Long-strip-shaped wafer bearing disc
By designing the body and positioning components of the elongated wafer carrier disk and adopting a two-point positioning method, the problems of high precision and wear in the existing wafer carrier disk positioning structure are solved, and the stable transportation and quality protection of elongated wafers are realized.
Patent Information
- Application Number
- CN202423093040.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing wafer carrier positioning structures require high precision and are prone to wear on long, strip-shaped wafers during transport, affecting wafer quality.
A long strip-shaped wafer carrier disk is designed, comprising a disk body and a positioning component. The disk body is provided with a loading protrusion, an outer ring, and a mating recess. The positioning component has a positioning unit, which reduces the contact area between the wafer and the positioning structure through a two-point positioning method, and provides guidance and orientation effects during transportation.
This effectively reduces the risk of warping and deformation of elongated wafers, lowers the accuracy requirements of the positioning structure, avoids the effects of wear, and ensures stable wafer transportation.
Smart Images

Figure CN223598684U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a strip-shaped wafer bearing disc, in particular to a strip-shaped wafer bearing disc for bearing and transporting strip-shaped wafers. BACKGROUND
[0002] In the wafer manufacturing process, in order to facilitate the wafer transfer and transport, and to avoid wafer damage during transport and affect the quality of finished products, for example, a strip-shaped wafer is cut and loaded into a wafer bearing disc. The wafer bearing disc has a wafer shape corresponding to the strip-shaped wafer and can provide a plurality of wafer loading slots for placing the wafer. The wafer bearing disc can be stacked to facilitate batch transportation of strip-shaped wafers.
[0003] However, the gap between the stacked wafer bearing discs cannot be accurately positioned, which may cause the strip-shaped wafer to jump out of the wafer loading slot during transportation due to vibration and other conditions, thereby affecting subsequent wafer material taking and processing. Therefore, the wafer bearing disc of the present application has a plurality of positioning structures protruding downward from the bottom of the wafer bearing disc. The size and position of the positioning structure correspond to the wafer loading slot, and can extend into the corresponding wafer loading slot when the wafer bearing discs are stacked, so that the strip-shaped wafer is not easily separated from the loading slot during transportation.
[0004] However, the size and position of the positioning structure correspond to the wafer loading slot, and can extend into the wafer loading slot when the wafer bearing discs are stacked, which not only requires high precision in size, but also may cause friction between the strip-shaped wafer and the positioning structure during transportation due to vibration and other factors, thereby affecting the quality of the strip-shaped wafer. In addition, the strip-shaped wafer is relatively fragile due to its shape, and the strip-shaped wafer is prone to warping or deformation when abutting the positioning structure. Therefore, how to effectively load and position the strip-shaped wafer while reducing the precision requirement of the positioning structure of the wafer bearing disc and avoiding the impact of the positioning structure on the strip-shaped wafer is the goal of the present application. UTILITY MODEL CONTENTS
[0005] The technical problem to be solved by the utility model is that the positioning structure of the wafer bearing disc has high precision requirement, and the positioning structure is prone to cause damage to the strip-shaped wafer during transportation.
[0006] The technical solution of the utility model is: to achieve the above purpose, the strip-shaped wafer bearing disc can be used to bear a plurality of strip-shaped wafers, and a plurality of strip-shaped wafer bearing discs can be stacked vertically. The strip-shaped wafer bearing disc comprises:
[0007] A tray body has a loading protrusion, an outer ring portion, and a mating recess. The loading protrusion has a plurality of loading long grooves formed on a top surface thereof. The plurality of loading long grooves have inner diameters that increase in size from bottom to top. The outer ring portion is formed on a bottom periphery of the loading protrusion and encloses the mating recess. The plurality of loading long grooves can respectively hold a plurality of long strip-shaped wafers. The mating recess of the tray body can be stacked with a loading protrusion of another long strip-shaped wafer holding tray.
[0008] A plurality of positioning assemblies. Each positioning assembly includes two positioning units that are protruded from the mating recess. The plurality of positioning assemblies are respectively positioned corresponding to the plurality of loading long grooves of the loading protrusion. The two positioning units of each positioning assembly can respectively extend into two end positions of a corresponding loading long groove of another long strip-shaped wafer holding tray.
[0009] The tray body has an outer side of the loading protrusion that is formed with a guide inclined surface that slopes from bottom to top and from outside to inside. An inner side of the outer ring portion is formed with a mating inclined surface corresponding to the guide inclined surface.
[0010] One corner of the tray body is formed with an orientation notch.
[0011] The mating recess of the tray body has a plurality of slots arranged in an array and opening downward. Each two adjacent slots are respectively formed with a reinforcing protruding rib.
[0012] The reinforcing protruding rib of the mating recess has a width that decreases in size from top to bottom.
[0013] The loading long groove of the long strip-shaped wafer holding tray can hold a long strip-shaped wafer. A plurality of long strip-shaped wafer holding trays can be stacked by the loading protrusion and the mating recess. The two positioning units of each positioning assembly can respectively extend into two end positions of a corresponding loading long groove of another long strip-shaped wafer holding tray. The two positioning units of each positioning assembly can be positioned by two points. The contact area between the long strip-shaped wafer and the positioning units can be reduced. The two positioning units can be positioned at opposite ends of the long strip-shaped wafer. The risk of warping deformation of the long strip-shaped wafer can be effectively avoided.
[0014] The inner diameters of the plurality of loading long grooves increase in size from bottom to top. The inclined inner wall of the loading long groove can provide an auxiliary guide effect when the long strip-shaped wafer is loaded. The long strip-shaped wafer can be surely and smoothly loaded in the loading long groove. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 A perspective view of a preferred embodiment of the long strip-shaped wafer holding tray.
[0016] Figure 2 is a perspective view of another angle of the strip-shaped wafer carrying disc of the present application.
[0017] Figure 3 is a sectional view of the strip-shaped wafer carrying disc of the present application.
[0018] Figure 4 is a plan view of the strip-shaped wafer carrying disc of the present application.
[0019] Figure 5 is a sectional view of the strip-shaped wafer carrying disc of the present application. Figure 4
[0020] Figure 6 is a sectional view of the strip-shaped wafer carrying disc of the present application. Figure 4
[0021] Figure 7 is a schematic view of the strip-shaped wafer carrying disc of the present application.
[0022] Figure 8 is a sectional view of the strip-shaped wafer carrying disc of the present application.
[0023] Figure 9 is a sectional view of the strip-shaped wafer carrying disc of the present application. Figure 8 DETAILED DESCRIPTION
[0024] The technical means adopted by the present application to achieve the predetermined purposes will be further described in the following in combination with the drawings and the preferred embodiments of the present application.
[0025] Please refer to Figures 1 to 7 , which is a preferred embodiment of the strip-shaped wafer carrying disc of the present application, which can be used to carry a plurality of strip-shaped wafers 30, and a plurality of said strip-shaped wafer carrying discs can be stacked one on top of another, said strip-shaped wafer carrying disc comprises a disc body 10 and a plurality of positioning components 20.
[0026] As shown in Figures 1 to 5 , the disc body 10 has a loading protrusion 11, an outer ring 12 and a matching recess 13, the top surface of the loading protrusion 11 is formed with a plurality of loading long grooves 111 opening upward, the inner diameter of the plurality of loading long grooves 111 gradually increases from bottom to top, the outer ring 12 is formed on the bottom periphery of the loading protrusion 11 and encloses the matching recess 13, the plurality of loading long grooves 111 can respectively carry the plurality of strip-shaped wafers 30, and the matching recess 13 of the disc body 10 can be stacked with the loading protrusion 11 of another said strip-shaped wafer carrying disc.
[0027] Among them, as shown in Figure 5 As shown, the outer side of the loading protrusion 11 of the disc body 10 is formed with a guide slope 112 which is inclined from bottom to top and from outside to inside, and the inner side of the outer ring portion 12 is formed with a matching slope 121 corresponding to the guide slope 112. Figure 1 、 Figure 4 As shown, one corner of the disc body 10 is formed with a directional notch 14.
[0028] In addition, as shown in Figure 2 、 Figure 5 The matching recess 13 of the disc body 10 has a plurality of slots 131 which are arranged in an array and have openings facing downward, and each two adjacent slots 131 are respectively formed with a reinforcing protruding rib 132. In addition, the width of the reinforcing protruding rib 132 of the matching recess 13 gradually decreases from top to bottom.
[0029] As shown in Figure 5 、 Figures 7 to 9 Each positioning assembly 20 includes two positioning units 21 which are protrusively formed in the matching recess 13. The positions of the plurality of positioning assemblies 20 are respectively corresponding to the plurality of loading long slots 111 of the loading protrusion 11, and the two positioning units 21 can respectively extend into the adjacent two end positions of the loading long slots 111 in the corresponding positions of another long strip-shaped wafer carrying disc.
[0030] As shown in Figure 5 、 Figure 6 The long strip-shaped wafer carrying disc is applied to the loading and conveying operations of the long strip-shaped wafer 30. The long strip-shaped wafer 30 can be respectively arranged and placed in the loading long slots 111 of the loading protrusion 11 of the disc body 10. Since the inner diameters of the plurality of loading long slots 111 gradually increase from bottom to top, the inclined inner walls of the loading long slots 111 can provide an auxiliary guiding effect when the long strip-shaped wafer 30 is loaded, so that the long strip-shaped wafer 30 can be surely and smoothly loaded in the loading long slots 111.
[0031] As shown in Figures 7 to 9 After the long strip-shaped wafer 30 is loaded on the long strip-shaped wafer carrying disc, a plurality of long strip-shaped wafer carrying discs loaded with the long strip-shaped wafer 30 can be stacked with each other, so that the batch conveying operation of the long strip-shaped wafer 30 can be performed.
[0032] As shown in Figures 7 to 9 When the long strip-shaped wafer carrying disc is stacked, the loading protrusion 11 of the long strip-shaped wafer carrying disc extends into the matching recess 13 of another long strip-shaped wafer carrying disc, and the positioning units 21 of each positioning assembly 20 of another long strip-shaped wafer carrying disc respectively extend into the corresponding loading long slots 111 of the long strip-shaped wafer carrying disc and are respectively located at the two end positions of the long strip-shaped wafer 30.
[0033] AsFigure 9 As shown, the elongated wafer carrier of this utility model can limit the elongated wafer 30 by means of the two positioning units 21 of each positioning component 20 in a two-point positioning manner, so that the elongated wafer 30 is not easy to fall off the loading slot 111 during transportation. Moreover, the two-point positioning method can not only effectively reduce the contact area between the elongated wafer 30 and the positioning unit 21, but also the two positioning units 21 are located at opposite ends of the elongated wafer 30, which can effectively avoid the risk of warping and deformation of the elongated wafer 30 under force.
[0034] Among them, such as Figure 7 As shown, when elongated wafer carrier disks are stacked, the orientation of the elongated wafer carrier disks can be ensured by orienting the orientation notches 14 of the disk body 10 to the same corner direction, thereby effectively providing an auxiliary orientation effect; in addition, as Figure 8 As shown, the guiding slope 112 of the loading protrusion 11 and the mating slope 121 on the inner side of the outer ring portion 12 of another elongated wafer carrier can cooperate with each other to guide each other, thereby providing an auxiliary alignment effect.
[0035] In addition, such as Figure 2 , Figure 5 As shown, by forming an array of slots 131 and reinforcing ribs 132 in the mating recess 13 of the disc body 10, the overall weight of the disc body 10 can be further reduced while having sufficient structural strength.
[0036] In summary, the elongated wafer carrier of this utility model can provide a good positioning effect for the elongated wafer 30 by means of the positioning unit 21 of the majority positioning components 20 in a two-point positioning manner. This not only reduces the contact area with the elongated wafer 30, but also prevents the elongated wafer 30 from warping and deforming under force.
[0037] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model's technical solution. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the content of the present utility model's technical solution shall still fall within the scope of the present utility model's technical solution.
Claims
1. A long strip wafer carrier capable of carrying a plurality of long strip wafers, and a plurality of said long strip wafer carriers are capable of being stacked on top of each other, characterized in that, The long-strip wafer carrying disc comprises: a disc body having a loading protrusion, an outer ring portion and a mating recess, the top surface of the loading protrusion is formed with a plurality of loading long grooves with openings facing upward, the inner diameter of the plurality of loading long grooves is gradually increased from bottom to top, the outer ring portion is formed at the bottom periphery of the loading protrusion and encircles the mating recess, the plurality of loading long grooves can respectively carry the plurality of long-strip wafers, and the mating recess of the disc body can be mutually matched with the loading protrusion of another long-strip wafer carrying disc for stacking; and a plurality of positioning assemblies, each positioning assembly comprises two positioning units which are protrudedly formed in the mating recess, the positions of the plurality of positioning assemblies are respectively corresponding to the plurality of loading long grooves of the loading protrusion, and the two positioning units can respectively extend into the adjacent two end positions of the loading long grooves in the corresponding positions of another long-strip wafer carrying disc.
2. The long strip wafer boat according to claim 1, wherein The outer side of the loading protrusion of the disc body is formed with a guide inclined surface which is inclined from bottom to top and from outside to inside, and the inner side of the outer ring portion is formed with a mating inclined surface corresponding to the guide inclined surface.
3. The long strip wafer boat according to claim 1, wherein One corner of the disc body is formed with an orientation notch.
4. The long strip wafer boat according to claim 2, wherein One corner of the disc body is formed with an orientation notch.
5. The long strip wafer boat according to any one of claims 1 to 4, wherein The mating recess of the disc body has a plurality of slot openings which are arrayed and have openings facing downward, and each two adjacent slot openings are respectively formed with a reinforcing protruding rib.
6. The long strip wafer boat of claim 2, wherein The width of the reinforcing protruding rib of the mating recess is gradually decreased from top to bottom.