Wafer tray pick-and-place device and wafer transfer device

Abstract

The utility model discloses a wafer tray pick-and-place device and a wafer transfer device. The wafer tray pick-and-place device comprises a rotating mechanism, a lifting mechanism and a translation mechanism, the lifting mechanism is connected with the rotating mechanism, the translation mechanism is connected with the lifting mechanism, the moving end of the translation mechanism is connected with the adsorption disc, air holes are formed in the adsorption disc and connected with an air source, and negative pressure generated by the air holes is used for sucking trays; the rotating mechanism comprises a rotating disc, a rotating shaft and a gear driving device, the lifting mechanism is fixed to the top of the rotating disc, the bottom of the rotating disc is rotationally connected with the workbench through the rotating shaft, and the gear driving device is connected with the rotating shaft; according to the wafer tray taking and placing device, rotation, translation and lifting motion are coupled, automatic movement of the adsorption disc in a three-dimensional space is achieved, automatic taking and placing operation of the tray is achieved, the taking efficiency of the tray is improved, the yield of wafers is improved, and the production cost of the wafers is reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, specifically a wafer tray handling device. Background Technology

[0002] Wafer fabrication is a highly precise manufacturing process with extremely stringent environmental requirements. To ensure product quality and performance, wafer fabrication is typically carried out in cleanrooms to minimize the impact of external contamination and guarantee extremely low defect rates and excellent electrical performance in the produced wafers. During the wafer fabrication process, vacuum electroplating is required to coat the wafer surface with one or more layers of metallic or non-metallic materials to enhance conductivity, corrosion resistance, or serve as a protective layer for subsequent processes.

[0003] Before electroplating, the wafers need to be placed on graphite trays. The process involves first removing the graphite tray from the tray compartment, then placing the wafers on it, and finally returning the tray to the compartment. All the wafers are then transported to the vacuum electroplating chamber via the tray compartment. Throughout this process, the handling of the graphite trays is done manually, using specialized tools. This results in low tray handling efficiency and increases the risk of wafer contamination. Any contamination on the wafer surface can become a hidden danger in the electroplating process. During electroplating, these contaminants can become weaknesses in coating adhesion, making the coating more prone to peeling off in subsequent processing or use, thus affecting the wafer's electrical connectivity, mechanical strength, and long-term reliability. Utility Model Content

[0004] In view of the problems existing in the prior art, this utility model provides a wafer tray picking and placing device to realize automatic tray picking and placing, thereby improving the electroplating efficiency and yield of wafers.

[0005] This utility model is achieved through the following technical solution:

[0006] A wafer tray loading and unloading device includes a rotating mechanism, a lifting mechanism, and a translation mechanism;

[0007] The lifting mechanism is connected to the rotating mechanism, and the translation mechanism is connected to the lifting mechanism. The moving end of the translation mechanism is connected to the adsorption plate. The adsorption plate is provided with air holes, which are connected to an air source. The negative pressure generated by the air holes is used to suck up the tray.

[0008] The rotating mechanism includes a rotating disk, a rotating shaft, and a gear drive device. The lifting mechanism is fixed on the top of the rotating disk, and the bottom of the rotating disk is rotatably connected to the worktable via the rotating shaft. The gear drive device is connected to the rotating shaft.

[0009] Preferably, the gear driving device comprises a fixed shaft sleeve, a gear ring and a driving gear;

[0010] The fixed shaft sleeve is sleeved on the rotating shaft, the top of the rotating shaft is fixedly connected with the rotating disc, the gear ring is coaxially fixedly connected with the fixed shaft sleeve, the driving gear is arranged at the bottom of the rotating disc and is engaged with the gear ring, and the driving gear is connected with the driving motor.

[0011] Preferably, the rotating mechanism is provided with a position detection device, which comprises a first photoelectric switch and a detection plate.

[0012] The first photoelectric switch is arranged on the rotating disc, and the detection plate is located on the rotating path of the first photoelectric switch.

[0013] Preferably, the lifting mechanism comprises a linear lifting module and a sliding block seat.

[0014] The linear lifting module is vertically installed on the rotating disc, the sliding block seat is connected with the sliding block of the linear lifting module, and the fixed seat for fixing the linear translation module is arranged on the sliding block seat.

[0015] Preferably, the fixed seat is of an L-shaped structure, the vertical plate of the fixed seat is connected with the sliding block seat, and the linear translation module is fixed on the horizontal plate of the fixed seat.

[0016] Preferably, the linear lifting module is provided with a second photoelectric switch and is located on the moving path of the sliding block.

[0017] Preferably, the translation mechanism is a linear translation module, and the adsorption disc is fixedly connected with the sliding block of the linear translation module through a cantilever arm.

[0018] Preferably, the adsorption disc comprises a gas disc and a gas cavity, the gas cavity is arranged at the top surface of the end of the cantilever arm, the gas disc is embedded in the gas cavity and is sealingly connected, the air hole is arranged on the gas disc and is communicated with the gas cavity, and the gas cavity is connected with the gas source through a pipeline.

[0019] Preferably, the first photoelectric switch is a groove type photoelectric switch.

[0020] A wafer transfer device comprises the wafer tray taking and placing device.

[0021] Compared with the prior art, the wafer transfer device has the following beneficial technical effects:

[0022] The wafer tray taking and placing device provided by the application couples rotation, translation and lifting movement, realizes automatic movement of the adsorption disc in three-dimensional space, places the tray bin in the movement space of the adsorption disc, adjusts the angle, height and horizontal position of the adsorption disc during the taking and placing process of the graphite tray, makes the adsorption disc located at the bottom of the tray, forms stable connection between the graphite tray and the adsorption disc under the action of negative pressure, then transports the tray to the target position, and then automatically transports the tray carrying the wafer to the wafer bin, the wafer tray taking and placing device couples rotation, translation and lifting movement, realizes automatic movement of the adsorption disc in three-dimensional space, realizes automatic taking and placing operation of the tray, improves the taking efficiency of the tray, improves the yield of the wafer, and reduces the generation cost of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some of the embodiments of the application, and therefore should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0024] Figure 1 It is an appearance schematic view of the tray conveying device of the utility model;

[0025] Figure 2 It is a structural view of the tray conveying device of the utility model;

[0026] Figure 3 It is a structural view of the rotating mechanism of the utility model;

[0027] Figure 4 It is a structural view of the lifting mechanism of the utility model;

[0028] Figure 5 It is a first structural view of the translation mechanism of the utility model;

[0029] Figure 6 It is a second structural view of the translation mechanism of the utility model;

[0030] Figure 7 It is a structural view of the adsorption disc of the utility model;

[0031] Figure 8 It is an internal structural view of the adsorption disc of the utility model;

[0032] Figure 9 It is a structural view of the wafer non-contact transfer device of the utility model.

[0033] In the figure: 1, rotating mechanism; 2, lifting mechanism; 3, translation mechanism; 11, rotating disc; 12, gear ring; 13, fixed shaft sleeve; 14, rotating shaft; 15, driving gear; 16, first photoelectric switch; 17, detection plate; 21, linear lifting module; 22, slider block; 23, fixed seat; 24, second photoelectric switch; 31, linear translation module; 32, cantilever; 33, suction disc; 34, third photoelectric switch; 35, air hole; 36, air cavity; 100, graphite tray. DETAILED DESCRIPTION

[0034] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0036] Reference Figures 1-8 A wafer tray taking and placing device, comprising a rotating mechanism 1, a lifting mechanism 2 and a translation mechanism 3, the rotating mechanism is arranged on a workbench;

[0037] The lifting mechanism 2 is connected with the rotating mechanism 1, the translation mechanism 3 is connected with the lifting mechanism 2, the moving end of the translation mechanism 3 is connected with a suction disc 33, the suction disc is used for sucking a tray, and the tray is located on the top of the suction disc, the wafer tray taking and placing device realizes automatic movement of the tray in three-dimensional space by coupling rotating, translating and lifting movements, realizes automatic taking and placing operation of the tray, and improves the taking efficiency of the tray.

[0038] The rotating mechanism 1 comprises a rotating disc 11, a rotating shaft and a gear driving device, the lifting mechanism 2 is fixed on the top of the rotating disc, the bottom of the rotating disc 11 is rotationally connected with the workbench 200 through the rotating shaft, the gear driving device is connected with the rotating shaft, the gear driving device drives the rotating shaft 14 to rotate, and then the rotating disc rotates.

[0039] The gear driving device comprises a fixed shaft sleeve 13, a gear ring 12 and a driving gear 15, the fixed shaft sleeve 13 is sleeved on the rotating shaft 14, the top of the rotating shaft is fixedly connected with the rotating disc, the gear ring 12 is sleeved on the fixed shaft sleeve, the driving gear 15 is arranged at the bottom of the rotating disc and is engaged with the gear ring 12, the driving gear 15 is connected with a driving motor, and the driving motor is arranged at the top of the rotating disc.

[0040] In the working process of the rotating mechanism 1, the driving motor drives the driving gear 15 to rotate, the driving gear 15 rotates around the gear ring, the driving gear 15 drives the rotating disc to rotate in the rotating process, and the rotating shaft 14 rotates in the fixed shaft sleeve 13, so that the rotating disc rotates.

[0041] In some embodiments, the rotating mechanism 1 is further provided with a position detection device, which comprises a first photoelectric switch 16 and a detection plate 17, the first photoelectric switch 16 is arranged at the bottom of the rotating disc 11, the detection plate 17 is arranged on the workbench and located on the rotating path of the first photoelectric switch 16, and when the first photoelectric switch 16 coincides with the plane position of the detection plate 17, it indicates that the rotating disc rotates to the set position.

[0042] The first photoelectric switch 16 is a groove type photoelectric switch, and the detection plate 17 has a plurality of detection plates for detecting different rotating positions of the rotating mechanism, and when the detection plate is located in the detection groove of the groove type photoelectric switch, it indicates that the rotating disc rotates to the set position.

[0043] The number of set positions depends on the position of the tray, and in the embodiment, the tray has two stations, one station is a tray warehouse, and the other station is a wafer placing station.

[0044] In some embodiments, the lifting mechanism is a linear lifting module 21 and a sliding block seat 22; the linear lifting module 21 is vertically installed on the rotating disc, the sliding block seat 22 is connected with the sliding block of the linear lifting module 21, and the sliding block seat 22 is provided with a fixing seat 23 for fixing the linear translation module. The fixing seat is an L-shaped structure, the vertical plate of which is connected with the sliding block seat, and the middle part of the linear translation module is fixed on the horizontal plate of the fixing seat.

[0045] The linear lifting module 21 is provided with a second photoelectric switch 24, and two second photoelectric switches 24 are arranged at the upper and lower ends of the linear lifting module 21 and located on the moving path of the sliding block.

[0046] The second photoelectric switch 24 has the same structure as the first photoelectric switch 16, and the detection plate is arranged on the side wall of the sliding block for detecting and limiting the moving position of the sliding block.

[0047] In some embodiments, the slider of the linear translation module is located at the top, the adsorption disc 33 is fixed to the slider through the cantilever 32, that is, one end of the cantilever is connected to the slider and the other end is connected to the adsorption disc, the slider drives the adsorption disc to move through the cantilever, and the tray is taken and placed.

[0048] The sidewall of the linear translation module is provided with a third photoelectric switch 34, two third photoelectric switches 34 are respectively arranged at the two ends of the linear translation module and are located on the moving path of the slider, the third photoelectric switch has the same structure as the first photoelectric switch 16, and a detection plate is arranged on the sidewall of the slider for detecting and limiting the moving position of the slider.

[0049] In the embodiment, the linear lifting module 21 adopts a linear displacement module, the linear displacement module adopts a screw and slider mechanism, and the horizontal moving device adopts a drag chain type linear module.

[0050] In some embodiments, the adsorption disc is a disc structure, a plurality of air holes are arranged on the surface of the adsorption disc, the air holes are connected to the air source through an air path, the air holes generate suction force to adsorb the tray, and it should be noted that the graphite tray 100 serves as a carrier of the wafer, and the graphite tray directly forms stable contact with the adsorption disc under the action of air pressure.

[0051] The adsorption disc comprises an air disc and an air cavity 36, the air cavity 36 is arranged at the top surface of the end of the cantilever, the air disc is embedded in the air cavity and is sealingly connected, the air holes are arranged on the air disc and are in communication with the air cavity, and the air cavity is connected to the air source through a pipeline.

[0052] The wafer tray taking and placing device of the application, the lifting mechanism is arranged at the top of the rotating disc, the translation mechanism is connected to the slider of the lifting mechanism, the slider drives the translation mechanism to adjust the height, one end of the slider of the translation mechanism is connected to the cantilever, the other end of the cantilever is connected to the adsorption disc, and the length direction of the cantilever is arranged along the movement direction of the translation mechanism. In the working process, the wafer tray taking and placing device moves the adsorption disc to the tray bin to adsorb the tray, then moves the tray to the target position, and finally places the tray carrying the wafer in the wafer bin again. After the tray bin is full, the whole tray bin is moved to the electroplating device for vacuum electroplating of the wafer. The device realizes non-contact taking and placing of the tray, improves the production efficiency of the wafer, and improves the electroplating yield of the wafer.

[0053] Referring to Figure 9 The application also provides a wafer transfer device comprising the wafer tray taking and placing device.

[0054] The above content only illustrates the technical thought of the application, and cannot limit the protection scope of the application. Any modification made on the basis of the technical solution according to the technical thought of the application falls within the protection scope of the claims of the application.

Claims

1. A wafer tray handling device, characterized in that, The rotating mechanism, the lifting mechanism and the translation mechanism are included. The lifting mechanism is connected with the rotating mechanism, the translation mechanism is connected with the lifting mechanism, and the moving end of the translation mechanism is connected with the adsorption disc. The rotating mechanism includes a rotating disc, a rotating shaft and a gear driving device.

2. The wafer tray handling apparatus of claim 1, wherein The gear driving device includes a fixed shaft sleeve, a gear ring and a driving gear. The fixed shaft sleeve is sleeved on the rotating shaft, the top of the rotating shaft is fixedly connected with the rotating disc, the gear ring is coaxially fixedly connected with the fixed shaft sleeve, the driving gear is arranged on the bottom of the rotating disc and is engaged with the gear ring, and the driving gear is connected with a driving motor.

3. The wafer tray handling apparatus of claim 1, wherein The rotating mechanism is provided with a position detection device, which includes a first photoelectric switch and a detection plate. The first photoelectric switch is arranged on the rotating disc, and the detection plate is located on the rotating path of the first photoelectric switch.

4. The wafer tray handling apparatus of claim 1, wherein The lifting mechanism includes a linear lifting module and a sliding block seat. The linear lifting module is vertically installed on the rotating disc, the sliding block seat is connected with the sliding block of the linear lifting module, and the sliding block seat is provided with a fixing seat for fixing the linear translation module.

5. The wafer tray handling apparatus of claim 4, wherein The fixing seat is in an L-shaped structure, the vertical plate of the fixing seat is connected with the sliding block seat, and the linear translation module is fixed on the horizontal plate of the fixing seat.

6. The wafer tray handling apparatus of claim 4, wherein The linear lifting module is provided with a second photoelectric switch and is located on the moving path of the sliding block.

7. The wafer tray handling apparatus of claim 1, wherein The translation mechanism is a linear translation module, and the adsorption disc is fixedly connected with the sliding block of the linear translation module through a cantilever.

8. The wafer tray handling apparatus of claim 1, wherein The adsorption disc includes a gas disc and a gas cavity, the gas cavity is arranged on the top surface of the end of the cantilever, the gas disc is embedded in the gas cavity and is sealingly connected, the air holes are arranged on the gas disc and are in communication with the gas cavity, and the gas cavity is connected with the gas source through a pipeline.

9. The wafer tray handling apparatus of claim 3, wherein The first photoelectric switch is a groove type photoelectric switch.

10. A wafer transfer device, comprising: The wafer tray taking and placing device of any one of claims 1-9 is included.

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