TO92 type plug-in lead frame

Abstract

The utility model discloses a TO92 type plug-in lead frame, which comprises an upper frame, a lower frame and a plurality of rows of lead frame groups, and the plurality of rows of lead frame groups are sequentially arranged between the upper frame and the lower frame left and right at intervals. Each lead frame group comprises two supporting ribs, a plurality of longitudinally distributed first lead frame units and a plurality of longitudinally distributed second lead frame units, the two supporting ribs are arranged in parallel in a left-right spaced mode, the two ends of each supporting rib are connected with the upper frame and the lower frame respectively, and a plurality of first outer pins and a plurality of second outer pins are connected between the two supporting ribs; the first lead frame unit comprises first outer pins and second outer pins, the first outer pins and the second outer pins are distributed in a staggered manner, the first lead frame unit comprises a first base island and a plurality of first pins, the plurality of first pins and the plurality of first outer pins are connected in a one-to-one correspondence manner, the first base island is connected with one of the first pins, and the second lead frame unit comprises a second base island and a plurality of second pins; the method has the advantages of remarkably reducing material waste and improving the space utilization rate of the substrate.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially to a TO92 type plug-in lead frame. BACKGROUND

[0002] With the rapid development of information technology, the application of integrated circuits (IC) is becoming more and more widespread, and its design is gradually evolving towards multifunctionality, large capacity, high density and light weight. As an indispensable part of integrated circuits, lead frames are used to achieve electrical connection between internal circuits and external leads of chips, and are important structural components to ensure the functionality and reliability of electronic devices. The physical properties of lead frames, such as volume, electrical conductivity and heat dissipation performance, are directly related to the overall performance of the packaged power device. Lead frames not only need to have good electrical conductivity and heat dissipation, but also need to achieve efficient electrical connection in a limited space to meet the high-density integration needs of modern electronic products.

[0003] Currently, the lead frames on the market are mostly arranged in a multi-unit matrix, with each lead frame unit arranged in a single row. Specifically, these lead frames are usually composed of a substrate, leads and support ribs. The substrate serves as the foundation of the entire frame and supports all units. The leads are used to connect the pads of the chip and the external pins, and the support ribs are used to enhance the mechanical strength of the frame and prevent deformation. This layout meets the basic needs of the current market to some extent, but still has some significant problems in actual application.

[0004] Although the existing lead frame design meets the basic needs of the current market to some extent, it still has obvious shortcomings. First, the unit spacing is large, which limits the number of units that can be arranged in the same substrate area, thereby limiting the number of packaged bodies produced in a single process. Second, due to the large unit spacing, most of the area on the substrate is not fully utilized, resulting in waste of materials, especially in large-scale production processes, this waste will significantly increase production costs. In addition, automated production equipment needs more time and space during movement and operation, which reduces the overall production efficiency. In high-density packaging applications, the larger unit spacing may limit the effective dissipation of heat, affecting the heat dissipation performance of the packaged body, and thus affecting the long-term stability and reliability of the chip.

[0005] In particular, TO92 type plug-in lead frames are widely used, but due to the traditional layout, TO92 type lead frames face greater challenges in high-density packaging. TO92 type lead frames are usually used for small, high-performance electronic component packaging, such as transistors and diodes. However, the existing TO92 type lead frame design still needs to be improved in terms of space utilization, material utilization, and heat dissipation performance. Therefore, it is particularly important to develop a new TO92 type plug-in lead frame to solve the problems existing in the prior art. SUMMARY

[0006] The utility model discloses a TO92 type plug-in lead frame which can significantly reduce material waste and improve the space utilization of the substrate.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a TO92 type plug-in lead frame, comprising an upper frame, a lower frame and a plurality of lead frame groups, the plurality of lead frame groups are arranged in left and right intervals between the upper frame and the lower frame, each lead frame group comprises two support ribs, a plurality of first lead frame units distributed longitudinally and a plurality of second lead frame units distributed longitudinally, the two support ribs are arranged in parallel with left and right intervals, and the two ends are connected with the upper frame and the lower frame respectively, a plurality of first outer feet and a plurality of second outer feet are connected between the two support ribs, the first outer feet and the second outer feet are arranged alternately, the first lead frame unit comprises a first base island and a plurality of first pins, the plurality of first pins are connected one by one with the plurality of first outer feet, the first base island is connected with one of the first pins, the second lead frame unit comprises a second base island and a plurality of second pins, the plurality of second pins are connected one by one with the plurality of second outer feet, and the second base island is connected with one of the second pins.

[0008] Preferably, the number of first pins is three, which are a first connecting pin, a second connecting pin and a third connecting pin, the first connecting pin and the third connecting pin are located on the upper and lower sides of the first base island respectively, and the second connecting pin is connected with the middle part of the side of the first base island.

[0009] Preferably, a first soldering point area is arranged on the upper side of the first base island, and the surfaces of the first base island and the first soldering point area are coated with a first silver plating layer.

[0010] Preferably, the end of the first connecting pin and the third connecting pin is provided with a first soldering point, and the surface of the first soldering point is coated with a second silver plating layer.

[0011] Preferably, the number of the second pins is three, which are a fourth connecting pin, a fifth connecting pin and a sixth connecting pin, the fourth connecting pin and the sixth connecting pin are respectively located on the upper and lower sides of the second base island, and the fifth connecting pin is connected with the middle of the side of the second base island.

[0012] Preferably, the lower side of the second base island is provided with a second soldering point area, and the surfaces of the second base island and the second soldering point area are coated with a third silver plating layer.

[0013] Preferably, the end portions of the fourth connecting pin and the sixth connecting pin are respectively provided with a second soldering point, and the surfaces of the second soldering points are coated with a fourth silver plating layer.

[0014] Preferably, a plurality of circular or elliptical positioning holes are respectively formed in the upper frame and the lower frame.

[0015] Preferably, the number of the lead frame groups is 10, and the center distance between adjacent lead frame groups is 29.5-30.5 mm.

[0016] Compared with the prior art, the utility model has the advantages that each lead frame group comprises two support ribs which are arranged in parallel and spaced apart, the two ends of the two support ribs are connected with the upper frame and the lower frame respectively, forming a stable frame structure, a plurality of first outer pins and a plurality of second outer pins are connected between the two support ribs, the outer pins are arranged in a staggered manner, ensuring that the lead frame can accommodate more pins in limited space, and improving the space utilization.

[0017] Each lead frame group comprises a plurality of first lead frame units and a plurality of second lead frame units which are arranged in a longitudinal direction, the first lead frame unit comprises a first base island and a plurality of first pins, the first pins are connected with the first outer pins one by one, the first base island is connected with one of the first pins, and the second lead frame unit comprises a second base island and a plurality of second pins, the second pins are connected with the second outer pins one by one, and the second base island is connected with one of the second pins, the staggered arrangement design not only improves the compactness of the lead frame, but also avoids short circuit and interference between the pins, and ensures the reliability of electrical connection.

[0018] The main advantages of the structure are as follows:

[0019] I. Improve the space utilization: by allowing a plurality of lead frame units to share two support ribs and arranging the first outer pins and the second outer pins in a staggered manner, more lead frame units can be arranged in the same substrate area, and the space utilization is significantly improved.

[0020] II. Reduce material waste: the compact design reduces unnecessary gaps and reduces material waste, thereby reducing production cost.

[0021] Three, enhanced mechanical strength: the arrangement of two support ribs not only provides additional mechanical support, but also enhances the overall stability of the lead frame, preventing deformation or damage during processing and use.

[0022] Four, improve production efficiency: staggered pin design makes automated production equipment more efficient during movement and operation, shortens production cycle and improves production efficiency.

[0023] Five, improve heat dissipation performance: compact and orderly layout helps effective heat dissipation, ensuring long-term stability and reliability of the chip under high-density packaging.

[0024] Six, optimize electrical performance: staggered arrangement of first and second pins avoids short circuit and interference between pins, ensuring reliability of electrical connection and stability of signal transmission. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0026] Figure 1 is a structural schematic diagram of the utility model;

[0027] Figure 2 is a structural schematic diagram of the lead frame group in the utility model;

[0028] Figure 3 is a structural schematic diagram of the first lead frame unit and the second lead frame unit in the utility model;

[0029] In the figure, 1 is an upper frame; 2 is a lower frame; 3 is a lead frame group; 4 is a support rib; 5 is a first lead frame unit; 6 is a second lead frame unit; 7 is a first outer leg; 8 is a second outer leg; 9 is a first base island; 10 is a first pin; 11 is a first connecting leg; 12 is a second connecting leg; 13 is a third connecting leg; 14 is a first soldering point area; 15 is a first silver plating layer; 16 is a first soldering point; 17 is a second silver plating layer; 18 is a second base island; 19 is a fourth connecting leg; 20 is a fifth connecting leg; 21 is a sixth connecting leg; 22 is a second soldering point area; 23 is a third silver plating layer; 24 is a second soldering point; 25 is a fourth silver plating layer; 26 is a positioning hole; 27 is a second pin. DETAILED DESCRIPTION

[0030] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0031] Embodiment one: As shown in the figure, a TO92 type plug-in lead frame includes an upper frame 1, a lower frame 2, and a plurality of column lead frame groups 3, which are arranged in sequence and left-right spaced between the upper frame 1 and the lower frame 2. Each lead frame group 3 includes two support ribs 4, a plurality of first lead frame units 5 distributed longitudinally, and a plurality of second lead frame units 6 distributed longitudinally. The two support ribs 4 are arranged in parallel and left-right spaced, and the two ends are connected with the upper frame 1 and the lower frame 2 respectively. A plurality of first outer legs 7 and a plurality of second outer legs 8 are connected between the two support ribs 4. The first outer legs 7 and the second outer legs 8 are arranged alternately. The first lead frame unit 5 includes a first base island 9 and a plurality of first pins 10. The plurality of first pins 10 are connected one by one with the plurality of first outer legs 7. The first base island 9 is connected with one of the first pins 10. The second lead frame unit 6 includes a second base island 18 and a plurality of second pins 27. The plurality of second pins 27 are connected one by one with the plurality of second outer legs 8. The second base island 18 is connected with one of the second pins 27.

[0032] Embodiment two: As shown in the figure, different from embodiment one, the number of first pins 10 is three, which are a first connecting pin 11, a second connecting pin 12, and a third connecting pin 13. The first connecting pin 11 and the third connecting pin 13 are respectively arranged on the upper and lower sides of the first base island 9. The second connecting pin 12 is connected with the middle part of the side edge of the first base island 9.

[0033] In the above structure, by arranging the first connecting pin 11 and the third connecting pin 13 on the upper and lower sides of the first base island 9 respectively, the connection of different pins of the chip with the external circuit can be ensured to be more uniform and stable. This symmetrical layout helps to reduce electrical noise and interference, improve the quality and reliability of signal transmission. The second connecting pin 12 is connected with the middle part of the side edge of the first base island 9, which provides additional mechanical support and enhances the stability of the first base island 9, preventing displacement or deformation during bonding and packaging, thereby improving the overall mechanical strength of the lead frame.

[0034] In this embodiment, a first soldering point area 14 is arranged on the upper side of the first base island 9. The surfaces of the first base island 9 and the first soldering point area 14 are coated with a first silver plating layer 15.

[0035] In the above structure, the upper side of the first base island 9 is provided with a first solder area 14, which provides a larger contact area for the soldering of the chip. This not only improves the connection strength between the chip and the lead frame, but also ensures the stability and reliability of the chip during the soldering process. The larger solder area can accommodate more solder, reducing the problem of poor connection caused by insufficient solder.

[0036] The surfaces of the first base island 9 and the first solder area 14 are coated with a first silver plating layer 15. The silver plating layer has excellent electrical conductivity and thermal conductivity, which can significantly improve the electrical performance and heat dissipation performance of the lead frame. In addition, the electrical conductivity of silver is much higher than that of copper and other common metals, which helps to reduce resistance and energy loss during signal transmission, improving the efficiency and quality of signal transmission. At the same time, the silver plating layer also has good thermal conductivity, which can effectively conduct the heat generated by the chip to the outside, ensuring the long-term stability and reliability of the chip under high-density packaging.

[0037] In this embodiment, the end of the first connecting pin 11 and the third connecting pin 13 is provided with a first soldering point 16, and the surface of the first soldering point 16 is coated with a second silver plating layer 17.

[0038] In the above structure, the end of the first connecting pin 11 and the third connecting pin 13 is provided with a first soldering point 16, which provides a dedicated contact area for the connection between the lead frame and the external circuit. This design not only improves the precision and reliability of soldering, but also ensures good electrical connection between the lead frame and the external pin. The presence of the first soldering point 16 makes it easier for the bonding equipment to locate and solder, reducing the error rate and defective rate during the soldering process and improving production efficiency.

[0039] The surface of the first soldering point 16 is coated with a second silver plating layer 17. The silver plating layer has excellent electrical conductivity and thermal conductivity, which can significantly improve the electrical performance and heat dissipation performance of the lead frame. In addition, the second silver plating layer 17 also has excellent anti-oxidation and anti-corrosion performance, which can effectively prevent the performance degradation of the soldering point caused by oxidation and corrosion during long-term use. This not only prolongs the service life of the lead frame, but also improves its reliability and stability in various environmental conditions. The anti-oxidation and anti-corrosion performance of the silver plating layer also ensures that the soldering point maintains good electrical connection and mechanical strength in high-temperature and humid environments.

[0040] Embodiment Three: As shown in the figure, different from Embodiment Two, the number of second pins 27 is three, which are the fourth connecting pin 19, the fifth connecting pin 20 and the sixth connecting pin 21. The fourth connecting pin 19 and the sixth connecting pin 21 are respectively located on the upper and lower sides of the second base island 18, and the fifth connecting pin 20 is connected to the middle of the side of the second base island 18.

[0041] The compact pin layout allows more pins to be accommodated in a limited space, improving the space utilization of the lead frame, reducing the size of the substrate and the waste of materials, thereby reducing production costs. The compact pin layout also simplifies the bonding process, making it easier for the bonding equipment to locate and weld each pin, reducing bonding time and error rate, and improving production efficiency.

[0042] In addition, the reasonable pin layout helps to effectively dissipate heat. The fourth connecting pin 19 and the sixth connecting pin 21 are respectively located on the upper and lower sides of the second base island 18, which can quickly conduct the heat generated by the chip to the outside, ensuring the long-term stability and reliability of the chip under high-density packaging. This layout design not only improves the heat dissipation performance, but also prolongs the service life of the chip.

[0043] In the embodiment, the lower side of the second base island 18 is extended to provide a second solder point area 22, and the surfaces of the second base island 18 and the second solder point area 22 are coated with a third silver plating layer 23.

[0044] In the above structure, the upper side of the second base island 18 is extended to provide a second solder point area 22, and the surfaces of the second base island 18 and the second solder point area 22 are coated with a third silver plating layer 23. This design not only improves the connection strength and reliability between the chip and the lead frame, but also significantly improves the electrical performance and heat dissipation performance of the lead frame. The second solder point area 22 provides a larger contact area for the chip, ensuring stability and connection quality during the welding process. The silver plating layer has excellent electrical conductivity and thermal conductivity, which can reduce contact resistance, improve signal transmission efficiency, and effectively dissipate heat, ensuring the long-term stability and reliability of the chip. In addition, the anti-oxidation and anti-corrosion performance of the silver plating layer prolongs the service life of the lead frame and improves its reliability in various environmental conditions.

[0045] In the embodiment, the end of the fourth connecting pin 19 and the sixth connecting pin 21 is provided with a second solder point 24, and the surface of the second solder point 24 is coated with a fourth silver plating layer 25.

[0046] The above design not only improves the precision and reliability of welding, but also significantly improves the electrical performance and heat dissipation performance of the lead frame. The second solder point 24 provides a dedicated contact area for the connection between the lead frame and the external circuit, ensuring the positioning and welding precision of the bonding equipment and reducing the error rate during the welding process. The silver plating layer has excellent electrical conductivity and thermal conductivity, which can reduce contact resistance, improve signal transmission efficiency, and effectively dissipate heat, ensuring the long-term stability and reliability of the chip under high-density packaging. In addition, the anti-oxidation and anti-corrosion performance of the silver plating layer prolongs the service life of the lead frame and improves its reliability in various environmental conditions.

[0047] In the fourth embodiment, as shown in the figure, a plurality of round or oval positioning holes 26 are formed on the upper frame 1 and the lower frame 2 respectively.

[0048] The above design not only improves the positioning accuracy and stability of the lead frame during packaging, but also simplifies the production and assembly process. The positioning holes 26 provide precise fixing points for the lead frame, ensuring accurate positioning during bonding and packaging, reducing the risk of poor welding and packaging defects caused by positional deviation.

[0049] The round or oval design of the positioning holes 26 can be selected according to different production equipment and process requirements, improving the compatibility and flexibility of the lead frame.

[0050] In this embodiment, the number of lead frame groups 3 is 10, and the center distance between adjacent lead frame groups 3 is 29.5-30.5mm.

[0051] The above design not only improves the space utilization and production efficiency of the lead frame, but also ensures the reasonable layout and non-interference between the lead frame groups 3. By setting the center distance between adjacent lead frame groups 3 to 29.5-30.5mm, more lead frame groups 3 can be arranged within a limited substrate area, maximizing material utilization, reducing waste, and reducing production costs. At the same time, the reasonable center distance ensures that each lead frame group 3 has enough space for bonding and packaging, avoiding short circuits and interference between pins, improving the reliability of electrical connections and the quality of signal transmission.

[0052] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation based on the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A TO92 type plug-in lead frame, comprising an upper frame, a lower frame, and multiple rows of lead frame groups, wherein the multiple rows of lead frame groups are arranged alternately on the left and right sides between the upper frame and the lower frame, characterized in that: Each lead frame assembly includes two support ribs, multiple longitudinally distributed first lead frame units, and multiple longitudinally distributed second lead frame units. The two support ribs are arranged parallel to each other with a left-right interval, and their two ends are respectively connected to the upper frame and the lower frame. Multiple first outer feet and multiple second outer feet are connected between the two support ribs. The first outer feet and second outer feet are arranged alternately. The first lead frame unit includes a first base island and multiple first pins. The multiple first pins are connected to the multiple first outer feet in a one-to-one correspondence. The first base island is connected to one of the first pins. The second lead frame unit includes a second base island and multiple second pins. The multiple second pins are connected to the multiple second outer feet in a one-to-one correspondence. The second base island is connected to one of the second pins.

2. The TO92 type plug-in lead frame according to claim 1, characterized in that: The first pin has three parts, namely a first connecting pin, a second connecting pin, and a third connecting pin. The first connecting pin and the third connecting pin are located on the upper and lower sides of the first base island, respectively, and the second connecting pin is connected to the middle of the side of the first base island.

3. A TO92 type plug-in lead frame according to claim 2, characterized in that: A first solder joint area is provided on the upper side of the first base island, and the surfaces of the first base island and the first solder joint area are coated with a first silver plating layer.

4. A TO92 type plug-in lead frame according to claim 3, characterized in that: Both the first connecting pin and the third connecting pin have a first solder joint at their ends, and the surface of the first solder joint is coated with a second silver plating layer.

5. A TO92 type plug-in lead frame according to claim 1, characterized in that: The second pin has three pins, namely the fourth pin, the fifth pin, and the sixth pin. The fourth pin and the sixth pin are located on the upper and lower sides of the second base island, respectively, and the fifth pin is connected to the middle of the side of the second base island.

6. A TO92 type plug-in lead frame according to claim 5, characterized in that: A second solder joint area is provided on the lower side of the second base island, and the surfaces of the second base island and the second solder joint area are coated with a third silver plating layer.

7. A TO92 type plug-in lead frame according to claim 6, characterized in that: The ends of the fourth connecting pin and the sixth connecting pin are each provided with a second solder joint, and the surface of the second solder joint is coated with a fourth silver plating layer.

8. A TO92 type plug-in lead frame according to claim 1, characterized in that: The upper and lower borders are respectively provided with multiple circular or elliptical positioning holes.

9. A TO92 type plug-in lead frame according to claim 1, characterized in that: The number of lead frame groups is 10, and the center distance between adjacent lead frame groups is 29.5 to 30.5 mm.

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