Wafer plating jig

Abstract

The utility model discloses a kind of material receiving jigs for wafer chemical plating processing, including frame, two groups of material receiving units and protection structure, two groups of material receiving units are all equipped with multiple respectively as vertical arc-shaped groove body structure and along first horizontal direction interval arrangement material receiving groove, multiple material receiving grooves in two groups of material receiving units are mirror-symmetrical along second horizontal direction and set on frame, and any two material receiving grooves cooperatively formed material receiving groove group being mirror-symmetrical;Protection structure is equipped with multiple along first horizontal direction extension protection strip, multiple protection strip is interval set on frame along second horizontal direction, to resist and press limit wafer top side clamped in material receiving groove group;Frame top side is fixed with to hang on transmission device on hook.The material receiving jig can effectively avoid wafer edge to appear plating or thin plating, wafer crack piece and chemical plating uneven etc. Unfavorable phenomenon, improve wafer product yield;Again structure is simple, reasonable, integrated and functional, easy to operate implementation.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a receiving fixture for wafer electroplating. Background Technology

[0002] Wafer plating is a key step in semiconductor manufacturing, specifically referring to the deposition of metal on the surface of a wafer through a chemical reaction to form circuits or provide specific functional layers. In the wafer plating process, the wafer is typically placed in a fixture, the fixture is then placed in a rack, and the rack is repeatedly immersed in the plating solution in a plating bath for the reaction. However, existing wafer plating fixtures have the following shortcomings in use:

[0003] 1) Existing wafer electroless plating fixtures generally employ either flat or vertical slot fixtures. ① While flat slot fixtures offer the advantage of uniform metal plating thickness, their application is limited. For example, in double-sided electroless plating processes, both sides of the wafer need to react with the plating solution, making flat slot fixtures unsuitable. ② Vertical slot fixtures allow both sides of the wafer to contact the plating solution, making them suitable for double-sided electroless plating processes. However, with traditional vertical slot fixtures, the wafer edges tend to adhere to the fixture as it moves vertically with the hanger, resulting in defects such as incomplete or thin plating at the wafer edges, affecting the yield of the wafer products.

[0004] 2) Existing wafer plating fixtures lack effective protective structures for wafers. As a result, when wafers enter the plating bath without adequate protection during the plating process, they are prone to wafer cracking and uneven plating. Furthermore, the wafer edges are easily damaged by over-plating or scouring caused by the flow of the plating solution, which seriously affects the overall performance and yield of the wafers.

[0005] 3) The wafer plating fixture and the hanger are separate units. After the fixture is placed in the hanger, the two need to be connected and fixed, which is a rather cumbersome operation.

[0006] In view of the above, this utility model is hereby proposed. Summary of the Invention

[0007] To overcome the above-mentioned defects, this utility model provides a receiving fixture for wafer electroplating processing. On the one hand, it can effectively avoid defects such as incomplete plating or thin plating at the edge of the wafer, wafer cracking, and uneven electroplating, which greatly improves the yield of wafer products. On the other hand, it has a simple and reasonable structure, strong integration and functionality, and is easy to operate and implement.

[0008] The technical solution adopted by this utility model to solve its technical problem is as follows: a receiving fixture for wafer electroplating, comprising a frame, two sets of receiving units, and a protective structure. Each of the two sets of receiving units is provided with multiple vertical arc-shaped groove structures and receiving grooves spaced apart along a first horizontal direction. The multiple receiving grooves in the two sets of receiving units are mirror-symmetrically arranged on the frame along a second horizontal direction perpendicular to the first horizontal direction. Any two receiving grooves in the two sets of receiving units that are mirror-symmetrically arranged also cooperate to form a receiving groove group for receiving wafers. The protective structure is provided with multiple protective strips extending along the first horizontal direction. The multiple protective strips are spaced apart along the second horizontal direction on the frame to press and restrict the top side of the wafer that is stuck in the receiving groove group. In addition, a hook for hanging on the transmission device of the electroplating equipment is fixedly provided on the top side of the frame.

[0009] As a further improvement of this utility model, the two receiving troughs in each of the receiving trough groups can be close to or far apart;

[0010] The multiple protective strips can be adjusted in position relative to the vertical position of the frame and positioned on the top side of the frame.

[0011] As a further improvement of this utility model, the frame is provided with a frame body and two slide bars, both of which extend along the first horizontal direction and are spaced apart along the second horizontal direction and slidably disposed on the bottom of the frame body;

[0012] In the two sets of receiving units, the upper ends of the multiple receiving slots are respectively fixedly disposed on the upper part of opposite sides of the frame body along the second horizontal direction, and the lower ends of the multiple receiving slots are respectively fixedly disposed on the two slide bars.

[0013] It also includes a locking device A, which can lock the two sliders to the bottom of the frame body.

[0014] As a further improvement of this utility model, the protective structure is further provided with two vertical uprights fixedly installed on the top sides of opposite sides of the frame along the first horizontal direction, two mounting seats that can slide vertically and are sleeved on the two vertical uprights, and a locking fastener B that can lock the two mounting seats to the two vertical uprights respectively, and multiple protective strips are fixedly installed between the two mounting seats respectively.

[0015] As a further improvement of this utility model, the two mounting bases are symmetrically provided with insertion holes on opposite sides for the protective strip to be tightly inserted.

[0016] As a further improvement of this utility model, the receiving groove is made of PPS resin material, and both ends of the receiving groove in the arc length direction are open, and the groove wall is provided with a number of through holes arranged at intervals along its arc length direction.

[0017] As a further improvement of this utility model, the cross-section of the receiving groove is U-shaped, and the depth of the receiving groove is not greater than the radial width of the ineffective area of ​​the wafer.

[0018] As a further improvement of this utility model, connecting blocks are fixedly connected to both ends of the material receiving groove along the arc length direction, and the material receiving groove is locked to the frame by the combination of the connecting blocks and the locking fastener C.

[0019] In addition, the material receiving trough has a chamfered surface and / or a beveled surface on the edge of the trough wall, and a superhydrophobic layer and an antistatic layer are coated on the inner surface of the material receiving trough.

[0020] As a further improvement of this utility model, the protective strip is a round rod-shaped structure made of polytetrafluoroethylene material, and the outer diameter of the protective strip is not greater than 2mm, and the distance between two adjacent protective strips is not less than 1cm.

[0021] As a further improvement of this utility model, the frame, the hook, the vertical pole and the mounting base are all made of stainless steel, and a polytetrafluoroethylene protective layer is applied to the surface of the frame, the hook, the vertical pole and the mounting base.

[0022] The beneficial effects of this utility model are as follows: Compared with the prior art, ① by utilizing the receiving fixture described in this utility model, when the wafer is clamped in the receiving groove group, the invalid area on the wafer can be aligned with the receiving groove, that is, the invalid area on the wafer is clamped in the receiving groove group. This achieves wafer clamping and positioning while ensuring that the valid area on the wafer is completely immersed in the electroplating solution, effectively avoiding defects such as incomplete plating or thin plating at the wafer edges, and improving the yield of wafer products. ② By incorporating the protective strip that can press and restrict the top side of the wafer, this utility model can significantly improve the stability of the wafer during the electroplating process, thereby effectively avoiding defects such as wafer cracking and uneven electroplating, greatly improving the electroplating quality of the wafer. ③ The receiving fixture described in this utility model integrates the functions of traditional wafer electroplating fixtures and hangers into one unit, simplifying both the fixture structure and processing operations, facilitating production implementation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the receiving fixture for wafer plating processing described in this utility model;

[0024] Figure 2This is a partial structural diagram of the receiving unit in the receiving fixture of this utility model installed on the frame;

[0025] Figure 3 This is a schematic diagram of the material receiving groove of the present invention;

[0026] Figure 4 This is a partial structural diagram of the protective structure in the receiving fixture of this utility model installed on the frame;

[0027] Figure 5 for Figure 4 An enlarged structural diagram of part A shown in the figure.

[0028] Referring to the accompanying drawings, the following explanations are provided:

[0029] 1. Frame; 10. Frame body; 11. Sliding bar; 2. Material receiving unit; 20. Material receiving groove; 200. Through hole; 21. Connecting block; 3. Protective structure; 30. Protective strip; 31. Vertical pole; 32. Mounting base; 4. Hook. Detailed Implementation

[0030] The preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0031] Example 1:

[0032] Please see the appendix Figure 1 To be continued Figure 5 As shown, this embodiment 1 provides a receiving fixture for wafer electroplating, which includes a frame 1, two sets of receiving units 2, and a protective structure 3. Each of the two sets of receiving units 2 is provided with multiple vertical arc-shaped groove structures and receiving grooves 20 spaced apart along a first horizontal direction. The multiple receiving grooves 20 in the two sets of receiving units 2 are mirror-symmetrically arranged on the frame 1 along a second horizontal direction perpendicular to the first horizontal direction. Any two receiving grooves 20 in the two sets of receiving units 2 that are mirror-symmetrically arranged also cooperate to form a receiving groove group for receiving wafers. The protective structure 3 is provided with multiple protective strips 30 extending along the first horizontal direction. The multiple protective strips 30 are spaced apart along the second horizontal direction on the frame 1 to press and restrict the top side of the wafer that is stuck in the receiving groove group. In addition, a hook 4 is fixedly provided on the top side of the frame 1 for hanging on the transmission device (such as a transmission crane) of the electroplating equipment.

[0033] As can be seen from the above, ① it is understandable that a wafer structure has effective and ineffective areas. In this embodiment, when the wafer is clamped in the receiving groove group, the ineffective areas on the wafer can be aligned with the receiving groove 20, that is, the ineffective areas on the wafer are clamped in the receiving groove group. This not only achieves wafer clamping and positioning, but also ensures that the effective areas on the wafer are completely immersed in the electroplating solution, effectively avoiding defects such as incomplete plating or thin plating at the wafer edges, and improving the yield of wafer products. ② In this embodiment, by equipping the protective strip 30 that can press and restrict the top side of the wafer, the stability of the wafer during the electroplating process can be greatly improved, thereby effectively avoiding defects such as wafer cracking and uneven electroplating, and greatly improving the electroplating quality of the wafer. ③ The receiving fixture in this embodiment integrates the functions of traditional wafer electroplating fixtures and hangers into one, which simplifies the fixture structure and processing operation, and facilitates production implementation.

[0034] The following provides a detailed description of the specific structure of the receiving fixture described in this application.

[0035] First, regarding the receiving unit 2.

[0036] In this embodiment, preferably, the two receiving slots 20 in each receiving slot group can be close to or far apart, so that the two receiving units 2 can be adapted to wafers of various sizes, thereby expanding the applicability of the receiving unit 2 and the receiving fixture.

[0037] Furthermore, the specific implementation structure for enabling the two receiving troughs 20 in each receiving trough group to be close to or far apart is as follows: Please refer to the appendix. Figure 1 Appendix Figure 2 and attached Figure 4As shown, the frame 1 includes a frame body 10 and two slide bars 11. Both slide bars 11 extend along the first horizontal direction and are spaced apart along the second horizontal direction and slidably disposed on the bottom of the frame body 10. In the two sets of receiving units 2, the upper ends of multiple receiving grooves 20 are respectively fixedly disposed on the upper parts of opposite sides of the frame body 10 along the second horizontal direction, and the lower ends of multiple receiving grooves 20 are respectively fixedly disposed on the two slide bars 11. A locking fastener A is also provided, which can lock the two slide bars 11 to the bottom of the frame body 10. Understandably, before wafer loading, the distance between the two sliders 11 can be adjusted (i.e., adjusted to bring the two sliders 11 closer or further apart) to drive the receiving slots 20 in the multiple receiving slot groups to move synchronously closer or further apart, so that the receiving slot groups are adapted to the size specifications of the wafers. After the sliders 11 / receiving slots 20 are adjusted to the appropriate positions, the positions of the sliders 11 / receiving slots 20 are fixed using the locking fastener A; then the wafer loading operation can be performed. As can be seen from the above, the method of adjusting the distance between the two receiving slots 20 in the receiving slot group in this embodiment is very simple and easy to operate, greatly improving production efficiency.

[0038] Furthermore, in the frame 1 structure, grooves extending along the second horizontal direction are respectively provided on the bottom of the opposite sides of the frame body 10 along the first horizontal direction, and sliders are respectively fixedly provided on both ends of each slider 11 along the first horizontal direction. Each slider 11 is slidably disposed in the two grooves by means of the sliders thereon.

[0039] Furthermore, in each of the material receiving units 2, the plurality of material receiving grooves 20 are arranged at equal intervals, and the implementation structure for fixing the upper and lower ends of the material receiving grooves 20 to the frame body 10 and the slide bar 11 respectively is as follows: Please refer to the appendix. Figure 2 and attached Figure 3 As shown, each of the receiving grooves 20 has a connecting block 21 fixedly connected to both ends (i.e., its upper and lower ends) along its arc length. The upper end of the receiving groove 20 is locked to the frame body 10 by the combination of the connecting block 21 and the locking fastener C (such as a bolt). The lower end of the receiving groove 20 is locked to the slide bar 11 by the combination of the connecting block 21 and the locking fastener C (such as a bolt).

[0040] Furthermore, the locking device A can be a bolt or a locking handle, which are conventional technical means and will not be described in detail here.

[0041] In addition, this embodiment also incorporates several design optimizations into the structure of the receiving groove 20, specifically: ① The receiving groove 20 is made of PPS resin material, and both ends of the receiving groove 20 in the arc length direction are open, and the groove wall of the receiving groove 20 is provided with a plurality of through holes 200 arranged at intervals along its arc length direction (see Appendix). Figure 3 (As shown). From the above structural design optimization, it can be seen that, on the one hand, the material properties of PPS resin (polyphenylene sulfide) enable the receiving tank 20 to have good chemical stability and low friction; on the other hand, by designing both ends of the receiving tank 20 along its arc length (i.e., its upper and lower ends) as open, and by providing the through holes 200 on the tank wall of the receiving tank 20, the presence of plating solution (i.e., plating chemicals) in the receiving tank 20 can be effectively avoided; moreover, opening both ends of the receiving tank 20 along its arc length also improves the structural symmetry of the receiving tank 20, thereby facilitating its installation and use. In addition, this application also optimizes the diameter of the through holes 200 to approximately 2 mm.

[0042] ② The receiving groove 20 has a U-shaped cross-section, and the depth of the receiving groove 20 is not greater than the radial width of the ineffective region of the wafer. It is understood that by optimizing the depth of the receiving groove 20 as described above, the plating quality of the wafer can be further guaranteed.

[0043] ③ A chamfered surface and / or a beveled surface are provided on the edge of the receiving tank 20 to prevent the wafer from being bumped during the loading and unloading process, which would lead to quality abnormalities; and a superhydrophobic layer and an antistatic layer are coated on the inner surface of the receiving tank 20. The superhydrophobic layer is preferably a SiO2 / PDMS composite transparent superhydrophobic coating, which can prevent the plating solution from remaining on the surface of the receiving tank 20 and minimize the contamination of the wafer by impurities. The antistatic layer is preferably a ZC-966 environmentally friendly antistatic layer, which can prevent the wafer from being contaminated or damaged by impurities due to electrostatic adsorption during the plating process.

[0044] Next, regarding the protective structure 3.

[0045] Preferably, in this embodiment, the multiple protective strips 30 are vertically adjustable and positioned on the top side of the frame 1. Understandably, by optimizing the installation method of the protective strips 30 as described above, the position of the protective strips 30 can be well adapted to the wafer size, while also allowing the pressure applied by the protective strips 30 to the wafer to be adjusted. This enables the protective strips 30 to effectively resist pressure on the top side of the wafer, significantly improving the stability of the wafer during electroplating and ensuring the quality of the electroplating process.

[0046] Furthermore, the specific implementation structure in this embodiment that enables the protective strip 30 to be adjusted and positioned vertically relative to the frame 1 on the top side of the frame 1 is as follows: Please refer to the appendix. Figure 4 and 5 As shown, the protective structure 3 also includes two vertical posts 31 fixedly mounted on the top sides of opposite sides of the frame 1 along the first horizontal direction, two mounting seats 32 that can slide vertically and are sleeved on the two vertical posts 31, and fasteners B that can lock the two mounting seats 32 to the two vertical posts 31 respectively. Multiple protective strips 30 are fixedly mounted between the two mounting seats 32. It can be understood that after the wafer is placed in the receiving slot assembly, the protective strips 30 can be adjusted to a suitable position by moving the mounting seats 32 up and down, and then the positions of the mounting seats 32 / protective strips 30 are fixed by the fasteners B. As can be seen from the above, the method for adjusting the positions of the mounting seats 32 / protective strips 30 in this embodiment is very simple and easy to operate, greatly improving production efficiency.

[0047] Furthermore, the specific implementation structure for fixing multiple protective strips 30 between two mounting bases 32 is as follows: multiple insertion holes are provided on the opposite sides of the two mounting bases 32 at intervals along the second horizontal direction, and the multiple insertion holes on the two mounting bases 32 are also symmetrically arranged in a one-to-one correspondence, and the two ends of each protective strip 30 are respectively tightly inserted into the two symmetrical insertion holes.

[0048] Furthermore, the locking device B can also be a bolt or a locking handle.

[0049] In addition, this embodiment also optimizes the design of the protective strip 30 as follows: the protective strip 30 is a cylindrical rod-shaped structure made of polytetrafluoroethylene (PTFE), and the outer diameter of the protective strip 30 is no greater than 2 mm, with a spacing of no less than 1 cm between two adjacent protective strips 30. On the one hand, by optimizing the material selection of the protective strip 30, it can effectively resist the corrosion of chemical substances in the electroplating solution, thereby extending the service life of the protective strip 30 and avoiding contamination of the wafer surface due to corrosion of the protective strip 30; on the other hand, by optimizing the outer diameter and spacing of the protective strip 30, the protective strip 30 can effectively resist and restrict the top side of the wafer while minimizing the wafer area contacted by the protective strip 30, thereby further ensuring the electroplating quality of the wafer.

[0050] Finally, regarding other optimization designs.

[0051] Preferably, in this embodiment, the frame 1, the hook 4, the vertical pole 31, and the mounting base 32 are all made of stainless steel, and a polytetrafluoroethylene (PTFE) protective layer is applied to the surfaces of the frame 1, the hook 4, the vertical pole 31, and the mounting base 32. The PTFE protective layer can be a PTFE coating, a PTFE protective film / sleeve, or other similar structures. As described above, the PTFE protective layer effectively extends the service life of the frame 1, the hook 4, the vertical pole 31, and the mounting base 32.

[0052] Note: The suffixes "A", "B", etc. in the component names in this specification (such as lock A, lock B, etc.) are only for clarity of description and are not intended to limit the scope of this utility model patent.

[0053] In summary, the wafer plating fixture described in this utility model can effectively avoid defects such as incomplete or thin plating at the wafer edge, wafer cracking, and uneven plating, greatly improving the yield of wafer products; it also has a simple and reasonable structure, strong integration and functionality, and is easy to operate and implement.

[0054] Many specific details have been set forth in the above description to provide a full understanding of this utility model. However, the above description is only a preferred embodiment of this utility model, and this utility model can be implemented in many other ways different from those described herein. Therefore, this utility model is not limited to the specific embodiments disclosed above. Furthermore, any person skilled in the art can make many possible variations and modifications to the technical solution of this utility model using the methods and techniques disclosed above, or modify it into equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of this utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model, without departing from the content of the technical solution of this utility model, shall still fall within the protection scope of the technical solution of this utility model.

Claims

1. A receiving fixture for wafer plating, characterized in that: The utility model relates to a kind of wafer receiving device, including frame (1), two groups of material receiving units (2) and protective structure (3), two groups of the material receiving unit (2) are each equipped with multiple respectively vertical arc-shaped groove structure and along first horizontal direction interval arrangement material receiving groove (20), multiple the material receiving groove (20) in two groups of the material receiving unit (2) are mirror image symmetry and set on the frame (1) along second horizontal direction perpendicular to the first horizontal direction, and two groups of the material receiving unit (2) and mirror image symmetry are set in any two material receiving groove (20) also cooperate to be used to receive wafer material receiving groove group;The protective structure (3) is equipped with multiple respectively along the first horizontal direction extension protection strip (30), multiple the protection strip (30) is interval set on the frame (1) along the second horizontal direction, to resist pressure limit for the wafer top side clamped in the material receiving groove group; In addition, the frame (1) top side is fixedly provided with a hook (4) for hanging on the transmission device of chemical plating equipment.

2. The wafer plating processing receiving jig according to claim 1, wherein: Two material receiving groove (20) in each material receiving groove group can be close to or away from each other; Multiple protection strips (30) can be positioned on the top side of the frame (1) with adjustable vertical position relative to the frame (1).

3. The wafer plating processing receiving jig according to claim 2, wherein: The frame (1) is provided with a frame body (10) and two sliding bars (11), both of which extend along the first horizontal direction and are slidingly arranged on the bottom of the frame body (10) along the second horizontal direction. In two groups of the material receiving unit (2), the upper ends of multiple material receiving grooves (20) are respectively fixedly arranged on the upper parts of the opposite sides of the frame body (10) along the second horizontal direction, and the lower ends of multiple material receiving grooves (20) are respectively fixedly arranged on the two sliding bars (11). A locking member A is further provided, which can lock the two sliding bars (11) on the bottom of the frame body (10).

4. The wafer plating processing receiving jig according to claim 2, wherein: The protective structure (3) is further provided with two vertical upright rods (31) fixedly arranged on the top sides of the opposite sides of the frame (1) along the first horizontal direction, two mounting seats (32) which can be vertically slidably sleeved on the two vertical upright rods (31), and a locking member B which can lock the two mounting seats (32) on the two vertical upright rods (31), respectively, and multiple protection strips (30) are fixedly arranged between the two mounting seats (32).

5. The wafer plating processing receiving jig according to claim 4, wherein: Symmetrical insertion holes are provided on the opposite sides of the two mounting seats (32) for the tight fitting of the protection strips (30).

6. The material receiving jig for wafer plating process according to claim 1, wherein: The material receiving groove (20) is made of PPS resin material, both ends of the arc length direction of the material receiving groove (20) are open, and a plurality of through holes (200) are arranged on the groove wall of the material receiving groove (20) along the arc length direction.

7. The wafer plating processing handling tool according to claim 6, wherein: The cross section of the material receiving groove (20) is U-shaped, and the groove depth of the material receiving groove (20) is not greater than the radial width of the ineffective area of the wafer.

8. The material receiving jig for wafer plating process according to claim 1, wherein: Two ends of the arc length direction of the material receiving groove (20) are respectively fixedly connected with connecting blocks (21), and the material receiving groove (20) is locked and connected to the frame (1) through the connecting blocks (21) and a locking part C. In addition, a chamfer surface and / or an inclined surface are arranged on the edge of the groove wall of the material receiving groove (20), and a super-hydrophobic layer and an anti-static layer are coated on the inner surface of the material receiving groove (20).

9. The material receiving jig for wafer plating process according to claim 1, wherein: The protection strip (30) is a round rod structure made of polytetrafluoroethylene material, the outer diameter of the protection strip (30) is not greater than 2 mm, and the spacing between adjacent two protection strips (30) is not less than 1 cm.

10. The wafer plating process handling tooling of claim 4, wherein: The frame (1), the hook (4), the vertical stand (31) and the mounting seat (32) are respectively made of stainless steel material, and a polytetrafluoroethylene protective layer is arranged on the surface of the frame (1), the hook (4), the vertical stand (31) and the mounting seat (32).

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