Electroplating adhesive tape for lead frame of integrated circuit
By designing a straight rod, elastic limiting components, and a toothed plate, the electroplating tape for integrated circuit lead frames is cut quickly and accurately, solving the problems of low cutting efficiency and easy damage to limiting components in existing technologies, thus improving work efficiency and extending service life.
Patent Information
- Application Number
- CN202423212729.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing electroplating tapes are difficult to cut quickly and accurately during the electroplating process, resulting in low work efficiency and easy damage to elastic limiting components, thus shortening their service life.
The design incorporates a straight rod, a first elastic limiting component, a second elastic limiting component, and a toothed plate structure. The toothed plate's teeth rub against the tape roll for cutting, and the plastic limiting block is positioned within the groove to ensure the accuracy of the cutting position and the stability of the limiting component.
It enables rapid and accurate cutting of tape, improving work efficiency, and the plastic limiting block prevents excessive stretching of the elastic limiting component, extending its service life.
Smart Images
Figure CN223592086U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of adhesive tape, concretely to integrated circuit lead frame electroplating adhesive tape. BACKGROUND
[0002] The electroplating adhesive tape is mainly used for insulating non-plating parts, ensuring that the plating layer is only deposited in the parts with coating, so as to realize the purpose of local electroplating. In the electroplating process, the parts that do not need electroplating must be shielded to prevent the infiltration and pollution of the electroplating solution. The electroplating adhesive tape plays a crucial role in the electroplating process due to its good shielding and insulating properties. SUMMARY
[0003] The utility model discloses an integrated circuit lead frame electroplating adhesive tape to solve the problems in the above background.
[0004] To achieve the above object, the utility model provides the following technical scheme: an integrated circuit lead frame electroplating adhesive tape, including top shell and bottom shell, the top shell and bottom shell are fixedly connected through the connecting column, the outside of connecting column is wound and is provided with the adhesive tape female roll, one side of top shell and bottom shell is slidably provided with first elastic stopper and second elastic stopper respectively, first elastic stopper and second elastic stopper are fixedly connected through straight rod, the side of straight rod is fixedly penetrated and is provided with the toothed plate, one side of first elastic stopper and second elastic stopper is all set up with recess, the top and bottom of recess are all fixedly provided with plastic limit block.
[0005] The top shell and the bottom shell are connected through threads between the connecting column.
[0006] The side of the top shell and the bottom shell opposite to each other is set with a matched guide groove.
[0007] The side of the toothed plate with the teeth is towards the adhesive tape female roll.
[0008] Compared with the prior art, the utility model has the advantages that:
[0009] The utility model discloses a straight rod, first elastic stopper, second elastic stopper and toothed plate design, the user can easily adjust the adhesive tape cutting position, realizes quick, accurate cutting, and greatly improves the work efficiency, the setting of plastic limit block in the recess effectively prevents the overstretching or damage of the elastic stopper, prolongs the service life of the adhesive tape. BRIEF DESCRIPTION OF DRAWINGS
[0010] Figure 1 It is the front view schematic drawing of the utility model;
[0011] Figure 2 It is the cross section schematic drawing of the utility model;
[0012] Figure 3 It is the side view schematic diagram of first elastic limiting piece and second elastic limiting piece of the utility model;
[0013] Figure 4 It is the top view schematic diagram of the utility model;
[0014] In the drawing: 1, top shell;2, bottom shell;3, adhesive tape mother roll;4, connecting column;5, first elastic limiting piece;6, straight rod;7, toothed plate;8, second elastic limiting piece;9, recess;10, plastic limiting block;11, guide slot. DETAILED DESCRIPTION
[0015] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0016] Please refer to Figures 1-4 The utility model provides a kind of integrated circuit lead frame electroplating adhesive tape, including top shell 1 and bottom shell 2, top shell 1 and bottom shell 2 are fixedly connected by connecting column 4, connecting column 4 is externally wound and provided with adhesive tape mother roll 3, the side of top shell 1 and bottom shell 2 is slidably provided with first elastic limiting piece 5 and second elastic limiting piece 8 respectively, first elastic limiting piece 5 and second elastic limiting piece 8 are fixedly connected by straight rod 6, the side of straight rod 6 is fixedly penetrated and provided with toothed plate 7, the side of first elastic limiting piece 5 and second elastic limiting piece 8 is all provided with recess 9, the top and bottom of recess 9 are all fixedly provided with plastic limiting block 10.
[0017] Top shell 1 and bottom shell 2 are all connected between connecting column 4 by screw thread, top shell 1 and bottom shell 2 are the support structure of adhesive tape mother roll 3, are closely connected by screw thread and connecting column 4, ensure the stability of entire adhesive tape device.
[0018] The side of top shell 1 and bottom shell 2 opposite is all provided with and matched guide slot 11.
[0019] The side of toothed plate 7 provided with tooth is towards adhesive tape mother roll 3.
[0020] After a certain length of adhesive tape is pulled out, the position of toothed plate 7 is moved by straight rod 6, until it is moved to the top of the position that needs to be cut through guide slot 11, the top surface of adhesive tape is cut by friction with toothed plate 7.
[0021] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0022] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.
Claims
1. An integrated circuit lead frame plating tape comprising a top cover (1) and a bottom cover (2), characterized in that: The top shell (1) and the bottom shell (2) are fixedly connected through the connecting column (4), the outer part of the connecting column (4) is provided with the adhesive tape mother roll (3), one side of the top shell (1) and the bottom shell (2) is slidably provided with the first elastic limiting piece (5) and the second elastic limiting piece (8) respectively, the first elastic limiting piece (5) and the second elastic limiting piece (8) are fixedly connected through the straight rod (6), the side edge of the straight rod (6) is fixedly provided with the toothed plate (7), one side of the first elastic limiting piece (5) and the second elastic limiting piece (8) is provided with the recess (9), and the top and the bottom of the recess (9) are fixedly provided with the plastic limiting block (10).
2. The electroplating tape for integrated circuit lead frames according to claim 1, wherein: The top shell (1) and the bottom shell (2) are fixedly connected through the connecting column (4).
3. The electroplating tape for integrated circuit lead frames according to claim 1, wherein: The side, away from each other, of the top shell (1) and the bottom shell (2) is provided with the matched guide groove (11).
4. The electroplating tape for integrated circuit lead frames according to claim 1, wherein: The side, provided with the teeth, of the toothed plate (7) faces the adhesive tape mother roll (3).