Embedded packaging structure
By using an embedded packaging structure, the connection stability between the heat sink and the substrate is enhanced by connecting side plates and connecting bottom plates, which solves the problem of increased substrate area and achieves miniaturization and improved stability of the packaging structure.
Patent Information
- Application Number
- CN202422973946.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-03
AI Technical Summary
In the prior art, the insufficient connection stability between the heat sink and the substrate leads to an increase in the substrate area, which makes it impossible to effectively utilize the limited packaging space, and the packaging size is too large.
An embedded packaging structure is adopted, which enhances connection stability and reduces connection area by setting a connecting side plate and a connecting bottom plate between the heat sink and the substrate, and filling the groove with structural adhesive.
This improved the connection stability between the heat sink and the substrate, reduced the overall size of the substrate, and ensured the stability and heat dissipation effect of the semiconductor packaging structure.
Smart Images
Figure CN223598709U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor packaging, more particularly, it relates to a embedded packaging structure. BACKGROUND
[0002] With the more and more functions of system level package chip, the number of components and chips in a package is also more and more, in the current situation can only increase the package size to reach the purpose of putting all components. Due to the limitation of available area on the substrate, the difficulty of design will be greatly increased, and there is a possibility of super-specification operation. Due to the hard requirement of the current design of the heat dissipation cover, the peripheral area on the substrate needs to be reserved for the heat dissipation cover, and more components cannot be arranged in the periphery, so that the overall package size is large.
[0003] In the prior art, the bottom of the peripheral side of the heat dissipation cover is fixedly connected with the surface of the substrate through structural glue, in order to ensure the connection stability of the two, the contact area between the two needs to be increased, which will increase the overall size of the substrate.
[0004] Therefore, a new technical scheme is needed to solve the above technical problems. UTILITY MODEL CONTENT
[0005] In view of the deficiencies in the prior art, the utility model aims at providing an embedded packaging structure.
[0006] The above technical purpose of the utility model is realized by the following technical scheme: an embedded packaging structure, comprising a substrate, the surface of the substrate is provided with a chip, the surface of the chip is provided with a heat dissipation cover, the heat dissipation cover comprises a heat dissipation plate covering the surface of the chip, the heat dissipation plate is provided with an inclined downward sealing plate along the peripheral side thereof, the bottom of the sealing plate is provided with a horizontally arranged connecting bottom plate, the peripheral side of the connecting bottom plate is provided with a vertically downward connecting side plate, the connecting bottom plate and the upper surface of the substrate, and the connecting side plate and the side wall of the substrate are all provided with structural glue.
[0007] By adopting the above technical scheme, by arranging the connecting side plate, the stability of the connection between the heat dissipation cover and the substrate can be further improved, so that the connection area between the connecting bottom plate and the substrate can be reduced, the overall size of the substrate can be reduced, and the stability of the semiconductor packaging structure can be ensured.
[0008] The utility model is further provided with the following arrangement: the middle part of the connecting bottom plate protrudes upward and forms a first groove with the surface of the substrate, and the structural glue is filled in the first groove.
[0009] The utility model is further provided with the following arrangement: the middle part of the connecting side plate protrudes outward and forms a second groove with the side wall of the substrate, and the structural glue is filled in the second groove.
[0010] The utility model further sets up: the surface middle part of base plate is equipped with the placement groove for placing chip, the inside of placement groove is provided with the glue filling layer.
[0011] The utility model further sets up: the placement groove is equipped with the glue containing groove along its circumferential side inner wall, the glue filling layer fills in the glue containing groove.
[0012] The utility model further sets up: the heat dissipation plate is protruding upwards at the top of chip, and forms the heat dissipation groove between chip, the heat dissipation groove is provided with the heat conducting layer.
[0013] The utility model has the advantages of the following: through setting up the connecting side plate, the stability of the connection between the heat dissipation cover and the base plate can be further improved, so that the connection area between the connecting bottom plate and the base plate can be reduced, the overall size of the base plate is reduced, and the stability of the semiconductor packaging structure is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is the cross section structure schematic view of this embodiment;
[0015] Figure 2 It is the cross section structure schematic view of the heat dissipation cover of this embodiment;
[0016] Figure 3 It is Figure 1 The local amplification schematic view of A part in middle.
[0017] BRIEF DESCRIPTION OF DRAWINGS: 1, base plate;2, chip;3, heat dissipation cover;301, heat dissipation plate;302, sealing plate;303, connecting bottom plate;304, connecting side plate;4, structural glue;5, first recess;6, second recess;7, placement groove;8, glue filling layer;9, glue containing groove;10, solder ball;11, heat dissipation groove;12, heat conducting layer. DETAILED DESCRIPTION
[0018] The utility model will be further explained in detail in connection with the drawings.
[0019] Wherein, same parts are indicated with same reference numerals in the drawings. It should be noted that the words "front", "back", "left", "right", "up" and "down" used in the following description refer to the directions in the drawings, and the words "bottom surface" and "top surface", "inner" and "outer" refer to the directions towards or away from the geometric center of a particular component.
[0020] As shown in the figure, a kind of embedded packaging structure, including substrate 1, the surface of substrate 1 is provided with chip 2, the surface of chip 2 is provided with heat dissipation cover 3, heat dissipation cover 3 includes the heat dissipation plate 301 covering the surface of chip 2, heat dissipation plate 301 is provided with the sealing plate 302 inclined downward along its periphery, the bottom of sealing plate 302 is provided with the horizontally arranged connecting bottom plate 303, the periphery of connecting bottom plate 303 is provided with the vertically downward connecting side plate 304, connecting bottom plate 303 and the upper surface of substrate 1, connecting side plate 304 and the sidewall of substrate 1 are all provided with structural glue 4.
[0021] By setting connecting side plate 304, the stability of the connection between heat dissipation cover 3 and substrate 1 can be further improved, so as to reduce the connection area between connecting bottom plate 303 and substrate 1, reduce the overall size of substrate 1, and ensure the stability of the semiconductor packaging structure.
[0022] The middle part of connecting bottom plate 303 protrudes upward and forms a first groove 5 between the surface of substrate 1, and the structural glue 4 is filled in the first groove 5. The middle part of connecting side plate 304 protrudes outward and forms a second groove 6 between the sidewall of substrate 1, and the structural glue 4 is filled in the second groove 6. When heat dissipation cover 3 and substrate 1 are installed, the first groove 5 and the second groove 6 are set to increase the connection area between heat dissipation cover 3 and structural glue 4, thereby further improving the stability of the connection between heat dissipation cover 3 and substrate 1.
[0023] A placement slot 7 for placing chip 2 is formed in the middle of the surface of substrate 1, and a glue filling layer 8 is arranged in the placement slot 7. A glue containing groove 9 is formed in the inner wall of the periphery of the placement slot 7, and the glue filling layer 8 is filled in the glue containing groove 9. By installing chip 2 in the placement slot 7, the glue filling layer 8 wraps the solder balls 10 at the bottom of chip 2, and by setting the glue containing groove 9, the glue filling layer 8 is prevented from overflowing from the placement slot 7, and can be completely placed in the placement slot 7, thereby further reducing the area size of substrate 1.
[0024] The heat dissipation plate 301 protrudes upward above the chip 2 and forms a heat dissipation groove 11 between the chip 2, and a heat conducting layer 12 is arranged in the heat dissipation groove 11. The heat conducting layer 12 is specifically a polyurethane heat conducting layer 12. The heat dissipation groove 11 increases the contact area of the heat conducting layer 12 and the heat dissipation plate 301, further improving the heat dissipation effect of the semiconductor packaging structure.
[0025] The specific embodiments are only an explanation of the present application, and are not a limitation of the present application. Those skilled in the art can make modifications to the embodiments without creative contribution after reading the present specification, as long as the modifications are within the scope of the claims of the present application.
Claims
1. An embedded package structure, comprising a substrate (1), a surface of the substrate (1) is provided with a chip (2), a surface of the chip (2) is provided with a heat dissipation cover (3), characterized in that: The heat dissipation cover (3) comprises a heat dissipation plate (301) covering the surface of the chip (2), the heat dissipation plate (301) is provided with an inclined downward sealing plate (302) along the circumferential side, the bottom of the sealing plate (302) is provided with a horizontally arranged connecting bottom plate (303), the circumferential side of the connecting bottom plate (303) is provided with a vertically downward connecting side plate (304), and the connecting bottom plate (303) and the connecting side plate (304) are both provided with a structural adhesive (4) between the upper surface of the base plate (1) and the side wall of the base plate (1).
2. The embedded package structure of claim 1, wherein: The middle part of the connecting bottom plate (303) protrudes upward and forms a first groove (5) between the surface of the base plate (1), and the structural adhesive (4) is filled in the first groove (5).
3. The embedded package structure of claim 1, wherein: The middle part of the connecting side plate (304) protrudes outward and forms a second groove (6) between the side wall of the base plate (1), and the structural adhesive (4) is filled in the second groove (6).
4. The embedded package structure of claim 1, wherein: The surface of the base plate (1) is provided with a placing groove (7) for placing the chip (2) in the middle part, and the placing groove (7) is provided with a glue filling layer (8) inside.
5. The embedded package structure of claim 4, wherein: The placing groove (7) is provided with a glue containing groove (9) along the circumferential inner wall, and the glue filling layer (8) is filled in the glue containing groove (9).
6. The embedded package structure of claim 1, wherein: The heat dissipation plate (301) protrudes upward above the chip (2) and forms a heat dissipation groove (11) between the chip (2), and the heat dissipation groove (11) is provided with a heat conducting layer (12).