Carrier structure
By designing a carrier structure suitable for different packaging machine track widths, and using a magnetic structure to fix the first and second carriers, the economic cost and yield risks caused by carriers with different sized substrates were solved, and a highly efficient packaging process was achieved.
Patent Information
- Application Number
- CN202422875850.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-11-25
AI Technical Summary
In the semiconductor packaging process, different substrate carriers of different sizes require different carrier models, which leads to inconsistent track widths on the packaging machine, resulting in increased economic costs and yield risks.
A carrier structure is designed, including a first carrier and a second carrier. The second carrier is smaller than the first carrier. The two are fixed together by a magnetic attraction structure. The second carrier is accommodated in the carrier slot of the first carrier to adapt to the track width requirements of different packaging machine stations.
By moving the second carrier as a whole, frequent carrier changes are avoided, packaging yield is improved, and economic costs and yield risks are reduced.
Smart Images
Figure CN223598700U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of semiconductor packaging, and in particular to a carrier structure. BACKGROUND
[0002] With the rapid development of the semiconductor industry, in the manufacturing process of semiconductor packaging, the substrate usually needs to be fixed by a carrier to prevent warping during the operation.
[0003] However, different sizes of substrates often require different carrier sizes, for example, in the mixed packaging process of FC (flip chip) packaging lines and WB (wire bonding) packaging lines, the width of the packaging machine track is inconsistent, and different carriers need to be replaced during packaging, which not only increases the economic cost, but also brings the risk of yield due to frequent replacement of different carriers. CONTENT OF THE UTILITY MODEL
[0004] The technical problem to be solved by the present application is to provide a carrier structure to solve the problems raised in the background.
[0005] To this end, the present application provides a carrier structure, comprising:
[0006] a first carrier and a second carrier, the size of the second carrier being smaller than that of the first carrier;
[0007] The second carrier comprises a second carrier body and at least two second carrier wings on both sides, and the second carrier body has a plurality of substrate grooves therein;
[0008] The first carrier comprises a first carrier body, the center of which has a carrier slot for accommodating the second carrier, at least two sides of the carrier slot have a bearing step corresponding to the second carrier wing, and when the second carrier is placed in the carrier slot of the first carrier, the two are relatively fixed by a magnetic attraction structure.
[0009] Optionally, the opposite sides or the periphery of the carrier slot have bearing steps, and correspondingly, the opposite sides or the periphery of the second carrier have second carrier wings.
[0010] Optionally, the width of the bearing step is less than or equal to the width of the second carrier wing.
[0011] Optionally, the substrate grooves are through grooves or non-through grooves, and the size of the substrate grooves is set according to different substrates corresponding to different packaging processes.
[0012] Optionally, the magnetic attraction structure is arranged at a position close to the bearing step of the first carrier or at a position close to the second carrier wing of the second carrier.
[0013] Optionally, the magnetic attraction structure is embedded in the back of the first carrier body near the load bearing step.
[0014] Optionally, the thickness of the second carrier wing is consistent with the height of the load bearing step, so that the upper surfaces of the second carrier and the first carrier are flush when the second carrier is placed in the carrier groove of the first carrier.
[0015] Optionally, the materials of the first carrier and the second carrier are metal or alloy.
[0016] Optionally, the edge position of the first carrier has a plurality of stress holes.
[0017] Optionally, the first carrier and / or the second carrier has a positioning hole.
[0018] The technical solution of the present application has the following advantages:
[0019] The carrier structure in the present application comprises a first carrier and a second carrier, the size of the second carrier is smaller than that of the first carrier; the second carrier comprises a second carrier body and at least two second carrier wings on both sides, the second carrier body has a plurality of substrate grooves therein; the first carrier comprises a first carrier body, the center position of the first carrier body has a carrier groove for accommodating the second carrier, at least two sides of the carrier groove have load bearing steps corresponding to the second carrier wings, and the first carrier and the second carrier are relatively fixed by a magnetic attraction structure when the second carrier is placed in the carrier groove of the first carrier. The carrier structure of the present application has two first carriers and second carriers with different sizes, one packaging machine track has a larger width and the other has a smaller width. When a wider first packaging machine track is needed for packaging, the second carrier is placed in the carrier groove of the first carrier and is attracted by the magnetic attraction structure, and the larger first carrier is used to adapt to the track width of the first packaging machine. When a narrower second packaging machine track is needed for packaging, the second carrier is directly taken out from the carrier groove of the first carrier and placed on the second packaging machine for packaging. Since the substrate is in the substrate groove of the second carrier during the entire packaging process, the second carrier can be moved as a whole according to the needs of the packaging process, avoiding the risk of packaging yield caused by frequent replacement of different carriers, and improving the yield of the operation. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 FIG. 1 is a schematic diagram of the first carrier of the carrier structure in an embodiment of the present application;
[0021] Figure 2Fig. 2 is a perspective view of a second carrier of a carrier structure according to an embodiment of the present application;
[0022] Figure 3 Fig. 4 is a cross-sectional view of a carrier structure according to an embodiment of the present application. DETAILED DESCRIPTION
[0023] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In describing the embodiments of the present application, the schematic views will be partially enlarged without the general proportion for the convenience of description, and the schematic views are only examples which should not limit the protection scope of the present application. In addition, the three-dimensional spatial dimensions including length, width and depth should be included in the actual manufacture.
[0024] An embodiment of the present application provides a carrier structure, referring to Figure 1 、 Figure 2 and Figure 3 , Figure 1 Fig. 1 is a perspective view of a first carrier of a carrier structure according to an embodiment of the present application, Figure 2 Fig. 2 is a perspective view of a second carrier of a carrier structure according to an embodiment of the present application, Figure 3 Fig. 4 is a cross-sectional view of a carrier structure according to an embodiment of the present application.
[0025] The carrier structure comprises:
[0026] a first carrier 100 and a second carrier 200, the size of the second carrier 200 being smaller than that of the first carrier 100;
[0027] The second carrier 200 comprises a second carrier body 210 and second carrier wings 220 on both sides, and the second carrier body 210 has a plurality of substrate grooves 230 therein;
[0028] The first carrier 100 comprises a first carrier body 110, the first carrier body 110 has a carrier groove 150 at the center position, the carrier groove 150 is used for accommodating the second carrier, and both sides of the carrier groove 150 has a bearing step 130, the bearing step 130 corresponds to the second carrier wings 220, and when the second carrier 200 is placed in the carrier groove 150 of the first carrier 100, the two are relatively fixed by using a magnetic attraction structure 140.
[0029] In the embodiment, the size of the first carrier 100 and the size of the second carrier 200 respectively correspond to the width of the corresponding packaging machine track, for example, the size of the first carrier 100 corresponds to the width of the WB (wire bonding) packaging line machine track, and the size of the second carrier 200 corresponds to the width of the FC (flip chip) packaging line machine track.
[0030] In other embodiments, the size of the first carrier and the size of the second carrier can also correspond to other different widths of the packaging machine track.
[0031] In the present embodiment, the second carrier wing 220 of the second carrier 200 is located on both sides, and the corresponding carrier steps 130 are also located on both sides of the carrier groove 150. The second carrier 200 is placed in the carrier groove 150 of the first carrier 100 by using the carrier steps 130 and the second carrier wing 220.
[0032] In other embodiments, the carrier groove has carrier steps around the periphery, and the second carrier has a second carrier wing around the periphery.
[0033] In the present embodiment, the width of the carrier step 130 is less than or equal to the width of the second carrier wing 220. In order to show clearly, Figure 3 the width of the carrier step 130 and the width of the second carrier wing 220 are appropriately widened in the cross-sectional view.
[0034] In the present embodiment, the thickness of the second carrier wing 220 is consistent with the height of the carrier step 130, so that when the second carrier 200 is placed in the carrier groove of the first carrier 100, the upper surfaces of the second carrier 200 and the first carrier 100 are flush. In other embodiments, the upper surfaces of the second carrier and the first carrier can also not be flush.
[0035] The substrate groove 230 is used to place the substrate to be packaged, and the size of the substrate groove is set according to different substrates corresponding to different packaging processes. The substrate groove 230 is a through groove or a non-through groove. When the substrate groove 230 is a through groove, the bottom of the substrate groove has a support claw structure. When the substrate groove 230 is a non-through groove, the side of the substrate groove 230 has a relief groove.
[0036] Since the size of the first carrier 100 is significantly larger than the size of the second carrier 200, the stress of the first carrier 100 will increase significantly during the heat treatment process, causing the carrier to warp. Therefore, the edge position of the first carrier 100 has a plurality of stress holes 120 to reduce the stress generated by the first carrier 100.
[0037] The materials of the first carrier 100 and the second carrier 200 are metal or alloy, and at least one of the first carrier 100 and the second carrier 200 is a magnetic material, so that the two can be relatively fixed by using a magnetic attraction structure.
[0038] The magnetic attraction structure is arranged at a position close to the bearing step of the first carrier or at a position close to the wing of the second carrier, so that when the second carrier 200 is placed in the carrier groove 150 of the first carrier 100, the two are relatively fixed by the magnetic attraction structure 140.
[0039] In the embodiment, the magnetic attraction structure 140 is embedded in the back of the first carrier body 110 at a position close to the bearing step 130, and the magnetic attraction structure 140 is a plurality of magnet blocks. The material of the second carrier 200 is a steel sheet, and the second carrier 200 and the first carrier 100 are relatively fixed by the magnetic attraction structure 140.
[0040] In other embodiments, the magnetic attraction structure 140 can also be arranged on the front of the first carrier body.
[0041] In the embodiment, the first carrier 100 has a positioning hole 160 for positioning in the subsequent packaging process. In other embodiments, the second carrier can also have a positioning hole.
[0042] In the embodiment, the sidewall of the carrier groove 150 of the first carrier 100 also has a avoiding groove 170 to facilitate the taking out and placing of the second carrier 200.
[0043] Embodiment:
[0044] In the packaging process, first, a wider first packaging machine track is used for packaging, the second carrier is placed in the carrier groove of the first carrier, and the magnetic attraction structure is used for attraction. The large-size first carrier is adapted to the track width of the first packaging machine. When a narrower second packaging machine track is used for packaging, the second carrier is directly taken out from the carrier groove of the first carrier and placed on the second packaging machine for packaging.
[0045] Since the substrate is in the substrate groove of the second carrier throughout the packaging process, only the second carrier needs to be moved as a whole according to the needs of the packaging process, and the substrate does not need to be taken out of the second carrier, thereby avoiding the risk of packaging yield caused by frequent replacement of different carriers, and facilitating improvement of the yield of the operation.
[0046] Although the above-mentioned preferred embodiments of the present application have been disclosed, the present application is not intended to be limited thereto. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present application by using the disclosed methods and technical contents without departing from the spirit and scope of the present application. Therefore, any simple modification, equivalent change and modification made to the above-mentioned embodiments according to the technical essence of the present application, which does not deviate from the technical solutions of the present application, is within the protection scope of the present application.
Claims
1. A vehicle structure characterized by, The utility model relates to a carrier and a second carrier, the second carrier is smaller than the first carrier in size; The second carrier includes a second carrier body and at least two second carrier wings, and the second carrier body has a plurality of substrate grooves; The first carrier includes a first carrier body, and the first carrier body has a carrier groove in the center position, the carrier groove is used for accommodating the second carrier, at least two sides of the carrier groove have bearing steps corresponding to the second carrier wings, and the second carrier and the first carrier are relatively fixed by a magnetic attraction structure when the second carrier is placed in the carrier groove of the first carrier. The carrier groove has bearing steps on opposite sides or around, and the second carrier has second carrier wings on opposite sides or around.
2. The carrier structure of claim 1, wherein, The width of the bearing step is less than or equal to the width of the second carrier wing.
3. The carrier structure of claim 1, wherein, The substrate groove is a through groove or a non-through groove, and the size of the substrate groove is set according to different substrates corresponding to different packaging processes.
4. The carrier structure of claim 1, wherein, The magnetic attraction structure is arranged at a position close to the bearing step of the first carrier or a position close to the second carrier wing of the second carrier.
5. The carrier structure of claim 1, wherein, When the magnetic attraction structure is arranged at a position close to the bearing step of the first carrier, the magnetic attraction structure is embedded in the back of the first carrier body at a position close to the bearing step.
6. The carrier structure of claim 5, wherein, The thickness of the second carrier wing is consistent with the height of the bearing step, so that the upper surfaces of the second carrier and the first carrier are flush when the second carrier is placed in the carrier groove of the first carrier.
7. The carrier structure of claim 1, wherein, The materials of the first carrier and the second carrier are metal or alloy.
8. The carrier structure of claim 1, wherein, The edge position of the first carrier has a plurality of stress holes.
9. The carrier structure of claim 1, wherein, The first carrier and / or the second carrier has a positioning hole.
10. The carrier structure of claim 1, wherein,