Bonding machine positioning tool for semiconductor module

Abstract

The utility model relates to the technical field of positioning tools, in particular to a bonding machine positioning tool for a semiconductor module, which comprises a base, at least two positioning blocks and a rubber pad, the top of the base is connected with the at least two positioning blocks, the positioning blocks are provided with suction holes at intervals, the rubber pad is connected to the tops of the positioning blocks, the rubber pad is provided with through holes matched with the suction holes, and the through holes are communicated with the suction holes. And the through holes are vertically aligned with the suction holes. According to the utility model, through arranging the rubber pad, a gap between the substrate and the bonding machine can be obviously reduced or even eliminated, the air leakage phenomenon caused by the gap when the vacuum equipment adsorbs the substrate is avoided, the adsorption fixing efficiency of the vacuum equipment is improved, the rubber pad can also increase the friction force between the substrate and the positioning block, and the stability of the substrate is improved; therefore, the bonding reliability of the bonding machine positioning tool and the performance of a final product are improved.

Description

Technical Field

[0001] This utility model relates to the field of positioning tooling technology, and more specifically, to a positioning tooling for a bonding machine for semiconductor modules. Background Technology

[0002] Semiconductor modules are complex circuit units formed by integrating multiple semiconductor devices. They are widely used in various electronic products, such as power management, signal processing, and data transmission. These modules not only integrate basic components such as transistors, resistors, and capacitors, but may also include advanced components such as microprocessors and memory, designed to provide specific functions or solve specific application problems. By integrating multiple functions into a single module, the space occupied on the circuit board can be effectively reduced, and the stability and efficiency of the system can be improved.

[0003] Bonding machines are crucial equipment for achieving internal electrical connections within semiconductor modules. Through precise operations, they solder tiny metal wires between semiconductor chips and lead frames or other substrates, forming stable electrical connections. This process demands extremely high precision and stability to ensure that each connection point can withstand subsequent processing steps and environmental changes during actual use.

[0004] When bonding semiconductor modules to substrates, vacuum equipment is needed to adsorb and fix the substrate. However, there are gaps between the substrate and the positioning fixture of the bonding machine, which can easily cause air leakage when the vacuum equipment adsorbs the substrate. This weakens the vacuum adsorption force, causing the substrate to shift or become unstable during the bonding process. This directly affects the accuracy and stability of the bonding, which can not only affect the precise alignment of the bonding points, but may also lead to bonding failure or even damage to the substrate and semiconductor module. Utility Model Content

[0005] In order to overcome the shortcomings of the gap between the substrate and the bonding machine, which easily leads to air leakage when the vacuum equipment adsorbs the substrate, thus affecting the reliability of bonding and the performance of the final product, the purpose of this utility model is to provide a positioning fixture for a bonding machine for semiconductor modules.

[0006] A positioning fixture for a bonding machine for semiconductor modules includes a base, positioning blocks, and a rubber pad. At least two positioning blocks are connected to the top of the base. The positioning blocks are provided with suction holes spaced apart. The rubber pad is connected to the top of the positioning blocks and has through holes that are adapted to the suction holes. The through holes are aligned vertically with the suction holes.

[0007] More preferably, it also includes a push block, a second rack, an electric gear, a first rack, and a guide connector. Each positioning block has a mounting groove in the center. The electric gear is installed in the middle of the mounting groove. There are two second racks and two first racks. The second rack and the first rack are respectively located on both sides of the electric gear in the length direction and on both sides in the width direction. The second rack and the first rack are both meshed with the electric gear. The push block is connected to the second rack and the first rack respectively through the guide connector.

[0008] More preferably, the second rack and the first rack are staggered vertically and both are located within the mounting groove.

[0009] More preferably, the guide connector includes a sliding block and a fixed rod. Sliding blocks are slidably provided around the positioning block. The fixed rod is connected to one end of the sliding block facing the mounting groove, and the other end is connected to the push block. The second rack and the first rack are both connected to the fixed rod.

[0010] More preferably, it also includes finite blocks, with finite blocks connected to each push block.

[0011] More preferably, it also includes rubber blocks, with rubber blocks connected to the side of the limiting block closest to the rubber pad.

[0012] Compared with the prior art, the present invention has the following advantages: By setting a rubber pad, the present invention can significantly reduce or even eliminate the gap between the substrate and the bonding machine, avoid air leakage when the vacuum equipment adsorbs the substrate due to the gap, improve the adsorption and fixation efficiency of the vacuum equipment, and the rubber pad can also increase the friction between the substrate and the positioning block, improve the stability of the substrate, thereby improving the bonding reliability of the positioning fixture of the bonding machine and the performance of the final product. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a structural separation diagram of the positioning block and rubber pad of this utility model.

[0015] Figure 3 This is a three-dimensional structural diagram of the positioning block, rubber pad, and push block of this utility model.

[0016] Figure 4 This is a schematic diagram of the structure of the first rack, electric gear, and second rack of this utility model.

[0017] Figure 5 This is a schematic diagram of the push block, sliding block, and fixing rod of this utility model.

[0018] The meanings of the reference numerals in the figure are as follows: 1-base, 101-suction hole, 2-positioning block, 201-mounting groove, 3-rubber pad, 4-push block, 5-sliding block, 6-through hole, 7-fixing rod, 8-second rack, 9-electric gear, 10-first rack, 11-limiting block, 12-rubber block. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example: A positioning fixture for a bonding machine used in semiconductor modules, such as... Figures 1-5 As shown, the device includes a base 1, positioning blocks 2, rubber pads 3, push blocks 4, a second rack 8, an electric gear 9, a first rack 10, a guide connector, a limiting block 11, and rubber blocks 12. At least two positioning blocks 2 are fixedly connected to the top of the base 1. Each positioning block 2 has suction holes 101 spaced apart. The rubber pads 3 are fixedly connected to the top of the positioning blocks 2. The rubber pads 3 have through holes 6 that match the suction holes 101, and these through holes 6 are vertically aligned with the suction holes 101. Each positioning block 2 has a central mounting groove 201, in which the electric gear 9 is installed. The first gear 9 has two racks, and the second rack 8 and the first rack 10 are respectively located on both sides of the electric gear 9 in the length direction and the width direction. The second rack 8 and the first rack 10 are both meshed with the electric gear 9. The push block 4 is connected to the second rack 8 and the first rack 10 respectively through the guide connector. The second rack 8 and the first rack 10 are staggered vertically and are both located in the mounting groove 201. The top of the push block 4 is fixedly connected to the limit block 11, and the side of the limit block 11 near the rubber pad 3 is fixedly connected to the rubber block 12.

[0021] like Figure 4 and Figure 5 As shown, the guide connector includes a sliding block 5 and a fixing rod 7. The positioning block 2 is slidably provided with sliding blocks 5 on all four sides. The end of the sliding block 5 facing the mounting groove 201 is fixedly connected to the fixing rod 7, and the other end is connected to the push block 4. The second rack 8 is connected to the left and right fixing rods 7, and the first rack 10 is connected to the front and rear fixing rods 7.

[0022] Before bonding, the electric gear 9 is rotated, and under the meshing action of the first rack 10 and the second rack 8 with the electric gear 9, the front and rear first racks 10 move away from each other, the left and right second racks 8 move away from each other, and the four fixing rods 7 move away from the electric gear 9, thereby moving the four push blocks 4 away from the positioning block 2. Then the substrate is placed on the rubber pad 3, and the electric gear 9 is reversed, so that the front and rear first racks 10 and the left and right second racks 8 are reset, thereby moving the fixing rods 7 towards the electric gear 9 and resetting, so that the push blocks 4 are reset. After the four push blocks 4 are reset, the limiting block 11 can limit the substrate. Then, an external vacuum device is used to pass through the suction hole 10. 1. The rubber pad 3 is used to adsorb and fix the substrate. It can significantly reduce or even eliminate the gap between the substrate and the bonding machine, avoid air leakage when the vacuum equipment adsorbs the substrate due to the gap, and improve the adsorption and fixing efficiency of the vacuum equipment. The rubber pad 3 can also increase the friction between the substrate and the positioning block 2, improve the stability of the substrate, ensure that the substrate is kept in the predetermined position before and during bonding, prevent the substrate from slipping when bonding with the semiconductor module, and improve the alignment accuracy. The rubber block 12 can increase the friction between the substrate and the limiting block 11, further improve the stability of the substrate, thereby improving the bonding reliability of the positioning fixture of this bonding machine and the performance of the final product. The rubber block 12 can also protect the substrate.

[0023] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A positioning fixture for a bonding machine of semiconductor modules, comprising a base (1) and positioning blocks (2), wherein at least two positioning blocks (2) are connected to the top of the base (1), and suction holes (101) are provided at intervals on the positioning blocks (2), characterized in that, It also includes a rubber pad (3), which is connected to the top of the positioning block (2). The rubber pad (3) has a through hole (6) that matches the suction hole (101), and the through hole (6) is aligned vertically with the suction hole (101). It also includes a push block (4), a second rack (8), an electric gear (9), a first rack (10) and a guide connector. Each positioning block (2) has a mounting groove (201) in the center. The electric gear (9) is installed in the middle of the mounting groove (201). The second rack (8) and the first rack (10) each have two racks. The second rack (8) and the first rack (10) are respectively located on both sides of the length direction and both sides of the width direction of the electric gear (9). The second rack (8) and the first rack (10) mesh with the electric gear (9). The push block (4) is connected to the second rack (8) and the first rack (10) respectively through the guide connector. The guide connector includes a sliding block (5) and a fixed rod (7). The positioning block (2) is slidably provided with sliding blocks (5) on all four sides. One end of the sliding block (5) facing the mounting groove (201) is connected to the fixed rod (7), and the other end is connected to the push block (4). The second rack (8) and the first rack (10) are both connected to the fixed rod (7).

2. The positioning fixture for a bonding machine for semiconductor modules according to claim 1, characterized in that, The second rack (8) and the first rack (10) are staggered vertically and are both located in the mounting groove (201).

3. The positioning fixture for a bonding machine of a semiconductor module according to claim 2, characterized in that, This positioning fixture also includes a limit block (11), and the push block (4) is connected to the limit block (11).

4. The positioning fixture for a bonding machine of a semiconductor module according to claim 3, characterized in that, This positioning fixture also includes rubber blocks (12), and the side of the limiting block (11) near the rubber pad (3) is connected to rubber blocks (12).

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