Heat dissipation device for integrated cooker
By designing multi-stage heat dissipation components and air box components in the integrated stove, the problem of poor heat dissipation of the main control board is solved, achieving efficient heat dissipation, extending the service life of the main control board and reducing the risk of failure.
Patent Information
- Application Number
- CN202422947417.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-11-29
AI Technical Summary
The heat dissipation of the existing integrated stove main control board is poor, resulting in a short lifespan of electronic components and susceptibility to damage from small animals, which affects the overall reliability of the equipment.
A main control heat dissipation device including a primary heat dissipation component and a secondary heat dissipation component was designed. A negative pressure zone is formed by a cooling fan and a centrifugal fan to achieve multi-stage heat dissipation of the main control module, and the heat is effectively discharged in conjunction with the air box component.
It improves the heat dissipation efficiency of the main control board, extends its service life, reduces the risk of failure, and lowers costs.
Smart Images

Figure CN223596001U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to life electric appliance technical field, concretely relates to a heat abstractor for integrated cooker. BACKGROUND
[0002] It is known that in the field of life electric appliances, gas stove integrated cooker is a common life electric appliance device in kitchen appliances, and the gas stove is also one of the important and high-use kitchen appliances in the public life. With the increasing updating of kitchen appliance equipment, the requirements for the durability and functionality of the electric appliances are also increasing. Specifically, for example, the heat generated by the electronic components on the main control board of the integrated cooker needs to be dissipated in time. If the heat dissipation effect is not good, it will affect the overall service life of the main control board. Therefore, a heat dissipation device for integrated cooker is needed, which has good passive heat dissipation efficiency, can actively reduce the temperature rise of the electronic components of the main control board during work, and improves the overall service life of the main control board. SUMMARY
[0003] Therefore, it is necessary to provide a heat dissipation device for integrated cooker with high passive heat dissipation efficiency and improved overall service life of the main control board.
[0004] The utility model provides a heat abstractor for integrated cooker, including installation frame body and install the embedded installation body and gas stove body on installation frame body, the gas stove body is installed on the upper portion of embedded installation body, be equipped with main control module, main control heat abstractor subassembly and wind box subassembly on installation frame body, the wind box subassembly is installed on installation frame body through connecting plate piece, main control module sets up and is connected to main control heat abstractal component, main control heat abstractor subassembly is connected to wind box subassembly through installation component, main control heat abstractor subassembly includes first class heat abstractor subassembly and second class heat abstractor subassembly, first class heat abstractor subassembly, main control module and second class heat abstractor subassembly form interval connection, first class heat abstractor subassembly is used to carry out first cooling to main control module, and second class heat abstractor subassembly is used to carry out secondary cooling to main control module.
[0005] Preferably, the main control module includes a main control bottom plate and a main control board, the main control board is fixed to the main control bottom plate, the first class heat abstractor subassembly includes a main control board cover and a heat dissipation fan, the main control board cover is connected with the main control board, the main control board cover forms a containing space, and the main control components on the main control board are contained in the containing space.
[0006] Preferably, the main control board is provided with a heat dissipation hole, and the heat dissipation fan is connected to the heat dissipation hole, and the heat dissipation fan is used to extract the heat generated by the main control board from the heat dissipation hole.
[0007] Preferably, the air inlet of the heat dissipation fan is communicated with the heat dissipation hole, the heat dissipation fan is a spiral heat dissipation fan, and the air outlet of the heat dissipation fan faces the inside of the installation rack body.
[0008] Preferably, the main control bottom plate is provided with a sliding connection end, the sliding connection end has upper and lower two sides, and a guide chamfer is arranged on the sliding connection end, and the guide chamfer is used for sliding connection to the installation assembly.
[0009] Preferably, the air bellow assembly comprises a centrifugal fan, an air bellow side plate and an air bellow front plate, the centrifugal fan is installed on the main wall plate surface of the installation rack body through a connecting plate, and the air bellow side plate and the air bellow front plate are connected and gap-connected on the outer surface of the centrifugal fan.
[0010] Preferably, the air bellow front plate is provided with a louver hole, the louver hole is communicated with the air outlet direction of the centrifugal fan, and the louver hole is used to exhaust the heat in the installation rack body to the outside of the installation rack body through the centrifugal fan.
[0011] Preferably, the secondary heat dissipation assembly comprises a heat dissipation plate, one side of the heat dissipation plate is connected to the back of the main control bottom plate, and the other side of the heat dissipation plate is attached to the air bellow side plate, the heat dissipation plate is used to conduct heat generated by the main control plate, and then the heat on the heat dissipation plate is transmitted to the air bellow side plate.
[0012] Preferably, the installation assembly comprises a connecting support, the connecting support is provided with a connecting piece end, a sliding connection piece and a connecting stop piece end, and the connecting piece end, the sliding connection piece and the connecting stop piece end are integrally formed and arranged in a Z-shaped sequence.
[0013] Preferably, after the connecting piece end is connected to the air bellow side plate, a sliding connection space is formed between the sliding connection piece and the surface of the air bellow side plate, the connecting support is provided with a first connecting support and a second connecting support, the first connecting support and the second connecting are arranged in an up-down orientation, and a sliding connection space for sliding connection of the two sides of the main control bottom plate is formed between the first connecting support and the second connecting support.
[0014] The utility model discloses a heat dissipation device for integrated cooker, install the main control heat dissipation subassembly on the installation frame body, and the main control heat dissipation subassembly is connected on the wind box subassembly through the installation component, and the main control heat dissipation subassembly includes primary heat dissipation component and secondary heat dissipation component, and the primary heat dissipation component is used to carry out the primary cooling to the main control module, and the secondary heat dissipation component is used to carry out the secondary cooling to the main control module, the heat dissipation device whole passive heat dissipation effect is good can actively reduce the temperature rise of electronic component in the main control board work, improves the main control board whole service life, further reaches the effect of prolonging the service life of main control board and reducing the cost of main control board. BRIEF DESCRIPTION OF DRAWINGS
[0015] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which preferred embodiments of the present application are shown. Like reference numerals refer to like elements throughout the drawings and the accompanying written specification. The drawings should not be understood to be drawn to scale only the principle of the present application is shown in the drawings.
[0016] Figure 1 It is a preferred embodiment schematic view of the heat dissipation device for integrated cooker of the utility model;
[0017] Figure 2 It is a plane schematic view of the heat dissipation device for integrated cooker of the utility model;
[0018] Figure 3 It is a plane schematic view of the main control heat dissipation subassembly in the heat dissipation device for integrated cooker of the utility model;
[0019] Figure 4 It is the schematic view of the installation frame body in the heat dissipation device for integrated cooker of the utility model.
[0020] In the drawing: 1, installation frame body;2, main control module;21, main control ware bottom plate;210, direction inverted angle;211, end piece;22, main control board;23, main control ware board cover;230, heat dissipation hole;24, heat dissipation fan;25, heat dissipation plate;3, wind box subassembly;31, centrifugal fan;32, wind box side plate;33, wind box front plate;34, louver hole;4, connecting support;41, connecting piece end;42, sliding connecting piece;43, connecting stop sheet end. DETAILED DESCRIPTION
[0021] The utility model discloses a heat dissipation device for integrated cooker, install the main control heat dissipation subassembly on the installation frame body, and the main control heat dissipation subassembly is connected on the wind box subassembly through the installation component, and the main control heat dissipation subassembly includes primary heat dissipation component and secondary heat dissipation component, and the primary heat dissipation component is used to carry out the primary cooling to the main control module, and the secondary heat dissipation component is used to carry out the secondary cooling to the main control module, the heat dissipation device whole passive heat dissipation effect is good can actively reduce the temperature rise of electronic component in the main control board work, improves the main control board whole service life, further reaches the effect of prolonging the service life of main control board and reducing the cost of main control board.
[0022] As Figures 1-4The utility model discloses an embodiment provides a heat abstractor for integrated stove, including installation frame body 1 and install the embedded installation body and gas -cooker body on installation frame body 1, the gas -cooker body is installed on the upper portion of embedded installation body, the embedded installation body can be the cabinet body, be equipped with main control module 2, main control heat abstractor subassembly and wind box subassembly 3 on installation frame body 1, wind box subassembly 3 is installed on installation frame body 1 through connecting plate piece, main control module 2 is connected on main control heat abstractor subassembly, main control heat abstractor subassembly is connected on wind box subassembly 3 through installation subassembly, main control heat abstractor subassembly includes primary heat abstractor subassembly and secondary heat abstractor subassembly, primary heat abstractor subassembly, main control module and secondary heat abstractor subassembly form interval connection, primary heat abstractor subassembly is used to carry out primary cooling to main control module, and primary heat abstractor subassembly extracts the heat inside main control module, and is arranged to the inside of fuselage, simultaneously through the louver hole of wind box subassembly negative pressure area and is taken away and is arranged to the outside of installation frame body, realizes the first cooling, and secondary heat abstractor subassembly is used to carry out secondary cooling to main control module, and secondary heat abstractor subassembly leads to secondary heat abstractor subassembly on the power module on the heat of main control module, and secondary heat abstractor subassembly is connected with wind box subassembly, and the heat on secondary heat abstractor subassembly leads to the side plate of wind box subassembly, and through the negative pressure area of centrifugal fan of wind box subassembly work formation realizes the side plate cooling of wind box subassembly, realizes secondary cooling.
[0023] Reference Figures 1-3 In further preferred embodiments, the main control module 2 includes a main control base plate 21 and a main control board 22, the main control board 22 is fixed on the main control base plate 21, the primary heat abstractor subassembly includes a main control board cover 23 and a heat dissipation fan 24, the heat dissipation fan 24 is installed on the top of the main control board cover 23, the main control board cover 23 is connected with the main control board 22, the main control board cover 23 is formed with a containing space, the main control elements on the main control board are contained in the containing space, the main control elements on the main control board 22 are main working elements, the width, length and depth of the main control board cover are set according to the main control elements on the main control board, the containing space contains the main control elements to ensure normal operation without interference.
[0024] Reference Figures 1-3 In further preferred embodiments, the main control board cover 23 is provided with a plurality of heat dissipation holes 230, the heat dissipation holes 230 are connected with the heat dissipation fan 24, the heat dissipation fan 24 is used for extracting the heat generated by the main control board from the heat dissipation holes 230, the heat generated by the main control elements on the main control board 22 is dissipated in the containing space formed on the main control board cover 23, the heat energy is extracted from the heat dissipation holes 230 by starting the heat dissipation fan, and is discharged to the inside of the fuselage, and is taken away and discharged to the outside of the installation frame body 1 through the louver hole of the wind box subassembly negative pressure area, thereby realizing the primary cooling of the main control board.
[0025] Reference Figures 1-3In a further preferred embodiment, the air inlet of the heat dissipation fan 24 is connected to the heat dissipation hole, the heat dissipation fan 24 is a spiral heat dissipation fan, the spiral heat dissipation fan is provided with an air outlet, the air outlet of the heat dissipation fan 24 faces the inside of the mounting rack body 1, and the heat dissipation fan 24 discharges the heat in the main control panel cover 23 to the idle position in the mounting rack body 1, and then the heat is sucked away through the louver hole of the negative pressure area of the air bellow assembly and discharged out of the mounting rack body.
[0026] Reference Figures 1-3 In a preferred embodiment, the main control device bottom plate 21 is provided with a sliding connection end, the sliding connection end has upper and lower two sides, the sliding connection end is provided with a guide chamfer 210, the guide chamfer 210 is used for sliding connection to the mounting assembly, the guide chamfer 210 facilitates installation and connection of the main control device bottom plate 21 and also facilitates maintenance and replacement in the later period, and the right side of the main control device bottom plate 21 is also provided with a protruding end piece 211, so as to facilitate pushing and pulling by the hand.
[0027] Reference Figures 1-4 In a further preferred embodiment, the air bellow assembly 3 includes a centrifugal fan 31, an air bellow side plate 32 and an air bellow front plate 33, the centrifugal fan 31 is installed on the main wall plate surface of the mounting rack body 1 through a connecting plate piece, the air bellow side plate 32 and the air bellow front plate 33 are connected and then gap-connected to the outer surface of the centrifugal fan 31, and the air bellow side plate 32 and the air bellow front plate 33 are arranged to form a negative pressure area inside the centrifugal fan 31 of the air bellow assembly and cool the side plate.
[0028] Reference Figures 1-3 In a preferred embodiment, the air bellow front plate 33 is provided with a louver hole 34, the louver hole 34 is connected to the air outlet direction of the centrifugal fan, and the louver hole 34 is used for discharging the heat in the mounting rack body out of the mounting rack body through the centrifugal fan, and the heat in the negative pressure area of the centrifugal fan of the air bellow assembly is discharged through the louver hole under the centrifugal fan.
[0029] Reference Figures 1-3 In a preferred embodiment, the secondary heat dissipation assembly includes a heat dissipation plate 25, one side of the heat dissipation plate 25 is connected to the back of the main control device bottom plate 21, and the other side of the heat dissipation plate 25 is attached to the air bellow side plate 32, the heat dissipation plate 25 is used for conducting heat generated on the main control panel 22, and then the heat on the heat dissipation plate 25 is transferred to the air bellow side plate 32, in the working of the product, the heat generated by the main control components on the main control panel 22 is conducted to the heat dissipation plate through the power module, the heat of the heat dissipation plate 25 is transferred to the air bellow side plate 32, and then the heat is sucked away through the louver hole of the negative pressure area of the centrifugal fan 31 of the air bellow assembly and discharged out of the mounting rack body.
[0030] Reference Figures 1-3In the preferred embodiment, the mounting assembly comprises a connecting bracket 4, which is provided with a connecting piece end 41, a sliding connecting piece 42 and a connecting stop piece end 43, and the connecting piece end, the sliding connecting piece and the connecting stop piece end are integrally connected in Z-shaped sequence, the Z-shaped connecting bracket is arranged to slideably connect the main control board 21, facilitating installation and disassembly, and the Z-shaped connecting bracket is stable in structure, ensuring the stability of the connecting structure and preventing loosening or displacement during carrying or moving.
[0031] Reference Figures 1-4 In the further preferred embodiment, after the connecting piece end is connected to the side plate 32 of the air bellow, the sliding connecting piece 42 and the surface of the side plate 32 of the air bellow form a sliding connecting space, the connecting bracket is provided with a first connecting bracket and a second connecting bracket, the first connecting bracket and the second connecting bracket are arranged in upper and lower positions, the first connecting bracket and the second connecting bracket form a sliding connecting space for slidingly connecting the two sides of the main control board, and the size of the sliding connecting space formed between the first connecting bracket and the second connecting bracket can be adjusted according to the specific model of the main control board, facilitating installation of the main control module.
[0032] The integrated cooker heat dissipation device has the advantages that: the heat dissipation device as a whole has good passive heat dissipation effect, can actively reduce the temperature rise of electronic components during operation of the main control board, improves the overall service life of the main control board, further prolongs the service life of the main control board and reduces the cost of the main control board.
[0033] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process conversion according to the content of the utility model specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the utility model.
Claims
1. A heat dissipation device for integrated stove, comprising a mounting rack body, an embedded mounting body and a gas stove body mounted on the mounting rack body, the gas stove body is mounted on the upper part of the embedded mounting body, the mounting rack body is provided with a main control module, a main control heat dissipation assembly and a wind box assembly, characterized in that: The wind box assembly is installed on the installation rack body through a connecting plate, the main control module is connected to a main control heat dissipation assembly, the main control heat dissipation assembly is connected to the wind box assembly through an installation assembly, the main control heat dissipation assembly comprises a first-stage heat dissipation assembly and a second-stage heat dissipation assembly, the first-stage heat dissipation assembly, the main control module and the second-stage heat dissipation assembly are connected in a spaced manner, the first-stage heat dissipation assembly is used for primary cooling of the main control module, and the second-stage heat dissipation assembly is used for secondary cooling of the main control module.
2. The heat dissipating device for an integrated kitchen as claimed in claim 1, wherein, The main control module comprises a main control bottom plate and a main control board, the main control board is fixed to the main control bottom plate, the first-stage heat dissipation assembly comprises a main control board cover and a heat dissipation fan, the main control board cover is connected to the main control board, and the main control board cover forms a containing space.
3. The heat dissipating device for an integrated kitchen of claim 2, wherein, A heat dissipation hole is formed in the main control board cover, the heat dissipation hole is connected to the heat dissipation fan, and the heat dissipation fan is used for extracting heat generated by the main control board from the heat dissipation hole.
4. The heat dissipating device for an integrated kitchen of claim 3, wherein, An air inlet of the heat dissipation fan is in communication with the heat dissipation hole, the heat dissipation fan is a snail-shaped heat dissipation fan, and an air outlet of the heat dissipation fan faces the installation rack body.
5. The heat dissipating device for an integrated kitchen of claim 2, wherein, The main control bottom plate is provided with a sliding connection end, the sliding connection end has upper and lower side edges, and a guide chamfer is arranged on the sliding connection end, the guide chamfer is used for sliding connection to the installation assembly.
6. The heat dissipating device for an integrated kitchen of claim 1, wherein, The wind box assembly comprises a centrifugal fan, a wind box side plate and a wind box front plate, the centrifugal fan is installed on a main wall plate surface of the installation rack body through a connecting plate, and the wind box side plate and the wind box front plate are connected and gap-connected to the outer surface of the centrifugal fan.
7. The heat dissipating device for an integrated kitchen as claimed in claim 6, wherein Louver holes are formed in the wind box front plate, the louver holes are in communication with the air outlet direction of the centrifugal fan, and the louver holes are used for discharging heat in the installation rack body to the outside of the installation rack body through the centrifugal fan. 8.The heat dissipation device for the integrated cooker of claim 6, The second-stage heat dissipation assembly comprises a heat dissipation plate, one side of the heat dissipation plate is connected to the back of the main control bottom plate, and the other side of the heat dissipation plate is attached to the wind box side plate, the heat dissipation plate is used for heat conduction of heat generated by the main control board, and then the heat on the heat dissipation plate is transmitted to the wind box side plate. 9.The heat dissipation device for the integrated cooker according to claim 1, wherein, The installation assembly comprises a connecting support, the connecting support is provided with a connecting piece end, a sliding connection piece and a connecting stop piece end, and the connecting piece end, the sliding connection piece and the connecting stop piece end are integrally formed and arranged in a Z-shaped sequence.
10. The heat dissipating device for an integrated kitchen of claim 9, wherein, After the connecting piece end is connected to the wind box side plate, a sliding connection space is formed between the sliding connection piece and the surface of the wind box side plate, the connecting support is provided with a first connecting support and a second connecting support, the first connecting support and the second connecting support are arranged in an up-down orientation, and the first connecting support and the second connecting support form a sliding connection space for sliding connection of the two sides of the main control bottom plate.