Semiconductor chamber valve plate seal

Abstract

The utility model provides a semiconductor chamber valve plate sealing element which comprises a body, the body is matched with a valve plate groove, the cross section of the body is in an E shape, the height of the side, close to the valve plate groove, of the body is consistent with the depth of the valve plate groove, a protruding part is arranged in the middle of the body, and the protruding part is matched with the valve plate groove. The height of the protruding part is larger than the depth of the valve plate groove, and the end, away from the valve plate groove, of the protruding part is an arc protrusion. By means of the special structure, the small fillet, the small width and the small area of the E-shaped sealing piece, the problems of distortion, breakage, particles and the like possibly caused by dynamic friction are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of sealing element, concretely relates to semiconductor chamber valve valve plate sealing element. BACKGROUND

[0002] At present, the existing semiconductor chamber valve valve plate sealing element is mainly O-shaped ring rubber body complete filling in the valve plate groove, and the sealing effect is mainly generated by the rubber body during the opening and closing process of the valve plate.

[0003] The existing chamber valve valve plate sealing element has a large volume protruding on the outer side of the valve plate, which causes the sealing element to frequently generate large friction with the outside during the sealing operation, and the particles generated by abrasion greatly affect the purity of the chamber. Meanwhile, the sealing element can be twisted and broken during the high-frequency dynamic opening and closing process. Meanwhile, in the closed chamber, the plasma can chemically and physically bombard the rubber body protruding outside, and the sealing element is prone to damage. SUMMARY

[0004] The utility model discloses a semiconductor chamber valve valve plate sealing element, which solves the above problems by the unique structure of the "mountain" shaped sealing element, small fillet, small width and small area, and reduces the problems such as distortion, fracture and particles caused by dynamic friction.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme.

[0006] The semiconductor chamber valve valve plate sealing element comprises a body, the body is matched with the valve plate groove, the cross section of the body is in the shape of "mountain", the height of the body close to one side of the valve plate groove is consistent with the depth of the valve plate groove, the middle part of the body is provided with a protruding part, the height of the protruding part is greater than the depth of the valve plate groove, and the end of the protruding part away from the valve plate groove is a circular arc protrusion.

[0007] Further, the body is made of a rubber part.

[0008] Further, the body is made of a perfluorinated rubber part.

[0009] Further, the protruding part is in the shape of a cone.

[0010] Further, the protruding part close to the valve plate groove is in the shape of a circular arc.

[0011] Further, the radius of the circular arc of the circular arc protrusion is 2-5mm.

[0012] Further, the radius of the circular arc of the circular arc protrusion is 2mm.

[0013] The utility model semiconductor chamber valve valve plate sealing element has the following positive effects:

[0014] (1) The utility model discloses a " mountain " shaped sealing element, through the special structure and small fillet of " mountain " shaped sealing element, small width, small area, reduce the distortion, fracture and particle problem that dynamic friction can bring.

[0015] (2) The utility model discloses a perfluorinated rubber can satisfy long -time use, and various special gas and liquid in cavity can have good compatible characteristics.

[0016] (3) The utility model discloses a special-shaped part can reduce the problem of many particles in the chamber due to gas corrosion and friction. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is the schematic diagram provided by the utility model embodiment.

[0018] The reference numerals in the drawing are as follows:

[0019] 1, body;2, valve plate groove;3, convex part;4, arc convex. DETAILED DESCRIPTION

[0020] The following specific embodiments of the semiconductor chamber valve plate sealing element of the utility model are given in combination with the drawings, but it is pointed out that the specific embodiments are not used to limit the specific implementation of the utility model. Any similar structure and its similar changes using the utility model should be included in the protection scope of the utility model. The following embodiment description is with reference to the additional drawings to illustrate the specific embodiments that can be used to implement the utility model. The directions mentioned in the embodiment, such as "up", "down", "front", "back", "left", "right", "top", "bottom" and the like, are only the directions of the additional drawings. Therefore, the direction terms used are used to explain and understand the utility model, not to limit the utility model.

[0021] Reference Figure 1 The semiconductor chamber valve plate sealing element comprises a body 1, the body 1 is matched with a valve plate groove 2, the cross section of the body 1 is " mountain " shaped, the height of the body 1 near one side of the valve plate groove 2 is consistent with the depth of the valve plate groove 2, that is, the height of the left side and the right side of the body 1 in the drawing is consistent with the depth of the valve plate groove 2. The middle part of the body 1 is provided with a convex part 3, and the height of the convex part 3 is greater than the depth of the valve plate groove 2. The end of the convex part 3 away from the valve plate groove 2 is an arc convex 4, that is, the top end of the convex part 3 in the drawing is an arc convex.

[0022] The body 1 is made of rubber, and the body 1 is made of perfluorinated rubber. The convex part 3 is tapered, and the convex part 3 is arc-shaped near the valve plate groove 2. The radius of the fillet of the arc convex part 4 is 2-5 mm, and in the embodiment, the radius of the fillet of the arc convex part 4 is 2 mm. The width of the contact surface of the arc convex part 4 is 6-10 mm, and in the embodiment, the width of the contact surface of the arc convex part 4 is 6.7 mm, and the width of the contact surface is the width of the convex part 3 above the two high points of the valve plate groove 2.

[0023] The "mountain" shaped rubber reduces the contact area and the cross-sectional area to 27.2914 square millimeters, effectively reducing the number of particles generated by wear and tear, and ensuring the purity of the chamber. At the same time, the fillet of the contact surface is significantly reduced from R12.4 to R2.0, reducing stress concentration in dynamic contact (R12.4 is the size of the original O-ring rubber body), and not easily turning and twisting. At the same time, the width of the contact surface is reduced from 21.1 mm to 6.7 mm (21.1 mm is the size of the original O-ring rubber body), the sealing contact surface is smaller, the friction is reduced, and the rubber is not easily curled and broken due to sliding friction. At the same time, the material selection of low compression permanent deformation perfluoro rubber material has good recovery deformation after compression. At the same time, the perfluoro material sealing ring can ensure that the special gas and special liquid in the semiconductor equipment will not affect the surface of the rubber part during long-term use, meeting the long service life and excellent appearance performance.

[0024] The contact area of the semiconductor chamber valve plate sealing element is small, the material is corrosion resistant, and it also has the function of high vacuum sealing. The contact fillet is reduced to reduce the particles generated by dynamic wear. The contact width is reduced to reduce the risk of dynamic distortion. The selected material is perfluoro rubber material with extremely low compression permanent deformation, which meets the sealing needs of various semiconductor sealing equipment. There is less contact with plasma in the chamber, which is less likely to produce particles and dust, meeting the purity requirements of the chamber.

[0025] The semiconductor chamber valve plate sealing element is used for the installation of the cavity door connection part in the cavity door sealing, and the sealing ring is placed in the slit valve plate to form a complete sealing structure with the slit valve plate. In the use process, the rubber sealing structure can resist various flowing gases and liquids and maintain good elasticity for a long time. The sealing element is made of low compression permanent deformation perfluoro rubber, which is resistant to high temperature and maintains good resilience under long-term compression. The "mountain" shaped structure can reduce the sliding friction of the rubber part, and the "mountain" shaped structure can reduce the particle pollution caused by plasma gas corrosion.

Claims

1. A valve plate seal for a semiconductor chamber valve, characterized in that, It includes a body which is fitted with the valve plate groove. The cross-section of the body is in the shape of a "mountain". The height of the body on the side close to the valve plate groove is consistent with the depth of the valve plate groove. A convex part is arranged in the middle of the body. The height of the convex part is greater than the depth of the valve plate groove. The end of the convex part away from the valve plate groove is an arc convexity.

2. The semiconductor chamber valve plate seal according to claim 1, characterized in that, The body is made of a rubber part.

3. The semiconductor chamber valve plate seal according to claim 2, characterized in that, The body is made of a perfluororubber part.

4. The semiconductor chamber valve plate seal according to claim 1, characterized in that, The convex part is conical.

5. The semiconductor chamber valve plate seal according to claim 4, characterized in that, The part of the convex part close to the valve plate groove is arc-shaped.

6. The semiconductor chamber valve plate seal according to claim 1, characterized in that, The fillet radius of the arc convexity is 2 - 5 millimeters.

7. The semiconductor chamber valve plate seal according to claim 6, characterized in that, The fillet radius of the arc convexity is 2 millimeters.

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