Chemical plating system
By installing a heating wire on the outer wall of the electroless plating solution bath, combined with a water bath heating device and a circulation pipeline, the problem of unstable temperature control in the electroless plating solution bath is solved, achieving more efficient temperature control and improved electroless plating quality.
Patent Information
- Application Number
- CN202423167353.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-20
AI Technical Summary
In existing electroless plating processes, the temperature control of the electroless plating solution bath is unstable, resulting in poor temperature uniformity of the plating solution and affecting the electroless plating effect.
A solution tank heating device with heating wires installed on the outer wall of the electroless plating solution tank is adopted. Combined with a water bath heating device and circulation pipeline, the electroless plating solution is heated and kept warm by a controller to ensure temperature stability.
It improves the heating efficiency and temperature stability of the electroless plating solution, enhances the quality of electroless plating, and reduces heating costs.
Smart Images
Figure CN223592828U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor technology, in particular to a chemical plating system. BACKGROUND
[0002] The chemical plating process in the preparation process of semiconductor products (such as wafers) generally adopts a chemical plating solution tank for wet process of the products. The temperature of the chemical plating solution in the chemical plating solution tank is an important parameter in the chemical plating process, and the stability of the temperature of the chemical plating solution in the solution tank directly affects the effect of the chemical plating. CONTENT OF THE UTILITY MODEL
[0003] The embodiment of the present application provides a chemical plating system, which comprises:
[0004] a chemical plating solution tank for containing chemical plating solution;
[0005] a water bath heating device having a heating water tank capable of being heated;
[0006] a circulating pipeline comprising a first section of pipeline extending from the chemical plating solution tank to the heating water tank, a second section of pipeline located in the heating water tank, and a third section of pipeline from the heating water tank to the chemical plating solution tank, for leading the chemical plating solution in the chemical plating solution tank out and flowing through the heating water tank and then flowing back into the chemical plating solution tank;
[0007] a solution tank heating device comprising heating wires arranged on the outer wall of the chemical plating solution tank;
[0008] a controller configured to control the solution tank heating device to heat the chemical plating solution in the chemical plating solution tank when the chemical plating solution in the chemical plating solution tank needs to be heated, and to control the water bath heating device to heat the chemical plating solution flowing through the heating water tank in the circulating pipeline, and configured to control the solution tank heating device to keep the chemical plating solution in the chemical plating solution tank warm after the chemical plating solution in the chemical plating solution tank is heated to a preset temperature.
[0009] In some embodiments, the chemical plating solution tank is further provided with a temperature detection device for detecting the temperature of the chemical plating solution in the chemical plating solution tank in real time and transmitting the detected temperature to the controller, and the controller can control the water bath heating device and the solution tank heating device to heat the chemical plating solution and control the solution tank heating device to keep the chemical plating solution warm according to the temperature.
[0010] In some embodiments, the solution tank heating device comprises a protective sleeve sheathed on the surface of the heating wires.
[0011] In some embodiments, the protective sleeve is provided with a heat preservation layer.
[0012] In some embodiments, the electroless plating solution tank comprises a side wall and a bottom wall, and the heating wire is arranged outside the side wall.
[0013] In some embodiments, in the height direction of the electroless plating solution tank, the heating wire is a continuous segment heating structure arranged outside the side wall, or the heating wire comprises a plurality of segment heating structures arranged outside the side wall.
[0014] In some embodiments, the ratio between the height of the heating wire and the height of the electroless plating solution tank is greater than or equal to 0.5.
[0015] In some embodiments, the electroless plating solution tank comprises a side wall and a bottom wall, and the bottom wall is provided with a solution outlet, and the area of the bottom wall outside the solution outlet is provided with a heating wire.
[0016] In some embodiments, the electroless plating solution tank is a stainless steel tank.
[0017] The electroless plating solution is a nickel plating solution.
[0018] The preset temperature is 80-90℃.
[0019] In some embodiments, the circulation pipeline is further provided with a circulating pump, which is used to provide power when the electroless plating solution in the electroless plating solution tank needs to be heated, so that the electroless plating solution in the electroless plating solution tank is led out, flows through the heating water tank, and then flows back into the electroless plating solution tank.
[0020] The water bath heating device further comprises a heater for heating the liquid in the heating water tank, and the heater is electrically connected with the controller, and the controller is configured to control the heater to heat the electroless plating solution flowing through the heating water tank in the circulation pipeline when the electroless plating solution in the electroless plating solution tank needs to be heated; wherein the heater is arranged apart from the second segment pipeline.
[0021] The main technical effects achieved by the embodiments of the present application are:
[0022] The electroless plating system provided by the embodiments of the present application can heat the electroless plating solution in the electroless plating solution tank by arranging the solution tank heating device with a heating wire on the outer wall of the electroless plating solution tank, and can cooperate with the water bath heating device to heat the electroless plating solution when the electroless plating solution in the electroless plating solution tank needs to be heated, and can keep the electroless plating solution in the electroless plating solution tank warm after the electroless plating solution is heated to a preset temperature, so as to ensure good stability of the electroless plating solution temperature, improve the heating efficiency of the electroless plating solution, and improve the electroless plating quality. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 is a system structure diagram of a chemical plating system provided by an exemplary embodiment of the present application;
[0024] Figure 2 is Figure 1 is an enlarged view of A of the chemical plating system shown in FIG. 1. DETAILED DESCRIPTION
[0025] The exemplary embodiments will be described in detail below with reference to the attached drawings. In the following description, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments are not meant to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the appended claims.
[0026] The terminology used in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used in the present application and the appended claims, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0027] The temperature of the chemical plating solution in the chemical plating solution tank is an important parameter in the chemical plating process, directly affecting the effect of chemical plating, such as the etching rate, the uniformity of the entire surface, and the film quality. In the related art, the chemical plating solution is heated by steam heating, direct heating, water bath heating, etc. Among them, the steam heating generally uses high-temperature steam flowing through the stainless steel nickel tank outside the steam coil to transfer heat to the tank solution to complete the heating, which requires a heating boiler. The heating boiler is a special heating equipment, with high management and investment cost, low heat transfer efficiency, and general uniformity of the temperature of the chemical solution in the tank. Direct heating, such as immersion heating, generally installs a heating device directly in the tank or installs a heating device in the main circulating pipeline, and the chemical solution directly contacts the water to complete heat exchange when circulating. However, the heater position is prone to local overheating, which leads to decomposition of the plating solution, and the temperature uniformity in the tank is poor. In water bath heating, there is a group of heaters in the water bath box to heat the hot water in the water bath box, and the hot water completes indirect heating by continuously circulating the chemical solution in the serpentine coil in the water bath box. However, this heating method has general temperature uniformity, and it takes a long time for the chemical solution to reach the expected temperature from room temperature.
[0028] The application provides a kind of electroless plating system, electroless plating system includes electroless plating solution tank, water bath heating device, circulating pipeline, solution tank heating device and controller.Electroless plating solution tank is used to hold electroless plating solution;Water bath heating device has the heating water tank that can be heated;Circulating pipeline includes first section pipeline from the electroless plating solution tank to heating water tank, second section pipeline in the heating water tank and third section pipeline from the heating water tank to the electroless plating solution tank, for the electroless plating solution in electroless plating solution tank is introduced and flows through heating water tank after electroless plating solution in electroless plating solution tank;Solution tank heating device includes heating wire arranged in the outer wall of the electroless plating solution tank;Controller is configured to heat the electroless plating solution in the electroless plating solution tank when the electroless plating solution in the electroless plating solution tank needs heating, and controls the water bath heating device to heat the electroless plating solution flowing through the heating water tank in the circulating pipeline, and is configured to control the solution tank heating device to heat preservation the electroless plating solution in the electroless plating solution tank after the electroless plating solution in the electroless plating solution tank is heated to preset temperature.The solution tank heating device with heating wire is arranged on the outer wall of the electroless plating solution tank, and the electroless plating solution in the electroless plating solution tank can be heated by the water bath heating device when the electroless plating solution in the electroless plating solution tank needs heating, and the electroless plating solution in the electroless plating solution tank can be heated to the preset temperature after the electroless plating solution in the electroless plating solution tank is heated, and the electroless plating solution in the electroless plating solution tank is heated preservation, so that the heating efficiency of electroless plating solution is improved while the temperature of electroless plating solution is well stabilized, the quality of electroless plating is improved, and the cost of heating wire is obviously lower than that of heating boiler used in steam heating, which is conducive to the cost control of electroless plating system.
[0029] The application will be described in detail below with reference to the accompanying drawings Figure 1 and Figure 2 Some embodiments of the electroless plating system of the application will be described in detail below.In the case of no conflict, the features in the following embodiments can be combined with each other.
[0030] Please refer to Figure 1 , and if necessary, combined with Figure 2 , the embodiments of the application provide an electroless plating system 100, which includes an electroless plating solution tank 10, a water bath heating device 20, a circulating pipeline 30, a solution tank heating device 40 and a controller 50.
[0031] The electroless plating solution tank 10 is used to hold electroless plating solution.
[0032] The water bath heating device 20 has a heating water tank 21 that can be heated.
[0033] The circulation pipeline 30 comprises a first section of pipeline 31 extending from the electroless plating solution tank 10 to the heated water tank 21, a second section of pipeline 32 located in the heated water tank 21, and a third section of pipeline 33 from the heated water tank 21 to the electroless plating solution tank 10, for leading the electroless plating solution in the electroless plating solution tank 10 out and flowing through the heated water tank 21 and then flowing back into the electroless plating solution tank 10.
[0034] The solution tank heating device 40 comprises heating wires 41 arranged on the outer wall of the electroless plating solution tank 10.
[0035] The controller 50 is configured to control the solution tank heating device 40 to heat the electroless plating solution in the electroless plating solution tank 10 and control the water bath heating device 20 to heat the electroless plating solution flowing through the heated water tank 21 in the circulation pipeline 30 when the electroless plating solution in the electroless plating solution tank 10 needs to be heated, and is configured to control the solution tank heating device 40 to keep the electroless plating solution in the electroless plating solution tank 10 at a preset temperature after the electroless plating solution in the electroless plating solution tank 10 is heated to the preset temperature.
[0036] In some embodiments, the electroless plating solution tank 10 is further provided with a temperature detection device 60 for detecting the temperature of the electroless plating solution in the electroless plating solution tank 10 in real time and transmitting the detected temperature to the controller 50, and the controller 50 can control the water bath heating device 20 and the solution tank heating device 40 to heat the electroless plating solution and control the solution tank heating device 40 to keep the electroless plating solution at a preset temperature according to the temperature.
[0037] The heating wires 41 can have different power levels, such as a relatively low power level of a heat preservation power level and at least one relatively high power level of a heating power level. The power corresponding to the heat preservation power level and the heating power level can be selected and set according to the specific structure of the electroless plating system 100, the electroless plating solution, and other specific conditions.
[0038] When the electroless plating operation needs to be performed using the electroless plating solution tank 10, the controller can directly control the solution tank heating device 40 to heat the electroless plating solution in the electroless plating solution tank 10 and control the water bath heating device 20 to heat the electroless plating solution flowing through the heated water tank 21 in the circulation pipeline 30. During the heating of the electroless plating solution, the temperature detection device 60 can detect the temperature of the electroless plating solution in the electroless plating solution tank 10 in real time and transmit the detected temperature to the controller 50. When the temperature transmitted by the temperature detection device 60 received by the controller 50 reaches a preset temperature, the controller 50 can control the water bath heating device 20 to stop heating, and correspondingly, the circulation pipeline 30 to stop circulating the electroless plating solution. Moreover, the controller 50 can control the heating wires 41 of the solution tank heating device 40 to enter the relatively low power level of the heat preservation power level.
[0039] In combination Figure 2 As shown in the drawings, in some embodiments, the solution tank heating device 40 comprises a protective sleeve 42 sleeved on the surface of the heating wire 41. The protective sleeve 42 can be a PFA sleeve to protect the heating wire from being corroded by the splashed electroless plating solution.
[0040] In combination Figure 2 As shown in the drawings, in some embodiments, the protective sleeve is provided with a heat preservation layer 43 located outside the protective sleeve 42, away from the side of the heating wire in contact with the electroless plating solution tank 10, to insulate the outside and reduce the heat loss of the solution tank heating device 40. The heat preservation layer 43 can be made of acid and alkali resistant and heat insulation materials.
[0041] The heat preservation layer 43 can be a heat preservation structure formed by a layer of heat preservation material, or a heat preservation structure formed by multiple layers of different heat preservation materials.
[0042] As Figure 2 shown in the drawings, in some embodiments, the heat preservation layer 43 can include a first heat preservation layer 431 close to the heating wire and a second heat preservation layer 432 located outside the first heat preservation layer 431. The first heat preservation layer 431 can be a polyurethane heat preservation cotton layer, and the second heat preservation layer 432 can be an aluminum foil layer, etc., to improve the heat preservation effect of the heat preservation layer.
[0043] In combination Figure 2 As shown in the drawings, in some embodiments, a waterproof layer 44 is provided outside the heat preservation layer 43 to prevent water or other liquids from washing the electroless plating solution tank 10 from adversely affecting the solution tank heating device 40.
[0044] The waterproof layer 44 can be a waterproof structure layer formed by PVC material or other waterproof materials.
[0045] Of course, in other embodiments, the waterproof layer can not be provided outside the heat preservation layer 43.
[0046] In some embodiments, the electroless plating solution tank 10 comprises a side wall 12 and a bottom wall 11, and the heating wire 41 is arranged outside the side wall 12.
[0047] In some embodiments, in the height direction of the electroless plating solution tank 10, the heating wire 41 is a continuous segment heating structure arranged outside the side wall 12, as Figure 1 shown in the drawings.
[0048] In other embodiments, the heating wire 41 comprises multiple segments of heating structure arranged outside the side wall 12, such as two segments, three segments, etc.
[0049] The greater the height of the heating wire 41 in the height direction of the electroless plating solution tank 10, that is, the greater the ratio between the height H1 of the heating wire 41 and the height H2 of the electroless plating solution tank 10, the better the heating and heat preservation effect.
[0050] In some embodiments, the ratio between the height H1 of the heating wire 41 and the height H2 of the electroless plating solution tank 10 is greater than or equal to 0.5.
[0051] For example, in some embodiments, the ratio between the height H1 of the heating wire 41 and the height H2 of the electroless plating solution tank 10 can be 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, etc.
[0052] It should be noted that the heating wire 41 can be continuously or intermittently wrapped outside the side wall 12 in the circumferential direction of the side wall. The greater the ratio between the length of the side wall outside wrapped by the heating wire 41 and the circumference of the side wall outside surface, the better the heating and heat preservation effect.
[0053] Based on the above arrangement of the heating wire, the area of the side wall 12 heated by the heating wire 41 outside the side wall 12 can reach a large area, for example, the ratio between the entire side wall 12 outside surface area can be greater than or equal to 0.5, to ensure the heating and heat preservation effect.
[0054] In some embodiments, the bottom wall 11 is provided with a solution outlet 101 to open when the electroless plating solution tank 10 needs to be discharged to make the electroless plating solution flow out, or to flow out the cleaning solution for cleaning the electroless plating solution tank 10 when the electroless plating solution tank 10 is cleaned. The area of the bottom wall 11 outside the solution outlet 101 is provided with a heating wire 41 to avoid unnecessary influence on the solution outlet 101 due to heating by the heating wire.
[0055] In some embodiments, the power of the heating wire 41 is 10W-30W, which can well realize the heating uniformity.
[0056] In some embodiments, the electroless plating solution tank 10 is a stainless steel tank.
[0057] The electroless plating solution is a nickel plating solution.
[0058] The preset temperature is 80℃-90℃, for example, 85℃, 86℃, 88℃, etc.
[0059] It should be noted that in other embodiments, the electroless plating solution tank can also be a solution tank of other materials. The electroless plating solution can also be a solution of other materials. Accordingly, the preset temperature can also be other temperatures.
[0060] In some embodiments, the circulation pipeline 30 is further provided with a circulation pump 34. The circulation pump 34 is used to provide power when the electroless plating solution in the electroless plating solution tank 10 needs to be heated, so that the electroless plating solution in the electroless plating solution tank 10 can be led out from the first section of pipeline 31, flow through the second section of pipeline 32 of the water bath heating device 20, and then flow back to the electroless plating solution tank 10 through the third section of pipeline 33. The electroless plating solution is heated by the water bath heating device 20 when flowing through the second section of pipeline 32.
[0061] In some embodiments, the water bath heating device 20 further comprises a heater 22 for heating the liquid in the heating water tank 21, the heater 22 is electrically connected with the controller 50, and the controller 50 is configured to control the heater 22 to heat the electroless plating solution flowing through the heating water tank 21 in the circulation pipeline 30 when the electroless plating solution in the electroless plating solution tank needs to be heated; wherein the heater 22 is arranged apart from the second section of pipeline 32 to avoid the local uneven heating of the second section of pipeline 32 caused by the heater 22.
[0062] The heater 22 can also be a heating structure with a heating wire.
[0063] Based on the above description, the electroless plating solution tank 10 is a stainless steel tank, the electroless plating solution is a nickel plating solution, and the preset temperature is 85°C. When the electroless plating solution in the electroless plating solution tank 10 needs to be heated, the electroless plating solution is heated from room temperature to the preset 85°C. The time required is significantly shortened compared to the separate water bath heating method used in the related art. In some embodiments, the shortened time is even 40% or more. Moreover, the heating wire can also perform heat preservation on the electroless plating solution after heating, and the temperature of the electroless plating solution has good stability.
[0064] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the following claims.
[0065] It should be understood that the application is not limited to the precise construction that has been described above and shown in the accompanying drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the application. The scope of the application is indicated only by the appended claims.
Claims
1. A chemical plating system characterized by, include: A chemical plating solution tank is used to hold chemical plating solutions. A water bath heating device, which has a heating water tank capable of heating; The circulation pipeline includes a first section of pipeline extending from the electroless plating solution tank to the heating water tank, a second section of pipeline located in the heating water tank, and a third section of pipeline extending from the heating water tank to the electroless plating solution tank, for drawing out the electroless plating solution in the electroless plating solution tank and flowing through the heating water tank before flowing back into the electroless plating solution tank; A solution tank heating device includes a heating wire disposed on the outer wall of the electroless plating solution tank; The controller is configured to, when the electroless plating solution in the electroless plating solution tank needs to be heated, control the solution tank heating device to heat the electroless plating solution in the electroless plating solution tank, and control the water bath heating device to heat the electroless plating solution flowing through the heating water tank in the circulation pipeline; and is also configured to, after the electroless plating solution in the electroless plating solution tank is heated to a preset temperature, control the solution tank heating device to keep the electroless plating solution in the electroless plating solution tank at a constant temperature.
2. The electroless plating system of claim 1, wherein The electroless plating solution tank is also equipped with a temperature detection device for real-time detection of the temperature of the electroless plating solution in the tank and transmission of the detected temperature to the controller. The controller can control the water bath heating device and the solution tank heating device to heat the electroless plating solution according to the temperature, and control the solution tank heating device to keep the electroless plating solution warm.
3. The electroless plating system of claim 1, wherein The solution tank heating device includes a protective sleeve fitted over the surface of the heating wire.
4. The electroless plating system of claim 3, wherein The protective sleeve is provided with an insulation layer.
5. The electroless plating system of claim 1, wherein The electroless plating solution tank includes a side wall and a bottom wall, and the heating wire is arranged around the side wall.
6. The electroless plating system of claim 5, wherein In the height direction of the electroless plating solution tank, the heating wire is a continuous heating structure disposed outside the side wall, or the heating wire includes multiple heating structures spaced apart outside the side wall.
7. The electroless plating system of claim 5, wherein The ratio between the height of the heating wire and the height of the electroless plating solution bath is greater than or equal to 0.
5.
8. The electroless plating system of claim 1, wherein, The electroless plating solution tank includes a side wall and a bottom wall. The bottom wall is provided with a solution outlet, and a heating wire is provided on the bottom wall in the area outside the solution outlet.
9. The electroless plating system of claim 1, wherein The chemical plating solution tank is a stainless steel tank; The electroless plating solution is a nickel plating solution; The preset temperature is 80℃-90℃.
10. The electroless plating system of claim 1, wherein The circulation pipeline is also equipped with a circulation pump, which is used to provide power when the electroless plating solution in the electroless plating solution tank needs to be heated, so that the electroless plating solution in the electroless plating solution tank is drawn out and flows through the heating water tank and then flows back to the electroless plating solution tank. The water bath heating device further includes a heater for heating the liquid in the heating water tank. The heater is electrically connected to the controller, which is configured to control the heater to heat the chemical plating solution flowing through the heating water tank in the circulation pipeline when the chemical plating solution in the chemical plating solution tank needs to be heated. The heater is spaced apart from the second section of the pipeline.