Developing and spraying structure of packaging substrate

By alternating the arrangement of nozzles and spray nozzles in the developing spray structure of the packaging substrate, the uniform developing of the upper and lower halves of the packaging substrate is achieved by utilizing the water flow effect, thus solving the problem of uneven vertical developing and improving the developing quality.

CN223598108UActive Publication Date: 2025-11-25XIAMEN ANJIELI MEIWEI TECH CO LTD +1
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202423089478.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-11-25
Estimated Expiration
2034-12-13

AI Technical Summary

Technical Problem

In the prior art, the packaging substrate has the problem of uneven development between the upper and lower parts during the vertical development process, which leads to defects such as short circuits and protrusions. Existing methods for adjusting the pressure difference between the upper and lower parts during vertical development cannot effectively improve the development uniformity.

Method used

Design a development spray structure for a packaging substrate, in which spray pipes and nozzles are arranged alternately in a specific number and pattern. The water flow effect is used to develop the lower half of the substrate first, and then the substrate is uniformly developed by subsequent spraying, ensuring that the upper and lower halves react in a consistent manner.

Benefits of technology

It improves the uniformity difference of the upper and lower development of the packaging substrate during the vertical development process, avoids the problem of line non-uniformity, and improves the development quality.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223598108U_ABST
    Figure CN223598108U_ABST
Patent Text Reader

Abstract

The utility model discloses a developing spraying structure of a packaging substrate, which is arranged at a developing processing section of vertical developing equipment and comprises a plurality of first spraying pipes and a plurality of second spraying pipes which are arranged in parallel along the vertical direction, and the first spraying pipes and the second spraying pipes are respectively provided with a plurality of nozzles. The plurality of first spray pipes and the plurality of second spray pipes are alternately arranged from top to bottom, the number of the plurality of first spray pipes is the same as that of the plurality of second spray pipes, and the surface of the packaging substrate is divided into an upper half part and a lower half part by a horizontal center line; the number of the nozzles, corresponding to the upper half part, of the first spray pipes and the number of the nozzles, corresponding to the second spray pipes, of the second spray pipes are larger than the number of the nozzles, corresponding to the lower half part, of the first spray pipes and the number of the nozzles, corresponding to the second spray pipes, of the second spray pipes. The developing and spraying structure can solve the problem that in the prior art, the packaging substrate is not uniform in the vertical developing process.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially relates to a developing spray structure of packaging substrate. BACKGROUND

[0002] In recent years, the vigorous development of AI, 5G and big data technologies has led to a sharp increase in demand for high-performance CPUs (central processing units), GPUs (graphics processing units), FPGAs (field programmable gate arrays) and ASICs (application-specific integrated circuits) for network routers / converters, and the production capacity of large-size FCBGA (flip chip ball grid array packaging format) packaging substrates is in short supply. In the packaging substrate, for the build-up layer, high circuit density and small line width and spacing are major challenges for the SAP process (semi-additive process). For the vertical developing line, due to the existence of water flow effect, when the developing point of the upper half of the board surface (the part facing up during developing) reaches 50%, the developing point of the lower half of the board surface is often at 25%; that is, under the condition that the developing point of the upper half of the board surface is normally developed within 40%-60%, the lower half of the board surface is often overdeveloped, resulting in circuit short circuit, protrusion and other defects.

[0003] In related technologies, the problem of improving developing uniformity is solved by adjusting the pressure difference between the upper and lower vertical developing, but it is still not possible to adjust the upper and lower developing points to a basically consistent state, and if the developing pressure difference between the upper and lower is too large, the line width uniformity will be affected, and the problem of uneven developing cannot be fundamentally improved. Therefore, there is an urgent need for a spray structure that can improve the developing difference between the upper and lower in the vertical developing process. SUMMARY

[0004] The utility model aims at at least one of the above-mentioned technical problems in the technical field. To this end, the utility model provides a developing spray structure of packaging substrate to solve the problem of unevenness between the upper and lower in the vertical developing of the packaging substrate in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model provides a developing spray structure of packaging substrate, which is arranged in the developing processing section of the vertical developing equipment, and comprises: a plurality of first spray pipes and a plurality of second spray pipes arranged in parallel in the vertical direction, the first spray pipe and the second spray pipe each have a plurality of nozzles, the plurality of first spray pipes and the plurality of second spray pipes are arranged alternately from top to bottom, the number of the plurality of first spray pipes is the same as that of the plurality of second spray pipes, the board surface of the packaging substrate is divided into an upper half and a lower half with a horizontal center line, the number of the nozzles of the plurality of first spray pipes and the plurality of second spray pipes corresponding to the upper half is greater than that of the nozzles of the plurality of first spray pipes and the plurality of second spray pipes corresponding to the lower half.

[0006] According to the developing and spraying structure of the packaging substrate, the number of the nozzles arranged on the lower half of the board surface of the corresponding substrate is less than the number of the nozzles arranged on the upper half of the board surface of the corresponding substrate, so that the developing liquid can be developed first by flowing from top to bottom, and then developed by the subsequent spraying, so that the developing treatment section can ensure that the reaction between the upper half and the lower half of the dry film of the packaging substrate and the developing liquid is basically consistent when the dry film is vertically developed.

[0007] In addition, the developing and spraying structure of the packaging substrate according to the above-mentioned utility model can have the following additional technical features:

[0008] Optionally, the first spray pipe has three, the second spray pipe has three, and the number of the nozzles of the developing and spraying structure is arranged from top to bottom in the mode of 7, 6, 7, 3, 3, 3.

[0009] Optionally, the extension direction of the first spray pipe and the extension direction of the second spray pipe are both inclined by an angle of 15° with respect to the horizontal direction.

[0010] Optionally, the nozzles on the first spray pipe and the nozzles on the second spray pipe are arranged alternately along the extension direction of the spray pipe.

[0011] Optionally, the developing pressure of each first spray pipe is the same as the developing pressure of each second spray pipe.

[0012] Further, the developing pressure is 1.0 kfg / cm 2 .

[0013] Optionally, the distance between adjacent first spray pipes and second spray pipes is equal; the distance between adjacent nozzles on each first spray pipe and each second spray pipe is equal.

[0014] Optionally, it further comprises a spraying frame, and a plurality of first spray pipes and a plurality of second spray pipes are arranged on the spraying frame in parallel along the vertical direction. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a front view structural schematic diagram of the developing and spraying structure of the utility model embodiment;

[0016] Figure 2 It is a front view structural schematic diagram of the developing and spraying structure of the prior art. DETAILED DESCRIPTION

[0017] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and should not be understood as limiting the present application.

[0018] In order to better understand the above technical solutions, the exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to convey the scope of the present application to those skilled in the art.

[0019] The present application provides a developing and spraying structure of a packaging substrate, which is arranged in a developing treatment section of a vertical developing device; wherein the vertical developing device is an existing device, which is not described in detail herein; the present application relates to a developing and spraying structure in the vertical developing device, which is connected with a developing liquid supply device in the vertical developing device, so as to spray developing liquid to the surface of the packaging substrate when the packaging substrate is developed, and then develop the dry film on the packaging substrate.

[0020] The developing and spraying structure comprises: a plurality of first spray pipes 100 and a plurality of second spray pipes 200 arranged in parallel in the vertical direction, the first spray pipe 100 and the second spray pipe 200 each have a plurality of nozzles 110, 210, the plurality of first spray pipes 100 and the plurality of second spray pipes 200 are arranged alternately from top to bottom, the number of the plurality of first spray pipes 100 is the same as the number of the plurality of second spray pipes 200, the surface of the packaging substrate is divided into an upper half and a lower half by a horizontal center line, the number of the nozzles 110 of the plurality of first spray pipes 100 and the nozzles 210 of the plurality of second spray pipes 200 corresponding to the upper half is greater than the number of the nozzles 110 of the plurality of first spray pipes 100 and the nozzles 210 of the plurality of second spray pipes 200 corresponding to the lower half.

[0021] That is, compared with the related art such as Figure 2The nozzle quantity arrangement of the development spray structure is divided according to the horizontal center line of the board surface of the packaging substrate, the number of the nozzles 110 of the plurality of first spray pipes 100 and the nozzles 210 of the plurality of second spray pipes 200 corresponding to the upper half of the board surface is greater than the number of the nozzles 110 of the plurality of first spray pipes 100 and the nozzles 210 of the plurality of second spray pipes 200 corresponding to the lower half of the board surface. Thus, relying on the water flow effect, when the substrate just enters the development processing section, the lower half of the board surface is developed first by the development liquid flowing from top to bottom, and then developed by the subsequent spray, so that the development processing section can ensure that the reaction between the upper half and the lower half of the packaging substrate and the development liquid is basically consistent when the dry film is vertically developed; and the problem of unevenness of the packaging substrate when vertically developed is further solved.

[0022] In specific embodiments, please refer to Figure 1 , the embodiment adopts the development spray structure shown in the development processing section Figure 1 , which comprises three first spray pipes 100 and three second spray pipes 200 arranged in parallel along the vertical direction, and the three first spray pipes 100 and the three second spray pipes 200 are arranged on a spray frame 300; the first spray pipe 100 in the upper half has 7 nozzles 110, the second spray pipe 200 has 6 nozzles 210, and the first spray pipe 100 and the second spray pipe 200 in the lower half each have 3 nozzles 110, 210. The nozzle quantity of the development spray structure formed in this way is arranged from top to bottom in the form of 7, 6, 7, 3, 3, 3.

[0023] More specifically, the extension direction of the first spray pipe 100 and the extension direction of the second spray pipe 200 are both inclined at an angle of 15° with respect to the horizontal direction. Among them, as shown in Figure 1 , the inclination direction of the first spray pipe 100 and the second spray pipe 200 is inclined downward from left to right. Generally, in this vertical development equipment, the substrate is vertically conveyed from left to right, and the inclination direction of the first spray pipe 100 and the second spray pipe 200 corresponds to the conveying direction of the substrate.

[0024] More specifically, the nozzles on the first spray pipe 100 and the nozzles on the second spray pipe 200 are arranged alternately along the extension direction of the spray pipe. Among them, as shown in Figure 1 , the nozzles of the second spray pipe 200 are located between two adjacent nozzles of the adjacent first spray pipe 100.

[0025] Further, the distance between the adjacent first spray pipe 100 and the second spray pipe 200 is equal; the distance between the adjacent two nozzles on each first spray pipe 100 and each second spray pipe 200 is equal.

[0026] In addition, in the present embodiment, the pressure of each of the spray pipes is 1.0 kfg / cm2. The substrate is moved at a speed of 2.5 m / min relative to the developing treatment section, the flow rate of the developer is 70 L / min, the concentration of the developer is 1%, and the temperature of the developer is 30°C.

[0027] Therefore, the developing spray structure of the present embodiment can better improve the problem of poor uniformity difference between the upper and lower developing of the vertical developing apparatus.

[0028] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0029] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0030] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can include the first and second features directly contacting, or the first and second features not directly contacting but contacting through another feature between them. Moreover, the first feature "on", "above" and "on top of" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "under", "below" and "underneath" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.

[0032] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present application.

[0033] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A developing spray structure for a packaging substrate, disposed in the developing section of a vertical developing apparatus, characterized in that, include: Multiple first nozzles and multiple second nozzles are arranged in parallel along a vertical direction. Each first nozzle and each second nozzle has multiple nozzles. The multiple first nozzles and multiple second nozzles are arranged alternately from top to bottom, and the number of multiple first nozzles is the same as the number of multiple second nozzles. The surface of the packaging substrate is divided into an upper half and a lower half along a horizontal center line. The number of nozzles of the multiple first nozzles and multiple second nozzles corresponding to the upper half is greater than the number of nozzles of the multiple first nozzles and multiple second nozzles corresponding to the lower half.

2. The developing spray structure of the packaging substrate as described in claim 1, characterized in that, The first nozzle has three parts, the second nozzle has three parts, and the number of nozzles in the developing spray structure is arranged in a 7, 6, 7, 3, 3, 3 pattern from top to bottom.

3. The developing spray structure of the packaging substrate as described in claim 1, characterized in that, The extension directions of the first nozzle and the second nozzle are both inclined at an angle of 15° relative to the horizontal direction.

4. The developing spray structure of the packaging substrate as described in claim 1, characterized in that, The nozzles on the first nozzle and the nozzles on the second nozzle are staggered along the extension direction of the nozzles.

5. The developing spray structure of the packaging substrate as described in claim 1, characterized in that, The developing pressure of each of the first nozzles is the same as the developing pressure of each of the second nozzles.

6. The developing spray structure of the packaging substrate as described in claim 5, characterized in that, The developing pressure is 1.0 kfg / cm. 2 .

7. The developing spray structure of the packaging substrate as described in claim 1, characterized in that, The distance between adjacent first and second nozzles is equal; the distance between two adjacent nozzles on each first nozzle and each second nozzle is equal.

8. The developing spray structure of the packaging substrate as described in claim 1, characterized in that, It also includes a spray frame, on which multiple first spray pipes and multiple second spray pipes are arranged in parallel in a vertical direction.