Integrated circuit board bearing device
By using the inclined bearing surface and extraction groove design of the integrated circuit board bearing device, the problem of bumps and knocks caused by repeated picking of integrated circuit boards during operation is solved, reducing the risk of damage.
Patent Information
- Application Number
- CN202423189575.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-24
AI Technical Summary
Existing integrated circuit boards are heavy and not designed for easy one-handed handling during operation, which increases the risk of bumps and collisions and raises the probability of damage when picked up repeatedly.
An integrated circuit board support device was designed, including an inclined support surface and a blocking surface, and equipped with an extraction slot to facilitate one-handed picking and reduce the risk of bumps and knocks.
The design of the inclined bearing surface and extraction groove simplifies the picking process of integrated circuit boards and reduces the risk of damage.
Smart Images
Figure CN223591481U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of semiconductor, and particularly relates to an integrated circuit board carrying device. BACKGROUND
[0002] In the prior art, when an operator is performing appearance inspection of an integrated circuit board, the integrated circuit board is heavy and the integrated circuit board itself does not have a design that allows the operator to pick up the integrated circuit board with one hand. Once the integrated circuit board is placed flat on a table, the operator has to pick up the integrated circuit board multiple times to finally hold the integrated circuit board, which increases the risk of knocking the integrated circuit board and increases the probability of damaging the integrated circuit board. CONTENT OF THE UTILITY MODEL
[0003] Therefore, one of the purposes of the present application is to provide an integrated circuit board carrying device to solve the above problems.
[0004] According to an embodiment of the present application, an integrated circuit board carrying device is provided. The integrated circuit board carrying device comprises a side surface, a carrying surface and a blocking surface. The carrying surface is arranged on the side surface. The carrying surface is inclined at an angle with a horizontal plane. A long side where the side surface and the carrying surface intersect comprises a picking groove. The blocking surface is arranged vertically above the carrying surface.
[0005] According to an embodiment of the present application, the long side of the carrying surface is inclined upwardly at a first angle with the horizontal plane.
[0006] According to an embodiment of the present application, the first angle is in the range of 20°-35°.
[0007] According to an embodiment of the present application, the short side of the carrying surface is inclined downwardly at a second angle with the horizontal plane.
[0008] According to an embodiment of the present application, the second angle is in the range of 20°-35°.
[0009] According to an embodiment of the present application, the edge of the picking groove is arc-shaped.
[0010] According to an embodiment of the present application, the width of the picking groove is in the range of 8-15 cm.
[0011] According to an embodiment of the present application, the blocking surface comprises an arc-shaped corner.
[0012] The integrated circuit board carrying device provided by the present application facilitates the user to pick up the integrated circuit board through the design of the picking groove, avoids knocking the integrated circuit board caused by multiple picking, and reduces the risk of damaging the integrated circuit board. BRIEF DESCRIPTION OF DRAWINGS
[0013] The accompanying drawings are included to provide a further understanding of subject matter and are incorporated in and constitute a part of specification, illustrate embodiments and together with the description serve to explain them but do not limit subject matter. In the drawings:
[0014] Figure 1 A schematic view of an integrated circuit board material carrying device according to an embodiment of the present application.
[0015] Figure 2 A schematic view of an integrated circuit board material carrying device carrying an integrated circuit board material according to an embodiment of the present application. DETAILED DESCRIPTION
[0016] The following disclosure provides various implementations or examples, which can be used to implement different features of the present disclosure. Specific examples of components and configurations are described herein to facilitate discussion of the present disclosure. It can be apparent to those skilled in the art that the described
[0017] Furthermore, spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and like terms, can be used herein for ease of describing one component or feature to another in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the drawings. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0018] Notwithstanding that the numerical ranges and parameters setting forth the broadest scope of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Moreover, all ranges disclosed herein are to be understood to be
[0019] Figure 1 A schematic view of an integrated circuit board material carrying device 10 according to an embodiment of the present application is shown. In some embodiments, the integrated circuit board material carrying device 10 is used to carry integrated circuit board materials. In some embodiments, the integrated circuit board material carrying device 10 includes a side surface 11, a carrying surface 12, and a blocking surface 13. In some embodiments, the carrying surface 12 is disposed on the side surface 11, and the blocking surface 13 is disposed vertically above the carrying surface 12. In some embodiments, the carrying surface 12 is inclined at an angle with respect to a horizontal plane. In some embodiments, a long edge 121 of the carrying surface 12 is inclined upwardly from the horizontal plane at a first angle θ1. In some embodiments, the first angle θ1 is in the range of 20°-35°. In some embodiments, a short edge 122 of the carrying surface 12 is inclined downwardly from the horizontal plane at a second angle θ2. In some embodiments, the second angle θ2 is in the range of 20°-35°. The inclination of the carrying surface 12 with respect to the horizontal plane can be such that an integrated circuit board material placed on the carrying surface 12 slides in directions F1 and F2 due to gravity and abuts against the blocking surface 13.
[0020] In some embodiments, the long edge where the side surface 11 and the carrying surface 12 meet includes a picking slot 20. When an integrated circuit board material is placed on the carrying surface 12, a user can pick up the integrated circuit board material by inserting a finger into the picking slot 20, avoiding the integrated circuit board material from being damaged by multiple picking.
[0021] In some embodiments, the width W20 of the extraction slot 20 is approximately the width of four fingers of an adult. In some embodiments, the width W20 of the extraction slot 20 is in the range of 8-15 cm. In some embodiments, the edges of the extraction slot 20 are rounded, which can avoid the user from being cut by the edges of the extraction slot 20 when picking up the integrated circuit board.
[0022] In some embodiments, the blocking surface 13 comprises a rounded corner. The rounded corner can avoid the user from being cut by the edges of the blocking surface 13 when picking up the integrated circuit board. In some embodiments, the integrated circuit board carrying device 10 is made of metal material as a whole, and the integrated circuit board carrying device 10 is connected to the ground wire to achieve an anti-static design.
[0023] Figure 2 A schematic view of the integrated circuit board carrying device 10 carrying the integrated circuit board 30 according to an embodiment of the present application is shown. As shown, when the integrated circuit board 30 is placed on the carrying surface 12, the design of the extraction slot 20 facilitates the user to pick up the integrated circuit board 30 by inserting fingers into the extraction slot 20. Figure 2
[0024] The integrated circuit board carrying device 10 according to the present application facilitates the user to pick up the integrated circuit board by the design of the extraction slot 20, avoids the integrated circuit board from being bumped due to multiple extractions, and reduces the risk of damage to the integrated circuit board.
[0025] As used herein, the terms "approximately," "substantially," "basically," and "about" are used to describe and account for small variations. When used in connection with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs exactly, as well as instances in which the event or circumstance occurs in close proximity. As used herein with respect to a given value or range, the term "about" generally means within ±10%, ±5%, ±1%, or ±0.5% of a given value or range. Ranges can be expressed herein as from one endpoint to another endpoint or between two endpoints. Unless otherwise specified, all ranges disclosed herein include the endpoints. The term "substantially co-planar" can refer to two surfaces that are positioned along the same plane to within a few micrometers (pm), e.g., to within 10 pm, 5 pm, 1 pm, or 0.5 pm. When referring to a value or characteristic that is "substantially the same," the term can refer to a value that is within ±10%, ±5%, ±1%, or ±0.5% of the average of the value.
[0026] As used herein, the terms“approximately,”“substantially,”“essentially,” and“about” are used to describe and account for small variations. When used in connection with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs exactly, and instances in which the event or circumstance occurs in close approximation. For example, when used in connection with a numerical value, the terms can refer to a range of variation less than or equal to ±10% of the numerical value, e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two numerical values can be considered“substantially” or“about” the same if the difference between the two values is less than or equal to ±10% of the average of the values (e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%). For example,“substantially” parallel can refer to a range of angular variation less than or equal to ±10° from 0°, e.g., less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example,“substantially” perpendicular can refer to a range of angular variation less than or equal to ±10° from 90°, e.g., less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.
[0027] For example, two surfaces can be considered coplanar or substantially coplanar if the displacement between the two surfaces is equal to or less than 5 pm, equal to or less than 2 pm, equal to or less than 1 pm, or equal to or less than 0.5 pm. A surface can be considered planar or substantially planar if the displacement of the surface relative to a plane between any two points on the surface is equal to or less than 5 pm, equal to or less than 2 pm, equal to or less than 1 pm, or equal to or less than 0.5 pm.
[0028] As used herein, the terms "conductive," "electrically conductive," and "electrical conductivity" refer to the ability to transfer electrical current. Electrically conductive materials generally indicate those materials that are little or zero resistant to the flow of electrical current. One measure of electrical conductivity is Siemens per meter (S / m). Generally, an electrically conductive material is one that has an electrical conductivity greater than approximately 104S / m (e.g., at least 105S / m or at least 106S / m). The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.
[0029] As used herein, the singular terms "a," "an," and "the" can encompass the plural unless the context clearly dictates otherwise. In describing embodiments, the use of "or" means "and / or" unless the context clearly dictates otherwise. In describing a component or feature as being "on" or "above" another component or feature, it is intended that the component or feature can be directly on the other component or feature or intervening components or features can be present.
[0030] As used herein, spatially relative terms, such as "beneath," "below," "lower," "above," "upper," "lower," "left," "right," and the like, can be used for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms can be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will be understood that when an element is referred to as being "connected to" or "coupled to" another element, it can be directly connected or coupled to the other element or intervening elements can be present.
[0031] The foregoing outlines features of several embodiments and details of the present disclosure. Embodiments described in the present disclosure can be readily used as bases for the design of other processes and structures for performing the same or similar purposes and / or for attaining the same or similar advantages that the embodiments described herein provide. Such equivalent constructions are not to depart from the spirit and scope of the present disclosure and are to be included therein.
Claims
1. An integrated circuit substrate carrier device, characterized in that, include: side; A bearing surface is disposed on the side surface, the bearing surface is inclined at an angle to the horizontal plane, and the long side where the side surface and the bearing surface intersect includes an extraction groove; as well as A blocking surface is vertically disposed above the bearing surface.
2. The integrated circuit substrate carrier device according to claim 1, characterized in that, The long side of the bearing surface is inclined upward from the horizontal surface at a first angle.
3. The integrated circuit substrate carrier device according to claim 2, characterized in that, The first angle is in the range of 20°-35°.
4. The integrated circuit substrate carrier device according to claim 3, characterized in that, The short side of the bearing surface is inclined downward from the horizontal at a second angle.
5. The integrated circuit substrate carrier device according to claim 4, characterized in that, The second angle is in the range of 20°-35°.
6. The integrated circuit substrate carrier device according to claim 1, characterized in that, The edges of the extraction groove are rounded.
7. The integrated circuit substrate carrier device according to claim 1, characterized in that, The width of the extraction groove is in the range of 8-15cm.
8. The integrated circuit substrate carrier device according to claim 1, characterized in that, The blocking surface includes rounded corners.