High-capacity high-power film capacitor

By setting a support base at the bottom of the film capacitor body and installing a positioning assembly, heat dissipation control and reinforcement support mechanism on the side, the problems of low heat dissipation efficiency and wear of film capacitors are solved, and efficient heat dissipation and stable placement are achieved.

CN223598549UActive Publication Date: 2025-11-25SUCCESS ELECTRONICS HUIZHOU
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Patent Information

Application Number
CN202423056729.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-11-25
Estimated Expiration
2034-12-11

AI Technical Summary

Technical Problem

Existing film capacitors have low heat dissipation efficiency and lack a protective structure at the bottom, leading to wear and difficulty in placing them flat.

Method used

A support base is provided at the bottom of the film capacitor body, and a positioning assembly mechanism, a heat dissipation control mechanism, and a reinforcement support mechanism are installed on the side, including a thermally conductive liner, an auxiliary mounting plate, heat dissipation fins, and a friction pad to enhance heat dissipation and stability.

Benefits of technology

It improves heat dissipation efficiency, enhances the stability and protection of the device, ensures flat placement, and features a detachable design for easy maintenance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of capacitors, in particular to a high-capacity high-power thin film capacitor, which comprises a thin film capacitor body and a support base, a heat dissipation control mechanism is arranged on the side edge of the thin film capacitor body, and a reinforcing support mechanism is arranged below the thin film capacitor body. When the high-capacity and high-power film capacitor is used, the lining plate made of a temperature conducting material and the auxiliary mounting plate are arranged on the side edge of the device, and the heat dissipation fins are arranged on the side edge of the auxiliary mounting plate at equal intervals, so that the heat generated in the device can be timely transmitted to the heat dissipation fins through the shell when the device is used; and the overall heat dissipation rate of the device is increased in the mode that the overall heat dissipation area of the device is increased through the heat dissipation fins, the heat dissipation fins are further arranged to be detachable through the mechanism assembly, follow-up cleaning and maintaining work of the heat dissipation fins is facilitated, the overall structural design is ingenious, and the practical effect is good.
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Description

TECHNICAL FIELD

[0001] The utility model relates to capacitor technical field, especially high capacity big power film capacitor. BACKGROUND

[0002] Film capacitor is a kind of capacitor, its dielectric material is made of film, compared with traditional electrolytic capacitor and ceramic capacitor, film capacitor has many advantages, such as higher stability, lower leakage current, high insulation resistance, wide operating temperature range and good frequency characteristic etc.;

[0003] Patent number "CN213211967U" disclosed "high voltage high frequency big power film capacitor", the device increases the fixing strength of pin in capacitor, while not affecting the normal use of capacitor;Because the existing film capacitor is static heat dissipation, the heat dissipation efficiency is low, at the same time, with the back and forth handling of film capacitor, its bottom end is not provided with relevant protection structure, it is easy to cause abrasion to film capacitor bottom end shell and lead to subsequent not easy to place flat, but the above-mentioned device does not improve this problem, and the overall practical effect is not good. UTILITY MODEL CONTENTS

[0004] The utility model discloses a high capacity big power film capacitor that is proposed to solve the above problems, which improves the problem that the existing film capacitor is static heat dissipation, the heat dissipation efficiency is low, and the bottom end of the film capacitor is not provided with a related protection structure during back and forth handling, which is easy to cause abrasion to the bottom end shell of the film capacitor and lead to subsequent not easy to place flat.

[0005] The high capacity big power film capacitor includes a film capacitor body and a supporting base, the bottom outer wall of the film capacitor body is provided with the supporting base, the side of the supporting base is provided with a positioning assembly mechanism, the side of the film capacitor body is provided with a heat dissipation control mechanism, and the lower portion of the film capacitor body is provided with a reinforcing support mechanism.

[0006] The positioning assembly mechanism includes mounting strips, mounting grooves and positioning bolts, two groups of mounting strips are symmetrically arranged on the outer walls of the two sides of the supporting base, mounting grooves are symmetrically and through formed in the top outer walls of the mounting strips, and the mounting grooves are internally provided with the positioning bolts.

[0007] Preferably, the heat dissipation control mechanism includes lining plates, auxiliary mounting plates and heat dissipation fins, the two side outer walls of the film capacitor body are symmetrically provided with the lining plates, the side outer walls of the lining plates are attached with the auxiliary mounting plates, and the side outer walls away from the lining plates of the auxiliary mounting plates are installed with the heat dissipation fins at equal intervals.

[0008] Preferably, the side outer wall of the auxiliary mounting plate is symmetrically provided with two groups of first threaded grooves, the side outer wall of the lining plate is symmetrically provided with two groups of second threaded grooves in correspondence, and the first threaded groove and the second threaded groove are in threaded connection with the fastening bolt.

[0009] Preferably, the reinforcing support mechanism comprises a friction pad, and the bottom end outer wall of the support base is attached with the friction pad.

[0010] Preferably, the top end outer wall of the friction pad is symmetrically provided with a limiting T-shaped strip, and the bottom end outer wall of the support base is provided with two groups of limiting T-shaped grooves in correspondence.

[0011] Preferably, the two side outer walls of the limiting T-shaped strip are symmetrically provided with limiting clamping blocks, the side outer wall of the support base at the position of the limiting T-shaped groove is provided with a limiting clamping groove in correspondence, and the limiting clamping block and the limiting clamping groove are in clamping connection.

[0012] Preferably, the side outer wall of the limiting clamping block is provided with a first cylindrical groove in penetration, the side outer wall of the support base at the position of the limiting clamping groove is provided with a second cylindrical groove in penetration in correspondence, and the first cylindrical groove and the second cylindrical groove are in clamping connection with the pin shaft.

[0013] The high-capacity high-power thin film capacitor has the advantages that:

[0014] 1. The high-capacity high-power thin film capacitor is provided with a lining plate and an auxiliary mounting plate made of temperature-conducting material on the side of the device, and the heat dissipation fins are arranged at equal intervals on the side of the auxiliary mounting plate, so that the heat generated in the device can be transmitted to the heat dissipation fins through the shell during use, the heat dissipation area of the device is increased through the heat dissipation fins, the heat dissipation rate of the device is accelerated, the heat dissipation fins are detachably arranged through the mechanism assembly, the cleaning and maintenance of the heat dissipation fins are facilitated, the normal heat dissipation rate of the device is ensured on the basis of the cleanliness of the heat dissipation fins, the overall structure is designed ingeniously, and the practical effect is good.

[0015] 2. The high-capacity high-power thin film capacitor is provided with a friction pad at the bottom end of the device, the contact friction force between the device and the ground is increased through the friction pad, the placement stability of the device is improved, the bottom shell of the capacitor is protected through the arrangement of the friction pad, the friction pad is detachably arranged through the mechanism assembly, the friction pad can be replaced when it is worn out after long-term use, the overall structure is designed simply, and the practical effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0017] Figure 2 This is a three-dimensional structural diagram of the positioning and assembly mechanism of this utility model;

[0018] Figure 3 This is a three-dimensional structural diagram of the heat dissipation control mechanism of this utility model;

[0019] Figure 4 For the present utility model Figure 3 Enlarged 3D structural diagram at point A;

[0020] Figure 5 This is a three-dimensional structural diagram of the reinforcement and support mechanism of this utility model;

[0021] Figure 6 For the present utility model Figure 5 Enlarged 3D structural diagram at point B.

[0022] In the diagram: 1. Film capacitor body; 2. Support base; 3. Positioning assembly mechanism; 31. Mounting strip; 32. Mounting groove; 33. Positioning bolt; 4. Heat dissipation control mechanism; 41. Liner plate; 42. Auxiliary mounting plate; 43. Heat dissipation fins; 44. First threaded groove; 45. Second threaded groove; 46. Fastening bolt; 5. Reinforcing support mechanism; 51. Friction pad; 52. Limiting T-shaped strip; 53. Limiting T-shaped groove; 54. Limiting block; 55. Limiting groove; 56. First cylindrical groove; 57. Second cylindrical groove; 58. Pin. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] In practical implementation: such as Figures 1-6 As shown, a high-capacity, high-power film capacitor includes a film capacitor body 1 and a support base 2: the support base 2 is provided on the bottom outer wall of the film capacitor body 1, the positioning and assembly mechanism 3 is provided on the side of the support base 2, the heat dissipation control mechanism 4 is provided on the side of the film capacitor body 1, and the reinforcing support mechanism 5 is provided below the film capacitor body 1.

[0025] The positioning assembly mechanism 3 comprises mounting strips 31, mounting grooves 32 and positioning bolts 33, two groups of mounting strips 31 are symmetrically arranged on the two side walls of the support base 2, mounting grooves 32 are symmetrically and throughly formed on the top end of the outer wall of the mounting strip 31, and the positioning bolts 33 are mounted in the mounting grooves 32;

[0026] When it is needed to install the film capacitor body 1 to a specified position, at this time, only the positioning bolts 33 are needed to be passed through the mounting grooves 32 from top to bottom and screwed into the mounting plate inside the corresponding position after the film capacitor body 1 is placed, and the installation is completed.

[0027] The heat dissipation control mechanism 4 comprises backing plates 41, auxiliary mounting plates 42 and heat dissipation fins 43, the two side walls of the film capacitor body 1 are symmetrically provided with the backing plates 41, the side edges of the backing plates 41 are attached with the auxiliary mounting plates 42, the side edges of the auxiliary mounting plates 42 away from the backing plates 41 are arranged with the heat dissipation fins 43 at equal intervals, the side edges of the auxiliary mounting plates 42 are symmetrically and throughly formed with two groups of first threaded grooves 44, the side edges of the backing plates 41 are correspondingly and symmetrically formed with two groups of second threaded grooves 45, and the first threaded grooves 44 and the second threaded grooves 45 are in threaded connection with the fastening bolts 46;

[0028] It is noted that the backing plates 41 and the auxiliary mounting plates 42 are both made of temperature-conducting plates, so that when the film capacitor body 1 works and generates heat, the backing plates 41 can timely transfer the heat of the shell of the film capacitor body 1 to the auxiliary mounting plates 42, and then to the heat dissipation fins 43 through the auxiliary mounting plates 42, and the heat dissipation fins 43 are arranged to increase the overall heat dissipation area of the device to enhance the overall heat dissipation rate of the device; when the outer wall of the heat dissipation fins 43 has accumulated dust after long-time use and needs to be cleaned, at this time, only the fastening bolts 46 are needed to be completely screwed out from the inside of the first threaded grooves 44, so that the heat dissipation fins 43 can be directly taken off together with the auxiliary mounting plates 42 from the side of the device, and when the heat dissipation fins 43 need to be reinstalled to the side of the device after cleaning, at this time, the auxiliary mounting plates 42 are first attached to the side of the backing plates 41 after the heat dissipation fins 43 are adjusted and installed, and then the fastening bolts 46 are passed through the first threaded grooves 44 and screwed into the second threaded grooves 45 at the corresponding positions, and the installation is completed.

[0029] The reinforcing support mechanism 5 comprises a friction pad 51, the bottom end outer wall of the support base 2 is attached with the friction pad 51, the top end outer wall of the friction pad 51 is symmetrically provided with a limiting T-shaped strip 52, the bottom end outer wall of the support base 2 is correspondingly provided with two groups of limiting T-shaped grooves 53, the limiting T-shaped strip 52 and the limiting T-shaped groove 53 are in sliding connection, the two side outer walls of the limiting T-shaped strip 52 are symmetrically provided with limiting clamping blocks 54, the side outer wall of the support base 2 at the position of the limiting T-shaped groove 53 is correspondingly provided with a limiting clamping groove 55, the limiting clamping block 54 and the limiting clamping groove 55 are in clamping connection, the side outer wall of the limiting clamping block 54 is provided with a first cylindrical groove 56, the side outer wall of the support base 2 at the position of the limiting clamping groove 55 is correspondingly provided with a second cylindrical groove 57, and the first cylindrical groove 56 and the second cylindrical groove 57 are in clamping connection with the pin shaft 58.

[0030] The friction pad 51 increases the friction force between the device and the ground, thereby achieving the effect of reinforcing support. Figure 5 As shown in the drawings, the two side outer walls of the film capacitor body 1 are provided with handles, at this time, the staff needs to hold the handle and lift the film capacitor body 1 upwards, then another staff adjusts the friction pad 51 to the appropriate position and pushes the limiting T-shaped strip 52 at the top of the friction pad 51 into the limiting T-shaped groove 53 at the corresponding position, when the limiting T-shaped strip 52 moves to the bottom end of the limiting T-shaped groove 53, the limiting clamping block 54 is just clamped into the bottom end of the limiting clamping groove 55, and the positions of the first cylindrical groove 56 and the second cylindrical groove 57 are in corresponding overlapping state, then the pin shaft 58 is sequentially clamped into the bottom end of the second cylindrical groove 57 at the corresponding position through the first cylindrical groove 56, and the installation of the friction pad 51 is completed.

[0031] When the film capacitor body 1 needs to be installed at a specified position, the film capacitor body 1 is placed, and the positioning bolt 33 is sequentially clamped into the installation plate at the corresponding position through the installation groove 32 from top to bottom, and the installation is completed.

[0032] It is specified here that the backing plate 41 and the auxiliary mounting plate 42 are both set as temperature guide plate materials, so that when the thin film capacitor body 1 works and generates heat, at this time the backing plate 41 can timely transmit the heat of the thin film capacitor body 1 to the auxiliary mounting plate 42, and then transmit it to the heat dissipation fin 43 through the auxiliary mounting plate 42, and the heat dissipation fin 43 is set by increasing the overall heat dissipation area of the device to enhance the overall heat dissipation rate of the device; when the outer wall of the heat dissipation fin 43 has accumulated dust after long-term use and needs to be cleaned, at this time only need to completely unscrew the fastening bolt 46 from the inside of the first threaded groove 44, and then directly take out the heat dissipation fin 43 together with the auxiliary mounting plate 42 from the side of the device, when the heat dissipation fin 43 needs to be reinstalled to the side of the device after cleaning, at this time first need to adjust the heat dissipation fin 43 to the appropriate installation, and then paste the auxiliary mounting plate 42 to the side of the backing plate 41, and then pass the fastening bolt 46 through the first threaded groove 44 and screw it to the bottom end of the second threaded groove 45 at the corresponding position to complete the installation;

[0033] Here, the friction pad 51 is designed to increase the overall frictional force of the device with the ground, thereby achieving the effect of reinforcing support.

[0034] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A high-capacitance, high-power thin-film capacitor, characterized by, The application relates to a thin-film capacitor body (1) and a supporting base (2), wherein the bottom end outer wall of the thin-film capacitor body (1) is provided with the supporting base (2), the side edge of the supporting base (2) is provided with a positioning assembly mechanism (3), the side edge of the thin-film capacitor body (1) is provided with a heat dissipation control mechanism (4), and the lower portion of the thin-film capacitor body (1) is provided with a reinforcing supporting mechanism (5). The positioning assembly mechanism (3) comprises mounting strips (31), mounting grooves (32) and positioning bolts (33), the two side outer walls of the supporting base (2) are symmetrically provided with two groups of mounting strips (31), the top end outer wall of the mounting strip (31) is symmetrically provided with the mounting groove (32) penetratingly formed, and the mounting groove (32) is internally provided with the positioning bolt (33).

2. The high-capacity, high-power thin film capacitor of claim 1, wherein: The heat dissipation control mechanism (4) comprises lining plates (41), auxiliary mounting plates (42) and heat dissipation fins (43), the two side outer walls of the thin-film capacitor body (1) are symmetrically provided with the lining plates (41), the side edge outer wall of the lining plate (41) is attached with the auxiliary mounting plate (42), and the side edge outer wall of the auxiliary mounting plate (42) away from the lining plate (41) is arranged with the heat dissipation fin (43) at equal intervals.

3. The high-capacity, high-power thin film capacitor of claim 2, wherein: The side edge outer wall of the auxiliary mounting plate (42) is symmetrically provided with two groups of first screw grooves (44) penetratingly formed, the side edge outer wall of the lining plate (41) is symmetrically provided with two groups of second screw grooves (45) corresponding to the first screw grooves (44), and the first screw grooves (44) and the second screw grooves (45) are in threaded connection with the fastening bolts (46).

4. The high-capacity, high-power thin film capacitor of claim 1, wherein: The reinforcing supporting mechanism (5) comprises a friction pad (51), and the bottom end outer wall of the supporting base (2) is attached with the friction pad (51).

5. The high-capacity, high-power thin film capacitor of claim 4, wherein: The top end outer wall of the friction pad (51) is symmetrically provided with limiting T-shaped strips (52), the bottom end outer wall of the supporting base (2) is provided with two groups of limiting T-shaped grooves (53) corresponding to the limiting T-shaped strips (52), and the limiting T-shaped strips (52) and the limiting T-shaped grooves (53) are in sliding connection.

6. The high-capacity, high-power thin film capacitor of claim 5, wherein: The two side outer walls of the limiting T-shaped strip (52) are symmetrically provided with limiting clamping blocks (54), the side edge outer wall of the supporting base (2) at the position of the limiting T-shaped groove (53) is provided with a limiting clamping groove (55) penetratingly formed corresponding to the limiting clamping blocks (54), and the limiting clamping blocks (54) and the limiting clamping groove (55) are in clamping connection.

7. The high-capacity, high-power thin film capacitor of claim 6, wherein: The side edge outer wall of the limiting clamping block (54) is provided with a first cylindrical groove (56) penetratingly formed, the side edge outer wall of the supporting base (2) at the position of the limiting clamping groove (55) is provided with a second cylindrical groove (57) penetratingly formed corresponding to the first cylindrical groove (56), and the first cylindrical groove (56) and the second cylindrical groove (57) are in clamping connection with the pin shaft (58).

Citation Information

Patent Citations

  • High-voltage high-frequency high-power film capacitor

    CN213211967U