped by the top block 4, and the taking of the material is completed.

[0032] As shown in Figure 1 and Figure 4 , the top of the storage plate 1 is provided with a positioning hole 5 at the four corners, and the bottom of the storage plate 1 is vertically provided with a positioning rod 9, when two storage plates 1 are stacked, the bottom of the positioning rod 9 extends into the corresponding positioning hole 5, in actual use, when a plurality of storage plates 1 are stacked together, the positioning rod 9 is inserted into the corresponding positioning hole 5, so that the adjacent two storage plates 1 can be limited, avoiding friction between the storage plates 1 during transportation to generate static electricity, so as to avoid damage to the chip by static electricity.

[0033] As shown in Figure 4 , the edge corners of the second groove 15 are provided with positioning blocks 14, the bottom of the positioning block 14 extends below the storage plate 1, when a plurality of storage plates 1 are stacked, the bottom of the positioning block 14 extends into the first groove 2 on the top of the lower storage plate 1, in actual use, when the storage plates 1 are stacked, the positioning block 14 extends into the first groove 2 on the top of the lower storage plate 1, and the side of the positioning block 14 also gaps with the side wall of the first groove 2, further limiting the adjacent two storage plates 1, and improving the use effect.

[0034] Specifically, in use, the staff places the chip in the accommodating groove 3, the bottom of the chip contacts the top of the top block 4, then the staff stacks the storage plate 1 and transports, in stacking, the staff inserts the positioning rod 9 at the bottom of the upper storage plate 1 into the positioning hole 5 opened at the top of the lower storage plate 1, meanwhile, the bottom of the positioning block 14 at the bottom of the upper storage plate 1 extends into the first groove 2 at the top of the lower storage plate 1, so that the side surface of the positioning block 14 contacts the side wall of the first groove 2, limiting the storage plate 1, avoiding mutual friction between the storage plates 1 to generate static electricity during transportation, when the chip needs to be taken out, the staff moves the strip-shaped moving plate 6, moves the two ends of the strip-shaped moving plate 6 from the limiting groove 7 to the bottom of the through groove 10, meanwhile, the strip-shaped moving plate 6 drives the guide block 12 to move from one end of the guide groove 11 to the other end, then the staff moves the strip-shaped moving plate 6 upwards, moves the strip-shaped moving plate 6 to be aligned with the limiting groove 7 above the through groove 10, in the process of moving the strip-shaped moving plate 6, the top block 4 is driven to move upwards, the chip is ejected from the accommodating groove 3, then the staff moves the two ends of the strip-shaped moving plate 6 into the limiting groove 7 at the upper end of the through groove 10 for fixing, then the staff can take down the chip, convenient to take the material.

[0035] Further, as shown in Figure 4 The outer surface of the positioning rod 9 is gap-fitted with the inner wall of the positioning hole 5, so that the storage plates 1 are prevented from shaking and colliding with each other during stacking, and static electricity is prevented from being generated by friction between the storage plates 1.

[0036] Further, as shown in Figure 4 When the plurality of storage plates 1 are stacked, the top end of the second groove 15 at the bottom of the upper storage plate 1 is spaced from the bottom end of the first groove 2 at the top of the lower storage plate 1, so that the chip at the bottom of the lower storage plate 1 is prevented from colliding with the structure on the upper storage plate 1 during stacking, and the storage effect is improved.

[0037] Further, as shown in Figure 2 The bottom of each limiting groove 7 is provided with a clamping groove 8, and the bottom of each end of the strip-shaped moving plate 6 is located in the corresponding clamping groove 8, so that when the strip-shaped moving plate 6 is moved into the limiting groove 7, the bottom of the strip-shaped moving plate 6 is moved into the clamping groove 8 under the action of gravity, the strip-shaped moving plate 6 is limited by the clamping groove 8, and the strip-shaped moving plate 6 is prevented from being pulled out of the limiting groove 7 during use.

[0038] Further, the top block 4 is made of conductive plastic, so that the storage plate 1 and the top block 4 do not generate static electricity during movement, and the top block 4 does not damage the chip when ejecting the chip.

[0039] The above merely describes a preferred embodiment of the present application, and the protection scope of the present application is not limited thereto, and any skilled person in the art, according to the technical scheme and the inventive concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A semiconductor chip tray, comprising a shelf (1), characterized in that: The top of the shelf (1) is provided with a first groove (2), and a number of receiving slots (3) are provided at equal intervals at the bottom of the first groove (2), and each receiving slot (3) is provided with a semiconductor chip. The bottom of the shelf (1) is provided with a second groove (15), the top of the second groove (15) is connected to the bottom of the receiving groove (3), and several strip-shaped movable plates (6) are installed at equal intervals inside the second groove (15). Several pairs of limiting blocks (13) are installed on the top of each strip-shaped movable plate (6), and a top block (4) is provided between each pair of limiting blocks (13). The top of the top block (4) extends into the corresponding receiving groove (3). Each top block (4) has guide grooves (11) on both sides, and each limiting block (13) has a guide block (12) installed on its top. One end of each guide block (12) extends into the corresponding guide groove (11) and slides with the guide groove (11). The bottom sides of the shelf (1) are provided with several pairs of through slots (10). The near ends of each pair of through slots (10) are connected to the second groove (15). Both ends of the strip moving plate (6) pass through the corresponding through slots (10). Each through slot (10) has a limiting groove (7) at both ends of its side. Both ends of the strip moving plate (6) are located in the corresponding limiting groove (7). The top four corners of the shelf (1) are provided with positioning holes (5), and the bottom four corners of the shelf (1) are provided with positioning rods (9). When two shelves (1) are stacked, the bottom of the positioning rods (9) extends into the corresponding positioning holes (5). Positioning blocks (14) are installed at the corners of the edges of the second groove (15). The bottom of the positioning block (14) extends to the bottom of the shelf (1). When several shelves (1) are stacked, the bottom of the positioning block (14) extends into the first groove (2) located on the top of the lower shelf (1).

2. A semiconductor chip tray according to claim 1, characterized in that: The side of the top block (4) is fitted with the inner sidewall of the receiving groove (3) with a clearance.

3. A semiconductor chip tray according to claim 2, characterized in that: When the strip moving plate (6) moves into the limiting groove (7) located above the through groove (10), the top of the top block (4) extends out of the receiving groove (3), and when the strip moving plate (6) moves into the limiting groove (7) located below the through groove (10), a receiving space is formed between the top of the top block (4) and the top opening of the receiving groove (3), and the semiconductor chip is placed in the space.

4. A semiconductor chip tray according to claim 1, characterized in that: The outer surface of the positioning rod (9) is clearance-fitted with the inner wall of the positioning hole (5).

5. A semiconductor chip tray according to claim 1, characterized in that: When several shelves (1) are stacked on top of each other, there is a gap between the top of the second groove (15) at the bottom of the upper shelf (1) and the bottom of the first groove (2) at the top of the lower shelf (1).

6. A semiconductor chip tray according to claim 1, characterized in that: Each limiting groove (7) has a slot (8) at its bottom, and the bottom of both ends of the strip moving plate (6) are located in the corresponding slot (8).

7. A semiconductor chip tray according to claim 1, characterized in that: The top block (4) is made of conductive plastic.

Images