Heating device for combustion and purification of waste gas in semiconductor manufacturing process

Abstract

The utility model relates to the technical field of semiconductor waste gas treatment equipment, in particular to a heating device for combustion and purification of semiconductor process waste gas, which comprises a gas inlet cylinder, a vortex guide structure arranged in the gas inlet cylinder, a waste gas pipe arranged on the side wall of the gas inlet cylinder, a mixing cylinder communicated with the top of the gas inlet cylinder, and a plurality of partition plates longitudinally distributed at intervals in the mixing cylinder. The top of the mixing cylinder is connected with a heating box, and the top of the heating box is provided with an exhaust pipe; an oxygen cylinder is arranged on the outer side of the air inlet cylinder, an air inlet fan is arranged at the input end of the oxygen cylinder, and the output end of the oxygen cylinder communicates with an inner cavity of the air inlet cylinder. The utility model is favorable for solving the problems that the spiral conveying rod in some existing heating devices is relatively heavy in structure, occupies a larger space in the gas inlet cylinder and extrudes a gas flowing space, the structure in the mixing cylinder is relatively simple, the gas mixing only depends on the rotation of a fan, and the stability of the gas mixing effect cannot be continuously guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor waste gas treatment equipment technical field especially relates to a kind of heating device of semiconductor process waste gas combustion purification. BACKGROUND

[0002] In the production process of semiconductor industry, a large number of chemicals and special gases are used, and a large amount of toxic and harmful gas process waste gas is continuously generated in the production link. In semiconductor process, harsh process refers to complex harsh, multi-dust and strong corrosion process. In the harsh process, a large amount of SiO2 dust and strong corrosive harmful substances need to be treated. The traditional cyclone combined oxygen heating device heats the waste gas by using flame at the waste gas pipe opening, so that the harmful gas is burned, thereby playing a purification role.

[0003] The prior art patent CN217978827U discloses a cyclone combined oxygen heating device for treating semiconductor process waste gas, which is applied in the technical field of semiconductor process waste gas treatment auxiliary equipment. The technical solution points of the patent are as follows: the cyclone combined oxygen heating device for treating semiconductor process waste gas includes an air inlet cylinder, a mixing cylinder and a heating mechanism. The air inlet cylinder is fixedly connected with a waste gas pipe at the bottom of the outer side wall. The air inlet cylinder is fixedly connected with a first motor at the bottom. The driving shaft of the first motor penetrates the air inlet cylinder and is fixedly connected with a spiral conveying rod. In the technical solution, the airflow driving in the air inlet cylinder adopts a spiral conveying rod. First, the structure of the spiral conveying rod is relatively bulky, which occupies a large space in the air inlet cylinder and squeezes the gas flow space. Second, the structure in the mixing cylinder is relatively simple, and the mixing of the gas only depends on the rotation of the fan, which cannot continuously guarantee the stability of the gas mixing effect. UTILITY MODEL CONTENTS

[0004] The utility model provides a kind of heating device of semiconductor process waste gas combustion purification, it is favorable to solve the problem that the structure of spiral conveying rod in some heating device is relatively bulky, which occupies a large space in the air inlet cylinder and squeezes the gas flow space, and the structure in the mixing cylinder is relatively simple, and the mixing of the gas only depends on the rotation of the fan, which cannot continuously guarantee the stability of the gas mixing effect.

[0005] The utility model is implemented as follows:

[0006] The utility model provides a heating device for semiconductor processing waste gas combustion purification, including the air inlet cylinder, be equipped with vortex guide structure in air inlet cylinder, vortex guide structure includes the flow guide piece of setting on the inner side wall of air inlet cylinder, and the flow guide piece is the cylinder structure of going through up and down, is equipped with the helical blade of guide flow effect on its inner side wall, is equipped with the exhaust pipe on the side wall of air inlet cylinder, and the exhaust pipe is used for the waste gas of being purified to input air inlet cylinder inner side bottom, and the top of air inlet cylinder is connected with a mixing cylinder, is equipped with a plurality of longitudinal interval distribution's baffle in the mixing cylinder, is equipped with the perforation of mutual dislocation on adjacent baffle, and the top of mixing cylinder is connected with the heating box, and the top of heating box is equipped with the exhaust pipe, the outside of air inlet cylinder is equipped with oxygen cylinder still, and the input end of oxygen cylinder is equipped with the air inlet fan, and the inner chamber of air inlet cylinder is communicated with the output end of oxygen cylinder.

[0007] On the basis of the above technical scheme, the top of the air inlet cylinder and the oxygen cylinder is connected and fixed with the bottom of the mixing cylinder, and the bottom of the heating box is connected and fixed with the top of the mixing cylinder, which constitutes an integrated structure.

[0008] On the basis of the above technical scheme, the bottom of the air inlet cylinder is further provided with a first fan, and the bottom of the first fan is extended to the outside of the air inlet cylinder through a rotating member and connected with a first motor, and the output direction of the first fan is vertically upward.

[0009] On the basis of the above technical scheme, the bottom end surface of the helical blade is provided with a plurality of flanges.

[0010] On the basis of the above technical scheme, the communication position of the exhaust pipe and the air inlet pipe is below the first fan.

[0011] On the basis of the above technical scheme, the oxygen cylinder is provided with a filter structure.

[0012] On the basis of the above technical scheme, the perforation on the baffle close to the side of the air inlet cylinder is dislocatedly arranged relative to the communication hole of the air inlet cylinder and the mixing cylinder.

[0013] On the basis of the above technical scheme, the heating box includes first heating box and second heating box which are transversely spaced, the bottom of the first heating box is communicated with the top of the mixing cylinder, the top of the first heating box and the bottom of the second heating box are communicated through a communication pipe, and the exhaust pipe is located at the top of the second heating box.

[0014] Compared with the prior art, the utility model at least has the following advantages:

[0015] The utility model discloses a vortex guide structure is set up in the air inlet cylinder to replace the screw rod in some present equipment, after the waste gas to be purified goes into the air inlet cylinder, can form the advancing posture of spiral vortex passively, provides more stable and efficient flow direction support for subsequent oxygen fusion, this is favorable to solve the structure of spiral conveying rod in some heating device of the present, occupies the larger space in the air inlet cylinder, extrudes the gas flow space, and the structure in the mixing cylinder is relatively simple, and the mixing of gas only depends on the rotation of fan, can not continuously guarantee the stability of gas mixing effect. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be briefly introduced to the drawing needed in the embodiment, it should be understood that the following drawings only show some embodiments of the utility model, therefore should not be regarded as the limitation to the scope, for ordinary skilled person in the art, under the premise of not paying the creative labor, still can obtain other related drawings according to these drawings.

[0017] Figure 1 It is a structure schematic diagram of the heating device for semiconductor process waste gas combustion purification in an embodiment;

[0018] Figure 2 It is Figure 1 The internal structure schematic diagram of

[0019] Figure 3 It is Figure 2 The local structure schematic diagram of guide member in

[0020] Figure 4 It is the local structure schematic diagram of spiral blade in an embodiment;

[0021] Figure 5 It is Figure 2 The structure schematic diagram of second baffle in

[0022] Figure 6 It is the internal structure schematic diagram of mixing cylinder in another embodiment.

[0023] Marked in the drawing: 1, air inlet cylinder;2, first motor;21, second fan;3, waste gas pipe;4, oxygen cylinder;41, air inlet fan;42, filter cotton;43, first communication hole;5, guide member;51, spiral blade;52, flange;6, mixing cylinder;61, second communication hole;62, first baffle;621, first perforation;63, second baffle;631, second perforation;64, third communication hole;65, third baffle;7, second motor;71, second fan;8, first heating box;81, check valve;82, communication pipe;9, second heating box;91, exhaust pipe. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in combination with the drawings of the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only to represent selected embodiments of the present application.

[0025] In the description of the present application, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0026] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to one element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration, and do not represent the only embodiment.

[0027] The present application will be further described below in combination with the drawings and specific embodiments.

[0028] In combination Figures 1-5 The present embodiment discloses a heating device for semiconductor process waste gas combustion purification, which comprises an air inlet cylinder 1, a first motor 2, a first fan 21, a waste gas pipe 3, an oxygen pipe, an air inlet fan 41, filter cotton 42, a flow guide 5, a mixing cylinder 6, a partition, a second motor 7, a second fan 71, a heating box and an exhaust pipe 91, which aims to solve the problem that the structure of the screw conveying rod in some heating devices is relatively bulky, occupies a large space in the air inlet cylinder 1, squeezes the gas flow space, and the structure in the mixing cylinder 6 is relatively simple, and the mixing of the gas only depends on the rotation of the fan, which cannot continuously guarantee the stability of the gas mixing effect.

[0029] The air inlet cylinder 1 is a hollow cylinder structure, the top of which is open, and the bottom is a closed end surface, the main body of the first motor 2 is fixed at the bottom of the air inlet cylinder 1, the output end of the first motor 2 extends into the air inlet cylinder 1 and is connected with the first fan 21, the first motor 2 can drive the first fan 21 to rotate at high speed, and the gas at the bottom of the inside of the air inlet cylinder 1 is blown upward in a vortex state.

[0030] An exhaust pipe 3 is arranged on the side wall of the air inlet cylinder 1, the exhaust pipe 3 is connected with an external exhaust conveying pipeline, the exhaust pipe 3 is used for inputting the exhaust gas to be purified into the bottom of the inside of the air inlet cylinder 1, and the exhaust gas is affected by the first fan 21 after entering the air inlet cylinder 1. It should be noted that the communication position of the exhaust pipe 3 and the air inlet pipe is below the first fan 21, that is, the position of the exhaust gas entering the air inlet cylinder 1 is in the negative pressure area of the first fan 21, and the exhaust gas can be timely sucked and flows upward.

[0031] A vortex guide structure is arranged in the air inlet cylinder 1, the vortex guide structure includes a flow guide piece 5 arranged on the inner side wall of the air inlet cylinder 1, the flow guide piece 5 is a cylinder structure penetrating from top to bottom, and a spiral blade 51 for guiding flow is arranged on the inner side wall of the flow guide piece 5. Figure 3 And Figure 4 A plurality of flanges 52 are arranged on the bottom end surface of the spiral blade 51. In working, under the influence of the first fan 21, the exhaust gas flows upward in a vortex state, in the upward process, the exhaust gas in the peripheral region contacts the spiral blade 51 and is affected by the contour of the spiral blade 51, so that the exhaust gas stably spirally flows upward, and the vortex stability is further improved, at the same time, due to the existence of the flanges 52, the exhaust gas is continuously slightly hindered in the upward process, so that the exhaust gas is branched at a plurality of positions, and the interaction frequency of the exhaust gas is realized after iteration, so that the mixing effect is high, which provides more favorable conditions for subsequent purification.

[0032] The top of the air inlet cylinder 1 is communicated with a mixing cylinder 6, and an oxygen cylinder 4 is further arranged outside the air inlet cylinder 1, the top of the air inlet cylinder 1 and the oxygen cylinder 4 is fixedly connected with the bottom of the mixing cylinder 6, and the bottom of the heating box is fixedly connected with the top of the mixing cylinder 6, so as to form an integrated structure, which is beneficial to improve the structural stability of the device.

[0033] An air inlet fan 41 is arranged at the input end of the oxygen cylinder 4, the output end of the oxygen cylinder 4 is communicated with the inner cavity of the air inlet cylinder 1 through a first communication hole 43, a filter structure is arranged in the oxygen cylinder 4, and the filter structure specifically adopts filter cotton 42, the air inlet fan 41 can input external air into the oxygen cylinder 4, after the dust in the air is intercepted by the filter cotton 42, the air carrying oxygen enters the air inlet cylinder 1, preliminarily mixes with the exhaust gas in the air inlet cylinder 1, and then enters the mixing cylinder 6 through a second communication hole 61 between the air inlet cylinder 1 and the mixing cylinder 6.

[0034] The mixing cylinder 6 is provided with a plurality of longitudinal spaced baffles, the adjacent baffles are provided with perforations which are staggered with each other, the perforations on the baffle close to the air inlet cylinder 1 are staggered with the communication hole of the air inlet cylinder 1 and the mixing cylinder 6, which is used to guide and control the gas in the mixing cylinder 6 to change the path, increase the activity of the gas flow, and improve the mixing effect.

[0035] Specifically, as shown in the drawings, Figure 2 The baffle in the embodiment includes a first baffle 62 and a second baffle 63, the first baffle 62 is spaced below the second baffle 63, the center of the first baffle 62 is a closed structure, and the periphery is provided with a first perforation 621; in combination Figure 5 The second baffle 63 is provided with a second perforation 631 in the middle, the first perforation 621 and the second perforation 631 and the second communication hole 61 are staggered with each other to form a bending gas flow path.

[0036] Further, the mixing cylinder 6 is connected with a heating box at the top, and the heating box is provided with an exhaust pipe 91 at the top. The heating box includes a first heating box 8 and a second heating box 9 which are transversely spaced, the bottom of the first heating box 8 is communicated with the top of the mixing cylinder 6 through a third communication hole 64, a one-way valve 81 is arranged in the third communication hole 64, so that the gas can only flow from one side of the mixing cylinder 6 to one side of the first heating box 8, the top of the first heating box 8 and the bottom of the second heating box 9 are communicated through a communication pipe 82, and the exhaust pipe 91 is located at the top of the second heating box 9.

[0037] Further, in order to improve the stability of the gas flow, a second motor 7 is arranged at the top of the mixing box, the output end of the second motor 7 extends into the inside of the mixing cylinder 6 and is connected with a second fan 71 after vertically penetrating through the second perforation 631, the output direction of the second fan 71 is upward, which helps the gas to flow upward through the baffle and into the first heating box 8.

[0038] In another embodiment, in combination Figure 6 In order to further improve the gas mixing effect, two layers of third baffles 65 are arranged above the second baffle 63, the third baffles 65 are uniformly provided with a plurality of small perforations, so that the gas is affected by the uniform and comprehensive shunt mixing when passing through, thereby improving the uniformity of the mutual mixing of the gas.

[0039] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heating device for combustion purification of semiconductor process exhaust gas, characterized by, The application relates to an air inlet cylinder (1) provided with a vortex guide structure, wherein the vortex guide structure comprises a flow guide piece (5) arranged on the inner side wall of the air inlet cylinder (1), the flow guide piece (5) is a cylinder structure penetrating from top to bottom, the inner side wall of the flow guide piece (5) is provided with spiral blades (51) for guiding flow, the side wall of the air inlet cylinder (1) is provided with an exhaust pipe (3) for inputting exhaust gas to be purified into the inner bottom of the air inlet cylinder (1), the top of the air inlet cylinder (1) is connected with a mixing cylinder (6), the mixing cylinder (6) is provided with a plurality of longitudinal interval distribution baffles, the adjacent baffles are provided with perforations staggered with each other, the top of the mixing cylinder (6) is connected with a heating box, the top of the heating box is provided with an exhaust pipe (91), and the outer side of the air inlet cylinder (1) is further provided with an oxygen cylinder (4), the input end of the oxygen cylinder (4) is provided with an air inlet fan (41), and the output end of the oxygen cylinder (4) is communicated with the inner cavity of the air inlet cylinder (1).

2. The heating device for combustion purification of semiconductor process exhaust gas according to claim 1, wherein The top of the air inlet cylinder (1) and the top of the oxygen cylinder (4) are connected and fixed with the bottom of the mixing cylinder (6), the bottom of the heating box is connected and fixed with the top of the mixing cylinder (6), and an integrated structure is formed.

3. The heating device for combustion purification of semiconductor process exhaust gas according to claim 1, wherein The bottom of the air inlet cylinder (1) is further provided with a first fan (21), the bottom of the first fan (21) extends to the outer side of the air inlet cylinder (1) through a rotating piece and is connected with a first motor (2), and the output direction of the first fan (21) is vertically upward.

4. The heating device for combustion purification of semiconductor process exhaust gas according to claim 3, wherein The bottom end face of the spiral blade (51) is provided with a plurality of flanges (52).

5. The heating device for combustion purification of semiconductor process exhaust gas according to claim 3, wherein The communication position of the exhaust pipe (3) and the air inlet pipe is below the first fan (21).

6. The heating device for combustion purification of semiconductor process exhaust gas according to claim 1, wherein The oxygen cylinder (4) is provided with a filtering structure.

7. The heating device for combustion purification of semiconductor process exhaust gas according to claim 1, wherein The perforations on the baffle close to the side of the air inlet cylinder (1) are arranged in a staggered mode relative to the communication hole of the air inlet cylinder (1) and the mixing cylinder (6).

8. The heating device for combustion purification of semiconductor process exhaust gas according to claim 1, wherein The heating box comprises first heating boxes (8) and second heating boxes (9) which are transversely and intervally distributed, the bottom of the first heating box (8) is communicated with the top of the mixing cylinder (6), the top of the first heating box (8) and the bottom of the second heating box (9) are communicated through a communication pipe (82), and the exhaust pipe (91) is located at the top of the second heating box (9).

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