Semiconductor product processing carrier

Abstract

The utility model discloses a semiconductor product processing carrier, which comprises a carrier body, a plurality of fixing mechanisms and a pair of mounting mechanisms, the plurality of uniformly distributed fixing mechanisms are arranged in the carrier body, each fixing mechanism comprises a fixed mounting plate, the fixed mounting plate is provided with a plurality of uniformly distributed fixed positioning rods, and the fixed positioning rods are arranged on the fixed mounting plate. A pair of fixed clamping pieces is slidably mounted on the fixed positioning rod, a fixed positioning plate is arranged on the fixed clamping pieces, mounting mechanisms are arranged on the two sides of the fixed mounting plate, and fixed limiting blocks are fixedly mounted at the two ends of the fixed positioning rod. According to the semiconductor product processing carrier provided by the utility model, through the arrangement of corresponding mechanisms, the processing carrier can fix semiconductors, the possibility that the semiconductors fall off and even are damaged is reduced, the loss of a user is reduced, meanwhile, the mixing of the semiconductors is reduced, the probability of disorder is reduced, and the production efficiency is improved. And the influence on the semiconductor processing efficiency is reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to a kind of semiconductor product processing carrier technical field, specifically related to a kind of semiconductor product processing carrier. BACKGROUND

[0002] Semiconductor refers to the conductivity performance between conductor and insulator at room temperature, semiconductor has application in integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion etc., most of electronic products, such as computer, mobile phone or digital recorder in core unit are closely associated with semiconductor, common semiconductor materials are silicon, germanium, gallium arsenide etc., silicon is the most influential one in various semiconductor materials applications.

[0003] In the process of semiconductor production, processing carrier is needed to transport semiconductor to specified position, but the existing processing carrier is mostly trolley plus tray, and a large number of semiconductors are placed in the tray, which can easily cause the falling and even damage of semiconductor, causing the loss of user, and at the same time, a variety of semiconductors are mixed together, which can easily cause confusion, and need to be reclassified subsequently, affecting the efficiency of semiconductor processing.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a kind of semiconductor product processing carrier.

[0005] The information disclosed in this background section is intended only to increase an understanding of the general background of the present utility model and should not be construed as a recognition of the prior art against which the present utility model is defined. UTILITY MODEL CONTENT

[0006] The utility model aims at providing a kind of semiconductor product processing carrier, which can solve the problems that existing processing carrier is easy to cause semiconductor to fall and even damage, and at the same time, affect processing efficiency.

[0007] In order to achieve the above-mentioned purpose, a kind of semiconductor product processing carrier is provided in a specific embodiment of the utility model, comprising: carrier body, a plurality of fixing mechanisms and a pair of mounting mechanisms;

[0008] The carrier body is provided with a plurality of evenly distributed fixing mechanisms, the fixing mechanism includes fixed mounting plate, the fixed mounting plate is provided with a plurality of evenly distributed fixed positioning rods, a pair of fixed clamping pieces are slidably installed on the fixed positioning rod, and the fixed clamping piece is provided with fixed positioning plate;

[0009] The two sides of the fixed mounting plate are provided with mounting mechanisms.

[0010] In one or more embodiments of the utility model, both ends of the fixed positioning rod are fixedly installed with fixed limiting blocks, the position of the fixed positioning rod can be positioned, the probability of shaking of the fixed positioning rod is reduced, and the stability of the fixed positioning rod is improved.

[0011] A pair of fixed supporting frames are installed between the fixed positioning rod and the fixed mounting plate, the position of the fixed positioning rod can be supported, the balance of the fixed positioning rod is improved, and the probability of tilting of the fixed positioning rod is reduced.

[0012] In one or more embodiments of the utility model, a fixed spring is installed between the fixed supporting frame and the fixed clamping piece, the fixed clamping piece can be extruded, one pair of fixed clamping pieces can be close to each other, and one pair of fixed clamping pieces can clamp the semiconductor;

[0013] The fixed spring is sleeved on the fixed positioning rod, the installation of the fixed spring is facilitated, the stability of the fixed spring is improved, and the probability of tilting of the fixed spring is reduced.

[0014] In one or more embodiments of the utility model, a fixed shaft core rod is fixedly installed on the fixed clamping piece, the rotation of the fixed positioning plate is facilitated, and corresponding support is provided for the rotation of the fixed positioning plate.

[0015] The fixed shaft core rod penetrates the fixed positioning plate and is arranged, the rotation of the fixed positioning plate is facilitated, and corresponding shaft core is provided for the rotation of the fixed positioning plate.

[0016] In one or more embodiments of the utility model, a rotary spring is installed between the fixed shaft core rod and the fixed positioning plate, the fixed positioning plate can be extruded downward, and the fixing effect on the semiconductor is improved.

[0017] A rotating groove matched with the fixed positioning plate is dug on the fixed clamping piece, the rotation of the fixed positioning plate is facilitated, and corresponding space is provided for the rotation of the fixed positioning plate.

[0018] In one or more embodiments of the utility model, a fixed clamping block is fixedly installed on the fixed clamping piece, the fixed positioning plate can be supported, and the fixed positioning plate will not excessively extrude the semiconductor.

[0019] The fixed clamping block is matched with the fixed positioning plate, the fixed clamping block better supports the fixed positioning plate, and the stability of the fixed positioning plate is improved.

[0020] In one or more embodiments of the utility model, a fixed guide rod is fixedly installed between the pair of fixed supporting frames, the sliding of the fixed clamping piece can be guided, and the balance of the fixed clamping piece is guaranteed.

[0021] The fixed guide rod is arranged through the fixed clamping piece, the sliding of the fixed clamping piece is facilitated, and the balance of the fixed clamping piece is improved.

[0022] A pair of the fixed clamping pieces are provided with a support rubber film mounted between the fixed clamping pieces, the semiconductor can be supported, and the stability of the semiconductor is improved.

[0023] In one or more embodiments of the utility model, the mounting mechanism includes mounting support, can support fixed mounting plate, improved the stability of fixed mounting plate, the sliding of fixed mounting plate is facilitated.

[0024] The sliding groove matched with the fixed mounting plate is dug on the mounting support, the installation of the fixed mounting plate is facilitated, the stability of the fixed mounting plate is improved, and the sliding of the fixed mounting plate is facilitated.

[0025] In one or more embodiments of the utility model, the mounting support is provided with a plurality of evenly distributed mounting balls rotatably mounted on the mounting support, the fixed mounting plate can be supported, the stability of the fixed mounting plate is improved, and the sliding of the fixed mounting plate is facilitated.

[0026] In one or more embodiments of the utility model, the mounting support is provided with a plurality of evenly distributed mounting balls rotatably mounted on the mounting support, the fixed mounting plate can be supported, the stability of the fixed mounting plate is improved, and the sliding of the fixed mounting plate is facilitated.

[0027] Compared with the prior art, the semiconductor product processing carrier of the utility model is provided with corresponding mechanisms, so that the semiconductor can be fixed on the processing carrier, the possibility of falling or damaging the semiconductor is reduced, the loss of the user is reduced, the mixing of the semiconductor is reduced, the possibility of confusion is reduced, and the influence on the semiconductor processing efficiency is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed in the embodiment or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings according to these drawings without creating labor.

[0029] Figure 1 It is a front view of an embodiment of the utility model;

[0030] Figure 2 It is Figure 1 Structure schematic view at A in the embodiment of the utility model;

[0031] Figure 3 It is a perspective view of an embodiment of the utility model.

[0032] Explanation of key figure labels:

[0033] 1-Carrier body, 2-Fixing mechanism, 201-Fixing mounting plate, 202-Fixing positioning rod, 203-Fixing clamping component, 204-Fixing positioning plate, 205-Fixing limit block, 206-Fixing support frame, 207-Fixing spring, 208-Fixing shaft rod, 209-Rotation spring, 210-Fixing locking block, 211-Fixing guide rod, 212-Supporting rubber diaphragm, 3-Mounting mechanism, 301-Mounting bracket, 302-Mounting ball bearing. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0035] like Figures 1 to 3 As shown, a semiconductor product processing carrier according to one embodiment of the present invention includes: a carrier body 1, multiple fixing mechanisms 2 and a pair of mounting mechanisms 3.

[0036] like Figures 1 to 2 As shown, the vehicle body 1 is provided with a plurality of evenly distributed fixing mechanisms 2. The fixing mechanism 2 includes a fixing mounting plate 201, which can divide the vehicle body 1, thereby dividing the space inside the vehicle body 1, and can also support the fixing support frame 206, thereby improving the stability of the fixing clamp 203.

[0037] In addition, the fixed mounting plate 201 is provided with several evenly distributed fixed positioning rods 202, which can support the fixed clamping member 203, facilitate the sliding of the fixed clamping member 203, and at the same time support the fixed spring 207.

[0038] In addition, a pair of fixed clamping parts 203 are slidably installed on the fixed positioning rod 202, which can clamp and position the semiconductor, thereby improving the stability of the semiconductor.

[0039] The fixed clamping member 203 is equipped with a fixed positioning plate 204, which can clamp the semiconductor and improve the stability of the semiconductor.

[0040] like Figures 1 to 2As shown, fixed limiting blocks 205 are fixedly installed at both ends of the fixed positioning rod 202, which can position the fixed positioning rod 202, reduce the probability of the fixed positioning rod 202 shaking, and improve the stability of the fixed positioning rod 202.

[0041] Among them, a pair of fixed support frames 206 are installed between the fixed positioning rod 202 and the fixed mounting plate 201, which can support the position of the fixed positioning rod 202, improve the balance of the fixed positioning rod 202, and reduce the probability of the fixed positioning rod 202 tilting.

[0042] like Figures 1 to 3 As shown, a fixing spring 207 is installed between the fixing support frame 206 and the fixing clamp 203, which can compress the fixing clamp 203 so that the pair of fixing clamps 203 can move closer to each other and clamp the semiconductor.

[0043] In addition, the fixing spring 207 is sleeved on the fixing positioning rod 202, which facilitates the installation of the fixing spring 207, improves the stability of the fixing spring 207, and reduces the probability of the fixing spring 207 tilting.

[0044] like Figures 1 to 2 As shown, a fixed shaft rod 208 is fixedly installed on the fixed clamping member 203, which can facilitate the rotation of the fixed positioning plate 204 and provide corresponding support for the rotation of the fixed positioning plate 204.

[0045] In addition, the fixed shaft rod 208 is set through the fixed positioning plate 204, which facilitates the rotation of the fixed positioning plate 204 and provides a corresponding shaft for the rotation of the fixed positioning plate 204.

[0046] like Figures 1 to 3 As shown, a rotary spring 209 is installed between the fixed shaft rod 208 and the fixed positioning plate 204, which can press the fixed positioning plate 204 downward, thereby improving the fixing effect on the semiconductor.

[0047] The fixed clamping member 203 has a rotating groove that matches the fixed positioning plate 204, which facilitates the rotation of the fixed positioning plate 204 and provides corresponding space for the rotation of the fixed positioning plate 204.

[0048] like Figures 1 to 3 As shown, a fixing clip 210 is fixedly installed on the fixing clamp 203, which can support the fixing positioning plate 204 and prevent the fixing positioning plate 204 from excessively squeezing the semiconductor.

[0049] In addition, the fixing clip 210 matches the fixing positioning plate 204, so that the fixing clip 210 can better support the fixing positioning plate 204 and improve the stability of the fixing positioning plate 204.

[0050] As shown in Figures 1 to 2 A pair of fixed support frame 206 between the fixed installation of the fixed guide rod 211, can be fixed to the sliding of the clamping piece 203 guide, make the balance of the fixed clamping piece 203 to guarantee.

[0051] Among them, the fixed guide rod 211 through the fixed clamping piece 203, the sliding of the fixed clamping piece 203 is convenient, improve the balance of the fixed clamping piece 203.

[0052] In addition, a pair of fixed clamping piece 203 between the installation of the support rubber film 212, can be supported by the semiconductor, improve the stability of the semiconductor.

[0053] As shown in Figures 1 to 3 The two sides of the fixed installation plate 201 are provided with mounting mechanism 3, mounting mechanism 3 includes installation support 301, can be fixed to the installation plate 201 support, improve the stability of the fixed installation plate 201.

[0054] Among them, the installation support 301 on the carving with fixed installation plate 201 matching sliding groove, the installation of the fixed installation plate 201 is convenient, improve the stability of the fixed installation plate 201, the sliding of the fixed installation plate 201 is convenient.

[0055] As shown in Figures 1 to 3 The installation support 301 is provided with a plurality of evenly distributed installation ball 302, can be fixed to the installation plate 201 support, improve the stability of the fixed installation plate 201, the sliding of the fixed installation plate 201 is convenient.

[0056] As shown in Figures 1 to 3 The installation support 301 is provided with a plurality of evenly distributed installation ball 302, can be fixed to the installation plate 201 support, improve the stability of the fixed installation plate 201, the sliding of the fixed installation plate 201 is convenient.

[0057] Specific use, the fixed installation plate 201 out, push away the fixed positioning plate 204, the semiconductor clamping in a pair of fixed clamping piece 203, through the fixed positioning rod 202 and the fixed guide rod 211 guide, make the fixed clamping piece 203 sliding, through the fixed spring 207 extrusion, make the fixed clamping piece 203 to the semiconductor clamping, make the fixed clamping piece 203 better to the semiconductor fixed, at the same time, the fixed positioning plate 204 can be through the fixed shaft center rod 208 clamping of the semiconductor, through the cooperation with the fixed clamping piece 203, the positioning of the semiconductor, the fixed installation plate 201 sliding to the carrier body 1, after closing the carrier body 1 can.

[0058] It is apparent for a person skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting, the scope of the present application being defined by the claims appended hereto rather than by the above description, and all the changes which fall within the meaning and the scope of the equivalent elements of the claims are intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims to the figures in which the reference signs are used.

[0059] Furthermore, it should be understood that although the present specification describes exemplary embodiments, not every embodiment contains only one independent technical solution, and the present specification is described in this way only for the sake of clarity, and a person skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that a person skilled in the art can understand.

Claims

1. A semiconductor product processing carrier, characterized by, Include: The carrier body; A plurality of fixing mechanisms are uniformly installed in the carrier body, the fixing mechanism includes a fixed mounting plate, a plurality of uniformly distributed fixed positioning rods are arranged on the fixed mounting plate, a pair of fixed clamping pieces are slidably installed on the fixed positioning rods, and a fixed positioning plate is arranged on the fixed clamping piece; A pair of mounting mechanisms are installed on both sides of the fixed mounting plate.

2. The semiconductor product processing carrier of claim 1, wherein, Both ends of the fixed positioning rod are fixedly installed with a fixed limiting block, and a pair of fixed support frames are installed between the fixed positioning rod and the fixed mounting plate.

3. The semiconductor product processing carrier of claim 2, wherein, A fixed spring is installed between the fixed support frame and the fixed clamping piece, and the fixed spring is sleeved on the fixed positioning rod.

4. The semiconductor product processing carrier of claim 3, wherein, The fixed clamping piece is fixedly installed with a fixed shaft core rod, and the fixed shaft core rod penetrates the fixed positioning plate.

5. The semiconductor product processing carrier of claim 4, wherein, A rotary spring is installed between the fixed shaft core rod and the fixed positioning plate, and a rotating groove matched with the fixed positioning plate is dug on the fixed clamping piece.

6. The semiconductor product processing carrier of claim 1, wherein, The fixed clamping piece is fixedly installed with a fixed clamping block, and the fixed clamping block is matched with the fixed positioning plate.

7. The semiconductor product processing carrier of claim 6, wherein, A fixed guide rod is fixedly installed between the pair of fixed support frames, the fixed guide rod penetrates the fixed clamping piece, and a support rubber film is installed between the pair of fixed clamping pieces.

8. The semiconductor product processing carrier of claim 1, wherein, The mounting mechanism includes a mounting bracket, and a sliding groove matched with the fixed mounting plate is dug on the mounting bracket.

9. The semiconductor product processing carrier of claim 8, wherein, A plurality of uniformly distributed mounting balls are rotatably installed on the mounting bracket.

10. The semiconductor product processing carrier of claim 9, wherein, A positioning groove matched with the mounting ball is dug on the mounting bracket.

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