Electric water pump

Abstract

The utility model discloses an electric water pump which comprises a containing cavity, the water pipe is arranged in the accommodating cavity; the PCB is arranged in the accommodating cavity; the heating piece is arranged on the PCB; the semi-permeable membrane is arranged in the containing cavity, the water pipe, the PCB and the semi-permeable membrane are sequentially arranged at intervals, and the semi-permeable membrane is breathable and waterproof. According to the utility model, the environment of the area where the PCB is located can be ensured to be in a dry state based on the moisture-proof mode of the heating element.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of electric water pump, especially an electric water pump. BACKGROUND

[0002] In the process of the continuous operation of the electric water pump, the air containing water vapor can enter the cavity of the electric water pump through the semi-permeable membrane (air permeable but water impermeable), and when the temperature decreases, the water vapor will become liquid water and cannot be discharged through the semi-permeable membrane. At this time, if the liquid water accumulates too much, it is extremely likely to cause the PCB (Printed Circuit Board) in the electric water pump to be damp, resulting in damage to the PCB, and ultimately causing the performance of the entire electric water pump to decrease significantly or even completely fail.

[0003] Currently, there are two solutions for preventing the PCB from being damp. The first solution is to evaporate the liquid water into water vapor through the heat generated by the operation of the electric water pump, and the special microporous structure of the semi-permeable membrane allows the water vapor to pass through smoothly and be discharged to the outside of the electric water pump, thereby reducing the humidity in the electric water pump to a certain extent and playing a role in preventing damp. However, if the electric water pump has not been started, there is no operating heat to drive the evaporation of the liquid water at this time, and therefore it is impossible to timely and effectively discharge the liquid water only by relying on the characteristics of the semi-permeable membrane. In this case, the efficiency of the semi-permeable membrane damp-proof solution is low and cannot meet the actual needs.

[0004] The second solution is to coat the surface of the PCB with a three-proofing paint or three-proofing glue to isolate the liquid water. However, during the coating process, the three-proofing paint or three-proofing glue may penetrate into the pin pins on the PCB. After the three-proofing paint or three-proofing glue penetrates into the pin pins, it will cause the electronic components on the PCB to fall off from the pin pins, resulting in failure of the PCB and even the entire electric water pump, and the electric water pump cannot operate normally. SUMMARY

[0005] The utility model aims at solving the problem that the prior art cannot timely and effectively reduce the humidity in the electric water pump. The utility model provides an electric water pump, which can ensure that the environment of the area where the PCB is located is in a dry state based on a damp-proof mode of a heating element.

[0006] To solve the above technical problems, an embodiment of the utility model discloses an electric water pump, which comprises:

[0007] a containing cavity;

[0008] a water pipe arranged in the containing cavity;

[0009] a PCB arranged in the containing cavity;

[0010] a heating element arranged on the PCB;

[0011] A semi-permeable membrane is arranged in the accommodating cavity, and the water pipe, the PCB board and the semi-permeable membrane are sequentially and spacedly arranged, and the semi-permeable membrane is permeable to air and impermeable to water.

[0012] The air containing water vapor enters the accommodating cavity through the semi-permeable membrane, and when the electric water pump is running, the motor continuously operates to generate heat. In this case, the water vapor can still be in a gaseous state and is discharged from the semi-permeable membrane. When the electric water pump stops working, the internal temperature decreases, and the water vapor changes into liquid water and cannot be discharged through the semi-permeable membrane. According to the above technical solution, in the first case, when the water vapor is in a gaseous state, the heat generated by the heating member makes the air pressure in the accommodating cavity higher than the air pressure outside, and under the driving of the air pressure difference, the water vapor is rapidly discharged to the outside air through the semi-permeable membrane. In the second case, the water vapor has changed into liquid water, and the heat generated by the heating member can evaporate the liquid water into water vapor. Due to the change of the state of the water, and the air pressure in the accommodating cavity is higher than the air pressure outside, under the driving of the air pressure difference, the water vapor is rapidly discharged to the outside air through the semi-permeable membrane. Therefore, the environment of the area where the PCB board is located is in a dry state, and a series of problems such as damage of the PCB board due to high humidity can be effectively avoided.

[0013] No matter what state the electric water pump is in, the liquid water can be converted into water vapor by the heat generated by the heating member independently, and the water vapor is discharged to the outside environment in time by the semi-permeable membrane. This means that even if the electric water pump is in a shutdown state, the humidity in the accommodating cavity can be effectively reduced by the operation of the heating member, thereby providing continuous and reliable moisture-proof protection for the PCB board. In addition, since this moisture-proof method based on the heating member is adopted, there is no need to additionally coat the surface of the PCB board with three-proof paint or three-proof glue. In this way, not only is the risk of damage of various electronic components due to the penetration of three-proof paint or three-proof glue into the pin feet on the PCB board avoided, but also the production process and maintenance process of the PCB board are simplified, and the reliability and stability of the electric water pump as a whole are further improved.

[0014] According to another specific embodiment of the utility model, the PCB board comprises a control member, the distance between the heating member and the control member is 10mm-20mm, and the heating member is connected with the control member.

[0015] When the humidity of the accommodating cavity is greater than or equal to a first humidity value, the control member is used to start the heating member;

[0016] When the humidity of the accommodating cavity is less than a second humidity value, or when the temperature of the heating member is greater than or equal to a first temperature value, the control member is used to turn off the heating member, and the first humidity value is greater than the second humidity value;

[0017] when the humidity of the accommodation cavity is greater than or equal to a third humidity value, the control member is configured to adjust the current of the heating member to a first current value, the third humidity value being greater than the first humidity value;

[0018] when the humidity of the accommodation cavity is less than the first humidity value, the control member is configured to adjust the current of the heating member to a second current value, the first current value being greater than the second current value.

[0019] With the above technical solution, in the whole operation system of the PCB, the control member of the PCB plays a role like a brain. In the specific embodiments involved in the present application, the control member is an MCU (Micro-Controller Unit, control system). As the core control hub of the PCB, the MCU is responsible for commanding and coordinating the operation of various circuit modules and related electronic elements on the PCB. Once the MCU is damp, the erosion of moisture will cause damage to its circuit structure and electronic elements, so that it cannot accurately execute instructions, and ultimately the whole PCB cannot run smoothly, and the whole electric water pump will be in a paralyzed state.

[0020] Therefore, in order to ensure the dry running environment of the control member, the distance between the heating member and the control member is set to 10mm-20mm in the technical solution. The above distance range indicates that, compared with other structural members on the PCB, the heating member is close to the control member. The set distance fully considers the rationality of the overall layout of the PCB, and does not adversely affect the space position reserved for other circuits on the PCB, and can ensure that the heat generated by the heating member can effectively act on the area near the control member when the heating member is working. When there is liquid water around the control member, the heat can quickly evaporate the liquid water into water vapor, thereby effectively drying the area near the control member and keeping the environment in the area where the control member is located in a dry state, providing reliable environmental protection for the stable operation of the control member.

[0021] When the humidity inside the accommodation cavity is greater than or equal to a first humidity value, for example, 60%, the control member starts the heating member to work and generate heat, which can gradually evaporate the liquid water near the control member into water vapor. As the heating process continues, the humidity in the accommodation cavity will gradually decrease. When the humidity decreases to below a second humidity value, for example, 55%, this humidity value indicates that the humidity level in the accommodation cavity at this time is in a relatively safe range and will not cause the control member to be damp, and the control member turns off the heating member. Through the technical solution, the heating member can be started or turned off at any time based on the real-time humidity in the accommodation cavity, which is more efficient and can avoid unnecessary energy consumption and other potential problems that may be caused by excessive heating.

[0022] In addition, when the temperature of the heating element is greater than or equal to a first temperature value, for example, 135℃, the control element also turns off the heating element, so as to avoid damage to the heating element and the PCB board due to excessive heating.

[0023] Further, the amount of heat generated by the heating element is determined by the amount of current delivered to the heating element by the control element. The greater the current, the more electrical energy the heating element obtains, and the more heat it generates; conversely, the smaller the current, the less heat it generates. Based on this characteristic, when the humidity of the accommodation cavity is high to a third humidity value, for example, 80%, the control element adjusts the current of the heating element to a first current value, for example, 50mA. By increasing the current, the amount of heat generated by the heating element is increased, so that the liquid water can be quickly evaporated into water vapor in a shorter time, so as to reduce the humidity of the accommodation cavity as soon as possible and ensure the safety of the control element. When the humidity of the accommodation cavity gradually decreases to a first humidity value, for example, 60%, during the heating process, the control element adjusts the current of the heating element to a second current value, for example, 10mA. At this time, since the humidity has been reduced, a higher amount of heat is no longer needed for evaporation operation, and the heat generated by a lower current is sufficient to meet the evaporation requirements of the liquid water under the current humidity, so that the stable control of the humidity of the accommodation cavity can be maintained, and the rational use and conservation of energy can be further achieved.

[0024] According to another specific embodiment of the present application, the electric water pump comprises a humidity sensor, the humidity sensor is used for detecting the humidity of the accommodation cavity, the humidity sensor is arranged on the PCB board, and the humidity sensor is connected with the control element.

[0025] By using the above technical solution, the humidity sensor detects the humidity of the accommodation cavity, and transmits the humidity value to the control element. The control element starts or turns off the heating element, or adjusts the current of the heating element according to the specific humidity value.

[0026] According to another specific embodiment of the present application, the electric water pump comprises a temperature sensor, the temperature sensor is used for detecting the temperature of the heating element, the temperature sensor is arranged on the PCB board, and the temperature sensor is connected with the heating element and the control element respectively.

[0027] By using the above technical solution, the temperature sensor detects the temperature of the heating element, and transmits the temperature value to the control element. The control element starts or turns off the heating element according to the specific temperature value.

[0028] According to another specific embodiment of the present application, the material of the heating element is a high-temperature coefficient resistance material, and the high temperature refers to a temperature greater than or equal to 150℃.

[0029] With the technical scheme, when the electric water pump is running, heat will inevitably be generated inside due to continuous operation of the motor, mechanical friction, high-speed flow of water in the pump body and other factors. In this case, the temperature inside the electric water pump is likely to rise to as high as 150 DEG C. Therefore, the technical scheme sets the material of the heating element as a material with high temperature coefficient resistance characteristics, so as to ensure that the heating element can still work stably and normally at a high temperature, i.e. 150 DEG C.

[0030] According to another specific embodiment of the present application, the first humidity value is 60% to 65%, the second humidity value is 50% to 55%, and the third humidity value is 75% to 85%.

[0031] According to another specific embodiment of the present application, the first temperature value is 135 DEG C to 145 DEG C.

[0032] According to another specific embodiment of the present application, the first current value is 45 mA to 55 mA, and the second current value is 10 mA to 15 mA.

[0033] According to another specific embodiment of the present application, the electric water pump comprises a water inlet and a water outlet, and the water inlet, the water pipe and the water outlet are sequentially communicated. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 A top view of the electric water pump according to an embodiment of the present application is shown.

[0035] Figure 2A A sectional view of the electric water pump according to an embodiment of the present application is shown.

[0036] Figure 2B A partial enlarged view of the A region in the electric water pump according to an embodiment of the present application is shown. Figure 2A

[0037] Figure 3 A connection schematic diagram of the PCB, the heating element, the humidity sensor and the temperature sensor according to an embodiment of the present application is shown.

[0038] REFERENCE SIGNS

[0039] The electric water pump 100;

[0040] The accommodating cavity 10;

[0041] The PCB 20; the control element 21;

[0042] The heating element 30;

[0043] The semi-permeable membrane 40;

[0044] The humidity sensor 50;​

[0045] Temperature sensor 60;

[0046] Water inlet 70;

[0047] Water outlet 80. DETAILED DESCRIPTION

[0048] The above description merely illustrates the principles of the application. It will thus be appreciated that those skilled in the art will be able to devise various arrangements that, although not explicitly described or shown herein, embody the principles of the application and are thus within its spirit and scope. In addition, it is understood that the application is not limited to the embodiments described herein, but that it includes all embodiments that fall within the scope of the claims.

[0049] It should be noted that in this specification, similar reference numbers and letters in the following drawings represent similar items, and thus, once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings.

[0050] In the description of the present embodiments, it should be noted that the terms "upper", "lower", "inner", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed, and are merely for the convenience of describing the present application and simplifying the description, and thus cannot be understood as indicating or implying that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus cannot be understood as limiting the present application.

[0051] The terms "first", "second", etc. are merely used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0052] In the description of the present embodiments, it should also be noted that, unless otherwise explicitly specified and limited, the terms "provided", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present embodiments can be understood according to the specific circumstances.

[0053] In order to make the purpose, technical scheme and advantages of the utility model clearer, the embodiments of the utility model will be described in further detail below with reference to the drawings.

[0054] Reference Figures 1 to 3 The embodiment of the application provides a kind of electric water pump 100, including containing cavity 10, water pipe (not shown in drawing), PCB board 20, two heating pieces 30 and semi-permeable membrane 40.Water pipe, PCB board 20 and semi-permeable membrane 40 are all arranged in containing cavity 10, and are sequentially spaced, and two heating pieces 30 are arranged in PCB board 20, and semi-permeable membrane 40 is breathable and not water permeable.

[0055] Since the air containing water vapor can enter containing cavity 10 through semi-permeable membrane 40, when electric water pump 100 operates, motor continuously operates to generate heat.In this case, water vapor can still be discharged from semi-permeable membrane 40 in gaseous state.When electric water pump 100 stops working, internal temperature decreases, and these water vapor will become liquid water and cannot be discharged through semi-permeable membrane 40.

[0056] By adopting the above technical scheme, in the first case, when water vapor is in gaseous state, the heat generated by heating piece 30 makes the air pressure in containing cavity 10 higher than that of external air, and under the driving of air pressure difference, water vapor will quickly discharge to external air through semi-permeable membrane 40.In the second case, water vapor has become liquid water, and at this time, liquid water can be evaporated into water vapor by the heat generated by heating piece 30.Due to the change of water state and the air pressure in containing cavity 10 being higher than that of external air, under the driving of air pressure difference, water vapor will quickly discharge to external air through semi-permeable membrane 40, so as to ensure that the environment of the area where PCB board 20 is located is in dry state, and effectively avoid a series of problems such as PCB board 20 being damaged due to high humidity.

[0057] No matter what working state electric water pump 100 is in, liquid water can be converted into water vapor by the heat generated by heating piece 30 independently, and water vapor is discharged to external environment in time by semi-permeable membrane 40.This means that even if electric water pump 100 is in shutdown state and does not operate, it also has the ability to effectively reduce the humidity in containing cavity 10 by the operation of heating piece 30, so as to provide continuous and reliable moisture-proof protection for PCB board 20.In addition, since this moisture-proof mode based on heating piece 30 and semi-permeable membrane 40 is adopted, there is no need to additionally coat three-proof paint or three-proof glue on the surface of PCB board 20.In this way, not only the risk of each electronic component falling off and being damaged due to three-proof paint or three-proof glue possibly penetrating into pin foot on PCB board 20 is avoided, but also the production process and maintenance process of PCB board 20 are simplified, and the overall reliability and stability of electric water pump 100 are further improved.

[0058] It should be noted that the number of heating elements 30 is not specifically limited in the embodiments of the present application, for example, in other possible embodiments, the number of heating elements 30 can be one, three, four, etc.

[0059] In some possible embodiments, with reference to Figures 1 to 3 The PCB 20 comprises a control element 21, the distance between each heating element 30 and the control element 21 is 10mm-20mm, and the heating element 30 is connected to the control element 21.

[0060] When the humidity of the accommodation cavity 10 is greater than or equal to a first humidity value, the control element 21 is configured to start the heating element 30.

[0061] When the humidity of the accommodation cavity 10 is less than a second humidity value, or when the temperature of the heating element 30 is greater than or equal to a first temperature value, the control element 21 is configured to turn off the heating element 30, and the first humidity value is greater than the second humidity value.

[0062] When the humidity of the accommodation cavity 10 is greater than or equal to a third humidity value, the control element 21 is configured to adjust the current of the heating element 30 to a first current value, and the third humidity value is greater than the first humidity value.

[0063] When the humidity of the accommodation cavity 10 is less than the first humidity value, the control element 21 is configured to adjust the current of the heating element 30 to a second current value, and the first current value is greater than the second current value.

[0064] With the above technical solution, in the entire operation system of the PCB 20, the control element 21 of the PCB 20 plays a role like the brain. In the specific embodiments involved in the present application, the control element 21 is an MCU (Micro-Controller Unit, control system). As the core control hub of the PCB 20, the MCU is responsible for commanding and coordinating the operation of various circuit modules and related electronic elements on the PCB 20. Once the MCU is damp, the invasion of water will damage its circuit structure and electronic elements, so that it cannot accurately execute instructions, and ultimately the entire PCB 20 cannot run smoothly, and the entire electric water pump 100 will be in a paralyzed state.

[0065] Therefore, in order to guarantee the dry operation environment of the control component 21, the distance between the heating component 30 and the control component 21 is set to 10-20 mm. The range of the distance indicates that the heating component 30 is close to the control component 21 compared with other structural components on the PCB 20. The set distance can guarantee that the heat generated by the heating component 30 can effectively act on the area near the control component 21 without adversely affecting the space reserved for other circuits on the PCB 20, when the heating component 30 works. When there is liquid water around the control component 21, the heat can quickly evaporate the liquid water into water vapor, thereby effectively drying the area near the control component 21 and keeping the environment in the area where the control component 21 is located in a dry state, thereby providing reliable environmental protection for the stable operation of the control component 21.

[0066] It should be noted that the distance between each heating component 30 and the control component 21 is not specifically limited in the embodiment of the application. For example, in other possible embodiments, the distance L1 between one of the heating components 30 and the control component can be 10 mm, 11.7 mm, 19 mm, 20 mm, etc., the distance L2 between the other heating component 30 and the control component can be 10 mm, 13.4 mm, 18 mm, 20 mm, etc., or the distances between the two heating components 30 and the control component can be equal, i.e., L1=L2. The specific distance is determined by the actual situation.

[0067] When the humidity inside the accommodation cavity 10 is greater than or equal to a first humidity value, for example, 60%, the control component 21 starts the heating component 30 to work to generate heat, which can gradually evaporate the liquid water near the control component 21 into water vapor. As the heating process continues, the humidity in the accommodation cavity 10 gradually decreases. When the humidity decreases to below a second humidity value, for example, 55%, the humidity value indicates that the humidity level in the accommodation cavity 10 is in a relatively safe range and does not pose a threat to the control component 21, and the control component 21 turns off the heating component 30. Through the technical solution, the heating component 30 can be started or turned off at any time based on the real-time humidity in the accommodation cavity 10, which is more efficient and can avoid unnecessary energy consumption and other potential problems that may be caused by excessive heating.

[0068] In addition, when the temperature of the heating component 30 is greater than or equal to a first temperature value, for example, 135℃, the control component 21 also turns off the heating component 30, in order to avoid damage to the heating component 30 and the PCB 20 caused by excessive heating.

[0069] Further, the amount of heat generated by the heating element 30 is determined by the amount of current delivered to the heating element 30 by the control element 21. The greater the current, the more power the heating element 30 receives and the more heat it generates. Conversely, the smaller the current, the less heat it generates. Based on this characteristic, when the humidity of the containing cavity 10 reaches a third humidity value, for example 80%, the control element 21 adjusts the current of the heating element 30 to a first current value, for example 50 mA. By increasing the current, the amount of heat generated by the heating element 30 is increased, so that the liquid water can be quickly evaporated into water vapor in a shorter time, so as to reduce the humidity of the containing cavity 10 as soon as possible and ensure the safety of the control element 21. When the humidity of the containing cavity 10 gradually decreases to a first humidity value, for example 60%, during the heating process, the control element 21 adjusts the current of the heating element 30 to a second current value, for example 10 mA. At this time, since the humidity has been reduced, a higher amount of heat is no longer needed for the evaporation operation, and the heat generated by the lower current is sufficient to meet the evaporation requirements of the liquid water at the current humidity, so that the stable control of the humidity of the containing cavity 10 can be maintained, and the rational use and conservation of energy can be further achieved.

[0070] In some possible implementations, with reference to Figures 1 to 3 The electric water pump 100 includes a humidity sensor 50 for detecting the humidity of the containing cavity 10. The humidity sensor 50 is arranged on the PCB 20 and is connected to the control element 21.

[0071] With the above technical solution, the humidity sensor 50 detects the humidity of the containing cavity 10 and transmits the humidity value to the control element 21, and the control element 21 starts or stops the heating element 30 or adjusts the current of the heating element 30 according to the specific humidity value.

[0072] In some possible implementations, with reference to Figures 1 to 3 The electric water pump 100 includes a temperature sensor 60 for detecting the temperature of the heating element 30. The temperature sensor 60 is arranged on the PCB 20 and is connected to the heating element 30 and the control element 21.

[0073] With the above technical solution, the temperature sensor 60 detects the temperature of the heating element 30 and transmits the temperature value to the control element 21, and the control element 21 starts or stops the heating element 30 according to the specific temperature value.

[0074] In some possible implementations, with reference to Figures 1 to 3 The material of the heating element 30 is a high-temperature coefficient resistance material, and the high temperature refers to a temperature greater than or equal to 150°C.

[0075] Adopt the above technical scheme, when the electric water pump 100 is running, due to the continuous operation of the motor, mechanical friction and the high-speed flow of water in the pump body and other factors, heat will inevitably be generated inside. In this case, the temperature inside the electric water pump 100 is likely to rise as high as 150℃. Therefore, the technical scheme sets the material of the heating element 30 to be a material with high temperature coefficient resistance characteristics, ensuring that the heating element 30 can still work stably and normally at high temperature conditions, i.e. 150℃.

[0076] In some possible embodiments, the first humidity value is 60% to 65%, the second humidity value is 50% to 55%, and the third humidity value is 75% to 85%.

[0077] It should be noted that the specific value of the first humidity value is not specifically limited in the embodiments of the present application, for example, in other possible embodiments, the specific value of the first humidity value can be 60%, 61%, 63.5%, 65%, etc. The specific value of the second humidity value is not specifically limited in the embodiments of the present application, for example, in other possible embodiments, the specific value of the second humidity value can be 50%, 51%, 52.6%, 55%, etc. The specific value of the third humidity value is not specifically limited in the embodiments of the present application, for example, in other possible embodiments, the specific value of the third humidity value can be 75%, 76%, 84.7%, 85%, etc.

[0078] In some possible embodiments, the first temperature value is 135℃ to 145℃.

[0079] It should be noted that the specific value of the first temperature value is not specifically limited in the embodiments of the present application, for example, in other possible embodiments, the specific value of the first temperature value can be 135℃, 138℃, 142.7℃, 145℃, etc.

[0080] In some possible embodiments, the first current value is 45mA to 55mA, and the second current value is 10mA to 15mA.

[0081] It should be noted that the specific value of the first current value is not specifically limited in the embodiments of the present application, for example, in other possible embodiments, the specific value of the first current value can be 45mA, 48mA, 52.9mA, 55mA, etc. The specific value of the second current value is not specifically limited in the embodiments of the present application, for example, in other possible embodiments, the specific value of the second current value can be 10mA, 11mA, 13.6mA, 15mA, etc.

[0082] In some possible embodiments, the reference Figures 1 to 3The electric water pump 100 comprises a water inlet 70 and a water outlet 80, and the water inlet 70, the water pipe and the water outlet 80 are sequentially communicated.

[0083] Although the present application has been illustrated and described with reference to certain preferred embodiments thereof, it should be understood that the above description is intended to be illustrative only and not limiting of the application as it is realized that changes in form and detail can be made without departing from the spirit of the application.

Claims

1. An electric water pump characterized by comprising: The electric water pump comprises: a containing cavity; a water pipe arranged in the containing cavity; a PCB board arranged in the containing cavity; a heating element arranged on the PCB board; a semi-permeable membrane arranged in the containing cavity, the water pipe, the PCB board and the semi-permeable membrane are arranged in sequence and spaced apart, and the semi-permeable membrane is air permeable and water impermeable.

2. The electric water pump of claim 1, wherein The PCB board comprises a control element, the distance between the heating element and the control element is 10mm-20mm, and the heating element is connected with the control element; when the humidity of the containing cavity is greater than or equal to a first humidity value, the control element is used to start the heating element; when the humidity of the containing cavity is less than a second humidity value, or when the temperature of the heating element is greater than or equal to a first temperature value, the control element is used to turn off the heating element, and the first humidity value is greater than the second humidity value; when the humidity of the containing cavity is greater than or equal to a third humidity value, the control element is used to adjust the current of the heating element to a first current value, and the third humidity value is greater than the first humidity value; when the humidity of the containing cavity is less than the first humidity value, the control element is used to adjust the current of the heating element to a second current value, and the first current value is greater than the second current value.

3. The electric water pump of claim 2, wherein The electric water pump comprises a humidity sensor for detecting the humidity of the containing cavity, the humidity sensor is arranged on the PCB board, and the humidity sensor is connected with the control element.

4. The electric water pump of claim 2, wherein The electric water pump comprises a temperature sensor for detecting the temperature of the heating element, the temperature sensor is arranged on the PCB board, and the temperature sensor is connected with the heating element and the control element respectively.

5. The electric water pump of claim 1, wherein The material of the heating element is a high temperature coefficient resistance material, and the high temperature refers to a temperature greater than or equal to 150℃.

6. The electric water pump of claim 2, wherein The first humidity value is 60%-65%, the second humidity value is 50%-55%, and the third humidity value is 75%-85%.

7. The electric water pump of claim 2, wherein The first temperature value is 135℃-145℃.

8. The electric water pump of claim 2, wherein, The first current value is 45mA-55mA, and the second current value is 10mA-15mA.

9. The electric water pump of claim 1, wherein, The electric water pump comprises a water inlet and a water outlet, the water inlet, the water pipe and the water outlet are sequentially communicated.

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